Dell PowerEdge XR2 User Manual

Dell EMC PowerEdge XR2

Technical Guide

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May 2020

Rev. A02

Contents

1 System overview.......................................................................................................................... 5

Introduction............................................................................................................................................................................ 5

New technologies.................................................................................................................................................................. 5

2 System features...........................................................................................................................6

Product comparison.............................................................................................................................................................. 6

Specifications......................................................................................................................................................................... 7

3 Chassis views and features .......................................................................................................... 9

Inside the system...................................................................................................................................................................9

4 Processor...................................................................................................................................10

Processor features...............................................................................................................................................................10

Supported processors......................................................................................................................................................... 10

Chipset................................................................................................................................................................................... 11

5 Memory..................................................................................................................................... 13

Memory speed......................................................................................................................................................................13

Memory module installation guides.................................................................................................................................... 13

6 Storage......................................................................................................................................15

Supported drives and SSD drives...................................................................................................................................... 15

Storage controllers...............................................................................................................................................................15

IDSDM/vFlash module........................................................................................................................................................ 15

Boot Optimized Storage Subsystem (BOSS).................................................................................................................. 16

Integrated M.2 boot solution.............................................................................................................................................. 16

7 PCIe slots...................................................................................................................................17

PCIe expansion cards...........................................................................................................................................................17

8 Power, Thermal, and Acoustics.................................................................................................... 18

Power consumption and energy efficiency.......................................................................................................................18

Power supply units...............................................................................................................................................................19

Thermal and acoustics.........................................................................................................................................................19

9 Rails..........................................................................................................................................22

10 Dell EMC OpenManage systems management..............................................................................23

11 Appendix A. Additional specifications.......................................................................................... 24

Power supply specifications...............................................................................................................................................24

Chassis dimensions..............................................................................................................................................................24

Environmental specifications............................................................................................................................................. 25

Contents 3

Video specifications.............................................................................................................................................................26

12 Appendix B. Standards compliance............................................................................................. 28

13 Appendix C. Additional resources............................................................................................... 29

14 Appendix D. Support and deployment services.............................................................................30

ProDeploy Enterprise Suite and Residency Services......................................................................................................30

ProDeploy Plus...............................................................................................................................................................30

ProDeploy....................................................................................................................................................................... 30

Basic Deployment.......................................................................................................................................................... 30

ProSupport Enterprise Suite...............................................................................................................................................31

ProSupport Plus................................................................................................................................................................... 31

ProSupport............................................................................................................................................................................31

ProSupport One for Data Center...................................................................................................................................... 32

Support Technologies......................................................................................................................................................... 32

Additional professional services.........................................................................................................................................33

Dell Education Services.......................................................................................................................................................33

Dell EMC Global Infrastructure Consulting Services.......................................................................................................33

Dell EMC Managed Services..............................................................................................................................................33

Contents

System overview

Introduction

The Dell PowerEdge XR2 is the latest rugged 2-socket, 1U rack server designed to run complex workloads in locations constrained by space or environmental challenges. The system is built for military purposes, that has shock and vibration requirements, oil and gas, and marine ship board transportation usage. The system features the Intel® Xeon® Processor Scalable family, up to 16 DIMMs, PCI Express (PCIe) 3.0 enabled expansion slots, and a choice of network interface technologies to cover NIC and LOM.

The PowerEdge XR2 adds new storage capacity options, making it well suited for software defined storage and data intensive applications that require greater storage, while not sacrificing I/O performance.

New technologies

The PowerEdge XR2 incorporates a number of new technologies to improve performance and flexibility. Below are the list of the new technologies offered:

• Intel Xeon Processor Scalable family

• Intel Lewisburg chipset

• 2666 MT/s DDR4 memory

• NVMe connection direct to processors

• Integrated M.2 module

• Optional M.2 based Boot Optimized Storage Solution (BOSS) module

• Dual core ARM processor for iDRAC

• Advanced vector cooling for PCIe slots

• NVMe SSD support

System overview 5

System features

Product comparison

Table 1. Product comparison table

Feature PowerEdge XR2 PowerEdge R420xr

Processors Intel Xeon Processor Scalable Family Intel Xeon processor E5-2400 v2 product

family

Chipset Intel C620 Intel C610

Memory 16 x DDR4 RDIMM/LRDIMM 12 x DDR3 RDIMM and UDIMM

Disk Drives

PCIe Slots Up to 2 x PCIe Gen3 Up to 2 x PCIe Gen3

RAID Controller

• 8 x 2.5-inch SAS/SATA SSD

• 4 x 2.5-inch NVMe SSD + 4 x 2.5 inch SAS/SATA

• 2 x 2.5-inch NVMe SSD + 6 x 2.5 inch SAS/SATA

• S140 (NVMe)

NOTE: S140 is not supported as

factory installed.

• HBA330 (Internal)

• H730P

• H330

4 x 2.5-inches SAS/SATA SSD only

• S110

• H310

• H710

• H710P

• H810 (external)

Backplane

Embedded NIC

Power Supplies

• 8 x 2.5 inch SAS/SATA

• 4 x 2.5 inch NVMe SSD + 4 x 2.5 inch SAS/SATA

• 2 x 2.5 inch NVMe SSD + 6 x 2.5 inch SAS/SATA

2 x 1Gb LOM and optional LAN on riser card:

• 2 X 1Gb

• 2 X 10Gb

• 2 X 10Gb SFP+

• 2 X 25Gb SFP+

• Dual hot-plug redundant 550 W AC

• Dual hot-plug redundant - 48V 600 W DC

NOTE:

The DC Power Supply for the XR2 uses the Anderson Power Products Saf-D-Grid power connector. The compatible power cords from Anderson Power Products are model

• 4 x 2.5 inch or 3.5 inch SAS/SATA

2 x 1Gb

Dual hot-plug redundant 550 W AC

6 System features

Feature PowerEdge XR2 PowerEdge R420xr

2035KZx and 2058KZx, where 'x' is the length in meters.

Remote Management iDRAC9 iDRAC7

LCD module LCD module option in bezel LCD by default

TPM TPM 2.0 China, TPM1.2, TPM2.0 TPM China, TPM1.2, TPM2.0

USB ports

iDRAC Direct front port Micro USB USB type A

Cooling Fan Up to 6 fan support Up to 6 fan support

IDSDM Module

• Front: 2 ports

• 1 standard USB 2.0

• 1 Micro USB dedicated to iDRAC

• Rear: 2 ports (USB 3.0)

• Internal: 1 port(USB 2.0)

• Internal Dual SD Module (IDSDM) and vFlash

One port

Internal Dual SD Module (IDSDM)

BOSS Module

PERC Mini - PERC 9 (dedicated slot) Mini - PERC 8 (dedicated slot)

GPU 1 x low profile, up to 75 W(single wide) None

Integrated 2 x M.2 ports

HWRAID BOSS w/ 2x M.2 ports

None

Specifications

Table 2. Technical specifications

Feature Specification

Form factor 1U rack server

Chassis dimension

• Height: 42.80 mm — 1.69 inches

• Width: 482.0 mm — 18.97 inches

• Depth with bezel:

• 8 x 2.5 inch

• Front bezel to rear PSU handle: 610.8 mm (24.04 inches)

• Front bezel to rear wall: 577.5 mm (22.73 inches)

• Depth without bezel:

• 8 x 2.5 inch

• Front bezel to rear PSU handle: 581.34 mm (22.88 inches)

• Front bezel to rear wall: 548.25 mm (21.58 inches)

Processors Intel Xeon Processor Scalable Family

Processor sockets Up to 2-sockets

Chipset Intel C621-1G

Memory

RAID controller

• Up to 2 TB

• Support up to 16 DIMMs

• Speeds up to 2666 MT/s

• Supports RDIMM and LRDIMM

• Supports registered ECC DDR4 DIMM only

• HBA330(Internal)

System features 7

Feature Specification

• S140(NVMe)

NOTE: S140 is not supported as factory installed.

• H330

• H730P

Drive bays

PCIe slots Up to 2x PCIe Gen3 slots (x16)

Power supply

GPU NVIDIA T4

Systems management Version 2.0

Operating systems

8 x 2.5 inch SAS/SATA

4 x 2.5 inch NVMe SSD + 4 x 2.5 inch SAS/SATA

2 x 2.5 inch NVMe SSD + 6 x 2.5 inch SAS/SATA

• 550W, 51.3 mm-Platinum

• -48V 600W DC

• Windows Server

• RHEL

• SUSE Linux Enterprise Server

• Ubuntu

• vSphere ESXi

• XenServer

8 System features

Chassis views and features

Inside the system

CAUTION: Many repairs may only be done by a certified service technician. You should only perform troubleshooting and

simple repairs as authorized in your product documentation, or as directed by the online or telephone service and

support team. Damage due to servicing that is not authorized by Dell is not covered by your warranty. Read and follow

the safety instructions that are shipped with your product.

Figure 1. Inside the system

Front IO board (VGA, ESATA, M.2, internal USB port, and smart

1. card controller)

3. Cabling latch 4. Power interposer board

5. MiniPERC riser or NVMe PERC riser 6. Low profile expansion riser 2

7. Low profile expansion riser 1 8. Processor 2 blank

9. Heat sink and processor 1 10. Air shroud

11. Hard drive backplane

2. Cooling fan (one processor configuration- 5 fans, two processor configuration - 6 fans)

Chassis views and features 9

Processor

The new Intel Xeon Processor Scalable Family processor is the most advanced compute core featuring a new core micro architecture optimized to accelerate a wide range of compute workloads. It delivers improved TCO through the best per core performance.

Topics:

• Processor features

• Supported processors

• Chipset

Processor features

The list below shows the features of the Intel Xeon Scalable Family processor:

• Up to 24 cores with Intel HT Technology (2 threads/core)

• Intel Turbo Boost technology (excludes Bronze processors)

• Between 85W-150W TDP

• Up to 1280GB/socket memory capacity on all standard processor

• 14nm process Technology

• Rebalanced Cache Hierarchy: 1.375MB Last level Cache/core

• Support for Intel AVX-512

• Intel Ultra Path Interconnect (UPI) with bandwidth up to 10.4 GT/s

• 6 channels DDR4 per CU RDIMM and LRDIMM

• 2133, 2400, 2666 speeds at 2 DIMMs per channel

• Memory Protection Extensions (MPX) support

• Integration of next generation Intel Omni-Path Fabric controller on select -F processors

• Up to 48 PCIe lanes per CPU with x16, x8, and x4 Bifurcation support

• PCI Express 3.0 (2.5, 5.0, 8.0GT/s)

• Separate Reference with Independent Spread Spectrum Clocking (SRIS)

• MCTP Scaling

• Per Core P-State (PCPS)

• Uncore Frequency Scaling (UFS)

• Energy Efficient Turbo (EET)

• On die PMAX detection

Supported processors

Table 3. Supported processors

Processor number

6252 150 24 Gold CXL

6248 150 20 Gold CXL

6242 150 16 Gold CXL

6240 150 18 Gold CXL

6238 140 22 Gold CXL

6234 130 8 Gold CXL

6230 125 20 Gold CXL

6226 125 12 Gold CXL

10 Processor

TDP (W) Core count Segment SLX/CXL

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