Diodes AP2172A User Manual

AP2162A/ AP2172A
POWER SWITCH WITH OUTPUT DISCHARGE
Description
The AP2162A and AP2172A are dual channel current-limited integrated high-side power switches optimized for Universal Serial Bus (USB) and other hot-swap applications. The family of devices complies with USB standards and available with both polarities of Enable input.
The devices have fast short-circuit response time for improved overall system robustness, and have integrated output discharge function to ensure completely controlled discharging of the output voltage capacitor. They provide a complete protection solution for application subject to heavy capacitive loads and the prospect of short circuit, and offer reverse current blocking, over-current, over-temperature and short-circuit protection, as well as controlled rise time and under­voltage lockout functionality. A 7ms deglitch capability on the open­drain flag output prevents false over-current reporting and does not require any external components.
All devices are available in SO-8, MSOP-8EP and U-DFN3030-8 packages.
Features
Dual Channel Current-Limited Power Switch with Output
Discharge
Fast Short-Circuit Response Time: 2µs  1.4A Accurate Current Limiting  Reverse Current Blocking  85m On-Resistance Input Voltage Range: 2.7V - 5.5V  Built-In Soft-Start with 0.6ms Typical Rise Time  Short Circuit and Thermal Protection  Fault Report (FLG) with Blanking Time (7ms typ)  ESD protection: 2kV HBM, 300V MM  Active High (AP2172A) or Active Low (AP2162A) Enable  Ambient Temperature Range: -40°C to +85°C  SO-8, MSOP-8EP and DFN3030E-8 (Exposed Pad): Available
in “Green” Molding Compound (No Br, Sb)
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)Halogen and Antimony Free. “Green” Device (Note 3)
UL Recognized, File Number E322375  IEC60950-1 CB Scheme Certified
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.
AP2162A/ AP2172A
Document number: DS32192 Rev. 4 - 2
Pin Assignments
Applications
LCD TVs & Monitors  Set-Top-Boxes, Residential Gateways  Laptops, Desktops, Servers,  Printers, Docking Stations, HUBs
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GND
IN
EN1 EN2
GND
EN1
EN2
GND
IN
EN1 EN2
IN
1
2
3
4
1 2 3
4
1
2
3
4
( Top View )
SO-8
( Top View )
MSOP-8EP
( Top View )
U-DFN3030-8
8
7
6
5
OUT1
OUT2
FLG2
8 7 6 5
8
7
6
5
FLG1
FLG1 OUT1 OUT2
FLG1 OUT1 OUT2 FLG2
FLG2
April 2013
© Diodes Incorporated
Typical Applications Circuit
AP2172 A Enable Active High
AP2162A/ AP2172A
Power Supply
2.7V to 5.5V 10k10k
ON
OFF
1uF
IN
FLG1 FLG2
EN1 EN2
GND
OUT1
OUT2
1uF
Load
10uF*
Load
10uF*1uF
Not e: * USB 2.0 requires 120 F per hub
Available Options
Part Number Channel
AP2162A 2 Active Low 1.4A 1.0A AP2172A 2 Active High 1.4A 1.0A
Enable Pin
(EN)
Current Limit
(typ)
Recommended Maximum Continuous Load Current
Pin Descriptions
Pin Number
Pin Name
GND 1 1 Ground
IN EN1 3 3 Switch 1 enable input, active low (AP2142A) or a ctive high (AP2152 A) EN2 4 4 Switch 2 enable input, active low (AP2142A) or a ctive high (AP2152 A)
FLG2 5 5 Switch 2 over-current and over-temperature fault re port; open-dra in flag is act ive low w hen triggered OUT2 OUT1 FLG1 8 8 Switch 1 over-current and over-temperature fault re port; open-dra in flag is act ive low w hen triggered
Exposed Pad Exposed Pad
SO-8
2 2 Voltage input pin
6 6 Switch 2 voltage output pin 7 7 Switch 1 voltage output pin
AP2162A/ AP2172A
Document number: DS32192 Rev. 4 - 2
MSOP-8EP
U-DFN3030-8
Exposed Pad: It should be connected to GND and thermal mass for enhanced thermal impedance. It should not be used as electrical ground conduction path.
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Function
April 2013
© Diodes Incorporated
Functional Block Diagram
AP2162A, AP2172A
EN1
UVLO
Thermal
Sense
Driver
Current
Limit
AP2162A/ AP2172A
FLG1
D eg litch
GND
Cu rrent
Sense
Discharge
IN
EN2
UVLO
Driver
Thermal
Sense
Cu rrent
Sense
Current
Limit
Control
Discharge
Control
D eg litch
GND
Absolute Maximum Ratings (@T
= +25°C, unless otherwise specified.)
A
Symbol Parameter Ratings Unit
ESD HBM Human Body Model ESD Protection 2 kV
ESD MM Machine Model ESD Protection 300 V
VIN
V
OUT
V
EN , VFLG
T
I
LOAD J(MAX)
TST
Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C)
Input Voltage 6.5 V Output Voltage
VIN +0.3 Enable Voltage 6.5 V Maximum Continuous Load Current Internal Limited A Maximum Junction Temperature 150 °C Storage Temperature Range (Note 4) -65 to +150 °C
Recommended Operating Conditions (@T
= +25°C, unless otherwise specified.)
A
Symbol Parameter Min Max Unit
VIN
I
OUT
VIH
VIL TA
Input Voltage 2.7 5.5 V Output Current 0 1.0 A High-Level Input Voltage on EN or
Low-Level Input Voltage on EN or
EN
EN
2 0 0.8 V
V
IN
Operating Ambient Temperature Range -40 +85 °C
AP2162A/ AP2172A
Document number: DS32192 Rev. 4 - 2
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OUT1
OUT2
FLG2
V
V
April 2013
© Diodes Incorporated
AP2162A/ AP2172A
Electrical Characteristics (@T
= +25°C, VIN = +5.0V, unless otherwise specified.)
A
Symbol Parameter Test Conditions (Note 5) Min Typ Max Unit
Input UVLO 1.6 2.0 2.4 V
UVLO
Input Shutdown Current Input Quiescent Current, Dual
I
Q
Disabled, I Enabled, I
OUT
OUT
= 0
= 0
0.1 1 µA
115 180 µA Input Leakage Current Disabled, OUT grounded 1 µA Reverse Leakage Current
REV
Switch On-Resistance
Over-Load Current Limit Ganged Over-Load Current Limit Current Limiting Trigger Threshold
Trig
Ganged Current Limiting Trigger Threshold
Short-Circuit Current per Channel
IOS
Ganged Short-Circuit Current Short-Circuit Response Time
EN Input Logic Low Voltage
V
IL
EN Input Logic High Voltage
V
IH
EN Input Leakage Output Leakage Current Output Turn-On Rise Time
TR
Output Turn-Off Fall Time
TF
Output Turn-On Delay Time Output Turn-Off Delay Time FLG Output FET On-Resistance
FLG
FLG Off Current
FOH
FLG Blanking Time
Blank
Discharge Resistance (Note 6)
DIS
Thermal Shutdown Threshold Thermal Shutdown Hysteresis 25
HYS
Disabled, VIN = 0V, V V
= 5V, I
IN
= +25°C
T
A
VIN = 5V, I VIN = 3.3V, I
= +25°C
T
A
= 3.3V, I
V
IN
VIN = 5V, V
= 5V, V
V
IN
= 1A,
OUT
= 1A, -40°C  TA  +85°C
OUT
= 1A,
OUT
= 1A, -40°C TA  +85°C
OUT
= 4V, CL = 10µF -40°C  TA  +85°C
OUT
= 4.8V, OUT1 &
OUT
OUT2 tied together, C
OUT
= 10µF
L
= 5V, I
at VIN
REV
SO-8 90 110 MSOP-8EP,
U-DFN3030-8
SO-8 110 130 MSOP-8EP,
U-DFN3030-8
-40°C T
+85°C
A
Output Current Slew rate (<100A/s), CL = 10µF OUT1 & OUT2 tied together, Output Current Slew rate
(<100A/s), C
= 10µF
L
OUTx connected to ground, device enabled into short circuit, C
= 10µF
L
OUT1 & OUT2 connected to ground, device enabled into short-circuit, C
V
= 0V to I
OUT
= 2.7V to 5.5V
V
IN
V
= 2.7V to 5.5V
IN
= 0V to 5.5V
V
EN
Disabled, V CL = 1µF, R CL = 1µF, R CL = 100µF, R CL = 100µF, R I
= 10mA
FLG
= 5V
V
FLG
OUT
LOAD LOAD
= 10µF
L
OUT
= 0V
= 5 = 5
LOAD LOAD
= I
(output shorted to ground)
LIMIT
= 5 = 5
CL = 10µF V
= 5V, disabled, I
IN
Enabled, R
LOAD
=1k
OUT
=1mA
0.01 0.1 µA
85 105
135
105 125
170
1.1 1.4 1.7 A
2.2 2.8 3.4 A
1.8 A
3.6 A
1.4 A
2.2 2.8 3.4 A 2 µs
0.8 V
2 V
1 µA
0.5 1 µA
0.6 1.5 ms
0.05 0.3 ms
0.2 0.5 ms
0.1 0.3 ms 20 40
0.01 1 µA
4 7 15 ms
100 140
V
I
SHDN
I
LEAK
I
R
DS(ON)
I
LIMIT
I
LIMIT_G
I
I
Trig_G
I
OS_G
T
SHORT
I
SINK
I
LEAK-O
T
D(ON)
T
D(OFF)
R
I
T
R
T
SHDN
T
SO-8 (Note 7) 115
Thermal Resistance Junction-to-Ambient
JA
MSOP-8EP (Note 8) 75
°C/W
U-DFN3030-8 (Note 8) 60
Notes: 5. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
6. The discharge function is active when the device is disabled (when enable is de-asserted or during power-up / power-down when V discharge function offers a resistive discharge path for the external storage capacitor for limited time.
7. Test condition for SO-8: Device mounted on FR-4 substrate PCB with minimum recommended pad layout.
8. Test condition for MSOP-8EP and U-DFN3030-8: Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top layer and thermal vias to bottom layer ground plane.
< V
). The
IN
UVLO
AP2162A/ AP2172A
Document number: DS32192 Rev. 4 - 2
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April 2013
© Diodes Incorporated
m
C C
Typical Performance Characteristics
AP2162A/ AP2172A
V
EN
V
OUT
50%
T
D(ON)
T
10%
50%
T
R
90%
D(OFF)
90%
10%
T
F
V
EN
50%
T
T
D(ON)
V
OUT
10%
50%
T
R
90%
D(OFF)
90%
10%
T
F
Figure 1 Voltage Waveforms: AP2162A (left), AP2172A (right)
Figure 2 Response Time to Short Circuit Waveform
All Enable Plots are for AP2162A Active Low
Turn-On Delay and Rise Time
Turn-Off Delay and Fall Time
EN 5V/div
Iin 500mA/div
Vout 2V/div
AP2162A/ AP2172A
Document number: DS32192 Rev. 4 - 2
500µs/div
CL=1F TA= +25°C RL=5
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EN 5V/div
Iin 500mA/div
Vout 2V/div
500µs/div
CL=1F TA= +25°C RL=5
April 2013
© Diodes Incorporated
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