The AP2162A and AP2172A are dual channel current-limited
integrated high-side power switches optimized for Universal Serial
Bus (USB) and other hot-swap applications. The family of devices
complies with USB standards and available with both polarities of
Enable input.
The devices have fast short-circuit response time for improved overall
system robustness, and have integrated output discharge function to
ensure completely controlled discharging of the output voltage
capacitor. They provide a complete protection solution for application
subject to heavy capacitive loads and the prospect of short circuit,
and offer reverse current blocking, over-current, over-temperature
and short-circuit protection, as well as controlled rise time and undervoltage lockout functionality. A 7ms deglitch capability on the opendrain flag output prevents false over-current reporting and does not
require any external components.
All devices are available in SO-8, MSOP-8EP and U-DFN3030-8
packages.
Features
Dual Channel Current-Limited Power Switch with Output
Discharge
Fast Short-Circuit Response Time: 2µs
1.4A Accurate Current Limiting
Reverse Current Blocking
85m On-Resistance
Input Voltage Range: 2.7V - 5.5V
Built-In Soft-Start with 0.6ms Typical Rise Time
Short Circuit and Thermal Protection
Fault Report (FLG) with Blanking Time (7ms typ)
ESD protection: 2kV HBM, 300V MM
Active High (AP2172A) or Active Low (AP2162A) Enable
Ambient Temperature Range: -40°C to +85°C
SO-8, MSOP-8EP and DFN3030E-8 (Exposed Pad): Available
UL Recognized, File Number E322375
IEC60950-1 CB Scheme Certified
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
AP2162A 2 Active Low 1.4A 1.0A
AP2172A 2 Active High 1.4A 1.0A
Enable Pin
(EN)
Current Limit
(typ)
Recommended Maximum
Continuous Load Current
Pin Descriptions
Pin Number
Pin Name
GND 1 1 Ground
IN
EN1 3 3 Switch 1 enable input, active low (AP2142A) or a ctive high (AP2152 A)
EN2 4 4 Switch 2 enable input, active low (AP2142A) or a ctive high (AP2152 A)
FLG2 5 5 Switch 2 over-current and over-temperature fault re port; open-dra in flag is act ive low w hen triggered
OUT2
OUT1
FLG1 8 8 Switch 1 over-current and over-temperature fault re port; open-dra in flag is act ive low w hen triggered
Exposed Pad — Exposed Pad
SO-8
2 2 Voltage input pin
6 6 Switch 2 voltage output pin
7 7 Switch 1 voltage output pin
AP2162A/ AP2172A
Document number: DS32192 Rev. 4 - 2
MSOP-8EP
U-DFN3030-8
Exposed Pad:
It should be connected to GND and thermal mass for enhanced thermal impedance.
It should not be used as electrical ground conduction path.
Note: 4. UL Recognized Rating from -30°C to +70°C (Diodes qualified TST from -65°C to +150°C)
Input Voltage 6.5 V
Output Voltage
VIN +0.3
Enable Voltage 6.5 V
Maximum Continuous Load Current Internal Limited A
Maximum Junction Temperature 150 °C
Storage Temperature Range (Note 4) -65 to +150 °C
Recommended Operating Conditions(@T
= +25°C, unless otherwise specified.)
A
Symbol Parameter Min Max Unit
VIN
I
OUT
VIH
VIL
TA
Input Voltage 2.7 5.5 V
Output Current 0 1.0 A
High-Level Input Voltage on EN or
Output Current Slew rate (<100A/s), CL = 10µF
OUT1 & OUT2 tied together, Output Current Slew rate
(<100A/s), C
= 10µF
L
OUTx connected to ground, device enabled into short
circuit, C
= 10µF
L
OUT1 & OUT2 connected to ground, device enabled into
short-circuit, C
V
= 0V to I
OUT
= 2.7V to 5.5V
V
IN
V
= 2.7V to 5.5V
IN
= 0V to 5.5V
V
EN
Disabled, V
CL = 1µF, R
CL = 1µF, R
CL = 100µF, R
CL = 100µF, R
I
= 10mA
FLG
= 5V
V
FLG
OUT
LOAD
LOAD
= 10µF
L
OUT
= 0V
= 5
= 5
LOAD
LOAD
= I
(output shorted to ground)
LIMIT
= 5
= 5
CL = 10µF
V
= 5V, disabled, I
IN
Enabled, R
LOAD
=1k
OUT
=1mA
0.01 0.1 µA
85 105
135
105 125
170
1.1 1.4 1.7 A
2.2 2.8 3.4 A
1.8 A
3.6 A
1.4 A
2.2 2.8 3.4 A
2 µs
0.8 V
2 V
1 µA
0.5 1 µA
0.6 1.5 ms
0.05 0.3 ms
0.2 0.5 ms
0.1 0.3 ms
20 40
0.01 1 µA
4 7 15 ms
100
140
V
I
SHDN
I
LEAK
I
R
DS(ON)
I
LIMIT
I
LIMIT_G
I
I
Trig_G
I
OS_G
T
SHORT
I
SINK
I
LEAK-O
T
D(ON)
T
D(OFF)
R
I
T
R
T
SHDN
T
SO-8 (Note 7) 115
Thermal Resistance Junction-to-Ambient
JA
MSOP-8EP (Note 8) 75
°C/W
U-DFN3030-8 (Note 8) 60
Notes: 5. Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account separately.
6. The discharge function is active when the device is disabled (when enable is de-asserted or during power-up / power-down when V
discharge function offers a resistive discharge path for the external storage capacitor for limited time.
7. Test condition for SO-8: Device mounted on FR-4 substrate PCB with minimum recommended pad layout.
8. Test condition for MSOP-8EP and U-DFN3030-8: Device mounted on 2” x 2” FR-4 substrate PCB, 2oz copper, with minimum recommended pad on top
layer and thermal vias to bottom layer ground plane.