Page 1
Double channel high-side solid-state relay
Features
Type R
VND600 35 mΩ 25 A
1. Per channel with all the output pins connected to the
PCB.
DS(on)
I
OUT
(1)
V
CC
36 V
VND600
■ CMOS-compatible input
■ Proportional load current sense
■ Shorted load protection
■ Under-voltage and over-voltage shutdown
■ Over-voltage clamp
■ Thermal shutdown
■ Current limitation
■ Protection against loss of ground and loss of
V
CC
■
Very low standby power dissipation
■ Reverse battery protected (see Application
schematic
)
Table 1. Device summary
Package
SO-16L
Description
The VND600 is a double chip device designed in
STMicroelectronics VIPower M0-3 technology.
The VND600 is intended for driving any type of
load with one side connected to ground. The
active V
against low energy spikes (see ISO7637 transient
compatibility table). Active current limitation
combined with thermal shutdown and automatic
restart protects the device against over-load.
The device integrates an analog current sense
output which delivers a current proportional to the
load current. The device automatically turns off in
the case where the ground pin becomes
disconnected.
Tube Tape and reel
pin voltage clamp protects the device
CC
Order codes
SO-16L VND600 VND60013TR
December 2008 Rev 4 1/26
www.st.com
26
Page 2
Contents VND600
Contents
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 16
3.1.1 Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 16
3.1.2 Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 17
3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.3 MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
3.4 Maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . . . . . . 18
4 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.1 SO-16L thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.2 SO-16L packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
2/26
Page 3
VND600 List of tables
List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Table 4. Thermal data (per island) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 6. Switching (V
Table 7. V
Table 8. Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 9. Current sense (9V ≤ VCC ≤ 16V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 10. Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 11. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 12. Electrical transient requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 13. Thermal parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Table 14. SO-16L mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Table 15. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
output diode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
CC
=13V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
CC
3/26
Page 4
List of figures VND600
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 4. Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 5. I
Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 7. Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 8. High-level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 9. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 10. Turn-on voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 11. Over-voltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 12. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 13. ILIM vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 14. On-state resistance vs VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 15. Input high-level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 16. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 17. On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 18. Input low-level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 19. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 20. Maximum turn-off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 21. SO-16L PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 22. Rthj-amb Vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 19
Figure 23. Thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 24. Thermal fitting model of a quad channel HSD in SO-16L . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Figure 25. SO-16L package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 26. SO-16L tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 27. SO-16L tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
OUT/ISENSE
versus I
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
OUT
4/26
Page 5
VND600 Block diagram and pin description
1 Block diagram and pin description
Figure 1. Block diagram
V
CC
OVERVOLTAGE
V
CLAMP
CC
UNDERVOLTAGE
DRIVER 1
INPUT 1
LOGIC
INPUT 2
GND
OVERTE MP. 1
OVERTE MP. 2
Ot1
Ot2
DRIVER 2
Figure 2. Configuration diagram (top view)
V
CC
1
N.C.
GND
INPUT 2
INPUT 1
C. SENSE 1
C. SENSE 2
V
CC
8
PwCLAMP 1
I
OUT1
PwCLAMP 2
I
OUT2
16
9
I
LIM1
V
dslim1
K
I
LIM2
V
dslim2
K
V
CC
OUTPUT 2
OUTPUT 2
OUTPUT 2
OUTPUT 1
OUTPUT 1
OUTPUT 1
V
CC
OUTPUT 1
Ot1
CURRENT
SENSE 1
OUTPUT 2
Ot2
CURRENT
SENSE 2
Table 2. Suggested connections for unused and not connected pins
Connection / pin Current Sense N.C. Output Input
Floating X X X
To ground
Through 1KΩ
resistor
X
Through 10KΩ
5/26
resistor
Page 6
Electrical specifications VND600
2 Electrical specifications
Figure 3. Current and voltage conventions
I
S1
V
CC1
I
Note: V
Fn
= V
CCn
- V
IN1
V
IN1
I
IN2
V
IN2
during reverse battery condition.
OUTn
INPUT1
INPUT2
GROUND1
2.1 Absolute maximum ratings
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to Absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics sure
program and other relevant quality document.
Table 3. Absolute maximum ratings
I
GND1
V
CC2
OUTPUT1
OUTPUT2
GROUND2
V
CC1
CURRENT SENSE 1
CURRENT SENSE 2
I
GND2
I
OUT1
I
SENSE1
I
OUT2
I
SENSE2
V
SENSE2
V
V
V
OUT2
I
S2
(*)
F1
SENSE1
V
OUT1
V
CC2
Symbol Parameter Value Unit
V
CC
- V
- I
gnd
I
OUT
- I
OUT
I
IN
V
CSENSE
DC supply voltage 41 V
Reverse DC supply voltage - 0.3 V
CC
DC reverse ground pin current - 200 mA
DC output current Internally limited A
Reverse DC output current - 21 A
DC input current +/- 10 mA
Current Sense maximum voltage
Electrostatic discharge
(human body model: R = 1.5KΩ; C = 100pF)
V
ESD
INPUT
CURRENT SENSE
OUTPUT
V
CC
6/26
- 3
+ 15
4000
2000
5000
5000
V
V
V
V
V
V
Page 7
VND600 Electrical specifications
Table 3. Absolute maximum ratings (continued)
Symbol Parameter Value Unit
Maximum switching energy
E
MAX
P
T
T
T
stg
(L = 0.12mH; R
= 150ºC; IL = 40A)
T
jstart
Power dissipation TC ≤ 25°C 8.3 W
tot
Junction operating temperature Internally limited °C
j
Case operating temperature - 40 to 150 °C
c
= 0Ω; V
L
= 13.5V;
bat
Storage temperature - 55 to 150 °C
136 mJ
2.2 Thermal data
Table 4. Thermal data (per island)
Symbol Parameter Value Unit
R
thj-lead
R
thj-amb
1. When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35 µm thick) connected
to all VCC pins. Horizontal mounting and no artificial air flow.
2. When mounted on a standard single-sided FR-4 board with 6cm2 of Cu (at least 35 µm thick) connected to
all VCC pins. Horizontal mounting and no artificial air flow.
Thermal resistance junction-lead 15 °C/W
Thermal resistance junction-ambient 65
(1)
48
(2)
°C/W
7/26
Page 8
Electrical specifications VND600
2.3 Electrical characteristics
Values specified in this section are for 8V < V
< 36V; -40°C < Tj < 150°C, unless otherwise
CC
stated.
Table 5. Power
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
V
V
R
V
CLAMP
I
L(off1)
I
L(off2)
I
L(off3)
Operating supply voltage 5.5 13 36 V
CC
Under-voltage shutdown 3 4 5.5 V
USD
Over-voltage shutdown 36 V
OV
I
= 5A; Tj = 25°C;
OUT
On-state resistance
ON
Clamp voltage I
Supply current
I
S
Off-state output current V
Off-state output current V
Off-state output current
I
= 5A; Tj = 150°C;
OUT
= 3A; V
I
OUT
= 20mA 41 48 55 V
CC
Off-state; V
= V
V
IN
OUT
Off-state; V
= V
V
IN
OUT
On-state; V
= 0A; R
I
OUT
= V
IN
OUT
= 0V; V
IN
V
= V
IN
OUT
= 6V
CC
= 13V;
CC
= 0V
= 13V;
CC
= 0V; Tj = 25°C
= 13V; V
CC
SENSE
= 5V;
IN
= 3.9 kΩ
= 0V 0 50 µA
= 3.5V -75 0 µA
OUT
= 0V; V
CC
= 13V;
Tj = 125°C
35
70
120
121240
25
6
5µA
mΩ
mΩ
mΩ
µA
µA
mA
V
= V
IN
Tj = 25°C
Note: V
I
L(off4)
CLAMP
Table 6. Switching (VCC=13V)
Off-state output current
and VOV are correlated. Typical difference is 5V.
Symbol Parameter Test conditions Min. Typ. Max. Unit
t
d(on)
t
d(off)
dV
OUT
dV
OUT
Table 7. VCC output diode
Turn-on delay time RL = 2.6Ω (see Figure 4.)30µs
Turn-off delay time RL = 2.6Ω (see Figure 4.)30µs
/dt
Turn-on voltage slope RL = 2.6Ω (see Figure 4.) See Figure 10. V/µs
(on)
/dt
Turn-off voltage slope RL = 2.6Ω (see Figure 4.) See Figure 12. V/µs
(off)
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
F
Forward on voltage - I
8/26
= 0V; V
OUT
= 2.3 A; Tj = 150°C 0.6 V
OUT
CC
= 13V;
3µA
Page 9
VND600 Electrical specifications
Table 8. Logic inputs
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
V
V
I(hyst)
V
Table 9. Current sense (9V ≤ V
Input low-level voltage 1.25 V
IL
Low-level input current V
I
IL
Input high-level voltage 3.25 V
IH
I
High-level input current V
IH
= 1.25V 1 µA
IN
= 3.25V 10 µA
IN
Input hysteresis voltage 0.5 V
Input clamp voltage
ICL
CC
≤ 16V)
I
IN
= - 1mA
I
IN
= 1mA
66.8
- 0.7
8V
Symbol Parameter Test conditions Min. Typ. Max. Unit
I
dK
dK
K
1/K1
K
2/K2
K
1
2
3
I
OUT/ISENSE
Current sense
ratio drift
I
OUT/ISENSE
Current sense
ratio drift
I
OUT/ISENSE
= 0.5A; V
OUT
= -40°C...150°C
T
j
= 0.5A; V
I
OUT
= - 40°C...150°C
T
j
I
= 5A; V
OUT
= - 40°C
T
j
= 25°C...150°C
T
j
I
OUT
= -40°C...150°C
T
j
I
OUT
= -40°C
T
j
= 5A; V
= 15A; V
SENSE
SENSE
Tj = 25°C...150°C
SENSE
SENSE
SENSE
= 0.5V;
= 0.5V;
= 4V;
= 4V;
= 4V;
3300 4400 6000
- 10 + 10 %
4200
4400
4900
4900
6000
5750
- 6 + 6 %
4200
4400
4900
4900
5500
5250
V
= 15A; V
dK
V
SENSE
3/K3
Current sense
ratio drift
Max analog
sense output
voltage
I
OUT
= -40°C...150°C
T
j
V
= 5.5V; I
CC
R
V
R
SENSE
> 8V, I
CC
SENSE
= 10kΩ
OUT
= 10kΩ
SENSE
OUT
= 5A;
Sense voltage in
V
SENSEH
over-temperature
V
CC
= 13V; R
SENSE
condition
Analog sense
R
VSENSEH
output
impedance in
over-temperature
V
= 13V; Tj > T
CC
output open
condition
t
DSENSE
1. Current sense signal delay after positive input slope.
Current sense
delay response
To 9 0 % I
SENSE
(1)
9/26
= 4V;
- 6 + 6 %
= 2.5A;
2
4
= 3.9kΩ 5.5 V
;
TSD
400 Ω
500 µs
V
V
Page 10
Electrical specifications VND600
Table 10. Protections
(1)
Symbol Parameter Test conditions Min. Typ. Max. Unit
T
TSD
T
T
hyst
I
lim
V
demag
V
1. To ensure long term reliability under heavy over-load or short circuit conditions, protection and related
diagnostic signals must be used together with a proper software strategy. If the device operates under
abnormal conditions this software must limit the duration and number of activation cycles.
Table 11. Truth table
Shutdown temperature 150 175 200 °C
Reset temperature 135 °C
R
Thermal hysteresis 7 15 °C
V
Current limitation
Turn-off output clamp
voltage
Output voltage drop
ON
limitation
= 13V
CC
5V < V
I
OUT
V
CC
IN
< 36V
= 2 A;
= 0V;
L = 6mH
= 0.5 A;
I
OUT
= -40°C...150°C
T
j
25 40 70
V
CC
- 41 V
CC
- 48 V
50 mV
70
- 55 V
CC
Conditions Input Output Sense
Normal operation
L
H
L
H
0
Nominal
A
A
Over-temperature
Under-voltage
Over-voltage
Short circuit to GND
Short circuit to V
CC
L
H
L
H
L
H
L
H
H
L
H
L
L
V
SENSEH
L
L
L
L
L
L
L
(T
j>TTSD
(T
H
H
< Nominal
Negative output voltage clamp L L 0
0
0
0
0
0
0
j<TTSD
) V
0
) 0
SENSEH
10/26
Page 11
VND600 Electrical specifications
Table 12. Electrical transient requirements
ISO T/R
Test level
7637/1
Test pulse
1- 25V
2 + 25V
3a - 25V
3b + 25V
4- 4V
5+ 26.5V
1. All functions of the device are performed as designed after exposure to disturbance.
2. One or more functions of the device is not performed as designed after exposure and cannot be returned to
proper operation without replacing the device.
I II III IV Delays and impedance
(1)
(1)
(1)
(1)
(1)
(1)
- 50V
+ 50V
- 50V
+ 50V
- 5V
+ 46.5V
(1)
(1)
(1)
(1)
(1)
(2)
- 75V
+ 75V
- 100V
+ 75V
- 6V
+ 66.5V
(1)
(1)
(1)
(1)
(1)
(2)
- 100V
+ 100V
- 150V
+ 100V
- 7V
+ 86.5V
(1)
(1)
(1)
(1)
(1)
(2)
2ms, 10Ω
0.2ms, 10Ω
0.1µs, 50Ω
0.1µs, 50Ω
100ms, 0.01Ω
400ms, 2Ω
Figure 4. Switching characteristics
V
OUT
90%
t
f
dV
OUT
/dt
(off)
t
dV
I
SENSE
OUT
80%
/dt
(on)
t
90%
r
10%
t
t
d(on)
DSENSE
t
d(off)
INPUT
t
t
11/26
Page 12
Electrical specifications VND600
Figure 5. I
I
OUT/ISENSE
6500
6000
5500
5000
4500
4000
3500
3000
0 2 4 6 8 10 12 14 16
OUT/ISENSE
versus I
OUT
max.Tj=25...150°C
min.Tj=25...150°C
I
OUT
max.Tj=-40°C
typic al value
min.Tj=-40°C
(A)
12/26
Page 13
VND600 Electrical specifications
Figure 6. Waveforms
NORMAL OPERATION
INPUT
LOAD CURRENT
SENSE
UNDERVOLTAGE
V
CC
INPUT
LOAD CURRENT
SENSE
V
CC
INPUT
LOAD CURRENT
SENSE
V
USD
V
VCC > V
OV
USD
V
USDhyst
OVERVOLTAGE
V
OVhys t
INPUT
LOAD CURRENT
LOAD VOLTAGE
SENSE
INPUT
LOAD VOLTAGE
LOAD CURRENT
SENSE
T
j
INPUT
LOAD CURRENT
SENSE
SHORT TO GROUND
SHORT TO V
<Nominal
T
TSD
T
R
OVERTEMPERATURE
CC
<Nominal
I
SENSE
=
V
SENSEH
R
SENSE
13/26
Page 14
Electrical specifications VND600
2.4 Electrical characteristics curves
Figure 7. Off-state output current Figure 8. High-level input current
IL(o ff1) (u A)
2.5
2.25
2
1.75
1.5
1.25
1
0.75
0.5
0.25
0
Off state
Vcc=36V
Vin=Vout=0V
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
Iih (uA )
5
4.5
Vin =3.25V
4
3.5
3
2.5
2
1.5
1
0.5
0
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
Figure 9. Input clamp voltage Figure 10. Turn-on voltage slope
Vicl (V)
10
9.5
Iin =1mA
9
8.5
8
7.5
7
6.5
6
5.5
5
-50 -25 0 25 50 75 100 125 150 175
Tc (°C )
dVout/dt(on) (V/ms)
700
650
600
550
500
450
400
350
300
250
Vcc=13V
Rl=1.3Ohm
-50 -25 0 25 50 75 100 125 150 175
Tc (ºC)
Figure 11. Over-voltage shutdown Figure 12. Turn-off voltage slope
Vov (V)
50
48
46
44
42
40
38
36
34
32
30
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
14/26
dV out/dt(off) (V/ms )
600
550
Ri=6.5Ohm
500
450
400
350
300
250
200
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
Page 15
VND600 Electrical specifications
Figure 13. I
vs T
LIM
case
Ili m (A )
20
18
Vcc=13V
16
14
12
10
8
6
4
2
0
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
Figure 14. On-state resistance vs V
Ron (mOhm)
80
70
60
50
40
30
20
10
0
Io u t =5A
Tc = 150°C
Tc = 25°C
Tc = - 40°C
5 10152025303540
Vcc (V)
Figure 15. Input high-level Figure 16. Input hysteresis voltage
Vhyst (V)
Vih (V)
3.6
3.4
3.2
3
2.8
2.6
2.4
2.2
2
-50 -25 0 25 50 75 100 125 150 175
1.5
1.4
1.3
1.2
1.1
1
0.9
0.8
0.7
0.6
0.5
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
Figure 17. On-state resistance vs Tcase Figure 18. Input low-level
CC
Ron (mOhm)
100
90
80
70
60
50
40
30
20
10
0
Io u t =5A
Vc c=8V & 36V
-75 -50 -25 0 25 50 75 100 125 150 175
Tc (°C)
Vil (V)
2.6
2.4
2.2
2
1.8
1.6
1.4
1.2
1
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
15/26
Page 16
Application information VND600
3 Application information
Figure 19. Application schematic
+5V
R
prot
R
prot
R
prot
µ
C
R
prot
INPUT1
C. SENSE 1
INPUT2
C. SENSE 2
V
V
CC1
CC2
D
ld
OUTPUT1
OUTPUT2
GND2
R
GND
D
GND
R
SENSE1,2
GND1
V
GND
3.1 GND protection network against reverse battery
3.1.1 Solution 1: resistor in the ground line (R
This can be used with any type of load.
The following is an indication on how to dimension the R
1. R
2. R
where - I
maximum rating section of the device datasheet.
Power Dissipation in R
P
= (- VCC)2/ R
D
This resistor can be shared amongst several different HSDs. Please note that the value of
this resistor should be calculated with formula (1) where I
maximum on-state currents of the different devices.
≤ 600mV / (I
GND
≥ (- VCC) / (- I
GND
is the DC reverse ground pin current and can be found in the absolute
GND
GND
S(on)max
GND
)
GND
(when V
).
< 0: during reverse battery situations) is:
CC
GND
only)
resistor.
GND
S(on)max
becomes the sum of the
Please note that if the microprocessor ground is not shared by the device ground then the
R
will produce a shift (I
GND
S(on)max
* R
GND
values. This shift will vary depending on how many devices are ON in the case of several
high-side drivers sharing the same R
GND
If the calculated power dissipation leads to a large resistor or several devices have to share
the same resistor then ST suggests to utilize Solution 2 (see below).
16/26
) in the input thresholds and the status output
.
Page 17
VND600 Application information
3.1.2 Solution 2: diode (D
A resistor (R
= 1kΩ) should be inserted in parallel to D
GND
) in the ground line
GND
inductive load.
This small signal diode can be safely shared amongst several different HSDs. Also in this
case, the presence of the ground network will produce a shift (≈ 600mV) in the input
threshold and in the status output values if the microprocessor ground is not common to the
device ground. This shift will not vary if more than one HSD shares the same diode/resistor
network.
Series resistor in INPUT and STATUS lines are also required to prevent that, during battery
voltage transient, the current exceeds the absolute maximum rating.
Safest configuration for unused INPUT and STATUS pin is to leave them unconnected.
3.2 Load dump protection
Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the
V
max DC rating. The same applies if the device is subject to transients on the VCC line
CC
that are greater than the ones shown in the ISO 7637-2: 2004(E) table.
3.3 MCU I/Os protection
If a ground protection network is used and negative transient are present on the VCC line,
the control pins will be pulled negative. ST suggests to insert a resistor (R
prevent the µC I/Os pins to latch-up.
if the device drives an
GND
prot
) in line to
The value of these resistors is a compromise between the leakage current of µC and the
current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of µC
I/Os.
-V
CCpeak/Ilatchup
≤ R
prot
≤ (V
OHµC-VIH-VGND
) / I
IHmax
Calculation example:
For V
5kΩ ≤ R
Recommended values: R
CCpeak
prot
≤ 65kΩ.
= - 100V and I
latchup
=10kΩ .
prot
≥ 20mA; V
OHµC
≥ 4.5V
17/26
Page 18
Application information VND600
3.4 Maximum demagnetization energy (VCC = 13.5V)
Figure 20. Maximum turn-off current versus inductance
LMAX (A)
I
100
A
B
10
C
VIN, I
1
0.01 0.1 1 10 100
L(mH)
A: T
B: T
C: T
= 150°C single pulse
jstart
= 100°C repetitive pulse
jstart
= 125°C repetitive pulse
jstart
L
Demagnetization Demagnetization Demagnetization
t
Note: Values are generated with R
=0 Ω. In case of repetitive pulses, T
L
demagnetization) of every pulse must not exceed the temperature specified above for
curves A and B.
18/26
(at beginning of each
jstart
Page 19
VND600 Package and PCB thermal data
4 Package and PCB thermal data
4.1 SO-16L thermal data
Figure 21. SO-16L PC board
Note: Layout condition of R
thickness = 2mm, Cu thickness = 35µm, Copper areas: 0.5cm
Figure 22. R
70
thj-amb
RTH j-amb (°C/W)
65
60
55
50
45
40
01234567
and Zth measurements (PCB FR4 area = 41mm x 48mm, PCB
th
2
, 6cm2).
Vs PCB copper area in open box free air condition
PC B C u heatsink area (cm^2)
19/26
Page 20
Package and PCB thermal data VND600
Figure 23. Thermal impedance junction ambient single pulse
ZT H (°C/W)
1000
100
10
1
0.1
0.01
0.0001 0.001 0.01 0.1 1 10 100 1000
Time (s)
Equation 1
Z
THδ
where
: pulse calculation formula
R
TH
δ Z
THtp
1 δ–()+⋅=
δ tpT⁄=
Footprint
6 cm
2
Figure 24. Thermal fitting model of a quad channel HSD in SO-16L
Tj_1
Pd1
Tj_2
20/26
C1
C1 C2
R1
Pd2
R2
C3 C4
R3R1 R6R5R2
T_amb
C5 C6C2
R4
Page 21
VND600 Package and PCB thermal data
Table 13. Thermal parameters
Area / island (cm2) Footprint 6
R1 (°C/W) 0.05
R2 (°C/W) 0.3
R3 (°C/W) 2.2
R4 (°C/W) 12
R5 (°C/W) 15
R6 (°C/W) 37 22
C1 (W.s/°C) 0.001
C2 (W.s/°C) 5E-03
C3 (W.s/°C) 0.02
C4 (W.s/°C) 0.3
C5 (W.s/°C) 1
C6 (W.s/°C) 3 5
21/26
Page 22
Package and packing information VND600
5 Package and packing information
5.1 ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
®
is an ST trademark.
Figure 25. SO-16L package dimensions
22/26
Page 23
VND600 Package and packing information
Table 14. SO-16L mechanical data
mm.
DIM.
Min. Typ. Max.
A 2.65
a1 0.1 0.2
a2 2.45
b 0.35 0.49
b1 0.23 0.32
C0.5
c1 45° (typ.)
D 10.1 10.5
E 10.0 10.65
e1.27
e3 8.89
F7.4 7.6
L 0.5 1.27
M 0.75
S 8° (max.)
23/26
Page 24
Package and packing information VND600
5.2 SO-16L packing information
Figure 26. SO-16L tube shipment (no suffix)
Base Q.ty 50
Bulk Q.ty 1000
C
B
Tube length (± 0.5) 532
A 3.5
B 13.8
C (± 0.1) 0.6
A
All dimensions are in mm.
Figure 27. SO-16L tape and reel shipment (suffix “TR”)
Tape dimensions
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
Tape width W 16
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 12
Hole Diameter D (± 0.1/-0) 1.5
Hole Diameter D1 (min) 1.5
Hole Position F (± 0.05) 7.5
Compartment Depth K (max) 6.5
Hole Spacing P1 (± 0.1) 2
All dimensions are in mm.
End
Reel dimensions
Base Q.ty 1000
Bulk Q.ty 1000
A (max) 330
B (min) 1.5
C (± 0.2) 13
F 20.2
G (+ 2 / -0) 16.4
N (min) 60
T (max) 22.4
24/26
Top
cover
tape
500mm min
Empty components pockets
saled with cover tape.
User direction of feed
Start
No componentsNo components Components
500mm min
Page 25
VND600 Revision history
6 Revision history
Table 15. Document revision history
Date Revision Changes
07-Jul-2004 1 Initial release.
Minor changes.
Current and voltage convention update (page 2).
Configuration diagram (top view) and suggested connections for
09-Sep-2004 2
03-May-2006 3 Suggested connections for unused and n.c.pins correction.
17-Dec-2008 4
unused and n.c. pins insertion (page 2).
6 cm2 Cu condition insertion in thermal data table (page 3).
- output diode section update (page 4).
V
CC
Revision history table insertion (page 34).
Disclaimers update (page 35).
Document reformatted and restructured.
Added content, list of figures and tables.
®
Added ECOPACK
packages information.
25/26
Page 26
VND600
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