Diodes AP2301FGEG, AP2301SN, AP2311FGEG, AP2311SN, AP2301M8G Schematic

AP2301/AP2311

2.0A SINGLE CHANNEL CURRENT-LIMITED POWER SWITCH

Description

The AP2301 and AP2311 are single channel current-limited

integrated high-side power switches optimized for Universal Serial

Bus (USB) and other hot-swap applications. The family of devices

complies with USB standards and is available with both polarities of

Enable input.

The devices have fast short-circuit response time for improved overall

system robustness, and have integrated output discharge function to

ensure completely controlled discharging of the output voltage

capacitor. They provide a complete protection solution for applications

subject to heavy capacitive loads and the prospect of short circuit,

and offer reverse current blocking, over-current, over-temperature

and short-circuit protection, as well as controlled rise time and under-

voltage lockout functionality. A 7ms deglitch capability on the open-

drain Flag output prevents false over-current reporting and does not

require any external components.

All devices are available in SO-8, MSOP-8, MSOP-8EP, U-DFN3030-

8 and U-DFN2020-6 packages.

Features

• Single channel current-limited power switch

• Output discharge function

• Fast short-circuit response time: 2µs

• 2.5A accurate current limiting

• Reverse current blocking

• 70mΩ on-resistance

• Input voltage range: 2.7V - 5.5V

• Built-in soft-start with 0.6ms typical rise time

• Over-current and thermal protection

• Fault report (FLG) with blanking time (7ms typ)

• ESD protection: 2kV HBM, 200V MM

• Ambient temperature range: -40°C to +85°C

• SO-8, MSOP-8, MSOP-8EP, U-DFN3030-8 and U-DFN2020-6:

Available in “Green” Molding Compound (No Br, Sb)

 Totally Lead-free & Fully RoHS Compliant (Notes 1 & 2)

 Halogen and Antimony Free. “Green” Device (Note 3)

• UL Recognized, File Number E322375

• IEC60950-1 CB Scheme Certified

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.

AP2301/AP2311

Document number: DS32241 Rev. 5 - 2

Pin Assignments

Applications

• LCD TVs & Monitors

• Set-Top-Boxes, Residential Gateways

• Laptops, Desktops, Servers, e-Readers, Printers, Docking

Stations, HUBs

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( Top View )

1

GND

2

IN

3

IN

EN

4

SO-8

( Top View )

1

GND

2

IN

3

IN

4

EN

MSOP-8 /MSOP-8EP

Note: latter with exposed pad

(dotted line)

(Top View)

1

GND

2

IN

3

IN

4

EN

U-DFN3030-8 Type E

U-DFN2020-6

8

NC

7

OUT

6

OUT

5

FLG

8

NC

7

OUT

6

OUT

5

FLG

8

NC

7

OUT

6

FLG

5

February 2014

Typical Applications Circuit

Enable Active High

Power Supply

2.7V to 5.5V

10k

ON

0.1uF

IN

FLG

EN

GND

OUT

0.1uF

AP2301/AP2311

Load

120uF

OFF

Available Options

Part Number Channel Enable Pin (EN)

AP2301 1 Active Low

AP2311 1 Active High

Recommended Maximum

Continuous Load Current (A)

Typical Current

Limit (A)

2A 2.5A

Pin Descriptions

Name

GND 1 1 2 Ground

IN

EN 4 4 3 Enable input, active low (AP2301) or active high (AP2311)

FLG 5 5

OUT

NC

Exposed

Pad

SO-8,

MSOP-8

2, 3 2, 3

6, 7 6, 7 5 Voltage Output Pin All OUT pins must be tied together externally.

8 8

—

AP2301/AP2311

Document number: DS32241 Rev. 5 - 2

Pin Number

MSOP-8EP,

U-DFN3030-8

Exposed

Pad

U-DFN2020-6

1 Voltage Input Pin; Connect a 0.1µF or larger ceramic capacitor from IN to GND as

4 Over-temperature and over-current fault reporting with 7ms deglitch; active low open-

6 NC:

Exposed

Pad

close as possible. (all IN pins must be tied together externally)

drain output. FLG is disabled for 7ms after turn-on.

No Internal Connection; recommend tie to OUT pins

Exposed pad. It should be externally connected to GND and thermal mass for enhanced thermal

impedance. It should not be used as electrical ground conduction path.

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Function

Package

SO-8

MSOP-8

MSOP-8EP U-DFN3030-8 U-DFN2020-6

February 2014

Functional Block Diagram

AP2301/AP2311

IN

UVLO

EN

Absolute Maximum Ratings (@T

Current

Sense

Discharge

Driver

Thermal

Sense

= +25°C, unless otherwise specified.)

A

Current

Limit

Deglitch

Control

OUT

FLG

GND

Symbol Parameter Ratings Unit

ESD HBM Human Body Model ESD Protection 2 kV

ESD MM Machine Model ESD Protection 200 V

VIN

V

OUT

V

EN , VFLG

I

LOAD

T

J(MAX)

TST

Notes: 4. All voltages referred to GND pin. Maximums are the lower of (VIN +0.3) and 6.5V

5. UL Recognized Rating from -30°C to +70°C (Diodes qualified T

Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be affected by exposure to absolute maximum rating conditions for extended periods of time.

Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling and transporting these devices.

Input Voltage (Note 4) -0.3 to 6.5 V

Output Voltage (Note 4)

Enable Voltage (Note 4)

Maximum Continuous Load Current Internal Limited A

Maximum Junction Temperature 150 °C

-0.3 to (VIN +0.3) or 6.5

Storage Temperature Range (Note 5) -65 to +150 °C

from -65°C to +150°C)

ST

V

Recommended Operating Conditions (@T

= +25°C, unless otherwise specified.)

A

Symbol Parameter Min Max Unit

V

I

OUT

V

T

Input voltage 2.7 5.5 V

IN

Output Current 0 2 A

EN Input Logic Low Voltage 0 0.8 V

IL

EN Input Logic High Voltage 2

IH

Operating Ambient Temperature -40 +85

A

V

IN

V

°C

AP2301/AP2311

Document number: DS32241 Rev. 5 - 2

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February 2014

AP2301/AP2311

Electrical Characteristics (@T

Symbol Parameter Test Conditions Min Typ Max Unit

V

∆V

I

SHDN

I

R

DS(ON)

I

SHORT

T

SHORT

I

LEAK-EN

I

LEAK-O

T

D(OFF)

R

I

T

R

T

Notes: 6. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.

7. The discharge function is active when the device is disabled (when enable is de-asserted or during power-up power-down when V The discharge function offers a resistive discharge path for the external storage capacitor for limited time.

8. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.

9. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane.

10. Device mounted on 1"x1" FR-4 substrate PCB, 2oz copper, with minimum recommended padon top layer and thermal vias to bottom layer ground.

Input UVLO

UVLO

Input UVLO Hysteresis

UVLO

Input Shutdown Current Disabled, OUT = open 0.1 1 µA

Input Quiescent Current Enabled, OUT = open 60 100 µA

I

Q

Input Leakage Current Disabled, OUT grounded 0.1 1 µA

LEAK

Reverse Leakage Current

REV

Switch on-resistance

Over-Load Current Limit (Note 6)

LIMIT

Current limiting trigger threshold Output Current Slew rate (<100A/s) 2.5 A

I

Trig

Short-Circuit Current Limit Enabled into short circuit 2.75 A

Short-circuit Response Time

EN Input Logic Low Voltage

V

IL

EN Input Logic High Voltage

V

IH

EN Input leakage

Output leakage current

Output turn-on delay time

D(ON)

Output turn-on rise time

TR

Output turn-off delay time

Output turn-off fall time

TF

FLG output FET on-resistance

FLG

FLG Off Current

FOH

FLG blanking time

Blank

Discharge time

DIS

Discharge resistance (Note 7)

DIS

Thermal Shutdown Threshold Enabled 140

SHDN

Thermal Shutdown Hysteresis 20

HYS

Thermal Resistance Junction-to-

θJA

Ambient

= +25°C, VIN = +5V, CIN = 0.1µF, CL = 1µF, unless otherwise specified.)

A

VIN rising

VIN decreasing

Disabled, V

V

= 5V, I

IN

VIN = 3.3V, I

V

= 5V, V

IN

V

= 0V to I

OUT

V

= 2.7V to 5.5V

IN

V

= 2.7V to 5.5V

IN

V

= 5V, V

IN

Disabled, V

CL= 1µF, R

I

= 10mA

FLG

V

= 5V

FLG

= 0V, V

IN

= 2.0A

OUT

= 2.0A

OUT

= 4.5V -40°C ≤ TA ≤ +85°C

OUT

= 0V and 5.5V

EN

= 0V

OUT

= 5Ω

LOAD

= 5Ω

LOAD

= 5Ω

LOAD

= 5Ω

LOAD

= 5V, I

OUT

REV

T

-40°C ≤ TA ≤ +85°C

T

-40°C ≤ TA ≤ +85°C

= I

(OUT shorted to ground)

LIMIT

at VIN

= +25°C

A

= +25°C

A

Assertion or deassertion due to overcurrent and overtemperature condition

CL= 1µF, VIN = 5V, disabled to V

VIN = 5V, disabled, I

OUT

= 1mA

OUT

< 0.5V

SO-8 (Note 8) 96

MSOP-8 (Note 8) 130

MSOP-8-EP (Note 9) 92

U-DFN3030-8 (Note 9) 84

1.6 2.0 2.4 V

50 mV

0.01 1 µA

70 84

105

90 108

135

2.05 2.50 2.85 A

2 µs

0.8 V

2 V

0.01 1 µA

0.5 1 µA

0.1 ms

0.6 1.5 ms

0.1 ms

0.05 0.1 ms

20 40 Ω

0.01 1 µA

4 7 15 ms

0.6 ms

100 Ω

°C/W

U-DFN2020-6 (Note 10) 90 °C/W

< V

UVLO

).

IN

mΩ

°C

AP2301/AP2311

Document number: DS32241 Rev. 5 - 2

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February 2014

Typical Performance Characteristics

AP2301/AP2311

V

EN

V

OUT

50%

T

D(ON)

T

10%

R

90%

Turn-On Delay and Rise Time

V

OUT

2V/div

V

EN

5V/div

I

IN

1A/div

Device enabled

V

50%

T

D(OFF)

90%

10%

T

F

EN

V

OUT

50%

T

D(ON)

T

10%

R

Figure 1. Voltage Waveforms: AP2301 (left), AP2311 (right)

All Enable Plots are for Enable Active Low

Turn-Off Delay and Fall Time

TA=25°C V

=5V

IN

=1uF

C

L

R

=2.5Ω

OUT

V

OUT

2V/div

V

EN

5V/div

I

IN

1A/div

Device disabled

90%

50%

T

D(OFF)

90%

T

F

10%

TA=25°C V

=5V

IN

C

=1uF

L

=2.5Ω

R

OUT

Turn-On Delay and Rise Time

V

OUT

2V/div

Device enabled

V

EN

5V/div

I

IN

1A/div

Inrush current limit

AP2301/AP2311

Document number: DS32241 Rev. 5 - 2

Turn-Off Delay and Fall Time

TA=25°C

=5V

V

TA=25°C

=5V

V

IN

C

=120uF

L

=2.5Ω

R

OUT

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V

OUT

2V/div

V

EN

5V/div

I

IN

1A/div

Device disabled

IN

C

=120uF

L

R

OUT

=2.5Ω

February 2014

r

Typical Performance Characteristics (cont.)

Device Enabled Into Short-Circuit

AP2301/AP2311

Inrush Current

V

EN

5V/div

I

OUT

1A/div

V

OUT

2V/div

I

IN

2A/div

FLG 5V/div

Full-Load to Short-Circuit

Transient Response

Output short circuited

Device turns off and re-enables into current limit

TA=25°C V

=5V

IN

C

=120uF

L

R

=1Ω

OUT

TA=25°C V

=5V

IN

R

OUT

=2.5Ω

V

EN

5V/div

TA=25°C V

=5V

IN

R

=2.5Ω

OUT

CL=120uF CL=220uF

I

OUT

1A/div

CL=470uF

Short-Circuit to Full-Load

Recovery Response

V

OUT

2V/div

IIN 2A/div

FLG 5V/div

Output short circuit

emoved

Short circuit present and device thermal cycles

TA=25°C V

=5V

IN

=2.5Ω

R

OUT

No-Load to Short-Circuit

Transient Response

V

OUT

2V/div

I

IN

2A/div

Output short circuited

Device enters current limit

TA=25°C V

=5V

IN

=0Ω

R

OUT

Short-Circuit to No-Load

Recovery Response

Output short

emoved

V

OUT

2V/div

IIN 2A/div

circuit

Short circuit present and device thermal cycles

T

A

V

IN

R

OUT

=25°C

=5V

=0Ω

FLG 5V/div

AP2301/AP2311

Document number: DS32241 Rev. 5 - 2

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February 2014

Diodes AP2301FGEG, AP2301SN, AP2311FGEG, AP2311SN, AP2301M8G Schematic [ru]