© 1999 Fairchild Semiconductor Corporation DS500154 www.fairchildsemi.com
July 1999
Revised August 1999
74LVT244 •74LVTH244 Low Voltage Octal Buffer/Line Driver with 3-STATE Outputs
74LVT244 •74LVTH244
Low Voltage Octal Buffer/Line Driver
with 3-STATE Outputs
General Description
The LVT244 and LVTH244 are octal buffers and line drivers
designed to be employed as memory address drivers,
clock drivers and bus oriented transmitters or receivers
which provide improved PC boa rd den sity.
The LVTH244 data inputs include bush old, eliminati ng the
need for external pull-up resistors to hold unused inputs.
These octal buffers and line drivers are designed for lowvoltage (3.3V) V
CC
applications, but wit h the capability to
provide a TTL interface to a 5V environment. The LVT244
and LVTH244 are fabricated with an advanced BiCMOS
technology to achieve h igh speed operation similar to 5V
ABT while maintaining low power dissipation.
Features
■ Input and output interface capability to systems at
5V V
CC
■ Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH244),
also available without bushold feat ure (74LVT244)
■ Live insertion/extraction per mitt ed
■ Power Up/Down high impedance provides glitch-free
bus loading
■ Outputs source/sink −32 mA/+64 mA
■ Functionally compatible with the 74 series 244
■ Latch-up performance exceeds 500 mA
Ordering Code:
Device also available in Tape and Reel. Specify by appending s uffix let te r “X” to the ordering code.
Logic Symbol
IEEE/IEC
Order Number Package Number Package Description
74LVT244WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
74LVT244SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVT244MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
74LVT244MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
74LVTH244WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300 Wide
74LVTH244SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVTH244MSA MSA20 20-Lead Shrink Small Outline Package (SSOP), EIAJ TYPE II, 5.3mm Wide
74LVTH244MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide