The AP2181 and AP2191 are integrated high-side power switches
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and
available with both polarities of Enable input. They offer current and
thermal limiting and short circuit protection as well as controlled rise
time and under-voltage lockout functionality. A 7ms deglitch capability
on the open-drain Flag output prevents false over-current reporting
and does not require any external components.
All devices are available in SO-8, MSOP-8EP, SOT25 and
U-DFN2018-6 packages.
Pin Assignments
GND
IN
EN
( Top View )
1
2
3
IN
4
SO-8
8
NC
7
OUT
6
OUT
5
FLG
Features
Single USB Port Power Switches
Over-Current and Thermal Protection
2.1A Accurate Current Limiting
Reverse Current Blocking
95m On-Resistance
Input Voltage Range: 2.7V – 5.5V
0.6ms Typical Rise Time
Very Low Shutdown Current: 1µA (max)
Fault Report (FLG) with Blanking Time (7ms typ)
ESD Protection: 4kV HBM, 300V MM
Active Low (AP2181) or Active High (AP2191) Enable
Ambient Temperature Range: -40°C to +85°C
SOT25, SO-8, MSOP-8EP (Exposed Pad), and U-DFN2018-6:
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
for MSOP-8EP, SOT25 packages
Machine Model ESD Protection
for U-DFN2018-6, SO-8 packages
VIN
V
OUT
V
EN , VFLG
I
LOAD
T
J(MAX)
TST
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices
Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified
Input Voltage 6.5 V
Output Voltage
Enable Voltage 6.5 V
Maximum Continuous Load Current Internal Limited A
Maximum Junction Temperature 150 °C
Storage Temperature Range (Note 4) -65 to +150 °C
T
from -65°C to +150°C)
ST
400 V
300 V
VIN +0.3
V
Recommended Operating Conditions(@T
= +25°C, unless otherwise specified.)
A
Symbol Parameter Min Max Units
V
IN
I
OUT
T
A
VIH High-Level Input Voltage on EN or EN
VIL Low-Level Input Voltage on EN or EN
Input voltage 2.7 5.5 V
Output Current 0 1.5 A
Operating Ambient Temperature -40 85
Notes: 5. Test condition for SO-8: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout.
6. Test condition for MSOP-8EP: Device mounted on 2” x 2” FR-4 substrate PC board, 2oz copper, with minimum recommended pad on top layer and
thermal vias to bottom layer ground plane.
7. Test condition for SOT25: Device mounted on FR-4, 2oz copper, with minimum recommended pad layout.
layer 1.0”x1.4” ground plane.
Input UVLO
UVLO
Input Shutdown Current
SHDN
Input Quiescent Current
I
Q
Input Leakage Current Disabled, OUT grounded 1 µA
I
LEAK
Reverse Leakage Current
I
REV
Switch On-Resistance
DS(ON)
Short-Circuit Current Limit
Over-Load Current Limit
I
LIMIT
Current Limiting Trigger Threshold
I
Trig
EN Input Logic Low Voltage
V
IL
EN Input Logic High Voltage
V
IH
EN Input Leakage
I
SINK
Output Turn-On delay time
D(ON)
Output Turn-On rise time
TR
Output Turn-Off delay time
D(OFF)
Output Turn-Off fall time
TF
FLG Output FET On-Resistance
R
FLG
FLG Blanking Time
Blank
Thermal Shutdown Threshold
SHDN
Thermal Shutdown Hysteresis 25
T
HYS
Thermal Resistance Junction-to-
JA
Ambient
8. Test condition for U-DFN2018-6: Device mounted on FR-4 2-layer board, 2oz copper, with minimum recommended pad on top layer and 3 vias to bottom
= +25°C, VIN = +5V, unless otherwise specified.)
A
R
= 1k
LOAD
Disabled, I
Enabled, I
Disabled, V
= 5V,
V
IN
I
= 1.5A
OUT
VIN = 3.3V,
= 1.5A
I
OUT
= 0
OUT
= 0
OUT
= 0V, V
IN
T
= +25°C
A
OUT
-40C TA +85°C
T
= +25°C
A
-40C T
= 5V, I
REV
at VIN
SOT25, MSOP-8EP, SO-8 95 115
U-DFN2018-6 90 110