The AP2181D and AP2191D are integrated high-side power switches
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and is
available with both polarities of Enable input. They offer current and
thermal limiting and short circuit protection as well as controlled rise
time and under-voltage lockout functionality. A 7ms deglitch capability
on the open-drain Flag output prevents false over-current reporting
and does not require any external components.
All devices are available in SO-8, MSOP-8, MSOP-8EP, SOT25, and
U-DFN2018-6 packages.
Features
Single USB Port Power Switches with Output Discharge
Over-Current and Thermal Protection
2.1A Accurate Current Limiting
Fast Transient Response
Reverse Current Blocking
90m On-Resistance
Input Voltage Range: 2.7V – 5.5V
0.6ms Typical Rise Time
Very Low Shutdown Current: 1µA (max)
Fault Report (FLG) with Blanking Time (7ms typ)
ESD Protection: 4kV HBM, 300V MM
Active High (AP2191D) or Active Low (AP2181D) Enable
Ambient Temperature Range -40°C to +85°C
SOT25, SO-8, MSOP-8, MSOP-8EP (Exposed Pad), and
U-DFN2018-6: Available in “Green” Molding Compound
(No Br, Sb)
Lead-Free Finish; RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
UL Recognized, File Number E322375
IEC60950-1 CB Scheme Certified
Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. All applicable RoHS exemptions applied.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
Caution: Stresses greater than the 'Absolute Maximum Ratings' specified above, may cause permanent damage to the device. These are stress ratings only;
Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified T
functional operation of the device at these or any other conditions exceeding those indicated in this specification is not implied. Device reliability may be
affected by exposure to absolute maximum rating conditions for extended periods of time.
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken when handling
and transporting these devices
Input Voltage 6.5 V
Output Voltage
VIN +0.3
Enable Voltage 6.5 V
Maximum Continuous Load Current Internal Limited A
Maximum Junction Temperature 150 °C
Storage Temperature Range (Note 4) -65 to +150 °C
from -65°C to +150°C).
ST
Recommended Operating Conditions(@T
= +25°C, unless otherwise specified.)
A
Symbol Parameter Min Max Unit
V
I
OUT
VIL
VIH
T
IN
A
Input Voltage 2.7 5.5 V
Output Current 0 1.5 A
EN Input Logic Low Voltage 0 0.8 V
EN Input Logic High Voltage 2
Notes: 5. The discharge function is active when the device is disabled (when enable is de-asserted). The discharge function offers a resistive discharge path
for the external storage capacitor.
6. Device mounted on FR-4 substrate PCB, 2oz copper, with minimum recommended pad layout.
7. Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground
plane.