• Active high (AP2172) or active low (AP2162) enable
• Ambient temperature range -40ºC to 85°C
• SOP-8L and MSOP-8L-EP (Exposed Pad): Available in
• Lead Free Finish / RoHS Compliant (Note 1)
• UL Recognized, File Number E322375
• IEC60950-1 CB Scheme Certified
on-resistance
“Green” Molding Compound (No Br, Sb)
Description
The AP2162 and AP2172 are integrated high-side power switches
optimized for Universal Serial Bus (USB) and other hot-swap
applications. The family of devices complies with USB 2.0 and
available with both polarities of Enable input. They offer current
and thermal limiting and short circuit protection as well as
controlled rise time and under-voltage lockout functionality.
A 7ms deglitch capability on the open-drain Flag output prevents
false over-current reporting and does not require any external
components.
All devices are available in SOP-8L and MSOP-8L-EP packages.
Applications
• Consumer electronics – LCD TV & Monitor, Game Machines
Notes: 1. EU Directive 2002/95/EC (RoHS). All applicable RoHS exemptions applied. Please visit our website at
http://www.diodes.com/products/lead_free.html
2. Pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which can be found on our website at
http://www.diodes.com/datasheets/ap02001.pdf
A 0.01-F to 0.1-F X7R or X5R ceramic bypass capacitor between IN and GND, close to the device, is
recommended. Placing a high-value electrolytic capacitor on the input and output pin(s) is recommended
when the output load is heavy. This precaution reduces power-supply transients that may cause ringing on
the input. Additionally, bypassing the output with a 0.01-F to 0.1-F ceramic capacitor improves the
immunity of the device to short-circuit transients.
Over-current and Short Circuit Protection
An internal sensing FET is employed to check for over-current conditions. Unlike current-sense resistors,
sense FETs do not increase the series resistance of the current path. When an overcurrent condition is
detected, the device maintains a constant output current and reduces the output voltage accordingly.
Complete shutdown occurs only if the fault stays long enough to activate thermal limiting.
Three possible overload conditions can occur. In the first condition, the output has been shorted to
GND before the device is enabled or before V
circuit and immediately clamps output current to a certain safe level namely I
In the second condition, an output short or an overload occurs while the device is enabled. At the instance
the overload occurs, higher current may flow for a very short period of time before the current limit function
can react. After the current limit function has tripped (reached the over-current trip threshold), the device
switches into current limiting mode and the current is clamped at I
In the third condition, the load has been gradually increased beyond the recommended operating current.
The current is permitted to rise until the current-limit threshold (I
the device is exceeded. The AP2162/AP2172 is capable of delivering current up to the current-limit threshold
without damaging the device. Once the threshold has been reached, the device switches into its current
limiting mode and is set at I
LIMIT
.
FLG Response
When an over-current or over-temperature shutdown condition is encountered, the FLG open-drain output
goes active low after a nominal 7-ms deglitch timeout. The FLG output remains low until both over-current
and over-temperature conditions are removed. Connecting a heavy capacitive load to the output of the
device can cause a momentary over-current condition, which does not trigger the FLG due to the 7-ms
deglitch timeout. The AP2162/AP2172 is designed to eliminate false over-current reporting without the need
of external components to remove unwanted pulses.
Power Dissipation and Junction Temperature
The low on-resistance of the internal MOSFET allows the small surface-mount packages to pass large
current. Using the maximum operating ambient temperature (T
calculated by:
D = RDS(ON)× I
P
Finally, calculate the junction tem perature:
J = PD x RθJA + TA
T
Where:
T
A= Ambient temperature °C θJA = Thermal resistance
R
P
D = Total power dissipation
2
IN has been applied. The AP2162/AP2172 senses the short
Thermal prot ection pr events th e IC from dama ge when heav y-overlo ad or short -circuit faults ar e present f or
extended periods of time. The AP2162/AP2172 implements a thermal sensing to monitor the operating
junction temperature of the power distribution switch. Once the die tempe rat u r e ri se s to appr o x ima te ly 14 0° C
due to excessive power dissipation in an over-current or short-circuit condition the internal thermal sense
circuitry turns the power switch off, thus preventing the power switch from damage. Hysteresis is built into
the thermal sense circuit allowing the device to cool down approximately 25°C before the switch turns back
on. The switch continues to cycle in this manner until the load fault or input power is removed. The
FLG open-drain output is asserted when an over-temperature shutdown or over-current occurs with 7-ms
deglitch.
Under-voltage Lockout (UVLO)
Under-voltage lockout function (UVLO) keeps the internal power switch from being turned on until the power
supply has reached at least 1.9V, even if the switch is enabled. Whenever the input voltage falls below
approximately 1.9V, the power switch is quickly turned off. This facilitates the design of hot-insertion systems
where it is not possible to turn off the power switch before input power is removed.
Host/Self-Powered HUBs
Hosts and self-powered hubs (SPH) have a local power supply that powers the embedded functions and the
downstream ports (see Figure 2). This power supply must provide from 5.25V to 4.75V to the board side of
the downstream connection under both full-load and no-load conditions. Hosts and SPHs are required to
have current-limit protection and must report over-current conditions to the USB controller. Typical SPHs are
desktop PCs, monitors, printers, and stand-alone hubs.
Figure 2. Typical Two-Po rt U S B Host / Self-Powered Hub
Generic Hot-Plug Applications
In many applications it may be necessary to remove modules or pc boards while the main unit is still
operating. These are considered hot-plug applications. Such implementations require the control of current
surges seen by the main power supply and the card being inserted. The most effective way to control these
surges is to limit and slowly ramp the current and voltage being applied to the card, similar to the way in
which a power supply normally turns on. Due to the controlled rise times and fall times of the
AP2162/AP2172, these devices can be used to provide a softer start-up to devices being hot-plugged into a
powered syst em. The UV LO feat ure of the AP 2162/A P2172 al so ensur es that the switc h is off aft er the car d
has been removed, and that the switch is off during the next insertion.
By placing the AP2162/AP2172 between the VCC input and the res t of the cir cuitry, t he input powe r reaches
these devices first after insertion. The typical rise time of the switch is approximately 1ms, providing a slow
voltage ramp at the output of the device. This implementation controls system surge current and provides a
hot-plugging mechanism for any device.
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further
notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither
does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will
agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages.
LIFE SUPPORT
Diodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the
President of Diodes Incorporated.