The µPC29M00 series of low dropout voltage three terminal positive regulators is constructed with PNP output
µ
transistor. The
typically 0.5 V.
The power dissipation of the
terminal positive voltage regulators that is constructed with NPN output transistor. Also, this series corresponds to
the low voltage output (3 V, 3.3 V) which is not in the conventional low dropout regulators (
FEATURES
• Output current in excess of 0.5 A
• Low dropout voltage V
• On-chip overcurrent and thermal protection circuit
• On-chip output transistor safe area protection circuit
PC29M00 series feature the ability to source 0.5 A of output current with a low dropout voltage of
µ
PC29M00 series can be drastically reduced compared with the conventional three
µ
PC24M00A series).
DIF = 0.5 V TYP. (at IO = 0.5 A)
PIN CONFIGURATION (Marking Side)
µ
PC29M00HF Series: MP-45G
12
3
1: INPUT
2: GND
3: OUTPUT
µ
PC29M00HB Series: MP-3
µ
PC29M00T Series: MP-3Z
4
12
3
1: INPUT
2: GND
3: OUTPUT
4: GND
Fin
Document No. G10027EJ3V0DS00 (3rd edition)
Date Published July 1998 N CP(K)
Printed in Japan
The information in this document is subject to change without notice.
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, Unless otherwise specified.)
µ
PC29M00 Series
ParameterSymbol
Input VoltageVIN20V
Internal Power Dissipation
Operating Ambient TemperatureTA–30 to +85°C
Operating Junction TemperatureTJ–30 to +150°C
Storage TemperatureTstg–55 to +150°C
Thermal Resistance (Junction to Case)Rth (J-C)712.5°C/W
Thermal Resistance (Junction to Ambient)
Note
PT1510W
Rth (J-A)65125°C/W
µ
PC29M00HF
Rating
µ
PC29M00HB, µPC29M00T
Note TC = 25 °C, Internally limited
When operating junction temperature rises up to 150 °C, the internal circuit shutdown output voltage.
Caution Exposure to Absolute Maximum Ratings for extended periods may affect device reliability;
exceeding the ratings could cause permanent damage. The parameters apply independently. The
device should be operated within the limits specified under DC and AC Characteristics.
TYPICAL CONNECTION
D1
Unit
PC29M00
INPUT
µ
COUTCIN
+
OUTPUT
D2
CIN: More than 0.1 µF. Required if regulator is located an appreciable distance from power supply filter. You
must use to prevent from the parasitic oscillation.
OUT: More than 47
C
1: Need for VO > VIN
D
µ
F. You must use the Low-impedance-type (low ESR) capacitor.
0 °C ≤ TJ ≤ 125 °C, 4.0 V ≤ VIN ≤ 16 V,
0 A ≤ IO≤ 350 mA
0 °C ≤ TJ≤ 125 °C, 0 A ≤ IO≤ 0.5 A
Line RegulationREGIN4.0 V ≤ VIN≤ 16 V730mV
Load RegulationREGL0 A ≤ IO≤ 0.5 A830mV
Quiescent CurrentI BIASIO = 0 A1.84.0mA
0 °C ≤ TJ ≤ 125 °C, 4.3 V ≤ VIN ≤ 16 V,
0 A ≤ IO≤ 350 mA
0 °C ≤ TJ≤ 125 °C, 0 A ≤ IO≤ 0.5 A
Line RegulationREGIN4.3 V ≤ VIN≤ 16 V833mV
Load RegulationREGL0 A ≤ IO≤ 0.5 A1033mV
Quiescent CurrentI BIASIO = 0 A1.84.0mA
0 °C ≤ TJ≤ 125 °C, 6 V ≤ VIN≤ 16 V,
0 A ≤ IO≤ 350 mA
0 °C ≤ TJ≤ 125 °C, 0 A ≤ IO≤ 0.5 A
Line RegulationREGIN6 V ≤ VIN≤ 16 V2650mV
Load RegulationREGL0 A ≤ IO≤ 0.5 A1750mV
Quiescent CurrentI BIASIO = 0 A1.94.0mA
0 °C ≤ TJ≤ 125 °C, 7 V ≤ VIN≤ 16 V,
0 A ≤ IO≤ 350 mA
0 °C ≤ TJ≤ 125 °C, 0 A ≤ IO≤ 0.5 A
Line RegulationREGIN7 V ≤ VIN≤ 16 V3060mV
Load RegulationREGL0 A ≤ IO≤ 0.5 A3060mV
Quiescent CurrentI BIASIO = 0 A2.04.0mA
0 °C ≤ TJ≤ 125 °C, 8 V ≤ VIN≤ 16 V,
0 A ≤ IO≤ 350 mA
0 °C ≤ TJ≤ 125 °C, 0 A ≤ IO≤ 0.5 A
Line RegulationREGIN8 V ≤ VIN≤ 16 V3570mV
Load RegulationREGL0 A ≤ IO≤ 0.5 A3570mV
Quiescent CurrentI BIASIO = 0 A2.04.0mA
0 °C ≤ TJ≤ 125 °C, 9 V ≤ VIN≤ 18 V,
0 A ≤ IO≤ 350 mA
0 °C ≤ TJ≤ 125 °C, 0 A ≤ IO≤ 0.5 A
Line RegulationREGIN9 V ≤ VIN≤ 18 V4080mV
Load RegulationREGL0 A ≤ IO≤ 0.5 A4080mV
Quiescent CurrentI BIASIO = 0 A2.04.0mA
0 °C ≤ TJ≤ 125 °C, 10 V ≤ VIN≤ 18 V,
0 A ≤ IO≤ 350 mA
0 °C ≤ TJ≤ 125 °C, 0 A ≤ IO≤ 0.5 A
Line RegulationREGIN10 V ≤ VIN≤ 18 V4590mV
Load RegulationREGL0 A ≤ IO≤ 0.5 A4590mV
Quiescent CurrentI BIASIO = 0 A2.04.0mA
0 °C ≤ TJ≤ 125 °C, 11 V ≤ VIN≤ 18 V,
0 A ≤ IO≤ 350 mA
0 °C ≤ TJ≤ 125 °C, 0 A ≤ IO≤ 0.5 A
Line RegulationREGIN11 V ≤ VIN≤ 18 V34100mV
Load RegulationREGL0 A ≤ IO≤ 0.5 A10100mV
Quiescent CurrentI BIASIO = 0 A2.14.0mA
0 °C ≤ TJ≤ 125 °C, 13 V ≤ VIN≤ 18 V,
0 A ≤ IO≤ 350 mA
0 °C ≤ TJ≤ 125 °C, 0 A ≤ IO≤ 0.5 A
Line RegulationREGIN13 V ≤ VIN≤ 18 V25120mV
Load RegulationREGL0 A ≤ IO≤ 0.5 A13120mV
Quiescent CurrentI BIASIO = 0 A2.14.0mA
VIN = 11.5 V, IO = 0.5 A80
Quiescent Current Change∆IBIAS
Output Noise VoltageVn10 Hz ≤ f ≤ 100 kHz210
Ripple RejectionR·Rf = 120 Hz, 13 V ≤ VIN≤ 18 V4053dB
Dropout VoltageVDIF0 °C ≤ TJ≤ 125 °C, IO = 0.5 A0.51.0V
Short Circuit CurrentIO shortVIN = 14 V0.7A
Peak Output CurrentIO peakVIN = 14 V0.71.21.5A
Temperature Coefficient of∆VO/∆T0 °C ≤ TJ≤ 125 °C, IO = 5 mA1.2mV/°C
Output Voltage
0 °C ≤ TJ ≤ 125 °C, 13 V ≤ VIN ≤ 18 V
VIN = 18 V0.5
VIN = 18 V0.61.11.5
11.412.6
1.720mA
µ
Vr.m.s.
12
Page 13
µ
PC29M00 Series
TYPICAL CHARACTERISTICS
Pd vs T
A
20150
Solid line:
µ
15
PC29M00HF Series
Broken line:
PC29M00HB Series
µ
µ
PC29M00T Series
With infinite heatsink
100
50
0
µ
PC29M03
µ
PC29M05
10
–50
µ
5
Pd - Total Power Dissipation - W
Without heatsink
1.92
–100
- Output Voltage Deviation - mV
–150
∆VO
PC29M12
1.0
0
05085 100150–50050100150
TA
- Operating Ambient Temperature - ˚C
–200
TJ
- Operating Junction Temperature - ˚C
∆VO vs T
J
IO = 5 mA
- Output Voltage - VVDIF
O
V
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
1.0
0.8
0.6
IO = 0.5 A
IO = 0.35 A
IO = 5 mA
µ
PC29M03
VO vs V
2378
VIN
µ
IN ( PC29M33)
45610
- Input Voltage - V
V
DIF
vs T
J
J = 25 ˚C
T
I
BIAS
(I
BIAS (s) )
50
40
30
20
- Quiescent Current - mA
10
IBIAS
0
246810 12 1416 18 20
VIN
I
O peak
1.5
TJ = 25 ˚C
1.0
TJ = 125 ˚C
µ
vs V
IN ( PC29M33)
IO = 0.5 A
IO = 0.35 A
IO = 0 A
- Input Voltage - V
µ
vs V
DIF ( PC29M03)
TJ = 25 ˚C
TJ = 0 ˚C
µ
0.4
- Dropout Voltage - V
µ
PC29M12
PC29M33
0.2
IO = 0.5 A
0
–250+25+50+75 +100 +125 +150
T
J - Operating Junction Temperature - ˚C
0.5
- Peak Output Current - A
IO peak
05101520
V
DIF
- Dropout Voltage - V
13
Page 14
µ
PC29M00 Series
I
O peak
µ
vs V
DIF ( PC29M05)
1.5
TJ = 0 ˚C
1.0
TJ = 25 ˚C
0.5
IO peak - Peak Output Current - A
TJ = 125 ˚C
05101520
V
DIF - Dropout Voltage - V
R·R vs I
80
70
O
TJ = 25 ˚C
4.3 V ≤ V
f = 120 Hz
µ
PC29M03
IN ≤ 16 V
R·R vs f
80
T
J = 25 ˚C
70
µ
PC29M03
IO = 0.5 A
60
µ
PC29M12
50
40
30
R·R - Ripple Rejection - dB
20
0
101001 k10 k100 k
f - Frequency - Hz
V
DIF
µ
vs I
O ( PC29M03)
1.0
TJ = 25 ˚C
0.8
60
50
R·R - Ripple Rejection - dB
40
30
0
0.10.20.30.40.5
I
O - Output Current - A
VO vs I
6
5
4
3
VIN = 16 V
2
VO - Output Voltage - V
µ
PC29M12
µ
O ( PC29M03)
J = 25 ˚C
T
VIN = 4 V
0.6
0.4
VDIF - Dropout Voltage - V
0.2
0
00.10.20.30.40.5
I
O - Output Current - A
1
00.20.40.60.81.01.2
I
O - Output Current - A
14
Page 15
PACKAGE DRAWINGS
µ
PD29M00HF Series
3PIN PLASTIC SIP (MP-45G)
µ
PC29M00 Series
A
E
B
I
D
132
H
J
Z
C
FG
NOTE
Each lead centerline is located within 0.25 mm of
its true position (T.P.) at maximum material condition.
M
L
M
K
Y
V
N
P
U
ITEM MILLIMETERS
A10.0±0.2
B7.0±0.2
C1.50±0.2
D17.0±0.3
φ
E
F0.75±0.10
G0.25
H2.54 (T.P.)
I5.0±0.3
J
K
L8.5±0.2
M8.5±0.2
N
P2.8±0.2
U2.4±0.5
V
Y8.9±0.7
Z1.30±0.2
3.3±0.2
2.46±0.2
5.0±0.2
4.5±0.2
0.65±0.10
P3HF-254B-4
15
Page 16
µ
PC29M00HB Series
MP-3 (SC-64) (Unit: mm)
6.5±0.2
5.0±0.2
4
+0.2
–0.1
1.5
2.3±0.2
0.5±0.1
µ
PC29M00 Series
1.1±0.1
µ
PC29M00T Series
MP-3Z (SC-63) (Unit: mm)
1.6±0.2
123
2.32.3
6.5±0.2
5.0±0.2
0.5
5.5±0.27.0 MIN.
+0.2
–0.1
0.75
+0.2
–0.1
1.5
13.7 MIN.
+0.2
0.5
–0.1
2.3±0.2
0.5±0.1
16
4.3 MAX.0.8
1.1±0.2
4
123
0.9 MAX.
2.32.3
5.5±0.2
10.0 MAX.
2.0 MIN.
0.8 MAX.
1.0 MIN.
1.5 TYP.
0.5
0.8
Page 17
µ
PC29M00 Series
RECOMMENDED SOLDERING CONDITIONS
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
processes are used, or if the soldering is perfomed under different condition, please make sure to consult with our
sales offices.
Fof more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E).
Surface mount devices
µ
PC29M00T Series: MP-3Z
ProcessConditionsSymbol
Infrared ray reflowPeak temperature: 235 °C or below (Package surface temperature),IR35-00-2
Reflow time: 30 seconds or less (at 210 °C or higher),
Maximum number of reflow processes: 2 times.
VPSPeak temperature: 215 °C or below (Package surface temperature),VP15-00-2
Reflow time: 40 seconds or less (at 200 °C or higher),
Maximum number of reflow processes: 2 times.
Wave solderingSolder temperature: 260 °C or below, Flow time: 10 seconds or less,WS60-00-1
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120 °C or below (Package surface temperature).
Partial heating methodPin temperature: 300 °C or below,—
Heat time: 3 seconds or less (Per each side of the device).
Caution Apply only one kind of soldering condition to a device, except for “partial heating method”, or
the device will be damaged by heat stress.
Through-hole devices
µ
PC29M00HF Series: MP-45G
µ
PC29M00HB Series: MP-3
ProcessConditions
Wave solderingSolder temperature: 260 °C or below,
(only to leads)Flow time: 10 seconds or less.
Partial heating methodPin temperature: 300 °C or below,
Heat time: 3 seconds or less (Per each pin).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make
sure that the package body does not get jet soldered.
17
Page 18
µ
PC29M00 Series
CAUTION ON USE
When using the µPC29M00 series at the input voltage which is lower than in the recommended operating condition,
the big quiescent current flows through devices because the transistor of the output paragraph is saturated (Refer
BIAS (IBIAS (s)) vs VIN curves in TYPICAL CHARACTERISTICS). The
to I
circuits, but they sometimes need about 80 mA current. Therefore the power supply on the input needs the enough
current capacity to pass this quiescent current when the devices startup.
µ
PC29M00 series have saturation protection
REFERENCE DOCUMENTS
QUALITY GRADE ON NEC SEMICONDUCTOR DEVICESC11531E
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUALC10535E
IC PACKAGE MANUALC10943X
GUIDE TO QUALITY ASSUARANCE FOR SEMICONDUCTOR DEVICESMEI-1202
SEMICONDUCTORS SELECTION GUIDEX10679E
NEC SEMICONDUCTOR DEVICE RELIABILITY/QUALITY CONTROLIEI-1212
SYSTEM-THREE TERMINAL REGULATOR
18
Page 19
[MEMO]
µ
PC29M00 Series
19
Page 20
µ
PC29M00 Series
[MEMO]
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special:Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96.5
2
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.