Dell PowerEdge C6400 User Manual

Dell EMC PowerEdge C6400

Technical Specifications

Reg ula tor y M ode l: E43 S S eries Reg ula tor y T ype : E 43S 001 Dec emb er 202 0 Rev . A 03

Notes, cautions, and warnings

NOTE: A NOTE indicates important information that helps you make better use of your product.

CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid

the problem.

WARNING: A WARNING indicates a potential for property damage, personal injury, or death.

© 2017 - 2020 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be trademarks of their respective owners.

Contents

Chapter 1: Technical specifications............................................................................................... 4

Dimensions of the Dell EMC PowerEdge C6400 enclosure...................................................................................... 4

Chassis weight..................................................................................................................................................................... 5

Supported operating systems...........................................................................................................................................5

PSU specifications.............................................................................................................................................................. 5

Chassis management board specifications....................................................................................................................6

Drives and storage specifications.................................................................................................................................... 6

Midplane specifications...................................................................................................................................................... 7

Environmental specifications............................................................................................................................................ 7

Standard operating temperature specifications..................................................................................................... 7

Expanded operating temperature specifications .................................................................................................16

Particulate and gaseous contamination specifications........................................................................................17

Maximum vibration specifications............................................................................................................................ 18

Maximum shock specifications................................................................................................................................. 18

Maximum altitude specifications.............................................................................................................................. 18

Fresh Air Operation......................................................................................................................................................18

Contents 3

Technical specifications

The technical and environmental specifications of your system are outlined in this section.

Topics:

• Dimensions of the Dell EMC PowerEdge C6400 enclosure

• Chassis weight

• Supported operating systems

• PSU specifications

• Chassis management board specifications

• Drives and storage specifications

• Midplane specifications

• Environmental specifications

Dimensions of the Dell EMC PowerEdge C6400 enclosure

1

Figure 1. Dimensions of PowerEdge C6400 enclosure

4 Technical specifications

Table 1. Dimensions of the PowerEdge C6400 enclosure

Xa Xb Y Za Zb Zc

482.6 mm (19 inches)

448 mm (17.63 inches)

86.8 mm (3.41 inches)

26.8 mm (1.05 inches)

763.2 mm (30.28 inches)

797.3 mm (31.38 inches)

Chassis weight

Table 2. Chassis weight of the Dell EMC PowerEdge C6400 enclosure with PowerEdge C6420 sleds

System Maximum weight (with all sleds and drives)

12 x 3.5-inch hard drive systems 43.62 Kg (96.16 lb)

24 x 2.5-inch hard drive systems 41.46 Kg (91.40 lb)

No backplane systems 34.56 Kg (76.19 lb)

Supported operating systems

The Dell EMC PowerEdge C6400 supports the following operating systems:

● Canonical Ubuntu LTS

● Citrix XenServer

● Microsoft Windows Server with Hyper-V

● Red Hat Enterprise Linux

● SUSE Linux Enterprise Server

● VMware ESXi

NOTE:

For more information about the specific versions and additions, see https://www.dell.com/support/home/drivers/

supportedos/poweredge-c6400

PSU specifications

The Dell EMC PowerEdge C6400 enclosure supports two AC power supply units (PSUs).

Table 3. PSU specifications

PSU wattage Class Heat dissipation

(maximum)

2400 W AC Platinum 9000 BTU/hr 50/60 Hz

2000 W AC Platinum 7500 BTU/hr 50/60 Hz

1600 W AC Platinum 6000 BTU/hr 50/60 Hz

NOTE: Heat dissipation is calculated using the PSU wattage rating.

NOTE: This system is also designed to connect to the IT power systems with a phase to phase voltage not exceeding 240

V.

Frequency Voltage Maximum input

100–240 V AC, autoranging

current

14 A–16 A

11.5 A

10 A

NOTE: If a system with 2400 W AC PSU operates at low line 100–120 V AC, then the power rating per PSU is derated to

1400 W.

Technical specifications 5

NOTE: If a system with 2000 W AC PSU operates at low line 100–120 V AC, then the power rating per PSU is derated to

1000 W.

NOTE: If system with 1600 W AC PSU operates at low line 100–120 V AC, then the power rating per PSU is derated to 800

W.

Chassis management board specifications

Figure 2. Chassis management board specifications

Fan cage 1 connector for fans 1 and 2 2. Left midplane signal cable

1.

3. Chassis management board signal cable to backplane 4. Chassis management board power connector from PIB

5. Chassis management board signal cable to PIB 6. FPGA connector

7. MCU connector 8. COM connector

9. Firmware jumpers 10. Right midplane signal cable

11. Fan cage 2 connector for fans 3 and 4

Drives and storage specifications

The Dell EMC PowerEdge C6400 enclosure supports SAS and SATA hard drives and Solid State Drives (SSDs).

Table 4. Supported drive options for the Dell EMC PowerEdge C6400 enclosure

Maximum number of drives in the enclosure Maximum number of drives assigned per sled

12 x 3.5-inch drive systems Three SAS or SATA hard drives and SSDs per sled

24 x 2.5-inch drive systems Six SAS or SATA hard drives and SSDs per sled

24 x 2.5-inch drive systems with NVMe The NVMe backplane supports either of these configurations:

● Two NVMe drives and four SAS or SATA hard drives and SSDs per sled

● Six SAS or SATA hard drives and SSDs per sled

M.2 SATA drive (optional) The supported capacity of the M.2 SATA card is up to 240 GB

NOTE: The M.2 SATA card can be installed on the x16

riser slot (slot 5).

Micro-SD card (optional) for boot (up to 64 GB) One on each PCIe riser of each sled

6 Technical specifications

Table 5. Supported RAID options with M.2 SATA drives

Options Single M.2 SATA drive without RAID Dual M.2 SATA drives with hardware

Hardware RAID No Yes

RAID Mode N/A RAID 1

Number of drives supported 1 2

Supported CPUs CPU 1 CPU 1 and CPU 2

RAID

Midplane specifications

Figure 3. Midplane specifications

Midplane signal connector 2 2. Thermal sensor cable connector

1.

3. Chassis management board cable connector 4. Midplane +12 V power cable connector

5. Midplane power cable ground connector

Environmental specifications

The sections below contains information about the environmental specifications of the system.

NOTE:

For additional information about environmental certifications, please refer to the Product Environmental Datasheet

located with the Manuals & Documents on www.dell.com/poweredgemanuals

Standard operating temperature specifications

NOTE:

1. Not available: Indicates that the configuration is not offered by Dell EMC.

2. Not supported: Indicates that the configuration is not thermally supported.

NOTE: All components including the DIMMs, communication cards, M.2 SATA, and PERC cards can be supported with

sufficient thermal margin if the ambient temperature is equal to or below to the maximum continuous operating temperature listed in these tables except for the Mellanox DP LP card and Intel Rush Creek card.

Technical specifications 7

Table 6. Standard operating temperature specifications

Standard operating temperature Specifications

Temperature ranges (for altitude less than 950 m or 3117 ft) 10°C–35°C (50°F–95°F) with no direct sunlight on the

equipment.

NOTE: Some configurations require a lower ambient temperature. For more information, see the following tables.

Table 7. Maximum continuous operating temperature for nonfabric dual processor configuration

TDP

Watts

205 W

Process

or

model

8280

8280L

8280M

8270

8268

Heat sink

model

CPU1:

FMM2M |

CPU2:

V2DRD

CPU1:

FMM2M |

CPU2:

V2DRD

CPU1:

FMM2M |

CPU2:

V2DRD

CPU1:

FMM2M |

CPU2:

V2DRD

CPU1:

FMM2M |

CPU2:

V2DRD

Max

memo

ry/

proce

ssor

CPU1:

6 |

CPU2:

8

CPU1:

6 |

CPU2:

8

CPU1:

6 |

CPU2:

8

CPU1:

6 |

CPU2:

8

CPU1:

6 |

CPU2:

8

3.5-inch chassis 2.5-inch chassis

12x

Drive

s

Not

Suppo

rted

(2°C)

8x

Drive

s

Not

Suppo

rted

(10°C

)

4x

Drive

s

Not Supp orted

(11°C

)

24x

Driv

es

Not Supp orted

(19°

C)

20x

Driv

16x

Drive

es

20 21 21 21 21 30

12x

Drive

s

No-BP

Chassis

8x

es

4x

Driv

es

N/A

Driv

s

200 W 6254

8276

8276L

165 W

8276M

8260

CPU1:

FMM2M |

CPU2:

V2DRD

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

6 |

CPU2:

8

CPU1:

8 |

CPU2:

8

CPU1:

8 |

CPU2:

8

CPU1:

8 |

CPU2:

8

CPU1:

8 |

CPU2:

8

Not Suppo rted(6

°C)

Not Suppo

rted(11

°C)

Not

Suppo

rted(1

4°C)

Not

Suppo

rted(1

8°C)

Not Supp orted

(15°

C)

Not Supp orted

(19°

C)

20 21 22 22 22 22 30

30 30 30 30 30 35 35

8 Technical specifications

Table 7. Maximum continuous operating temperature for nonfabric dual processor configuration (continued)

TDP

Watts

Process

or

model

8260L

8260M

8260C

6252

6248

Heat sink

model

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

JYKMM |

CPU2:

V2DRD

Max

memo

ry/

proce

ssor

CPU1:

8 |

CPU2:

8

CPU1:

8 |

CPU2:

8

CPU1:

8 |

CPU2:

8

CPU1:

8 |

CPU2:

8

CPU1:

8 |

CPU2:

8

3.5-inch chassis 2.5-inch chassis

12x

Drive

s

8x

Drive

21 23 30 30 30 30 30 35 35

4x

24x

Drive

s

20x

Driv

es

30 30 30 30 30 35 35

es

16x

Drive

s

12x

Drive

No-BP

Chassis

8x

es

4x

Driv

es

N/A

Driv

s

150 W

125 W

6240

6242

6244

6240C

6230

5220

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

FMM2M |

CPU2:

V2DRD

CPU1:

FMM2M |

CPU2:

V2DRD

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

8 |

CPU2:

8

CPU1:

8 |

CPU2:

8

CPU1:

6 |

CPU2:

8

CPU1:

6 |

CPU2:

8

CPU1:

8 |

CPU2:

8

CPU1:

8 |

CPU2:

8

Not

21 23 30 30 30 30 30 35 35

Suppo

rted(1

4°C)

21 23 30 30 30 30 30 35 35

25 30 30 30 30 35 35 35 35 35

5218

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

8 |

CPU2:

8

25 30 30 30 30 35 35 35 35 35

Technical specifications 9

Table 7. Maximum continuous operating temperature for nonfabric dual processor configuration (continued)

TDP

Watts

115 W 5217

Process

or

model

5218B

8253

6238T

6230N

Heat sink

model

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

FMM2M |

CPU2:

V2DRD

Max

memo

ry/

proce

ssor

CPU1:

8 |

CPU2:

8

CPU1:

8 |

CPU2:

8

CPU1:

8 |

CPU2:

8

CPU1:

8 |

CPU2:

8

CPU1:

6 |

CPU2:

8

3.5-inch chassis 2.5-inch chassis

12x

Drive

s

25 30 30 30 30 35 35 35 35 35

8x

Drive

s

4x

Drive

s

24x

Driv

es

20x

Driv

es

16x

Drive

s

12x

Drive

s

8x

Driv

es

4x

Driv

es

Chassis

No-BP

N/A

5218T

5218N

105 W

5222

8256

100 W 4216

5215

85 W

5215M

CPU1:

FMM2M |

CPU2:

V2DRD

CPU1:

FMM2M |

CPU2:

V2DRD

CPU1:

FMM2M |

CPU2:

V2DRD

CPU1:

FMM2M |

CPU2:

V2DRD

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

6 |

CPU2:

8

CPU1:

6 |

CPU2:

8

CPU1:

6 |

CPU2:

8

CPU1:

6 |

CPU2:

8

CPU1:

8 |

CPU2:

8

CPU1:

8 |

CPU2:

8

CPU1:

8 |

CPU2:

8

30 35 35 35 35 35 35 35 35 35

35 35 35 35 35 35 35 35 35 35

10 Technical specifications

Table 7. Maximum continuous operating temperature for nonfabric dual processor configuration (continued)

TDP

Watts

Process

or

model

5215L

4215

4214

4214C

4210

Heat sink

model

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

JYKMM |

CPU2:

V2DRD

Max

memo

ry/

proce

ssor

CPU1:

8 |

CPU2:

8

CPU1:

8 |

CPU2:

8

CPU1:

8 |

CPU2:

8

CPU1:

8 |

CPU2:

8

CPU1:

8 |

CPU2:

8

3.5-inch chassis 2.5-inch chassis

12x

Drive

s

35 35 35 35 35 35 35 35 35 35

8x

Drive

s

4x

Drive

s

24x

Driv

es

20x

Driv

es

16x

Drive

s

12x

Drive

s

8x

Driv

es

4x

Driv

es

Chassis

No-BP

N/A

4208

3204

70 W 4209T

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

JYKMM |

CPU2:

V2DRD

CPU1:

8 |

CPU2:

8

CPU1:

8 |

CPU2:

8

CPU1:

8 |

CPU2:

8

35 35 35 35 35 35 35 35 35 35

Table 8. Maximum continuous operating temperature for non-fabric single processor configuration

No-BP

Chassis

TDP Watts

205W

Processo

r model

8280

8280L

8280M

Heat

sink

model

CPU1:

FMM2M

CPU1:

FMM2M

CPU1:

FMM2M

Max

memor

y/

proces

sor

CPU1:

6

CPU1:

6

CPU1:

6

3.5-inch chassis 2.5-inch chassis

12x

Drive

8x

4x

24x

Driv

s

es

30 30 30 35 35 35 35 35 35 35

Driv

es

20x

Drive

es

16x

Driv

s

es

12x

Drive

s

8x

Drive

s

4x

Drive

s

N/A

8270

CPU1:

FMM2M

CPU1:

6

30 30 30 35 35 35 35 35 35 35

Technical specifications 11

Table 8. Maximum continuous operating temperature for non-fabric single processor configuration (continued)

TDP Watts

200 W 6254

165 W

Processo

r model

8268

6212U

8276

8276L

8276M

8260

8260L

8260M

Heat

sink

model

CPU1:

FMM2M

CPU1:

FMM2M

CPU1:

JYKMM

CPU1:

JYKMM

CPU1:

JYKMM

CPU1:

JYKMM

CPU1:

JYKMM

CPU1:

JYKMM

CPU1:

JYKMM

Max

memor

y/

proces

sor

CPU1:

6

CPU1:

6

CPU1:

8

CPU1:

8

CPU1:

8

CPU1:

8

CPU1:

8

CPU1:

8

CPU1:

8

3.5-inch chassis 2.5-inch chassis

12x

Drive

8x

4x

24x

Driv

s

es

30 30 30 35 35 35 35 35 35 35

30 35 35 35 35 35 35 35 35 35

Driv

es

20x

Drive

es

16x

Driv

s

es

12x

Drive

s

8x

Drive

s

4x

Drive

Chassis

s

No-BP

N/A

150 W

125W

8260C

6210U

6252

6248

6240

6242

6244

6240C

6230

5220

5218

CPU1:

JYKMM

CPU1:

JYKMM

CPU1:

JYKMM

CPU1:

JYKMM

CPU1:

JYKMM

CPU1:

JYKMM

CPU1:

FMM2M

CPU1:

FMM2M

CPU1:

JYKMM

CPU1:

JYKMM

CPU1:

JYKMM

CPU1:

8

CPU1:

8

CPU1:

8

CPU1:

8

CPU1:

8

CPU1:

8

CPU1:

6

CPU1:

6

CPU1:

8

CPU1:

8

CPU1:

8

30 35 35 35 35 35 35 35 35 35

35 35 35 35 35 35 35 35 35 35

5218B

12 Technical specifications

CPU1:

JYKMM

CPU1:

8

35 35 35 35 35 35 35 35 35 35

Table 8. Maximum continuous operating temperature for non-fabric single processor configuration (continued)

TDP Watts

115 W 5217

105 W

100 W 4216

Processo

r model

8253

6238T

6230N

5218T

5218N

5222

8256

Heat

sink

model

CPU1:

JYKMM

CPU1:

JYKMM

CPU1:

JYKMM

CPU1:

FMM2M

CPU1:

FMM2M

CPU1:

FMM2M

CPU1:

FMM2M

CPU1:

FMM2M

CPU1:

JYKMM

Max

memor

y/

proces

sor

CPU1:

8

CPU1:

8

CPU1:

8

CPU1:

6

CPU1:

6

CPU1:

6

CPU1:

6

CPU1:

6

CPU1:

8

3.5-inch chassis 2.5-inch chassis

12x

Drive

8x

4x

24x

Driv

s

es

35 35 35 35 35 35 35 35 35 35

30 35 35 35 35 35 35 35 35 35

Driv

es

20x

Drive

es

16x

Driv

s

es

12x

Drive

s

8x

Drive

s

4x

Drive

Chassis

s

No-BP

N/A

5215

5215M

5215L

4215

85 W

70 W 4209T

4214

4214C

4210

4208

3204

CPU1:

JYKMM

CPU1:

JYKMM

CPU1:

JYKMM

CPU1:

JYKMM

CPU1:

JYKMM

CPU1:

JYKMM

CPU1:

JYKMM

CPU1:

JYKMM

CPU1:

JYKMM

CPU1:

JYKMM

CPU1:

8

CPU1:

8

CPU1:

8

CPU1:

8

CPU1:

8

CPU1:

8

CPU1:

8

CPU1:

8

CPU1:

8

CPU1:

8

35 35 35 35 35 35 35 35 35 35

Technical specifications 13

Table 9. Configuration Restrictions with Mellanox Navi Dual Port Card with Active (Optical) connectivity

TDP Watts

205 W

200 W

173 W

165 W

160 W

150 W

140 W

135 W

130 W

3.5-inch chassis 2.5-inch chassis

12x HDDs 8x HDDs 4x HDDs 24x HDDs 16x HDDs 8x HDDs 4x HDDs N/A

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

23 25 28 29 29 30 33

24 25 29 30 30 31 33

24 26 30 31 31 31 34

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

24 25 25 26 29

24 25 26 26 30

26 27 28 28 31

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

24 24 28

Not

supported

Not

supported

No-BP

Chassis

23

125 W 20 25 27 30 31 32 32 35

115 W 21 27 28 32 33 34 34 >35

113 W 21 27 28 32 33 34 34 >35

105 W 22 28 30 34 35 >35 >35 >35

85 W 23 32 33 >35 >35 >35 >35 >35

70 W 25 34 >35 >35 >35 >35 >35 >35

Table 10. Configuration Restrictions with Intel Rush Creek

TDP Watts

12x HDDs 8x HDDs 4x HDDs 24x HDDs 16x HDDs 8x HDDs 4x HDDs N/A

205 W Not

supported

200 W Not

supported

173 W Not

supported

165 W Not

supported

160 W Not

supported

3.5-inch chassis 2.5-inch chassis

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

20 20 23 24 28

22 22 24 25 29

22 22 24 26 29

Not

supported

Not

supported

20 20 23

21 21 24

No-BP

Chassis

150 W Not

supported

140 W Not

supported

14 Technical specifications

supported

Not

supported

Not

supported

24 24 26 27 30

26 26 27 28 31

Table 10. Configuration Restrictions with Intel Rush Creek (continued)

TDP Watts

12x HDDs 8x HDDs 4x HDDs 24x HDDs 16x HDDs 8x HDDs 4x HDDs N/A

135 W Not

supported

130 W Not

supported

125 W Not

supported

115W Not

supported

105 W 20 23 24 30 33 33 34 >35

85 W 24 26 27 34 >35 >35 >35 >35

70 W 25 28 29 >35 >35 >35 >35 >35

3.5-inch chassis 2.5-inch chassis

Not

supported

Not

supported

Not

supported

21 23 29 31 31 32 34

20 26 26 28 29 32

20 27 27 29 29 33

21 28 28 30 30 33

Table 11. Configuration Restrictions with Intel NVMe SSD AIC P4800X

TDP Watts

12x HDDs 8x HDDs 4x HDDs 24x HDDs 16x HDDs 8x HDDs 4x HDDs N/A

205 W Not

supported

3.5-inch chassis 2.5-inch chassis

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

No-BP

Chassis

No-BP

Chassis

Not

supported

200 W Not

supported

173 W Not

supported

165 W Not

supported

160 W Not

supported

150 W Not

supported

140 W Not

supported

135 W Not

supported

130 W Not

supported

125 W Not

supported

115 W Not

supported

105 W Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

20 20 20 20 25

20 25 25 25 30

25 25 25 25 30

Not

supported

Not

supported

Not

supported

Not

supported

20 20 20 25

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

20

25

85 W Not

supported

70 W Not

supported

Not

supported

Not

supported

Not

supported

Not

supported

30 30 30 30 >35

>35 >35 >35 >35 >35

Technical specifications 15

Expanded operating temperature specifications

Table 12. Expanded operating temperature

Expanded operating temperature Specifications

Continuous operation 5°C–40°C at 5% to 85% RH with maximum 29°C dew point.

NOTE: Outside the standard operating temperature (10°C–35°C), the system can

operate continuously in temperatures as low as 5°C and as high as 40°C.

For temperatures between 35°C and 40°C, derate maximum allowable temperature by 1°C per 175 m above 950 m (1°F per 319 ft).

≤ 1% of annual operating hours –5°C–45°C at 5% to 90% RH with maximum 29°C dew point.

NOTE: Outside the standard operating temperature (10°C–35°C), the system can

operate down to –5°C or up to 45°C for a maximum of 1% of its annual operating hours.

For temperatures between 40°C-45°C, derate maximum allowable temperature by 1°C per 125 m above 950 m (1°F per 228 ft).

NOTE: When operating in the expanded temperature range, system performance may be impacted.

NOTE: When operating in the expanded temperature range, ambient temperature warnings may be reported in the System

Event Log.

Operating temperature derating specifications

Table 13. Operating temperature

Operating temperature derating Specifications

< 35°C (95°F) Maximum temperature is reduced by 1°C/300 m (1°F/547 ft)

above 950 meters (3,117 ft).

35°C–40°C (95°F–104°F) Maximum temperature is reduced by 1°C/175 m (1°F/319 ft)

above 950 meters (3,117 ft).

> 45°C (113°F) Maximum temperature is reduced by 1°C/125 m (1°F/228 ft)

above 950 meters (3,117 ft).

Relative humidity specifications

Table 14. Relative humidity specifications

Relative humidity Specifications

Storage 5% to 95% RH with 33°C (91°F) maximum dew point.

Atmosphere must be noncondensing always.

Operating 10% to 80% relative humidity with 29°C (84.2°F) maximum

dew point.

16 Technical specifications

Temperature specifications

Table 15. Temperature specifications

Temperature Specifications

Storage –40°C–65°C (–40°F to 149°F)

Continuous operation (for altitude less than 950 m or 3117 ft) 10°C–35°C (50°F to 95°F) with no direct sunlight on the

equipment.

Fresh air For information about fresh air, see Expanded Operating

Temperature section.

Maximum temperature gradient (operating and storage) 20°C/h (68°F/h)

NOTE: Some configurations require a lower ambient temperature for more information, see the Standard operating

temperature specifications.

Particulate and gaseous contamination specifications

Table 16. Particulate contamination specifications

Particulate contamination Specifications

Air filtration Data center air filtration as defined by ISO Class 8 per ISO

14644-1 with a 95% upper confidence limit.

NOTE: This condition applies only to data center environments. Air filtration requirements do not apply to IT equipment

designed to be used outside a data center, in environments such as an office or factory floor.

NOTE: Air entering the data center must have MERV11 or MERV13 filtration.

Conductive dust Air must be free of conductive dust, zinc whiskers, or other

conductive particles.

NOTE: This condition applies to data center and non-data center environments.

Corrosive dust Air must be free of corrosive dust.

Residual dust present in the air must have a deliquescent point less than 60% relative humidity.

NOTE: This condition applies to data center and non-data center environments.

Table 17. Gaseous contamination specifications

Gaseous contamination Specifications

Copper coupon corrosion rate <300 Å/month per Class G1 as defined by ANSI/

ISA71.04-2013

Silver coupon corrosion rate <200 Å/month per Class G1 as defined by ANSI/

ISA71.04-2013

NOTE: Maximum corrosive contaminant levels measured at ≤50% relative humidity.

Technical specifications 17

Maximum vibration specifications

Table 18. Maximum vibration specifications

Maximum vibration Specifications

Operating 0.26 Grms at 5 Hz to 350 Hz (all operation orientations).

Storage 1.88 Grms at 10 Hz to 500 Hz for 15 min (all six sides tested).

Maximum shock specifications

Table 19. Maximum shock specifications

Maximum shock Specifications

Operating 24 executed shock pulses 6 G in the positive and negative x,

y, z axis for up to 11 ms (four pulses on each side of the system).

Storage 6 consecutively executed shock pulses of 71 G in the positive

and negative x, y, z axes for up to 2 ms (one pulse on each side of the system).

Maximum altitude specifications

Table 20. Maximum altitude specifications

Maximum altitude Specifications

Operating 3048 m (10,000 ft)

Storage 12,000 m (39,370 ft)

Fresh Air Operation

Fresh Air operation restrictions

● Processors with a TDP greater than 105 W are not supported

● Support for processors of 85 W and below without PERC restrictions

● 3.5-inch drive configuration is not supported

● 114-mm heat sink is required for the processor in CPU1 socket

● Kerby-flat OCP is not supported

● M.2 card on DCS Mezzanine slot is not supported.

● NVMe SSD is not supported

● AEP DIMM and LRDIMM are not supported

● PCIe cards greater than 25 W are not supported

● H730 PERC and H330 support for 105-W processors

● No PERC restrictions for 85 W and lesser TDP processors

18

Technical specifications