Dell 2005FPW Schematic
COLOR MONIT OR
SER VICE MANUAL
CAUTION
BEFORE SERVICING THE UNIT,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS NO. : CL-74
MODEL: 2005FPW
1. LCD CHARACTERISTICS
Type : TFT WSXGA LCD
Size : 20.1inch
Pixel Pitch : 0.258(H) x 0.258(V)
Color Depth : 8-bit, 16,777,216 colors
Electrical Interface : LVDS
Surface Treatment : Anti-Glare, Hard Coating (3H)
Operating Mode : Normally Black
Backlight Unit : Six-CCFL (Cold Cathode
Fluorescent Lamp)
2. OPTICAL CHARACTERISTICS
2-1. Viewing Angle by Contrast Ratio ≥10
Left : 88°(Typ) / Right : 88°(Typ)
Top : 88°(Typ) / Bottom : 88°(Typ)
2-2. Luminance : 220(min), 300(Typ)
2-3. Contrast Ratio : 400(min), 600(Typ)
3. SIGNAL (Refer to the Timing Chart)
3-1. Sync Signal
• Type : Separate, SOG (Sync On Green)
Digital
3-2. Video Input Signal
1) Type : R, G, B Analog
2) Voltage Level : 0~0.7 V
3) Input Impedance : 75 Ω
3-3. Operating Frequency
Horizontal : 30 ~ 81kHz
Vertical : 56 ~ 75Hz
4. RESOLUTION
MAX/Recommend : 1680 x 1050 @60Hz
5. POWER SUPPLY
5-1. Power Adaptor(Built-in Power)
Input : AC 100-240V, 50/60Hz , 1.6A
5-2. Power Consumption
6. ENVIRONMENT
6-1. Operating Temperature: 5°C~35°C (50°F~95°F)
(Ambient)
6-2. Relative Humidity : 10%~80%
(Non-condensing)
6-3. MTBF : 70,000 Hours(Min),
Lamp Life : 40,000 Hours(Min)
7. DIMENSIONS (with TILT/SWIVEL)
Width : 398.6 mm (15.61'')
Depth : 224.6 mm (9.33'')
Height : 537.8 mm (16.81'')
8. WEIGHT (with TILT/SWIVEL)
Net. Weight : 7.8kg (17.19 lbs)
Gross Weight : 10.0kg (22.05 lbs)
9. USB
Upstream : 1 port, Downstream : 4 port
Speed : Full-12Mbps, Low-1.5Mbps
High Speed : 480Mbps(USB 2.0)
10. Dot Specification
1) Bright Dot
Bright Dot is defined as Dots (sub-pixels) which appeared brightly
in the screen when the LCM Displayed with dark pattern.
- Total amount of Bright dots ……………………………………1
- Partial bright dot(in 30°± distance, Full Black) ………………8
2) Dark Dot
Dark Dot is defined as Dots(sub-pixels) which appeared darkly in
the screen when the LCM displayed with bright pattern.
- Total amount of Dark dot ………………………………………4
3) Total amount of Dot Defects ……………………………………5
*
Brightness guarantee within warranty period (15 months)
: More than 70% of minimum specification
CONTENTS
SPECIFICATIONS
- 2 -
SPECIFICATIONS ................................................... 2
PRECAUTIONS ....................................................... 3
TIMING CHART ....................................................... 7
DISASSEMBLY ....................................................... 8
BLOCK DIAGRAM ................................................... 9
DESCRIPTION OF BLOCK DIAGRAM...................10
ADJUSTMENT ...................................................... 12
TROUBLESHOOTING GUIDE .............................. 14
WIRING DIAGRAM ............................................... 18
EXPLODED VIEW...................................................19
REPLACEMENT PARTS LIST ...............................21
SCHEMATIC DIAGRAM......................................... 26
MODE
Power S/W Off
(Audio, USB Detach)
H/V SYNC
ON/ON
OFF/ON
ON/OFF
OFF/OFF
-
POWER CONSUMPTION
less than 75 W
less than 3 W
less than 3 W
less than 3 W
less than 1 W@110VAC
LED COLOR
GREEN
AMBER
AMBER
AMBER
-
VIDEO
ACTIVE
OFF
OFF
OFF
-
NORMAL
STAND-BY
SUSPEND
DPMS OFF
Power s/w on
Power s/w On
(Audio, USB
Detach)
- 3 -
WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCD
monitor that are important for safety. These parts are
marked on the schematic diagram and the
replacement parts list. It is essential that these critical
parts should be replaced with the manufacturer’s
specified parts to prevent electric shock, fire or other
hazard.
• Do not modify original design without obtaining written
permission from LG or you will void the original parts
and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly
or electric shock as this will result in damage to the
screen.
• Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person’s body are
grounded through wrist band.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight (CCFL) or
inverter circuit, must disconnect the AC adapter
because high voltage appears at inverter circuit about
650Vrms.
• Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Current Hot Check Circuit
PRECAUTION
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.
1.5 Kohm/10W
To Instrument's
exposed
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
- 4 -
SERVICING PRECAUTIONS
CAUTION: Before servicing receivers covered by this
service manual and its supplements and addenda, read
and follow the SAFETY PRECAUTIONS on page 3 of this
publication.
NOTE: If unforeseen circumstances create conflict
between the following servicing precautions and any of the
safety precautions on page 3 of this publication, always
follow the safety precautions. Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC
power source before;
a. Removing or reinstalling any component, circuit
board module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical
plug or other electrical connection.
c. Connecting a test substitute in parallel with an
electrolytic capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect
polarity installation of electrolytic capacitors may
result in an explosion hazard.
d. Discharging the picture tube anode.
2. Test high voltage only by measuring it with an
appropriate high voltage meter or other voltage
measuring device (DVM, FETVOM, etc) equipped with
a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Discharge the picture tube anode only by (a) first
connecting one end of an insulated clip lead to the
degaussing or kine aquadag grounding system shield
at the point where the picture tube socket ground lead
is connected, and then (b) touch the other end of the
insulated clip lead to the picture tube anode button,
using an insulating handle to avoid personal contact
with high voltage.
4. Do not spray chemicals on or near this receiver or any
of its assemblies.
5. Unless specified otherwise in this service manual,
clean electrical contacts only by applying the following
mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator;
10% (by volume) Acetone and 90% (by volume)
isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual,
lubrication of contacts in not required.
6. Do not defeat any plug/socket B+ voltage interlocks
with which receivers covered by this service manual
might be equipped.
7. Do not apply AC power to this instrument and/or any of
its electrical assemblies unless all solid-state device
heat sinks are correctly installed.
8. Always connect the test receiver ground lead to the
receiver chassis ground before connecting the test
receiver positive lead.
Always remove the test receiver ground lead last.
9. Use with this receiver only the test fixtures specified in
this service manual.
CAUTION: Do not connect the test fixture ground strap
to any heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be
damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive (ES)
Devices. Examples of typical ES devices are integrated
circuits and some field-effect transistors and
semiconductor "chip" components. The following
techniques should be used to help reduce the incidence of
component damage caused by static by static electricity.
1. Immediately before handling any semiconductor
component or semiconductor-equipped assembly, drain
off any electrostatic charge on your body by touching a
known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device,
which should be removed to prevent potential shock
reasons prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with
ES devices, place the assembly on a conductive
surface such as aluminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or
unsolder ES devices.
4. Use only an anti-static type solder removal device.
Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to
damage ES devices.
5. Do not use freon-propelled chemicals. These can
generate electrical charges sufficient to damage ES
devices.
6. Do not remove a replacement ES device from its
protective package until immediately before you are
ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable
conductive material).
7. Immediately before removing the protective material
from the leads of a replacement ES device, touch the
protective material to the chassis or circuit assembly
into which the device will be installed.
CAUTION: Be sure no power is applied to the chassis
or circuit, and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or
the lifting of your foot from a carpeted floor can
generate static electricity sufficient to damage an ES
device.)
- 5 -
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and
appropriate tip size and shape that will maintain tip
temperature within the range or 500。F to 600。F.
2. Use an appropriate gauge of RMA resin-core solder
composed of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a
mall wire-bristle (0.5 inch, or 1.25cm) brush with a
metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal
temperature.
(500。F to 600。F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static,
suction-type solder removal device or with solder
braid.
CAUTION: Work quickly to avoid overheating the
circuitboard printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal
temperature (500。F to 600。F)
b. First, hold the soldering iron tip and solder the strand
against the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of
the component lead and the printed circuit foil, and
hold it there only until the solder flows onto and
around both the component lead and the foil.
CAUTION: Work quickly to avoid overheating the
circuit board printed foil.
d. Closely inspect the solder area and remove any
excess or splashed solder with a small wire-bristle
brush.
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong)
through which the IC leads are inserted and then bent flat
against the circuit foil. When holes are the slotted type,
the following technique should be used to remove and
replace the IC. When working with boards using the
familiar round hole, use the standard technique as
outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation
by gently prying up on the lead with the soldering iron
tip as the solder melts.
2. Draw away the melted solder with an anti-static
suction-type solder removal device (or with solder
braid) before removing the IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad
and solder it.
3. Clean the soldered areas with a small wire-bristle
brush. (It is not necessary to reapply acrylic coating to
the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as
close as possible to the component body.
2. Bend into a "U" shape the end of each of three leads
remaining on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the
corresponding leads extending from the circuit board
and crimp the "U" with long nose pliers to insure metal
to metal contact then solder each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor
leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the
circuit board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close
as possible to diode body.
2. Bend the two remaining leads perpendicular y to the
circuit board.
3. Observing diode polarity, wrap each lead of the new
diode around the corresponding lead on the circuit
board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder
joints of the two "original" leads. If they are not shiny,
reheat them and if necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board
hollow stake.
2. Securely crimp the leads of replacement component
around notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the
replaced component and adjacent components and the
circuit board to prevent excessive component
temperatures.
- 6 -
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed
circuit board will weaken the adhesive that bonds the foil
to the circuit board causing the foil to separate from or
"lift-off" the board. The following guidelines and
procedures should be followed whenever this condition is
encountered.
At IC Connections
To repair a defective copper pattern at IC connections use
the following procedure to install a jumper wire on the
copper pattern side of the circuit board. (Use this
technique only on IC connections).
1. Carefully remove the damaged copper pattern with a
sharp knife. (Remove only as much copper as
absolutely necessary).
2. carefully scratch away the solder resist and acrylic
coating (if used) from the end of the remaining copper
pattern.
3. Bend a small "U" in one end of a small gauge jumper
wire and carefully crimp it around the IC pin. Solder the
IC connection.
4. Route the jumper wire along the path of the out-away
copper pattern and let it overlap the previously scraped
end of the good copper pattern. Solder the overlapped
area and clip off any excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper
pattern at connections other than IC Pins. This technique
involves the installation of a jumper wire on the
component side of the circuit board.
1. Remove the defective copper pattern with a sharp
knife.
Remove at least 1/4 inch of copper, to ensure that a
hazardous condition will not exist if the jumper wire
opens.
2. Trace along the copper pattern from both sides of the
pattern break and locate the nearest component that is
directly connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead
of the nearest component on one side of the pattern
break to the lead of the nearest component on the
other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is
dressed so the it does not touch components or sharp
edges.
TIMING CHART
- 7 -
VIDEO
SYNC
B
D
C
F
E
A
<< Dot Clock (MHz), Horizontal Frequency (kHz), Vertical Frequency (Hz), Horizontal etc... (µs), Vertical etc... (ms) >>
H + 37.879 1056 800 40 128 88
V + 60.317 628 600 1 4 23
H – 31.469 800 640 16 96 48
V – 59.94 525 480 10 2 33
H – 37.5 840 640 16 64 120
V – 75 500 480 1 3 16
H – 31.468 900 720 18 108 54
V + 70.08 449 400 12 2 35
H + 46.875 1056 800 16 80 160
V + 75.0 625 600 1 3 21
H – 48.363 1344 1024 24 136 160
V – 60.0 806 768 3 6 29
H – 60.123 1312 1024 16 96 176
V – 75.029 800 768 1 3 28
H+/– 67.500 1600 1152 64 128 256
V+/– 75.000 900 864 1 3 32
H + 63.981 1688 1280 48 112 248
V + 60.02 1066 1024 1 3 38
H + 79.976 1688 1280 16 144 248
V + 75.035 1066 1024 1 3 38
H – 65.920 2240 1680 104 176 280
V + 59.954 1089 1050 3 6 30
Mode
H/V
Sort
1
2
3
4
5
6
7
8
9
10
11
28.321
25.175
31.5
40.0
49.5
65.0
78.75
108.0
108.0
135.0
146.25
800x600
60Hz
640x480
60Hz
640x480
75Hz
720x400
70Hz
800x600
75Hz
1024x768
60Hz
1024x768
75Hz
1152x864
75Hz
1280x1024
60Hz
1280x1024
75Hz
1680x1050
60Hz
Sync
Polarity
Frequency
Dot
Clock
Total Period
(E)
Video Active Time
(A)
Sync Duration
(D)
Back Porch
(F)
Front Porch
(C)
Resolution
DISASSEMBLY
- 8 -
REAR CABINET REMOVEL.
2) Please lift central inside edge of Cabinet upward with
fingertip then latch will be departed.
(This time take care so that do not give damage on
the module surface.)
3) Progress to left and lifts cabinet furtively and extracts
latch.
4) Progress to right and extracts cabinet side latch by
same method.
5) Progress to bottom.
Warning : if you lift cabinet up, power connector lead
may be disconnected or damaged.)
Refer to the small picture.
6) Turn upside down then lift the back cover ass'y up.
1) Remove the screws.
- 9 -
Gm1501 CF
ADC
Scaling
PLL
OSD
LVDS
Analog I(R/G/B)
D-Sub
5V
Regulator
Regulator
3.3V
1.8V
12
5V
V
(AUO)
(LPL)
3.3V
2.5V
LVDS
Tx
DVI Rx
EEPROM(EDID)
EEPROM
(System)
DVI-D
DVI(TMDS)
KEY
1.8V
ROM
MICOM
Real
colour
Regulator
2.5V
Flash
ROM
DDR
RAM
2.5V
Panel
3.3V
S-video
EEPROM(EDID)
Composite
YC+YU
CVBS
Decoder
(TW9905)
3.3V
12V Audio
Power
supply
12V
Up
stream
Down
Stream
*2
USB
2040H
Down
Stream
Down
Stream
5V
Regulator
3.3V 1.8V
5V
BLOCK DIAGRAM
- 10 -
DESCRIPTION OF BLOCK DIAGRAM
1. Video Controller Part & Display Data Transmitter Part.
This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the
digital video signal using a pixel clock.
The pixel clock for each mode is generated by the PLL.
The range of the pixel clock is from 25MHz to 147MHz.
This part consists of the Scaler, Flash-ROM IC which stores program data, Reset IC.
The Scaler gets the video signal converted analog to digital, interpolates input to 1680 x1050 resolution signal and
outputs 8-bit R, G, B signal to transmitter.
Especially pre-amp / ADC / Video controller/ Transmitter are merged to one chip "Gm1501" by Genesis.
This part transmit digital signal from the Scaler to the receiver of module.s
2. Power Part
This part consists of the two 3.3V and one 2.5V and one 1.8Vregulators to convert power which is provided
12V in Power Board V is provided for LCD Panel.(Only LPL)
5V in Power Board V is provided for LCD Panel.(Only AUO)
12V in Power Board V is provided for Inverter Part.
Also, 5V is converted 3.3V and 2.5V and 1.8V by regulator. Converted power is provided for IC in the main board.
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