Product specification
Supersedes data of 2000 Jan 12
File under Integrated Circuits, IC01
2001 Jul 25
Page 2
Philips SemiconductorsProduct specification
Economy audio CODEC with featuresUDA1343TT
FEATURES
General
• Low power consumption
• 2.4 to 3.6 V power supply range, with 3 V typical
• 5 V tolerant TTL compatible digital inputs
• 256, 384 and 512fs system clock
• Supports sampling frequencies from 8 to 110 kHz
• Non-inverting ADC plus integrated high-pass filter to
cancel DC offset
• The ADC supports 2 V (RMS) input signals
• Stereo PGA with 0 to 24 dB gain in 3 dB steps
• Overload detector for easy record level control
• Separate power control for ADC + PGA and DAC
• Integrated digital interpolation filter plus non-inverting
DAC
• Functions controllable by L3 microcontroller interface
• Small package size (TSSOP28)
• ADC and DAC output polarity can be set.
Multiple format input interface
• I2S-bus, MSB-justified up to 24 bits and LSB-justified
16, 18, 20 and 24 bits format compatible
• Four combined data formats with MSB data output and
LSB 16, 18, 20 and 24 bits data input
• 1fs input and output format data rate.
• High linearity, dynamic range and low distortion
• Digital silence detector
• Digital mixer for mixing ADC signal and playback signal
• ADC volume controlin 0.25 dB steps and cosine roll-off
mute.
APPLICATIONS
• Portable equipment which includes audio functions
• Digital video camera.
GENERAL DESCRIPTION
The UDA1343TT is a single-chip stereo Analog-to-Digital
Converter (ADC) and Digital-to-Analog Converter (DAC)
with basic signal processing features employing bitstream
conversion techniques. The low power consumption, the
small package size and low voltage requirements make
the device eminently suitable for use in low-voltage
low-power portable digital audio equipment which
incorporates recording and playback functions.
DAC digital sound processing
• Digital dB-linear volume control (low microcontroller
load) via L3 microcontroller in 0.25 dB steps
• Digital de-emphasis for 32, 44.1, 48 and 96 kHz
• Cosine roll-soft mute.
Advanced audio configuration
• Stereo single-ended input configuration
• Stereo line output (under microcontroller volume
control), no post filter required
ORDERING INFORMATION
TYPE
NUMBER
UDA1343TTTSSOP28plastic thin shrink small outline package; 28 leads; body width 4.4 mmSOT361-1
2001 Jul 252
NAMEDESCRIPTIONVERSION
TheUDA1343TTis equipped with a digital mixer formixing
the ADC signal directly to the playback signal (forexample
for Karaoke applications). In the mixing mode the ADC
output signal can be output before or after the mixer.
The mixer can also be used as a selector to select
between the ADC or the digital data being played back at
the DAC.
PACKAGE
Page 3
Philips SemiconductorsProduct specification
Economy audio CODEC with featuresUDA1343TT
QUICK REFERENCE DATA
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Supplies
V
DDA(ADC)
V
DDA(DAC)
V
DDD
I
DDA(ADC)
I
DDA(DAC)
I
DDO(DAC)
I
DDD
T
amb
Analog-to-digital converter
V
i(rms)
(THD + N)/Stotalharmonic distortion-plus-noise to
S/Nsignal-to-noise ratioV
α
cs
Digital-to-analog converter
V
o(rms)
(THD + N)/Stotalharmonic distortion-plus-noise to
α
cs
S/Nsignal-to-noise ratiocode = 0; A-weighted
ADC analog supply voltage2.43.03.6V
DAC analog supply voltage2.43.03.6V
digital supply voltage2.43.03.6V
ADC analog supply currentoperating mode−10−mA
ADC Power-down−100−µA
DAC analog supply currentoperating mode−4−mA
DAC Power-down−50−µA
DAC operational amplifier supply
current
operating mode−2.5−mA
DAC Power-down−200−µA
digital supply currentoperating mode−5−mA
ADC plus DAC
−300−µA
Power-down
ambient temperature−40−+85°C
input voltage (RMS value)notes 1, 2 and 3−1.0−V
at 0 dB
signal ratio
f
= 44.1 kHz−−85−dB
s
=96kHz−−81−dB
f
s
at −60 dB; A-weighted
= 44.1 kHz−−37−dB
f
s
=96kHz−−35−dB
f
s
= 0 V; A-weighted
i
f
= 44.1 kHz−97−dB
s
=96kHz−95−dB
f
s
channel separation−100−dB
output voltage (RMS value)860900940mV
at 0 dB
signal ratio
= 44.1 kHz−−85−dB
f
s
f
=96kHz−−80−dB
s
at −60 dB; A-weighted
= 44.1 kHz−−37−dB
f
s
f
=96kHz−−35−dB
s
channel separation−100−dB
= 44.1 kHz−100−dB
f
s
f
=96kHz−98−dB
s
2001 Jul 253
Page 4
Philips SemiconductorsProduct specification
Economy audio CODEC with featuresUDA1343TT
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Power performance
P
ADDA
P
DA
P
AD
P
PD
Notes
1. The input voltage can be up to 2 V (RMS) when the current through the ADC input pin is limited to approximately
1 mA by using a series resistor.
2. The input voltage to the ADC scales proportionally with the power supply.
3. The performance figures and input voltage of the ADC are given with the PGA gain set to 0 dB.
power consumption in record and
−64−mW
playback mode
power consumption in playback mode−36−mW
power consumption in record mode−46−mW
power consumption in Power-down
−2.0−mW
mode
2001 Jul 254
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Philips SemiconductorsProduct specification
Economy audio CODEC with featuresUDA1343TT
BLOCK DIAGRAM
handbook, full pagewidth
VINL
V
DDD
V
SSD
DATAO
BCK
WS
DATAI
OVERFL
V
DDA(ADC)VSSA(ADC)
21
35
PGAPGA
10
11
18
16
17
19
9
DIGITAL INTERFACE
DE-EMPHASIS/VOLUME/MUTE
UDA1343TT
V
ADCP
ADC
DECIMATION FILTER
DC/VOLUME/MUTE
DIGITAL MIXER
INTERPOLATION FILTER
NOISE SHAPER
V
764
ADC
ADCN
V
L3-BUS
INTERFACE
DIGITAL
SILENCE
DETECTOR
ref(A)
21
20
13
14
15
12
8
VINR
TEST1
TEST2
RESET
L3MODE
L3CLOCK
L3DATA
SYSCLK
DAC
VOUTL
26
25272322
V
DDO
V
SSO
V
DDA(DAC)VSSA(DAC)
Fig.1 Block diagram.
2001 Jul 255
DAC
V
ref(D)
24
VOUTR
28
MGL886
Page 6
Philips SemiconductorsProduct specification
Economy audio CODEC with featuresUDA1343TT
PINNING
SYMBOLPINTYPEDESCRIPTION
V
SSA(ADC)
V
DDA(ADC)
VINL3analog input padADC input left
V
ref(A)
VINR5analog input padADC input right
V
ADCN
V
ADCP
TEST185 V tolerant digital input pad with internal pull-down padtest pin 1
OVERFL95 V tolerant slew-rate controlled digital output padADC overload output
V
DDD
V
SSD
SYSCLK125 V tolerant digital Schmitt triggered input padsystem clock input 256, 384 or 512f
L3MODE13digital input padL3MODE input
L3CLOCK145 V tolerant digital Schmitt triggered input padL3CLOCK input
L3DATA155 V tolerant digital Schmitt triggered input with pull-down,
BCK165 V tolerant digital Schmitt triggered input padbit clock input
WS175 V tolerant digital Schmitt triggered input padword select input
DATAO185 V tolerant slew-rate controlled digital output paddata output
DATAI195 V tolerant digital Schmitt triggered input paddata input
RESET205 V tolerant digital Schmitt triggered input pad with
TEST2215 V tolerant digital input pad with internal pull-down padtest pin 2
V
SSA(DAC)
V
DDA(DAC)
VOUTR24analog output padDAC output right
V
DDO
VOUTL26analog output padDAC output left
V
SSO
V
ref(D)
1analog ground padADC analog ground
2analog supply padADC analog supply voltage
4analog padADC reference voltage
6analog padADC negative reference voltage
7analog padADC positive reference voltage
10digital supply paddigital supply voltage
11digital ground paddigital ground
L3DATA input
slew rate controlled output pad
reset input
internal pull-down
22analog ground padDAC analog ground
23analog supply padDAC analog supply voltage
25analog supply padoperational amplifier supply voltage
27analog ground padoperational amplifier ground
28analog padDAC reference voltage
s
2001 Jul 256
Page 7
Philips SemiconductorsProduct specification
Economy audio CODEC with featuresUDA1343TT
Reset
handbook, halfpage
V
SSA(ADC)
V
DDA(ADC)
L3CLOCK
1
2
VINL
3
V
4
ref(A)
VINR
5
V
V
OVERFL
SYSCLK
L3MODE
ADCN
ADCP
TEST1
V
DDD
V
SSD
6
7
UDA1343TT
8
9
10
11
12
13
Fig.2 Pin configuration.
MGL887
28
27
26
25
24
23
22
21
20
19
18
17
16
1514
V
ref(D)
V
SSO
VOUTL
V
DDO
VOUTR
V
DDA(DAC)
V
SSA(DAC)
TEST2
RESET
DATAI
DATAO
WS
BCK
L3DATA
Pin 20 is a reset pin (active HIGH), which resets the
internal digital core of the IC and also resets all feature
values of the L3 interface to their default settings as given
in Tables 8 and 9.
Since the RESET pin is a pull-down pad with
Schmitt-trigger, a Power-On Reset (POR) function can be
made by connecting this pinto the digital power supply via
a capacitor.
Note: care must be taken that during the HIGH period of
the reset signal it is best to have at least 8 SYSCLK clock
cycles to properly reset the device.
Analog-to-Digital Converter (ADC)
The stereo ADC of the UDA1343TT consists of two
5th-order Sigma-Delta modulators. They have a modified
Ritchie-coder architecture in a differential switched
capacitor implementation. The oversampling ratio is 64.
Analog front-end
The overall system gain is proportional to V
. The 0 dB
DDA
input level is defined as that which gives a −1dB
Full-Scale (FS) digital output (relative to the full-scale
swing).
FUNCTIONAL DESCRIPTION
The UDA1343TT accommodates slave mode only, this
means that in all applications the system devices must
provide the system clock and the serial audio clock
signals.
Thesystemclock must be locked infrequencytothe digital
interface input signals.
The BCK clock can be up to 128fs, or in other words the
BCK frequency f
frequency fWS or less: f
is 128 times the Word Select (WS)
BCK
= < 128 × fWS.
BCK
Important: the WS edge MUST fall on the negative edge
of the BCK at all times for correct operation of the digital
I/O data interface.
Note: the sampling frequency range is from 8 to 110 kHz,
however for the 512f
clock mode the sampling range is
s
from 8 to 55 kHz.
The analog front-end is equipped with a Programmable
Gain Amplifier (PGA) which can be controlled via the L3
interface. The control range is from 0 dB to 24 dB gain in
3 dB steps independant for left and right.
In applications in which a 2 V (RMS) input signal is used,
a12kΩresistormust be connectedin series withthe input
of the ADC. This makes a voltage divider with the internal
ADC resistor andmakes sure only 1 V (RMS) maximumis
input to the IC. Using this application for a2 V (RMS) input
signal, the switch must be set to 0 dB. When a 1 V (RMS)
inputsignal is input totheADC in the sameapplication,the
gain switch of the PGA must be set to 6 dB via the L3
interface.
An overview of the maximum input voltages allowed
againstthe presence of an externalresistorand the setting
of the gain switch is given in Table 1.
Thedecimation from 64fsto1fsisperformed in twostages.
The first stage realizes a 4th-order characteristic.
sin x
----------- x
This filter decreases the sample rate by 16. The second
stage consists of 2 half-band filters and a recursive filter,
each decimating by a factor of 2.
Table 2 Digital decimation filter characteristics
ITEMCONDITIONSVALUE (dB)
Pass-band ripple0 − 0.45f
Stop band>0.55f
Dynamic range0 − 0.45f
Overall gain with
DC−1.16
s
s
s
±0.05
−50
114
0 dB input to the
ADC
In the ADC path there is a volume control with a range of
0dBto−66 dB and −∞ dB in 0.25 dB steps, and a cosine
roll-off soft mute.
Table 3 Digital interpolation filter characteristics
The UDA1343 is equipped with a digital silence detector
on the digital data input. This detects whether a certain
amount of consecutive samples are 0. The status of the
digital silence detector can be read from the
microcontroller interface.
The number of samples can be set via the L3 interface to
3200, 4800, 9600 or 19600 samples.
The digital silence detection status can be read from the
microcontroller interface.
Mute
Muting the DAC will result in a cosine roll-off soft mute,
using32 × 4 = 128 samples (at 44.1 kHz thisis 3 ms). The
cosine roll-off curve is illustrated in Fig.3.
handbook, halfpage
1
mute
factor
0.8
MGS755
Note:thedigital output level is inversely proportional tothe
ADC analog power supply. This means that with a
constant analog input level and increasing analog power
supply, the digital output level will decrease proportionally.
Overload detection (ADC)
In practice the output is used to indicate whenever the
output data, ineither the left or rightchannel, is larger than
−1 dB (the actual figure is −1.16 dB) of the maximum
possible digital swing. When this condition is detected the
OVERFL output (pin 9) is forced HIGH for at least 512f
s
cycles (11.6 ms at fs= 44.1 kHz). This time-out is resetfor
each infringement.
Interpolation filter (DAC)
The digital filter interpolates from 1 to 128fsby means of a
cascade of a recursive filter and an FIR filter.
2001 Jul 258
0.6
0.4
0.2
0
013
2
t (ms)
Fig.3 Mute as a function of raised cosine roll-off.
Page 9
Philips SemiconductorsProduct specification
Economy audio CODEC with featuresUDA1343TT
Double speed
SInce the device supports a sampling range of
8 to 110 kHz, the device can support double speed (e.g.
for 44.1 kHz and 48 kHz) by just doubling the system
speed. In double speed all features are available.
Digital mixer
The UDA1343TT has a digital mixer which can mix the
ADC signal to the playback signal. A functional block
diagram of the mixer mode is given in Fig.4.
When the device is in mixer mode, care is taken to avoid
clipping. This is done by reducing both signals by −6dB
before mixing. After mixing there is master volume and
mute, after which the signal is reamplified digitally by 6 dB.
handbook, full pagewidth
from ADC
and decimator
DIGITAL
DC FILTER
ADC volume + mutemaster volume + mute
VOLUME +
MUTE
−6 dB
The codec can be set to mixer mode via the L3 interface
by setting the MIX bit HIGH.
In the mixer mode there are 3 volume and mute controls
available; one for the ADC channel, one for the playback
channel and one for the master (equal sum) signal.
All three volume ranges can be controlled in 0.25 dB
steps.
In the mixer mode, the ADC volume control is used for
mixing purposes. The decimator output signal can be
output from the chip before the ADC volume control or
after the ADC volume control. This can be set via the L3
interface using the ADC output select bit.
+
VOLUME +
MUTE
+6 dB
to interpolator
and DAC
ADC_OUT
select (L3)
2
I
S-bus
output
−6 dB
VOLUME +
MUTE
I2S-bus
input
UDA1343TT
2
S-bus volume + mute
I
Fig.4 Mixing feature in the UDA1343TT.
MGL888
2001 Jul 259
Page 10
Philips SemiconductorsProduct specification
Economy audio CODEC with featuresUDA1343TT
Digital output signal
The output to the digital output of the UDA1343TT can be
selected from 3 positions, using the two bits ADC_OUT
select in the L3 microcontroller interface. The 3 positions
are as follows:
• Directly from the ADC and decimator (default)
• After volume control and mute in the ADC data path
• After the digital mixer and before master volume control
and mute. It should be noted that this output is before
the +6 dB gain. This is done in order to prevent clipping
at the mixer output at all times.
Noise shaper (DAC)
The 3rd-order noise shaper operates at 128fs. It shifts
in-band quantization noise to frequencies well above the
audio band. This noise shaping technique enables high
signal-to-noise ratios to be achieved. The noise shaper
output is converted into an analog signal using a Filter
Stream Digital-to-Analog Converter (FSDAC).
The Filter Stream DAC (FSDAC)
The FSDAC is a semi-digital reconstruction filter that
converts the 1-bit data stream of the noise shaper to an
analog output voltage. The filter coefficients are
implemented as current sources and are summed at
virtual ground of the output operational amplifier.
In this way very high signal-to-noise performance and low
clock jitter sensitivity is achieved. A post-filter is not
needed due to the inherent filter function of the DAC.
On-board amplifiers convert the FSDAC output current to
an output voltage signal capable of driving a line output.
The output voltage of the FSDAC scales proportionally
with the power supply voltage.
Multiple format input/output audio interface
The digital audio interface supports multiple standards:
• I2S-bus with data word length of up to 24 bits
• MSB-justifiedserial format with data wordlengthof up to
24 bits
• LSB-justified data formats with word lengths of 16, 18,
20 and 24 bits
• Four combined data formats with MSB data output
and 16, 18, 20 and 24 LSB data input.
The digital audio interface formats are illustrated in Fig.5.
2001 Jul 2510
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2001 Jul 2511
book, full pagewidth
Philips SemiconductorsProduct specification
Economy audio CODEC with featuresUDA1343TT
WS
BCK
DATA
WS
BCK
DATA
WS
BCK
DATA
WS
BCK
DATA
MSB B2
MSB B2MSBLSBLSB MSB B2B2
LEFT
INPUT FORMAT I
LEFT
MSB-JUSTIFIED FORMAT
LEFT
LEFT
RIGHT
3
21> = 812 3
MSBMSBB2
2
S
RIGHT
>=8>=8
MSB B2 B3 B4
321321
16
1521
MSB
B2
16
1518 1721
> = 8
B15
LSB
LSB JUSTIFIED FORMAT 16 BITS
B17
LSB
LSB JUSTIFIED FORMAT 18 BITS
RIGHT
RIGHT
16
MSB B2
16 1518 1721
MSB B2 B3 B4
1521
B15 LSB
B17 LSB
WS
BCK
DATA
WS
BCK
DATA
MSB
LEFT
16
1518 1720 1921
B19
B23
LSB
LSB
MSB
B2
B3 B4
MSB B2 B3 B4 B5 B6
LSB JUSTIFIED FORMAT 20 BITS
LEFT
16
1518 1720 1922 2124 2321
B2
B3 B4
B5 B6 B7 B8 B9 B10
LSB JUSTIFIED FORMAT 24 BITS
RIGHT
16
MSB B2 B3 B4 B5 B6
RIGHT
16
B5 B6 B7 B8 B9 B10
1518 1720 1921
B19 LSB
1518 1720 1922 2124 2321
B23 LSB
MBK983
Fig.5 The digital audio interface formats.
Page 12
Philips SemiconductorsProduct specification
Economy audio CODEC with featuresUDA1343TT
L3 INTERFACE
Introduction
The UDA1343TT has a microcontroller input mode. In the
microcontroller mode, all the digital sound processing
features and the system controlling features can be
controlledby the microcontroller. Thecontrollable features
are:
• System clock frequency
• Data input format
• Power control
• DC filtering
• De-emphasis
• Volume:mastervolume,I2S-busmixervolumeandADC
volume
• Mute: master mute, I2S-bus mute and ADC mute
• Mixer settings
• PGA gain settings
• Digital silence control settings
• Polarity settings of the ADC and the DAC.
Theexchange of dataand control information betweenthe
microcontroller and the UDA1343TT is accomplished
through a serial hardware interface comprising the
following pins:
• L3DATA: microcontroller interface data line
• L3MODE: microcontroller interface mode line
• L3CLOCK: microcontroller interface clock line.
Information transfer via the microcontroller bus is
organized LSB first, and in accordance with the so called
‘L3’ format, in which two different modes of operation can
be distinguished; address mode and data transfer mode
(see Fig 6).
Important: when the device is powered-up, at least one
L3CLOCK pulse must be sent to the L3 interface to
wake-up the interface prior to sending to the device. This
is only needed once after the device is powered-up.
Device addressing
Table 4 Selection of data transfer
DOM
BIT 1
As can be seen in Table 4, the DATA and STATUS read
and write actions are combined.
The device address consists of one byte, which is split up
into two parts:
• Bits 7 to 2 represent a 6-bit device address
• Bits 1 and 0 represent the type of data transfer
according to Table 4.
As can be seen in Table 4, there are two types of data
transfers, being DATA and STATUS which can be read
and written.
Register addressing
After sending the device address, including the flags (the
DOM bits) whether the information is read or written, one
byte is sent with the destination register address using
7 bits, and 1 bit which signals whether information will be
read or written. The fundamental timing for the data mode
is illustrated in Fig.7.
Basically there are 3 cases for register addressing:
1. Register addressing for L3 write: the first bit is at
2. Prepare read addressing: the first bit of the byte is at
3. The read action itself: in this case the device returns a
DOM
BIT 0
00not used
01not used
10DATA and STATUS write or pre-read
11DATA and STATUS read
logic 0 indicating a write action to the destination
register, and is followed by 7 register address bits.
logic 1, signalling data will be read from the register
indicated.
register address prior to sending data from that
register. When the first bit of the byte is at logic 0, the
register address is valid, if the first bit is at logic 1 the
register address is invalid.
TRANSFER
The device addressing mode is used to select a device for
subsequent data transfer. The address mode is
characterized by L3MODE being LOW and a burst of
8 pulses on L3CLOCK, accompanied by 8 bits.
The fundamental timing is illustrated in Fig.6.
Basically, 2 types of transfer can be defined; data transfer
to the device and data transfer from the device;
see Table 4.
2001 Jul 2512
Page 13
Philips SemiconductorsProduct specification
Economy audio CODEC with featuresUDA1343TT
Data write mode
For writing data to a device four bytes must be sent.
The data write mode is illustrated in Fig.8.
1. One byte with the device address including ‘01’ for
signalling write to the device.
2. One byte starting with a logic 0 for signalling write
followed by 7 bits indicating the destination address.
3. Two data bytes.
Notes:
1. Each time a new destination address needs to be
written, the device address must sent again.
2. When addressing the device for the first time after
power-up of the device, at least one L3 clock cycle
must be sent to enable the L3 interface.
Data read mode
For reading from the device, a prepare-read must first be
done. After the prepare-read, the device address is sent
again. The device then returns with the register address,
indicating whether the address was valid or not, and the
data of the register. This procedure is explained below,
and an example transmission is illustrated in Fig.9.
1. One byte with the device address including ‘01’ for
signalling write to the address.
2. Onebyte is sent withtheregister address which needs
to be read. This byte starts with a logic 1, which
indicated that there will be a read action from the
register.
3. One byte with the device address including ‘11’ is sent
to the device. The ‘11’ indicates that the device must
write data to the microcontroller.
4. The device now writes the requested register address
to the bus, indicating whether the requested register
was valid or not (logic 0 means valid, logic 1 means
invalid).
5. The device writes the data from the requested register
to the bus (two bytes).
handbook, full pagewidth
L3MODE
L3CLOCK
L3DATA
t
h(L3)A
t
BIT 0
su(L3)A
t
su(L3)DA
t
CLK(L3)L
t
CLK(L3)H
Fig.6 Timing address mode.
2001 Jul 2513
t
h(L3)DA
t
su(L3)A
t
h(L3)A
T
cy(CLK)(L3)
BIT 7
MGL723
Page 14
Philips SemiconductorsProduct specification
Economy audio CODEC with featuresUDA1343TT
handbook, full pagewidth
L3MODE
L3CLOCK
L3DATA
L3DATA
write
read
t
t
su(L3)D
t
en(L3)DA
stp(L3)
t
CLK(L3)L
T
t
h(L3)DA
BIT 0
t
CLK(L3)H
t
h(L3)R
t
su(L3)R
t
su(L3)DA
cy(CLK)L3
Fig.7 Data write and read mode timing.
t
h(L3)D
t
h(L3)DA
BIT 7
t
dis(L3)DA
t
stp(L3)
MGL889
2001 Jul 2514
Page 15
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2001 Jul 2515
L3 wake-up pulse after power-up
L3CLOCK
L3MODE
register address
data byte 1data byte 2
MGS753
L3DATA
device address
0
10
DOM bits
write
Fig.8 Data write mode for L3 version 2.
Philips SemiconductorsProduct specification
Economy audio CODEC with featuresUDA1343TT
L3CLOCK
L3MODE
L3DATA
device address
0
111
DOM bits
prepare readsend by the device
register addressregister address
1
read
0/1
valid/non-valid
Fig.9 Data read mode for L3 version 2.
data byte 2data byte 2
MGL890
Page 16
Philips SemiconductorsProduct specification
Economy audio CODEC with featuresUDA1343TT
L3 protocol
WARNING
Write followed by read
When issuing a read command following a write command, at least 8 µs delay must be inserted to allow the write to
take effect. No further restrictions apply to the order of L3 read and write commands.
Table 5 L3 data WRITE
MODEDATA
Addressing mode device address01111000
Data transfer 1register address0 (write)A6A5A4A3A2A1A0
Data transfer 2MS data byteD15D14D13D12D11D10D9D8
Data transfer 3LS data byteD7D6D5D4D3D2D1D0
Table 6 L3 prepare READ DATA
MODEDATA
Addressing mode device address01111000
Data transfer 1register address1 (read)A6A5A4A3A2A1A0
Table 7 L3 READ DATA
MODEDATA
Addressing mode device address11111000
Data transfer 1register address0= valid
Data transfer 2MS data byteD15S14D13D12D11D10D9D8
Data transfer 3LS data byteD7D6D5D4D3D2D1D0
FIRST IN TIMELATEST IN TIME
BIT 0BIT 1BIT 2BIT 3BIT 4BIT 5BIT 6BIT 7
FIRST IN TIMELATEST IN TIME
BIT 0BIT 1BIT 2BIT 3BIT 4BIT 5BIT 6BIT 7
FIRST IN TIMELATEST IN TIME
BIT 0BIT 1BIT 2BIT 3BIT 4BIT 5BIT 6BIT 7
A6A5A4A3A2A1A0
1 = invalid
2001 Jul 2516
Page 17
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2001 Jul 2517
L3 settings
L3 REGISTER MAPPING
Table 8 L3 register mapping including default register settings; bits D15 to D8
A 1-bit value to enable the digital master mute. This mute
control signal mutes the master playback signal after
mixing.
Table 21 Master mute
MTMFUNCTION
0no muting
1muting
MIXER MUTE CONTROL
Two 1-bit values to enable the digital mutes of the mixer.
These signals can be used to independently mute the
I2S-bus playback signal or the signal coming from the
ADC. These mute functions can only be used in the mixer
mode when the MIX bit is set HIGH.
The MT-ADC and MT-IIS bits can also be used to select
either the I2S-bus or the ADC signal for playback.
2001 Jul 2521
MT-ADC/MT-IISFUNCTION
0no muting
1muting
DIGITAL DE-EMPHASIS
A 2-bit value to enable the digital de-emphasis filter.
DC FILTER
A 1-bit value to enable the digital DC filter (see Table 24).
Table 24 DC filtering; note 1
DC1DC0FUNCTION
00no DC filtering
01DC filtering with −3 dB at 3 Hz
10DC filtering with −3 dB at 100 Hz
11DC filtering with −3 dB at 200 Hz
Note
1. The corner frequencies of the DC filter are given assuming 44.1 kHz sampling frequency.
ADC POWER CONTROL
Three 1-bit value to disable the ADC to reduce power consumption.
Table 25 Power control settings
PON BIASPON-R ADCPON-L ADCFUNCTION
0xxboth ADC channels off and also bias block turned off
101ADC left channel powered on, bias block turned on
110ADC right channel powered on, bias block turned on
111both left and right ADC channels enabled, bias block turned on
PGA GAIN SETTINGS
Two 4-bit values to program the PGA gain settings. The PGA settings can be set individually for the left and the right
00000dB gain
00013dB gain
00106dB gain
00119dB gain
010012dB gain
010115dB gain
011018dB gain
011121dB gain
100024dB gain
1:::not used
2001 Jul 2522
Page 23
Philips SemiconductorsProduct specification
Economy audio CODEC with featuresUDA1343TT
L3 readable registers
The L3 interface also contains some read-only registers in which system status can be read. The read-only registers are
given in Table 27. It should be noted that all bits mentioned in the table are active HIGH.
Table 27 Description of the bits from the READ ONLY registers
NAMEFUNCTION
2
SDET-IIS-Lsignals whether the output data of the I
SDET-IIS-Rsignals whether the output data of the I
MTM_statesignals whether there is master mute
MT-ADC_statesignals whether there is mute in the ADC channel
MT-IIS_statesignals whether there is mute in the I
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages referenced to ground;
V
DDD=VDDA=VDDO
=3V; T
=25°C; unless otherwise specified.
amb
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
DDD
T
xtal(max)
T
stg
T
amb
V
es
I
lu(prot)
I
sc(DAC)
digital supply voltagenote 1−5.0V
maximum crystal temperature−150°C
storage temperature−65+125°C
ambient temperature−40+85°C
electrostatic handling voltagehuman body model; note 2V
1. All power supply pins (VDDand VSS) must be connected to the same external power supply unit.
2. When higher capacitive loads must be driven, a 100 Ω resistor must be connected in series with the DAC output in
order to prevent oscillations in the output operational amplifier.
input voltage (RMS value)note 1−1.0−V
unbalance between channels−0.1−dB
at 0 dB
distortion-plus-noise to signal ratio
fs= 44.1 kHz−−85−dB
fs= 96 kHz−−83−dB
at −60 dB; A-weighted
fs= 44.1 kHz−−37−dB
fs= 96 kHz−−35−dB
S/Nsignal-to-noise ratioVi= 0 V; A-weighted
fs= 44.1 kHz−97−dB
fs= 96 kHz−95−dB
α
cs
PSRRpower supply rejection ratiof
channel separation−100−dB
= 1 kHz;
ripple
V
ripple(p-p)
=1%
Analog-to-digital converter using PGA
V
i(rms)
input voltage (RMS value)
resulting in −1 dB FS digital output
0 dB setting−1000−mV
3 dB setting−708−mV
6 dB setting−500−mV
9 dB setting−354−mV
12 dB setting−250−mV
15 dB setting−178−mV
18 dB setting−126−mV
21 dB setting−89−mV
24 dB setting−63−mV
−30−dB
2001 Jul 2525
Page 26
Philips SemiconductorsProduct specification
Economy audio CODEC with featuresUDA1343TT
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
(THD + N)/Stotal harmonic
distortion-plus-noise to signal ratio
S/Nsignal-to-noise ratioVi= 0 V; A-weighted;
Digital-to-analog converter
V
o(rms)
∆V
o
output voltage (RMS value)860900940mV
unbalance between channels−0.1−dB
(THD + N)/Stotal harmonic
distortion-plus-noise to signal ratio
α
cs
channel separation−80−dB
S/Nsignal-to-noise ratiocode= 0; A-weighted
PSRRpower supply rejection ratiof
Note
1. The performance figures and input voltage given are with the PGA gain set to 0 dB.
f
= 44.1 kHz; at 0 dB
s
0 dB setting−−85−dB
3 dB setting−−85−dB
6 dB setting−−85−dB
9 dB setting−−85−dB
12 dB setting−−83−dB
15 dB setting−−83−dB
18 dB setting−−82−dB
21 dB setting−−81−dB
24 dB setting−−81−dB
fs= 44.1 kHz;
at −60 dB; A-weighted
0 dB setting−−37−dB
3 dB setting−−37−dB
6 dB setting−−37−dB
9 dB setting−−35−dB
12 dB setting−−34−dB
15 dB setting−−33−dB
18 dB setting−−31−dB
21 dB setting−−29−dB
24 dB setting−−27−dB
−97−dB
at 44.1 kHz
at 0 dB
fs= 44.1 kHz−−87−dB
fs= 96 kHz−−80−dB
at −60 dB; A-weighted
fs= 44.1 kHz−−39−dB
fs= 96 kHz−−37−dB
fs= 44.1 kHz−100−dB
fs= 96 kHz−98−dB
ripple
V
ripple(p-p)
= 1 kHz;
=1%
−60−dB
2001 Jul 2526
Page 27
Philips SemiconductorsProduct specification
Economy audio CODEC with featuresUDA1343TT
AC CHARACTERISTICS (DIGITAL)
V
DDD=VDDA=VDDO
otherwise specified.
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
System clock timing; see Fig.10
T
sys
t
CWL
t
CWH
t
r
t
f
Serial input/output data timing; see Fig.11
t
BCK
t
BCKH
t
BCKL
t
r
t
f
t
s(DATAI)
t
h(DATAI)
t
d(DATAO-BCK)
t
d(DATAO-WS)
t
h(DATAO)
t
s(WS)
t
h(WS)
Address and data transfer mode timing; see Fig 6
T
cy(CLK)(L3)
t
CLK(L3)H
t
CLK(L3)L
t
su(L3)A
t
h(L3)A
t
su(L3)DA
t
h(L3)DA
t
su(L3)DAA
t
h(L3)DAA
t
halt
= 2.7 to 3.6 V; T
system clock cyclef
f
LOW level pulse widthf
sys
f
HIGH level pulse widthf
sys
= −40 to +85 °C; RL=5kΩ; all voltages referenced to ground; unless
amb
= 256fs, note 13688488ns
sys
f
= 384fs, note 12459325ns
sys
f
= 512fs, note 23644244ns
sys
< 19.2 MHz0.30T
sys
f
≥ 19.2 MHz0.40T
sys
< 19.2 MHz0.30T
sys
≥ 19.2 MHz0.40T
f
sys
−0.70T
sys
−0.60T
sys
−0.70T
sys
−0.60T
sys
sys
sys
sys
sys
ns
ns
ns
ns
rise time−−20ns
fall time−−20ns
bit clock period
1
⁄
128fs
−−ns
bit clock HIGH time30−−ns
bit clock LOW time30−−ns
rise time−−20ns
fall time−−20ns
data input set-up time20−−ns
data input hold time0−−ns
data output delay time
−−80ns
(from BCK falling edge)
data output delay time (from WS edge) MSB-justified format −−80ns
data output hold time0−−ns
word select set-up time20−−ns
word select hold time10−−ns
L3CLOCK cycle time500−−ns
L3CLOCK HIGH period250−−ns
L3CLOCK LOW period250−−ns
L3MODE set-up timeaddress mode190−−ns
L3MODE hold timeaddress mode190−−ns
L3MODE set-up timedata transfer mode190−−ns
L3MODE hold timedata transfer mode190−−ns
L3DATA set-up timedata transfer mode
190−−ns
and address mode
L3DATA hold timedata transfer mode
30−−ns
and address mode
L3MODE halt time190−−ns
2001 Jul 2527
Page 28
Philips SemiconductorsProduct specification
Economy audio CODEC with featuresUDA1343TT
Notes to the AC characteristics (Digital)
1. Sampling range from 16 to 100 kHz is supported, with fs= 44.1 kHz typical.
2. Sampling range from 16 to 55 kHz is supported, with fs= 44.1 kHz typical.
handbook, full pagewidth
handbook, full pagewidth
WS
BCK
t
CWH
t
CWL
T
sys
MGR984
Fig.10 System clock timing.
t
BCKH
t
r
t
f
t
h(WS)
t
s(WS)
t
d(DATAO-BCK)
t
BCKL
t
d(DATAO-WS)
DATAO
DATAI
T
cy
Fig.11 Serial interface timing.
2001 Jul 2528
t
h(DATAO)
t
s(DATAI)
t
h(DATAI)
MGL885
Page 29
Philips SemiconductorsProduct specification
Economy audio CODEC with featuresUDA1343TT
APPLICATION INFORMATION
The application information as given in Fig.12, is an optimum application environment. Simplification is possible at the
cost of some performance degradation. The following notes apply:
• The capacitors at the output of the DAC can be reduced. It should be noted that the cut-off frequency of the DC filter
also changes.
• The capacitors at the input of the ADC can also be reduced. It should be noted that the cut-off frequency of the
capacitor with the 12 kΩ input resistance of the ADC will also change.
handbook, full pagewidth
3 V
ground
system
clock
overload
flag
left
input
right
input
8LM32A07
8LM32A07
X4
X5
L1
L2
C1
47 µF
(16 V)
C6
47 µF
(16 V)
C12
100 µF
(16 V)
R30
47 Ω
V
DDD
C11
100 µF
(16 V)
100 nF
V
DDA
V
DDD
SYSCLK
DATAO
BCK
WS
DATAI
OVERFL
VINL
VINR
RESET
L3MODE
L3CLOCK
L3DATA
12
18
16
17
19
9
3
5
20
13
14
15
100 µF
(16 V)
100 nF
(63 V)
V
SSA(ADC)
1
V
DDA
R21
C2
C21
1 Ω
R24
C25
100 nF
V
DDA(ADC)VADCNVADCP
26711
(63 V)
UDA1343TT
27
V
SSO
C26
100 nF
(63 V)
C7
100 µF
(16 V)
V
25
DDO
V
R25
1 Ω
DDO
22
V
SSA(DAC)
C27
100 nF
(63 V)
C10
100 µF
(16 V)
V
V
23
DDA
SSD
V
DDD
10
V
DDA(DAC)
R29
1 Ω
R28
1 Ω
V
DDD
V
ref(A)
4
VOUTL
26
VOUTR
24
V
ref(D)
28
C5
47 µF
(16 V)
C8
47 µF
(16 V)
C22
100 nF
(63 V)
C23
100 nF
(63 V)
R22
10 kΩ
R27
10 kΩ
C3
47 µF
(16 V)
R23
100 Ω
R26
100 Ω
C4
47 µF
(16 V)
X2
X3
MGL891
left
output
right
output
Fig.12 Application diagram.
2001 Jul 2529
Page 30
Philips SemiconductorsProduct specification
Economy audio CODEC with featuresUDA1343TT
PACKAGE OUTLINE
TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
SOT361-1
D
c
y
Z
28
pin 1 index
15
A
2
A
1
114
w M
b
e
p
E
H
E
L
L
detail X
A
X
v M
A
Q
(A )
3
A
θ
p
02.55 mm
scale
DIMENSIONS (mm are the original dimensions)
UNITA1A2A
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
A
max.
0.15
mm
1.10
OUTLINE
VERSION
SOT361-1 MO-153
0.05
0.95
0.80
IEC JEDEC EIAJ
0.25
b
3
p
0.30
0.19
(1)E(2)(1)
cD
0.2
9.8
4.5
0.1
9.6
REFERENCES
4.3
0.65
2001 Jul 2530
eHELLpQZywv θ
6.6
6.2
0.75
0.50
0.4
0.3
EUROPEAN
PROJECTION
0.130.10.21.0
0.8
0.5
ISSUE DATE
95-02-04
99-12-27
o
8
o
0
Page 31
Philips SemiconductorsProduct specification
Economy audio CODEC with featuresUDA1343TT
SOLDERING
Introduction to soldering surface mount packages
Thistextgives a very brief insighttoacomplex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuit board byscreenprinting, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating,soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• Forpackageswith leads on four sides, the footprintmust
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement andbefore soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Wave soldering
Conventional single wave soldering is not recommended
forsurfacemount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
2001 Jul 2531
Page 32
Philips SemiconductorsProduct specification
Economy audio CODEC with featuresUDA1343TT
Suitability of surface mount IC packages for wave and reflow soldering methods
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2001 Jul 2532
Page 33
Philips SemiconductorsProduct specification
Economy audio CODEC with featuresUDA1343TT
DATA SHEET STATUS
PRODUCT
DATA SHEET STATUS
Objective dataDevelopmentThis data sheet contains data from the objective specification for product
Preliminary dataQualificationThis data sheet contains data from the preliminary specification.
Product dataProductionThis data sheet contains data from the product specification. Philips
(1)
STATUS
(2)
DEFINITIONS
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DEFINITIONS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseor at any otherconditionsabovethose given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationorwarrantythat such applications will be
suitable for the specified use without further testing or
modification.
DISCLAIMERS
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductorscustomersusingorselling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuseof any of these products, conveys nolicenceortitle
under any patent, copyright, or mask work right to these
products,and makes no representations orwarrantiesthat
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
2001 Jul 2533
Page 34
Philips SemiconductorsProduct specification
Economy audio CODEC with featuresUDA1343TT
NOTES
2001 Jul 2534
Page 35
Philips SemiconductorsProduct specification
Economy audio CODEC with featuresUDA1343TT
NOTES
2001 Jul 2535
Page 36
Philips Semiconductors – a w orldwide compan y
Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors,
Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. +31 40 27 24825
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
2001
Internet: http://www.semiconductors.philips.com
72
Printed in The Netherlands753503/02/pp36 Date of release: 2001 Jul 25Document order number: 9397750 07922
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