The following check should be performed for the continued protection of the customer and service technician.
LEAKAGE CURRENT CHECK
Before returning the unit to the customer, make sure you make either (1) a leakage current check or (2) a line to chassis
resistance check. If the leakage current exceeds 0.5 milliamps, or if the resistance from chassis to either side of the power
cord is less than 460 kohms, the unit is defective.
LASER RADIATION
Do not stare into beam or view directly with optical instruments, class 3A laser product.
DHT-500SD
CAUTION
Please heed the points listed below during servicing and inspection.
◎ Heed the cautions!
Spots requiring particular attention when servicing, such as
the cabinet, parts, chassis, etc., have cautions indicated on
labels or seals. Be sure to heed these cautions and the cautions indicated in the handling instructions.
◎ Caution concerning electric shock!
(1) An AC voltage is impressed on this set, so touching inter-
nal metal parts when the set is energized could cause
electric shock. Take care to avoid electric shock, by for example using an isolating transformer and gloves when
servicing while the set is energized, unplugging the power
cord when replacing parts, etc.
(2)There are high voltage parts inside. Handle with extra care
when the set is energized.
◎
Caution concerning disassembly and assembly!
Though great care is taken when manufacturing parts from
sheet metal, there may in some rare cases be burrs on the
edges of parts which could cause injury if fingers are moved
across them. Use gloves to protect your hands.
◎ Only use designated parts!
The set's parts have specific safety properties (fire resistance, voltage resistance, etc.). For replacement parts, be
sure to use parts which have the same properties. In particular, for the important safety parts that are marked ! on wiring
diagrams and parts lists, be sure to use the designated parts.
◎ Be sure to mount parts and arrange the
wires as they were originally!
For safety reasons, some parts use tape, tubes or other insulating materials, and some parts are mounted away from the
surface of printed circuit boards. Care is also taken with the
positions of the wires inside and clamps are used to keep
wires away from heating and high voltage parts, so be sure to
set everything back as it was originally.
◎ Inspect for safety after servicing!
Check that all screws, parts and wires removed or disconnected for servicing have been put back in their original positions, inspect that no parts around the area that has been
serviced have been negatively affected, conduct an insulation
check on the external metal connectors and between the
blades of the power plug, and otherwise check that safety is
ensured.
(Insulation check procedure)
Unplug the power cord from the power outlet, disconnect the
antenna, plugs, etc., and turn the power switch on. Using a
500V insulation resistance tester, check that the insulation resistance between the terminals of the power plug and the externally exposed metal parts (antenna terminal, headphones
terminal, microphone terminal, input terminal, etc.) is 1MΩ or
greater. If it is less, the set must be inspected and repaired.
CAUTION
Many of the electric and structural parts used in the set have
special safety properties. In most cases these properties are
difficult to distinguish by sight, and using replacement parts
with higher ratings (rated power and withstand voltage) does
not necessarily guarantee that safety performance will be preserved. Parts with safety properties are indicated as shown
below on the wiring diagrams and parts lists is this service
manual. Be sure to replace them with parts with the designated part number.
(1) Schematic diagrams ... Indicated by the ! mark.
(2) Parts lists ... Indicated by the ! mark.
Concerning important safety parts
Using parts other than the designated parts
could result in electric shock, fires or other
dangerous situations.
TWSOAudio transmit frame sync.
SEL_PLL2ISystem and DSCK output clock frequency selection is made at the rising edge of RESET#.
The matrix below lists the available clock frequencies and their respective PLL bit settings.
SEL_PLL2SEL_PLL1SEL_PLL0ClockType
000VCO off.
001DCLK
32010Bypass mode
011DCLK x 2
100DCLK x 4.5
101DCLK x 3
110DCLK x 3.5z
111DCLK x 4
33
36
37TSD[2]OAudio transmit serial data output 2.
38TSD[3]OAudio transmit serial data output 3.
39MCLKI/OAudio master clock for audio DAC.
40TBCKOAudio transmit bit clock.
41SEL_PLL3Clock Source
42,48NCNo connect pins. Leave open.
45RSDIAudio receive serial data.
46RWSIAudio receive frame sync.
47RBCKIAudio receive bit clock.
49XINICrystal input.
50XOUTOCrystal output.
51AVEEIAnalog power for PLL.
66:61, 58:53DMA[11:0]ODRAM address bus [11:0]
69DCAS#ODRAM column address strobe,
70DSCK_ENODRAM clock enable.
71DWE#ODRAM write enable.
72DRAS#ODRAM row address strobe.
73DMBS0OSDRAM bank select 0.
74DMBS1OSDRAM bank select 1.
96:93, 90:85,
82:77
97, 100DCS[1:0]#OSDRAM chip select [1:0]
101DQMOData input/output mask.
102DSCKOOutput clock to SDRAM.
105DCLKI27 MHz clock input to PLL.
106UDACOVideo UDAC output.
107VREFIInternal voltage to video DAC.
108CDACOVideo CDAC output.
109COMPICompensation input.
110RSETIDAC current adjustment resistor input.
111ADVEEIAnalogpower for video DAC.
113YDACOVideo YDAC output.
TSD0OAudio transmit serial data port 0.
SEL_PLL0IRefer to the description and matrix for SEL_PLL2 pin 32.
TSD1OAudio transmit serial data port 1.
SEL_PLL1IRefer to the description and matrix for SEL_PLL2 pin 32.
114VDACOVideo VDAC output.
115YUV7OYUV7 pixel output data.
116PCLK2XSCNI/O27 MHz video output pixel clock.
117PCLKQSCNO13.5 MHz video output pixel clock.
118VSYNC#I/OVertical sync, active low.
119HSYNC#I/OHorizontal sync, active low.
127:122HD[5:0]I/OHost data I/O [5:0].
128HD[6]I/OHost data I/O [6].
131HD[7]I/OHost data I/O [7].
132HD[8]I/OHost data bus 8.
133HD[9]I/OHost data bus line 9.
134HD[10]I/OHost data bus line 10.
135HD[11]I/OHost data bus line 11.
136HD[12]I/OHost data bus line 12.
137HD[13]I/OHost data bus line 13.
140HD[14]I/OHost data bus line 14.
141HD[15]I/OHost data bus line 15.
142HWRQ#OHost write request.
143HRRQ#OHost read request.
144HIRQI/OHost interrupt.
145HRST#OHost reset.
146HIORDYIHostI/O ready.
149HWR#I/OHost write.
150HRD#OHost read.
151HIOCS16#IDevice16-bit data transfer.
152HCS1FX#OHost select 1.
153HCS3FX#OHost select 3.
158, 155:154HA[2:0]I/OHost address bus.
160AUX[0]OI
162AUX[2]I/OAuxiliary ports 2.
165AUX[3]I/OAuxiliary ports 3.
169:166AUX[7:3]I/OAuxiliary ports 7:3.
170LOE#ODevice output enable.
176:173LCS[3:0]#OChip select [3:0].
197:194,
191:185,LD[15:0]I/OEPROM device data bus.
182:178
198LWRLL#ODevice low-byte write enable.
199LWRHL#ODevice high-byte write enable.
202CAMIN0ICameraYUV 0.
203CAMIN1ICameraYUV 1.
2XSRFINI/AAnalog RF signal input after passing through the equalizer
3XSIPINI/AInverting input pin of data slicer
5XSDSSLVO/ASlice level output pin
6XSRSLINTI/AReference current setting pin for analog data slicer
8XSAWRCO/AOutput for enlarge VCO range. Analog output from DAC buffer
9XSRFGCO/ARFgain control output
10XSEFGCO/AE,F gain control output
11XSFOCUSO/AOutput voltage level for focusing buffer IC
12XSTRACKO/AOutput voltage level for tracking buffer IC
13XSSLEGO/AOutput voltage level for sledge buffer IC
15XSMOTORO/AOutput voltage level for spindle motor buffer IC
17XSRFRPLPI/AHigh bandwidth low pass filter input for RFRP
18XSTELPI/AHigh bandwidth low pass filter input forTE
19XSVREF2I/A2.1V reference voltage input
20XSRFRPI/ARF ripple/envelope signal input
21XSTEXII/ATracking zero crossing input signal
23XSTEII/ATracking error input signal
24XSFEII/AFocus error input signal
25XSCEII/A
1. Center error input signal
2. Photo Interrupt input
DescriptionPin No.
PC
MPEG
DEC.
8
DHT-500SD
Pin Name
27XSSBADI/ASub-beam addition signal input
166XSPDIREFI/A
167XSFDIREFI/A
169XSPLLFTR2I/AData PLL loop filter pin#2
171XSFDOO/AOutput node of frequency detector charge pump circuit
172XSFTROPII/AInput node of loop filter OP circuit
173XSVR_PLLI/APLL reference voltage input
174XSPDOFTR2I/APhase detector filter pin#1
175XSVREFOO/AReference voltage output
176XSAWRCVCOI/AAuto Wide Range Control of VCO input pin. For enlarge VCO range in CAV mode
29XSDFCTIDetect detection signal input
30XSCSJOChip select signal for accessing control registers
31XSCLKOClock output for accessing control registers
32XSDATAI/ORegisters data input/output pin
33XSLDCOLaser diode on/off control output for both CD/DVD
34XSFGINIMotor Hall sensor input
35XSSPDONOSpindle motor on output
36, 37, 38, 39 XSFLAG[3:0]OThese pins are used to monitor some status of servo control block
48, 51, 52XGPIO[2:0]I/O
40XMP1_7I/OInternal microcontroller programmable I/O port 1.7.
41XMP1_6I/OInternal microcontroller programmable I/O port 1.6.
43XMP1_5I/OThis pin is now changed to be NC.
44XMP1_4I/OInternal microcontroller programmable I/O port 1.4.
45XMP1_3I/OInternal microcontroller programmable I/O port 1.3.
47XMP1_2I/OInternal microcontroller programmable I/O port 1.2.
49XMP1_1I/OInternal microcontroller programmable I/O port 1.1.
57XMP1_0I/O
46XMFSCSJI/OOutput chip select connected to external flash ROM chip enable pin
54XMPSENJI/OOutput program store enable connected to external ROM PSENJ pin.
56XMALEI/OThis signal is used as address latch signal in address/data mux mode
70XMCSJI/O
71XMRDJI/O
72XMWRJI/OThis signal is used as the Wire Strobe signal
73XMINT1JI/O
74, 75, 77, 78,
79, 80, 81, 82,
83, 84, 85, 86,
87, 89, 90, 91
62, 63, 64, 65,
66, 67, 68, 69bus for the 8-bit processor mode.
163XTPLCKI/OPLCK test pin
164XTSLRFI/OSLRF test pin
59XOSC1ICrystal input/System clock. The input frequency from outside crystal or oscillator is 33.8688MHz
60XOSC2OCrystal output
53XCRSTJI
94XHCS1JIThis pin is used to select the command block task file registers
93XHCS3JIThis pin is used to select the control block task file registers
103XHIORJIAsserted by the host during a host I/O read operation
104XHIOWJIAsserted by the host during a host I/O write operation
105XHDRQO
101XHDACKJI
99XHCS16JO
50XHRSTJIHost Reset. The reset of ATA bus
100XHINTO
XMA[15:0]I/OThese pins are used as address bus
XMD[7:0]I/O
Type
Phase detector reference current generator. Connect a resistor between this pin and
ground to set reference current
Frequency detector reference current generator. Connect a resistor between this pin and
ground to set reference current
1. These pins are used as general purpose I/O bus
2. When use internal microcontroller, XGPIO[2] can be used as programmable I/O port 3.6.
Internal microcontroller programmable I/O port 1.0.
This pin is default used as the A16 (microcontroller address line 16)
1. This signal must be asserted for all microcontroller accesses to the register of this chip
2. When use internal microcontroller, this signal can be used as programmable I/O port 3.1
1. This signal is used as the Read Strobe signal
2. When use internal microcontroller, this signal can be used as programmable I/O port 3.0
1. This signal is an interrupt line to the microcontroller
2. When use internal microcontroller, this signal can be used as programmable I/O port 3.7
These pins are used as data bus for the 16-bit processor mode, or the address/data mux
Chip Reset. As asserted low input generates a component reset that stops all operations within
the chip and deasserts all output signals. All input/output signals are set to input.
1.
DMA request. This pin is configured as the DMA request signal, and is used during DMA transfer
between the host and the controller. This pin is tri-stated when DMA transfers are not enabled.
2.
MPEG acknowledge. This pin is used as the ACKJ signal when MPEG interface mode is selected.
1. DMA acknowledge. This pin is configured as DACKJ, and is used as the DMA acknowledge
signal during DMA data transfers.
2. MPEG request. This pin is used as the REQ signal when MPEG interface mode is selected
1. 16-bit data select. This signal indicates that a 16-bit data transfer is active on the host data
bus. This pin is open-drain tri-state output.
2. MPEG clock. This pin is used as the CLOCK signal when MPEG interface mode is selected.
1. Host interface request. This tri-state pin is the host interrupt request, and is asserted to
indicate to the host that the controller needs attention.
2. MPEG begin. This pin is used as the BEGIN signal when MPEG interface mode is selected
DescriptionPin No.
9
DHT-500SD
Pin Name
97XHPDIAGJI/OThis pin is used as the Passed Diagnostics signal, and may be an input or an open-drain output
92XHDASPJI/O
102XHIORDYI/O
95, 96, 98XHA[2:0]I
106, 107, 108,2.
109, 111, 112,3. VCD I/F. Bit3-0 are used as VCD I/F signal when VCD function is enabled. The relationship of
113, 114, 116,bit3-0 and VCD I/F is as follow
117, 118, 119,HD0—CD-DATA
120, 121, 122,HD1—CD-LRCK
123HD2—CD-BCK
143XRSDCLKOThis signal is the clock output for SDRAM
147XROEJO
142XRWEJOThis signal is asserted low when a buffer memory write operation is active
124, 125, 126,
127, 128, 129,
131, 132, 134,
135, 136, 137,
138, 139, 140,
141
4AVDD5_DSAnalog Power +5V for Data Slicer part
14AVDD5_DAAnalog Power +5V for DAC part
26AVDD5_ADAnalog Power +5V for ADC part
168AVDD5_PLAnalog Power +5V for Data PLL part
7, 55, 58, 76,
115, 146,
150, 162
1AVSS_DSAnalog Ground for Data Slicer part
16AVSS_DAAnalog Ground for DAC part
22AVSS_ADAnalog Ground for ADC part
170AVSS_PLAnalog Ground for Data PLL part
28, 42, 61,
88, 110, 130,
138, 154, 165
XHD[15.0]I/O
XRA[11:0]O1: Normal operation
XRD[15:0]I/OThese signals are the 8-bit parallel data lines to/from the buffer memory.
VDDPower +3.3V for digital core logic and pad
GNDDigital Ground core logic and pad.
Type
This pin is used as the Drive Active/Slave Present signal, and is an input or an open-drain
output. This pin is used for Master/Slave drive communication and/or for driving an LED
1. I/O channel ready. This signal is driven low to extend host transfer cycles when the controller
is not ready to respond. This pin will be tri-stated when a read or write is not in progress.
2. MPEG error. This pin is used as the ERROR signal when MPEG interface mode is selected
Host address lines. The host address lines A[2:0] are used to access the various host control,
status, and data registers
1. Host data bus. This bus is used to transfer data and status between the host and the controller.
MPEG data bus 7-8. The HD[7:0] are used as the DATA [7:0] when MPEG interface mode is selected.
HD3—CD-C2PO
This signal is used as the memory output enable for external DRAM buffers. After RSTJ is
asserted, this signal will be low
This signal is used as Row address output to external DRAM buffer. After RSTJ is asserted, this
signal will be high
This signal is used as column address output to external DRAM. After RSTJ is asserted, this
signal will be high
1. RAM address lines. These are bits11-0 for addressing the buffer memory.
2. Hardware setting. The bits6-0 are used as hardware setting for some functions.
RA[9] : FLASH size is 64K/128K
1: FLASH size is 64K
0: FLASH size is 128K
RA[8] : External CPU is 8032/H8
1: 8032
0: H8
RA[7] : Microcontroller programmable I/O port 1 pin control
1: By internal microcontroller
0: By registers to decide input/output
RA[6] : System test pin output
0: System test pin output
RA[5] : For testing purpose, don’t need to set
RA[4] : IDE master/slave
1: Slave
0: Master
RA[3] : For testing purpose, don’t need to set
RA[2] : For testing purpose, don’t need to set
RA[1-0] : MCU Mode selection
11: Normal Mode (inter nal uP, internal address latch)
10: Outside uP Mode (ICE Mode)
01: Test mode for internal uP testing
00: Internal uP mode with external address latch
DescriptionPin No.
10
SP3721A (ME: U2)
CDRF
CDRDDC
DHT-500SD
HOLD1
VNA
FNN
FNP
DIP
DIN
RX
BYP
SIGO
VPA
AIP
AIN
ATON
ATOP
49505152535455565758596061626364
DVDRFP
DVDRFN
PD1
PD2
CP
CN
A2
B2
C2
D2
1
2
3
4
5
6
7
8
9
10
11
D
12
C
13
B
14
A
15
F
16
E
NC
VCI2
CDTE
TOP VIEW
VNB
DVDLD
DVDPD
CDLD
CDPD
VC
LDON#
VCI
VPB
VIIRR
VIP
32313029282726252423222120191817
VIB
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
FDCHG#
SDEN
SDATA
SCLK
LCP
LCN
CE
FE
TE
MEI
MEV
TPH
DFT
PI
MIN
MEVO
MLPF
SP3721A Terminal Function
Pin Name
Type
1, 2DVDREP, DVDRENIRF Signal Inputs.Differential RF signal attenuator input pins
63CDRFIRF Signal Inputs.Single-ended RF signal attenuator input pin
59, 60AIP, AINIAGC Amplifier Inputs.Differential AGC amplifier input pins
53, 54DIP, DINI
Analog inputs for RF Single Buffer.Differential analog inputs to the RF single-ended output buffer
and full wave rectifier
Low Impedance Enable.A TTL compatible input pin that activates the FDCHG switches. A low
32FDCHG#I
level activates the switches and the falling edge of the internal FDCHG triggers the fast decay for
the MIRR bottom hold circuit. (open high)
49HOLD1I
Hold Control. A TLL compatible control pin which, when pulled high, disables the RF AGC charge
pump and holds the RF AGC amplifier gain at its present value.(open high)
11~14D, C, B, AIPhoto Detector Interface Inputs. Inputs from the main beam Photo detector matrix outputs
5~8A2, B2, C2, D2I
Photo Detector Interface Inputs.AC coupled inputs for the DPD from the main beam Photo
detector matrix outputs
15~16F, EICD tracking Error Inputs. Inputs from the CD photo detector error outputs.
3~4PD1, PD2ICD Photo detector Interface Inputs. Inputs from the CD photo detector error outputs
40MEIIMirror Envelope Inputs.The SIGO envelope input pin
35MINI
RF signal Input for Mirror. AC coupled inputs for the mirror detection circuit from the pull-in signal
output. (PI)
21DVDPDIAPC Input. DVD APC input pin from the monitor photo diode
23CDPDIAPC Input. CD APC input pin from the monitor photo diode
25LDON#IAPC Output On/Off.APC output control pin. A low level activates the LD output. (open high)
61, 62ATON/ATOPODifferentialAttenuator Output. Attenuator outputs
51, 52FNN, FNPODifferential Normal Output. Filter normal outputs
57SIGOOSingle Ended Normal Output. Single-ended RF output
64CDRFDCOCD RF Signal Output. Single ended CD RF summing output
42FEOFocusingError Signal Output. Focus error output reference to VCI
41TEOTracking Error Signal Output. Tracking error output reference to VCI
DescriptionPin No.
11
DHT-500SD
Pin Name
43CEOCenter Error Signal Output. Center error output reference to VCI
34NEVOOSIGO Bottom Envelope Output. Bottom envelope for mirror detection
22DVDLDOAPC output. DVD APC output pin to control the laser power
24CDLDOAPC output. CD APC output pin to control the laser power
56BYPI/OThe RF AGC integration capacitor CBYP, is connected between BYP and VPA
9CPI/O
10CNI/O
45LCP—Center Error LPF pin. An external capacitance is connected between this pin and the LCN pin
44LCN—Center Error LPF pin. An external capacitance is connected between this pin and the LCP pin
30MP—MIRR signal Peak hold pin. An external capacitance is connected to between this pin and VPB
31MB—MIRR signal Bottom hold pin. An external capacitance is connected to between this pin and VPB
39MEV—Sigo Bottom Envelope pin. An external capacitance is connected to between this pin and VPB
17CDTE—CD Tracking. E-F Opamp output for feedback
38TPH—PI Top Hold pin. An external capacitance is connected to between this pin and VPB
26VC—
27VCI—Reference Voltage input. DC bias voltage input for the servo input reference
18VCI2—Reference Voltage input. DC bias voltage input for the servo input reference
55RX—
33MLPF—MIRR signal LPF pin. An external capacitance is connected between this pin and VPB
19NC—No Connect
48SDENI
47SDATAI/O
46SCLKI
58VPAPower. Power supply pin for the RF block and serial port
28VPBPower. Power supply pin for the servo block
50VNAGround. Ground pin for the RF block and serial port
20VNBGround. Ground pin for the servo bolck
Type
Defect Output. Pseudo CMOS output. When a defect is detected, the DFT output goes high. Also
the servo AGC output can be monitored at this pin, when CAR bits 7-4 are ‘0011’
Pull-in Signal Output. The summing signal output of A, B, C, D or PD1, PD2 for mirror detection.
Reference to VCI
Differential Phase tracking LPF pin. An external capacitance is connected between this pin and
the CN pin
Differential Phase tracking LPF pin. An external capacitance is connected between this pin and
the CP pin
Reference Voltage output. This pin provides the internal DC bias reference voltage (+2.5V lix).
Output Impedance is less than 50ohms
Reference Resistor Input. An external 8.2kohm, 1% resistor is connected from this pin to ground
to establish a precise PTAT (proportional to absolute temperature) reference current for the filter
Serial Data Enable. Serial Enable CMOS input. A high level input enable the serial port (Not to be
left open)
Serial Data. Serial data bi-directional CMOS pin. NRZ programming data for the internal registers
is applied to this input ( Not to be left open)
Serial Clock. Serial Clock CMOS input. The clock applied to this pin is synchronized with the data
applied to SDATA (Not to be left open)
Active on the positive going edge to sample all input.
Disables or enables device operation by masking or enabling all input
except CLK,CKE and L(U)DQM
Masks system clock to freeze operation from the next clock cycle.
CKE should be enabled at least one cycle prior to new command.
Disable input buffers for power down in standby.
Row/column aaddresses are multiplexed on the same pins.
Row address : RA0 ~ RA10,column address : CA0 ~ CA7
Selects bank to activated during row address latch time.
Select bank for read/write during column address latch time.
Latches row addresses on the positive going edge of the CLK
with RAS low.
Enables row access & precharge.
Latches column addresses on the positive going edge of the CLK
with CAS low.
Enables column access.
Enables write operation and row precharge.
Latches data in starting from CAS, WE active.
Makes data output Hi-Z, t
Blocks data input when L(U)DQM active.
Data inputs/outputs are multiplexed on the same pins.
Powe and ground for the input buffers and the core logic.
Isolated power supply and ground for the output buffers to provide
improved noise immunity.
This pin is recommended to be left No Connection on the device.
SHZ after the clock and masks the output.
14
MX29LV800ABTC-70 (ME: U10)
NC
WE
NC
NC
1
2
3
4
5
6
7
A9
8
A8
9
10
11
12
13
14
15
16
17
18
A7
19
A6
20
A5
21
A4
22
A3
23
A2
24
A1
A15
A14
A13
A12
A11
A10
A19
RESET
RY/BY
A18
A17
BLOCK DIAGRAM
DHT-500SD
48
A16
47
BYTE
46
GND
45
Q15/A-1
44
Q7
43
Q14
42
Q6
41
Q13
40
Q5
39
Q12
38
Q4
37
VCC
36
Q11
35
Q3
34
Q10
33
Q2
32
Q9
31
Q1
30
Q8
29
Q0
28
OE
27
GND
26
CE
25
A0
CE
OE
WE
RESET
A0-A19
CONTROL
INPUT
LOGIC
ADDRESS
LATCH
AND
BUFFER
PROGRAM/ERASE
HIGH VOLTAGE
X-DECODER
FLASH
ARRAY
Y-DECODER
Y-PASS GATE
SENSE
AMPLIFIER
ARRAY
SOURCE
PGM
DATA
HV
HV
WRITE
S TAT E
MACHINE
(WSM)
STATE
REGISTER
COMMAND
DA TA
DECODER
COMMAND
DATA LATCH
Q0-Q15/A-1
PROGRAM
DATA L AT C H
I/O BUFFER
15
BH7862FS (MAIN:IC11)
DHT-500SD
01CTRAP
02MUTE1MUTE1
CIN
03
04GND
05YIN
06VCC
07GND
08PYIN
09GND
10PYTRAP
11VCC
12PbIN
13GND
14PrIN
15MUTE2
1.5-6M
20k
CLAMP
CLAMP
20k
20k
MUTE2
BPF
LPF
12M
LPF
LPF
LPF
6M
6M
6M
6dB
6dB
6dB
6dB
6dB
75ohm
75ohm
75ohm
75ohm
75ohm
TEST
32
31
30
29
28
27
22
21
20
19
18
COUT
TEST
MIXOUT
MIXFB
GND
YTRAP
GND26
YOUT25
YFB24
GND23
PYOUT
PYFB
GND
PbOUT
N.C.
16PrTRAP
6dB
75ohm
BH7862FS Terminal Function
Pin No.
Port
1CTRAP
10PYTRAP
16PrTRAP
Pin for LC resonation
27YTRAP
2MUTE1Mute control pin, L: C, MIX,Y simultaneous mute
3CIN
12PbINSignal input pin, chroma signal & color-difference signal
14PrIN
4, 7, 9, 13, 20, 23, 26, 28
GNDGND pin
5YINSignal input pin, luminance signal
8PYIN
6
11Powersupply for PY, Pb, Pr
VCC
Powersupply for C, MIX,Y
15MUTE2Mute control pin, L: PY,Pb, Pr simultaneous mute
17PrOUT
19PbOUT