Datasheet UDA1345TS Datasheet (Philips)

Page 1
INTEGRATED CIRCUITS
DATA SH EET
UDA1345TS
Economy audio CODEC
Product specification Supersedes data of 2000 Apr 18 File under Integrated Circuits, IC01
2000 Dec 19
Page 2
Philips Semiconductors Productspecification
Economy audio CODEC UDA1345TS

CONTENTS

1 FEATURES
1.1 General
1.2 Multiple format input interface
1.3 DAC digital sound processing
1.4 Advanced audio configuration 2 GENERAL DESCRIPTION 3 ORDERING INFORMATION 4 QUICK REFERENCE DATA 5 BLOCK DIAGRAM 6 PINNING 7 FUNCTIONAL DESCRIPTION
7.1 Analog-to-Digital Converter (ADC)
7.2 Analog front-end
7.3 Decimation filter (ADC)
7.4 Interpolation filter (DAC)
7.5 Double speed
7.6 Noise shaper (DAC)
7.7 The Filter Stream DAC (FSDAC)
7.8 Power control
7.9 L3MODE or static pin control
7.10 L3 microcontroller mode
7.10.1 Pinning definition
7.10.2 System clock
7.10.3 Multiple format input/output interface
7.10.4 ADC input voltage control
7.10.5 Overload detection (ADC)
7.10.6 DC cancellation filter (ADC)
7.11 Static pin mode
7.11.1 Pinning definition
7.11.2 System clock
7.11.3 Mute and de-emphasis
7.11.4 Multiple format input/output interface
7.11.5 ADC input voltage control
7.12 L3 interface
7.12.1 Address mode
7.12.2 Data transfer mode
8 LIMITING VALUES 9 THERMAL CHARACTERISTICS 10 DC CHARACTERISTICS 11 AC CHARACTERISTICS (ANALOG) 12 AC CHARACTERISTICS (DIGITAL) 13 APPLICATION INFORMATION 14 PACKAGE OUTLINE 15 SOLDERING
15.1 Introduction to soldering surface mount packages
15.2 Reflow soldering
15.3 Wave soldering
15.4 Manual soldering
15.5 Suitability of surface mount IC packages for wave and reflow soldering methods
16 DATA SHEET STATUS 17 DEFINITIONS 18 DISCLAIMERS
Page 3
Philips Semiconductors Productspecification
Economy audio CODEC UDA1345TS

1 FEATURES

1.1 General

• Low power consumption
• 2.4 to 3.6 V power supply range with 3.0 V typical
• 5 V tolerant TTL compatible digital inputs
• 256, 384 and 512fs system clock
• Supports sampling frequencies from 8 to 100 kHz
• Non-inverting ADC plus integrated high-pass filter to
cancel DC offset
• The ADC supports 2 V (RMS) input signals
• Overload detector for easy record level control
• Separate power control for ADC and DAC
• Integrated digital interpolation filter plus non-inverting
DAC
• Functions controllable either by L3 microcontroller interface or via static pins
• The UDA1345TSis pinand function compatible withthe UDA1344TS
• Small package size (SSOP28).

1.2 Multiple format input interface

• I2S-bus, MSB-justified up to 24 bits and LSB-justified 16, 18 and 20 bits format compatible
• Three combined data formatswith MSB data output and LSB 16, 18 and 20 bits data input
• 1fs input and output format data rate.

1.3 DAC digital sound processing

The sound processing features of the UDA1345TS can only be used in L3 microcontroller mode:
• Digital dB-linear volume control (low microcontroller load) via L3 microcontroller with 1 dB steps
• Digital de-emphasis for 32, 44.1 and 48 kHz
• Soft mute via cosine roll-off (in 1024 samples).
1.4 Advanced audio configuration
• Stereo single-ended input configuration
• Stereo line output (under microcontroller volume
control), no post filter required
• High linearity, dynamic range and low distortion.

2 GENERAL DESCRIPTION

The UDA1345TS is a single-chip stereo Analog-to-Digital Converter (ADC) and Digital-to-Analog Converter (DAC) with signal processing features employing bitstream conversion techniques. The low power consumption and low voltage requirements make the device eminently suitable for use in low-voltage low-power portable digital audio equipment which incorporates recording and playback functions.
The UDA1345TS supports the I2S-bus data format with word lengths of upto 24 bits, theMSB justified dataformat with word lengths of up to 20 bits and the LSB justified serial data format with word lengths of 16, 18 and 20 bits. The UDA1345TS also supports three combined data formats with MSB justified data output and LSB 16, 18 and 20 bits data input.
The UDA1345TS can be used either with static pin control or under L3 microcontroller interface. In L3 mode the UDA1345TS has basic sound features in playback mode such as de-emphasis, volume control and soft mute.
Note: in contrast to the UDA1344TS, the UDA1345TS does not have bass-boost and treble.

3 ORDERING INFORMATION

TYPE NUMBER
NAME DESCRIPTION VERSION
UDA1345TS SSOP28 plastic shrink small outline package; 28 leads; body width 5.3 mm SOT341-1
PACKAGE
Page 4
Philips Semiconductors Productspecification
Economy audio CODEC UDA1345TS

4 QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies
V
DDA(ADC)
V
DDA(DAC)
V
DDD
I
DDA(ADC)
I
DDA(DAC)
I
DDO(DAC)
I
DDD
T
amb
Analog-to-digital converter
V
i(rms)
(THD + N)/S total harmonic distortion-plus-noise to
S/N signal-to-noise ratio V
α
cs
Digital-to-analog converter
V
o(rms)
(THD + N)/S total harmonic distortion plus
α
cs
S/N signal-to-noise ratio code = 0; A-weighted
ADC analog supply voltage 2.4 3.0 3.6 V DAC analog supply voltage 2.4 3.0 3.6 V digital supply voltage 2.4 3.0 3.6 V ADC analog supply current operating mode − 10 14 mA
ADC power-down − 600 800 mA ADC power-down all − 300 800 mA
DAC analog supply current operating mode − 4 7.0 mA
DAC power-down − 50 150 µA
DAC operational amplifier supply current operating mode − 2.0 3.0 mA
DAC power-down − 200 400 µA
digital supply current operating mode − 58mA
ADC and DAC power-down − 350 500 µA
ambient temperature −40 − +85 °C
input voltage (RMS value) notes 1 and 2 − 1.0 − V
at 0 dB
signal ratio
= 44.1 kHz −−85 −80 dB
f
s
f
=96kHz −−80 −75 dB
s
at −60 dB; A-weighted
fs= 44.1 kHz −−36 −30 dB
=96kHz −−34 −30 dB
f
s
= 0 V; A-weighted
i
f
= 44.1 kHz 90 96 − dB
s
= 96 kHz 90 94 − dB
f
s
channel separation − 100 − dB
output voltage (RMS value) note 3 − 900 − mV
at 0 dB
noise-to-signal ratio
fs= 44.1 kHz −−85 −80 dB
=96kHz −−80 −71 dB
f
s
at −60 dB; A-weighted
= 44.1 kHz −−37 −30 dB
f
s
=96kHz −−35 −30 dB
f
s
channel separation − 100 − dB
= 44.1 kHz 90 100 − dB
f
s
f
= 96 kHz 90 98 − dB
s
Page 5
Philips Semiconductors Productspecification
Economy audio CODEC UDA1345TS
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Power performance
P
ADDA
P
DA
P
AD
P
PD
Notes
1. The input voltage can be up to 2 V (RMS) when the current through the ADC input pin is limited to approximately
1 mA by using a series resistor.
2. The input voltage to the ADC scales proportionally with the power supply voltage.
3. The output voltage of the DAC scales proportionally with the power supply voltage.
powerconsumption in recordand playback
− 64 − mW
mode power consumption in playback only mode − 36 − mW power consumption in record only mode − 46 − mW power consumption in Power-down mode − 2.2 − mW
Page 6
Philips Semiconductors Productspecification
Economy audio CODEC UDA1345TS

5 BLOCK DIAGRAM

handbook, full pagewidth
VINL
V
DDD
V
SSD
DATAO
BCK
WS
DATAI
MP1
V
DDA(ADC)VSSA(ADC)
21
3 5
10
11
18 16 17 19
9
0 dB/6 dB
SWITCH
DC-CANCELLATION FILTER
V
ADCP
ADC
DECIMATION FILTER
DIGITAL INTERFACE
INTERPOLATION FILTER
V
76 4
ADC
ADCN
V
ref(A)
0 dB/6 dB
SWITCH
L3-BUS
INTERFACE
21 20
13
14 15 12
UDA1345TS
NOISE SHAPER
VINR
8
MC1 MC2 MP5
MP2 MP3 MP4 SYSCLK
DAC
VOUTL
26
25 27 23 22
V
DDO
V
SSO
V
DDA(DAC)VSSA(DAC)
Fig.1 Block diagram.
DAC
V
ref(D)
24
VOUTR
28
MGS875
Page 7
Philips Semiconductors Productspecification
Economy audio CODEC UDA1345TS

6 PINNING

SYMBOL PIN TYPE DESCRIPTION
V
SSA(ADC)
V
DDA(ADC)
VINL 3 analog input pad ADC input left V
ref(A)
VINR 5 analog input pad ADC input right V
ADCN
V
ADCP
MC1 8 5 V tolerant digital input pad with internal pull-down pad mode control 1 (pull-down) MP1 9 5V tolerant slew rate controlled digital output pad multi purpose pin 1 V
DDD
V
SSD
SYSCLK 12 5 V tolerant digital Schmitt triggered input pad system clock 256, 384 or 512f MP2 13 3-level input pad multi purpose pin 2 MP3 14 5 V tolerant digital Schmitt triggered input pad multi purpose pin 3 MP4 15 3-level input pad multi purpose pin 4 BCK 16 5 V tolerant digital Schmitt triggered input pad bit clock input WS 17 5 V tolerant digital Schmitt triggered input pad word select input DATAO 18 5 V tolerant slew rate controlled digital output pad data output DATAI 19 5 V tolerant digital Schmitt triggered input pad data input MP5 20 5 V tolerant digital Schmitt triggered input pad multi purpose pin 5 (pull down) MC2 21 5 V tolerant digital input pad with internal pull-down pad mode control 2 (pull-down) V
SSA(DAC)
V
DDA(DAC)
VOUTR 24 analog output pad DAC output right V
DDO
VOUTL 26 analog output pad DAC output left V
SSO
V
ref(D)
1 analog ground pad ADC analog ground 2 analog supply pad ADC analog supply voltage
4 analog pad ADC reference voltage
6 analog pad ADC negative reference voltage 7 analog pad ADC positive reference voltage
10 digital supply pad digital supply voltage 11 digital ground pad digital ground
s
22 analog ground pad DAC analog ground 23 analog supply pad DAC analog supply voltage
25 analog supply pad operational amplifier supply voltage
27 analog ground pad operational amplifier ground 28 analog pad DAC reference voltage
Page 8
Philips Semiconductors Productspecification
Economy audio CODEC UDA1345TS

7.1 Analog-to-Digital Converter (ADC)

handbook, halfpage
V
SSA(ADC)
V
DDA(ADC)
1 2
VINL
3
V
4
ref(A)
VINR
5 V V
SYSCLK
ADCN ADCP
MC1 MP1
V
DDD
V
SSD
MP2 MP3
6
7
UDA1345TS
8
9
10 11 12 13
Fig.2 Pin configuration.
MGS876
28 27 26 25 24 23 22 21 20 19 18 17 16 1514
V
ref(D)
V
SSO
VOUTL V
DDO
VOUTR V
DDA(DAC)
V
SSA(DAC)
MC2 MP5 DATAI DATAO WS BCK MP4
The stereo ADC of the UDA1345TS consists of two 5th-order Sigma-Delta modulators. They have a modified Ritchie-coder architecture in a differential switched capacitor implementation. The oversampling ratio is 64.

7.2 Analog front-end

The analog front-end isequipped with aselectable 0 dB or 6 dB gain block (the pin to select this mode is given in Section 7.10). This block can be used in applications in which both 1 V (RMS) and 2 V (RMS) input signals can be input to the UDA1345TS.
In applications in which a 2 V (RMS) input signal is used, a12kΩresistor must be used inseries with theinput ofthe ADC.This forms a voltage divider together with the internal ADC resistor and ensures that only 1 V (RMS) maximum is input to the IC. Using this application for a 2 V (RMS) input signal, the switch must be set to 0 dB. When a 1 V (RMS) input signal is input to the ADC in the same application, the gain switch must be set to 6 dB.
An overview of the maximum input voltages allowed againstthepresence of an external resistor andthe setting of the gain switch is given in Table 1; the power supply voltage is assumed to be 3 V.

7 FUNCTIONAL DESCRIPTION

The UDA1345TS accommodates slave mode only, this means that in all applications the system devices must provide the system clocks (being the system clock itself and the digital audio interface signals).
Thesystem clock must be locked in frequency to the audio digital interface input signals.
The BCK clock can be up to 128fs, or in other words the BCK frequency is 128 times the Word Select (WS) frequency or less: f
= < 128 × fWS.
BCK
Important: the WS edge MUST fall on the negative edge oftheBCK at all times for properoperationof the digital I/O data interface.
Note: the sampling frequency range is from 8 to 100 kHz, however for the 512fs clock mode the sampling range is from 8 to 55 kHz.
Table 1 Application modes using input gain stage
RESISTOR
(12 kΩ)
INPUT GAIN
SWITCH
MAXIMUM
INPUT
VOLTAGE
Present 0 dB 2 V (RMS) Present 6 dB 1 V (RMS) Absent 0 dB 1 V (RMS) Absent 6 dB 0.5 V (RMS)
7.3 Decimation filter (ADC)
Thedecimationfrom 64fsto1fsis performed in two stages. The first stage realizes a 4th-order characteristic.
sin x
----------- ­x
This filter decreases the sample rate by 8. The second stage consists of 2 half-band filters and a recursive filter, each decimating by a factor of 2.
Page 9
Philips Semiconductors Productspecification
Economy audio CODEC UDA1345TS
Table 2 Digital decimation filter characteristics
ITEM CONDITIONS VALUE (dB)
Pass-band ripple 0 − 0.45f Stop band >0.55f Dynamic range 0 − 0.45f Overall gain when
DC −1.16
s
s
s
±0.05
−60
114
a 0 dB signal is input to ADC to digital output
Note:thedigitaloutputlevel is inversely proportional to the ADC analog power supply. This means that with a constant analog input level and increasing power supply the digital output level will decrease proportionally.
7.4 Interpolation filter (DAC)
The digital filter interpolates from 1 to 128fsby means of a cascade of a recursive filter and an FIR filter.
Table 3 Digital interpolation filter characteristics
ITEM CONDITIONS VALUE (dB)
Passband ripple 0 − 0.45f Stopband >0.55f
s
Dynamic range 0 − 0.45f
s
s
±0.03
−65
116.5
Gain DC −3.5

7.7 The Filter Stream DAC (FSDAC)

The FSDAC is a semi-digital reconstruction filter that converts the 1-bit data stream of the noise shaper to an analog output voltage. The filter coefficients are implemented as current sources and are summed at virtual ground of the output operational amplifier. In this way very high signal-to-noise performance and low clock jitter sensitivity is achieved. A post filter is not needed due to the inherent filter function of the DAC. On-board amplifiers convert the FSDAC output current to an output voltage signal capable of driving a line output.
The output voltage of the FSDAC is scaled proportionally with the power supply voltage.

7.8 Power control

Intheeventthatthe DAC is powered-up or powered-down, a cosine roll-off mute will be performed (when powering down) or a cosine roll-up de-mute (when powering up) will be performed. This is in order to prevent clicks when powering up or down. This power-on/off mute takes 32 × 4 = 128 samples.

7.9 L3MODE or static pin control

The UDA1345TS can be used under L3 microcontroller interface mode or under static pin control. The mode can be set via the Mode Control (MC) pins MC1 (pin 8) and MC2 (pin 21). The function of these pins is given in Table 4.

7.5 Double speed

SInce the device supports a sampling range of 8 to 100 kHz, the device can support double speed (e.g. for 44.1 kHz and 48 kHz sampling frequency) by just doubling the system speed. In double speed all features are available.

7.6 Noise shaper (DAC)

The 3rd-order noise shaper operates at 128fs. It shifts in-band quantization noise to frequencies well above the audio band. This noise shaping technique enables high signal-to-noise ratios to be achieved. The noise shaper output is converted into an analog signal using a filter stream digital-to-analog converter.
Table 4 Mode Control pins MC1 and MC2
MODE MC2 MC1
L3MODE LOW LOW Test modes LOW HIGH
HIGH LOW
Static pin mode HIGH HIGH
Important: in L3MODE the UDA1345TS is completely pin and function compatible with the UDA1340M and the UDA1344TS.
Note: the UDA1345TS does NOT supportbass-boost and treble.
Page 10
Philips Semiconductors Productspecification
Economy audio CODEC UDA1345TS

7.10 L3 microcontroller mode

The UDA1345TS is set to the L3 microcontroller mode by setting both MC1 (pin 8) and MC2 (pin 21) LOW.
The definition of the control registers is given in Section 7.12.
7.10.1 PINNING DEFINITION The pinning definition underL3 microcontroller interface is
given in Table 5.
Table 5 Pinning definition under L3 control
SYMBOL PIN DESCRIPTION
MP1 9 OVERFL output MP2 13 L3MODE input MP3 14 L3CLOCK input MP4 15 L3DATA input MP5 20 ADC 1 V or 2 V (RMS) input control
7.10.2 S
YSTEM CLOCK
Under L3 control the options are 256, 384 and 512fs.
7.10.3 MULTIPLE FORMAT INPUT/OUTPUT INTERFACE The UDA1345TS supports the following data input/output
formats under L3 control:
• I2S-bus with data word length of up to 24 bits
• MSB-justifiedserialformat with data word length ofup to
20 bits
• LSB-justified serial format with data word lengths of 16, 18 or 20 bits
• Three combined data formatswith MSB data output and LSB 16, 18 and 20 bits data input.
The formats are illustrated in Fig.3. Left and right data channel words are time multiplexed.
7.10.4 ADC INPUT VOLTAGE CONTROL
The UDA1345TS supports a 2 V (RMS) input using a series resistor of 12 kΩ as described in Section 7.2. In L3 microcontroller mode, the gain can be selected via pin MP5.
When MP5 is set LOW, 0 dB gain is selected. When MP5 is set HIGH, 6 dB gain is selected.
7.10.5 O
VERLOAD DETECTION (ADC)
In practice the output is used to indicate whenever the output data, in either the left or right channel, is greater than −1 dB (the actual figure is −1.16 dB) of the maximum possible digital swing. When this condition is detected the OVERFL output is forced HIGH for at least 512fs cycles (11.6 ms at fs= 44.1 kHz). This time-out is reset for each infringement.
7.10.6 DC CANCELLATION FILTER (ADC) An optional IIR high-pass filter is provided to remove
unwanted DC components. The operation is selected by themicrocontrollerviatheL3-bus. The filter characteristics are given in Table 6.
Table 6 DC cancellation filter characteristics
ITEM CONDITIONS VALUE (dB)
Pass-band ripple none Pass-band gain 0 Droop at 0.00045f Attenuation at DC at 0.00000036f Dynamic range 0 − 0.45f
s
s
s
0.031 >40
>110

7.11 Static pin mode

TheUDA1345TSissettostaticpincontrolmodebysetting both MC1 (pin 8) and MC2 (pin 21) HIGH.
7.11.1 P
INNING DEFINITION
The pinning definition under static pin control is given in Table 7.
Table 7 Pinning definition for static pin control
SYMBOL PIN DESCRIPTION
MP1 9 data input/output setting MP2 13 3-level pin controlling de-emphasis
and mute
MP3 14 256f
or 384fs system clock
s
MP4 15 3-levelpin to control ADC power mode
and 1 V (RMS) or 2 V (RMS) input
MP5 20 data input/output setting
2000 Dec 19 10
Page 11
Philips Semiconductors Productspecification
Economy audio CODEC UDA1345TS
7.11.2 SYSTEM CLOCK Under static pin control the options are 256fs and 384fs.
With pin MP3 (pin 14) the mode can be set as is given in Table 8.
Table 8 System clock settings under static pin mode
MODE MP3
256f
system clock LOW
s
384f
system clock HIGH
s
7.11.3 MUTE AND DE-EMPHASIS Under static pin control via MP2 de-emphasis and mute
can be selected forthe playback path.The definition of the MP2 pin is given in Table 9.
Table 9 Settings for pin MP2
MODE MP2
No de-emphasis and mute LOW De-emphasis 44.1 kHz 0.5V
DDD
Muted HIGH
7.11.5 ADC
INPUT VOLTAGE CONTROL
The UDA1345TS supports a 2 V (RMS) input using a series resistor as described in Section 7.2.
In static pin mode the 3-level pin MP4 (pin 15) is used to select 0 or 6 dB gain mode. When MP4 is set LOW the ADC is powered-down. When MP4 is set to half the power supply voltage, then 6 dB gain is selected, and when MP4 is set HIGH then 0 dB gain is selected.
Table 11 MP4 mode settings (static mode)
MODE MP4
ADC Power-down mode LOW 6 dB gain mode MID 0 dB gain mode HIGH
7.11.4 M
ULTIPLE FORMAT INPUT/OUTPUT INTERFACE
The data input/output formats supported under static pin control are as follows:
• I2S-bus with data word length of up to 24 bits
• MSB-justifiedserialformat with data word length ofup to
24 bits
• Two combined data formats with MSB data output and LSB 16 and 20 bits data input.
The data formats can be selected using pins MP1 (pin 9) and MP5 (pin 20) as given in Table 10.
Table 10 Data format settings under static pin control
INPUT FORMAT MP1 MP5
MSB mode LOW LOW
2
I
S-bus LOW HIGH
MSB output LSB 20 input HIGH LOW MSB output LSB 16 input HIGH HIGH
The formats are illustrated in Fig.3. Left and right data channel words are time multiplexed.
2000 Dec 19 11
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2000 Dec 19 12
ndbook, full pagewidth
Philips Semiconductors Productspecification
Economy audio CODEC UDA1345TS
WS
BCK
DATA
WS
BCK
DATA
WS
BCK
DATA
WS
BCK
LEFT
>=8 >=8
MSB B2 MSBLSB LSB MSBB2
LEFT
1321
>=8 >=8
MSB B2 MSBLSB LSB MSB B2B2
LEFT
1516 1
MSB LSBB2
LEFT
RIGHT
321321
INPUT FORMAT I
RIGHT
32
MSB-JUSTIFIED FORMAT
2
B15
LSB-JUSTIFIED FORMAT 16 BITS
215161718 1
2
S-BUS
RIGHT
21516 1
MSB LSBB2 B15
RIGHT
215161718 1
DATA
WS
BCK
DATA
MSB B2 B3 B4
LEFT
MSB B2 B3 B4 B5 B6
LSB
B17
LSB-JUSTIFIED FORMAT 18 BITS
2151617181920 1
LSB
B19
LSB-JUSTIFIED FORMAT 20 BITS
Fig.3 Serial interface formats.
MSB B2 B3 B4
RIGHT
MSB B2 B3 B4 B5 B6
B17
B19
LSB
2151617181920 1
LSB
MGG841
Page 13
Philips Semiconductors Productspecification
Economy audio CODEC UDA1345TS

7.12 L3 interface

The UDA1345TS has a microcontroller input mode. In the microcontroller mode, all of the digital sound processing features and the system controlling features can be controlledby the microcontroller. The controllablefeatures are:
• System clock frequency
• Data input format
• Power control
• DC filtering
• De-emphasis
• Volume
• Mute.
Theexchange of data andcontrol information between the microcontroller and the UDA1345TS is accomplished through a serial hardware interface comprising the following pins:
• L3DATA: microcontroller interface data line
• L3MODE: microcontroller interface mode line
• L3CLOCK: microcontroller interface clock line.
Informationtransfervia the microcontroller bus is LSB first, and is organized in accordance with the so called ‘L3’ format, in which two different modes of operation can be distinguished; address mode and data transfer mode (see Figs 4 and 5).
The address mode is required to select a device communicating via the L3-bus and to define the destination register set for the data transfer mode. Data transfer for the UDA1345TS can only be in one direction: for the UDA1345TS, data can onlybe written to the device.
Important: since the UDA1345TS does not have a Power-up reset circuit, after power up the L3 interface registers MUST be initialized.
7.12.1 ADDRESS MODE
The address mode is used to select a device for subsequent data transfer and to define the destination register set (DATA or STATUS). The address mode is characterized by L3MODE being LOW and a burst of 8 pulses on L3CLOCK, accompanied by 8 data bits. The fundamental timing is shown in Fig.4. Data bits 0 and 1 indicate the type of subsequent data transfer as given in Table 12.
Table 12 Selection of data transfer
BIT 1 BIT 0 TRANSFER
0 0 DATA (volume, de-emphasis, mute,
and power control) 0 1 not used 1 0 STATUS(system clock frequency, data
input format and DC filter) 1 1 not used
Data bits 7 to 2 represent a6-bit device address, with bit 7 being the MSB and bit 2 the LSB. The address of the UDA1345TS is 000101 (bit 7 to bit 2). In theevent that the UDA1345TS receives a different address, it will deselect its microcontroller interface logic.
7.12.2 DATA TRANSFER MODE The selection preformed in the address mode remains
active during subsequent data transfers, until the UDA1345TS receives a new address command. The fundamental timing of data transfers is essentially the same as in the address mode, shown in Fig.4. The maximum input clock and data rate is 128fs. All transfers are byte wise,i.e. they are based on groups of 8 bits. Data will be stored in the UDA1345TS after the eighth bit of a byte has been received. A multibyte transfer is illustrated in Fig.6.
7.12.2.1 Programming the sound processing and other features
The feature values are stored in independent registers. Thefirstselectionoftheregistersisachievedbythe choice of data type that is transferred, being DATA or STATUS. This is performed in the address mode, bit 1 and bit 0 (see Table 12). The second selection is performed by the 2 MSBs of the data byte (bit 7 and bit 6). The other bits in the data byte (bit 5 to bit 0) are the values that are placed in the selected registers.
When the data transfer of type DATA is selected, the features Volume, De-emphasis, Mute and Power control can be controlled. Whenthe data transferof type STATUS is selected, the features system clock frequency, data input format and DC filter can be controlled.
2000 Dec 19 13
Page 14
Philips Semiconductors Productspecification
Economy audio CODEC UDA1345TS
handbook, full pagewidth
L3MODE
L3CLOCK
L3DATA
t
h(MA)
t
BIT 0
t
LC
t
s(MA)
t
s(DAT)
HC
Fig.4 Timing address mode.
t
h(DAT)
t
s(MA)
t
h(MA)
T
cy
BIT 7
MGL883
t
t
s(MT)
halt
BIT 0
t
HC
t
LC
t
h(DAT)
handbook, full pagewidth
L3MODE
L3CLOCK
L3DATA
write
Fig.5 Timing for data transfer mode.
2000 Dec 19 14
t
s(DAT)
t
halt
T
cy
t
h(DAT)
BIT 7
t
h(MT)
MGL884
Page 15
Philips Semiconductors Productspecification
Economy audio CODEC UDA1345TS
t
handbook, full pagewidth
L3MODE
L3CLOCK
L3DATA
halt
address
addressdata byte #1 data byte #2
Fig.6 Multibyte transfer.
Table 13 Data transfer of type status
LAST IN TIME FIRST IN TIME
REGISTER SELECTED
BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
0 0 SC1 SC0 IF2 IF1 IF0 DC System Clock frequency (5 : 4);
data Input Format (3 : 1); DC-filter
Table 14 Data transfer of type data
LAST IN TIME FIRST IN TIME
REGISTER SELECTED
BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0
0 0 VC5 VC4 VC3 VC2 VC1 VC0 Volume Control (5 : 0) 01000000not used 1 0 0 DE1 DE0 MT 0 0 De-Emphasis (4 : 3); MuTe 110000PC1PC0Power Control (1 : 0)
MGD018
2000 Dec 19 15
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Philips Semiconductors Productspecification
Economy audio CODEC UDA1345TS
7.12.2.2 System clock frequency
A 2-bit value (SC1 and SC0) to select the used external clock frequency (see Table 15).
Table 15 System clock frequency settings
SC1 SC0 FUNCTION
0 0 512f 0 1 384f 1 0 256f
s s s
1 1 not used
7.12.2.3 Data input format
A 3-bit value (IF2 to IF0) to select the used data format (see Table 16).
Table 16 Data input format settings
IF2 IF1 IF0 FUNCTION
2
000I
S-bus 0 0 1 LSB-justified; 16 bits 0 1 0 LSB-justified; 18 bits 0 1 1 LSB-justified; 20 bits 1 0 0 MSB-justified 1 0 1 MSB-justified output/
LSB-justified 16 bits input
1 1 0 MSB-justified output/
LSB-justified 18 bits input
1 1 1 MSB-justified output/
LSB-justified 20 bits input
7.12.2.4 DC filter
A 1-bit value to enable the digital DC filter (see Table 17).
Table 17 DC filtering
DC FUNCTION
0 no DC filtering 1 DC filtering
Table 18 Volume settings
VC5 VC4 VC3 VC2 VC1 VC0 VOLUME (dB)
000000 0 000001 0 000010 −1 000011 −2
:::::: : 110011 −50 110100 −52 110001 −54 110010 −57 110111 −60 111000 −66 111001 −∞
:::::: : 111111 −∞
7.12.2.6 De-emphasis
A 2-bit value to enable the digital de-emphasis filter.
Table 19 De-emphasis settings
DE1 DE0 FUNCTION
0 0 no de-emphasis 0 1 de-emphasis; 32 kHz 1 0 de-emphasis; 44.1 kHz 1 1 de-emphasis; 48 kHz
7.12.2.7 Mute
A 1-bit value to enable the digital DAC mute (playback).
Table 20 DAC mute
MT FUNCTION
0 no muting 1 muting
7.12.2.5 Volume control
A 6-bit value to program the left and right channel volume attenuation (VC5 to VC0). The range is 0 dB to −∞ dB in steps of 1 dB (see Table 18).
2000 Dec 19 16
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Philips Semiconductors Productspecification
Economy audio CODEC UDA1345TS
7.12.2.8 Power control
A 2-bit value to disable the ADC and/or DAC to reduce power consumption.
Table 21 Power control settings
PC1 PC0
FUNCTION
ADC DAC
0 0 off off 0 1 off on 1 0 on off 1 1 on on

8 LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages referenced to ground; V
DDD=VDDA=VDDO
=3V; T
=25°C; unless otherwise specified.
amb
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
DDD
T
xtal(max)
T
stg
T
amb
V
es
I
lu(prot)
digital supply voltage note 1 − 5.0 V maximum crystal temperature − 150 °C storage temperature −65 +125 °C ambient temperature −40 +85 °C electrostatic handling according to JEDEC II specification latch-up protection current T
amb
= 125 °C;
− 200 mA
VDD= 3.6 V
I
sc(DAC)
short-circuit current of DAC T
=0°C; VDD=3V;
amb
note 2
output short-circuited to V
SSA(DAC)
output short-circuited to V
DDA(DAC)
− 450 mA
− 325 mA
Notes
1. All V
and VSS connections must be made to the same power supply.
DD
2. DAC operation after short-circuiting cannot be warranted.

9 THERMAL CHARACTERISTICS

SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th(j-a)
thermal resistance from junction to
in free air 90 K/W
ambient
2000 Dec 19 17
Page 18
Philips Semiconductors Productspecification
Economy audio CODEC UDA1345TS

10 DC CHARACTERISTICS

V
DDD=VDDA=VDDO
(pins 1, 11, 22 and 27); unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies
V
DDA(ADC)
V
DDA(DAC)
V
DDD
I
DDA(ADC)
I
DDA(DAC)
I
DDO(DAC)
I
DDD
Digital input pins (5V tolerant TTL compatible)
V
IH
V
IL
V
IH(th)
V
IL(th)
V
hys
input leakage current −−10 µA
I
LI
C
i
3-level input pins (MP2; MP4)
V
IH
V
IM
V
IL
Digital output pins
V
OH
V
OL
Analog-to-digital converter
V
ref(A)
R
o(ref)
R
i
C
i
= 3.0 V; fs = 44.1 kHz; T
=25°C; RL=5kΩ; note 1; all voltages referenced to ground
amb
ADC analog supply voltage 2.4 3.0 3.6 V DAC analog supply voltage 2.4 3.0 3.6 V digital supply voltage 2.4 3.0 3.6 V ADC analog supply current operating mode − 10 14 mA
ADC power-down − 600 800 mA ADC power-down all − 300 800 mA
DAC analog supply current operating mode − 4 7.0 mA
DAC power-down − 50 150 µA
DAC operational amplifier supply current
operating mode − 2.0 3.0 mA DAC power-down − 200 400 µA
digital supply current operating mode − 58 mA
ADC and DAC
− 350 500 µA
power-down
HIGH-level input voltage 2.0 − 5.0 V LOW-level input voltage −0.5 − +0.8 V HIGH-level threshold input
1.3 − 1.9 V
voltage LOW-level threshold input voltage 0.9 − 1.35 V Schmitt trigger hysteresis voltage 0.4 − 0.7 V
input capacitance −−10 pF
HIGH-level input voltage 0.9V MIDDLE-level input voltage 0.4V
DDD DDD
− V
DDD
− 0.6V
+ 0.5 V
DDD
V
LOW-level input voltage −0.5 − +0.5 V
HIGH-level output voltage IOH= −2 mA 0.85V
−− V
DDD
LOW-level output voltage IOL=2mA −−0.4 V
reference voltage with respect to V V
reference output resistance − 24 − kΩ
ref(A)
SSA
0.45V
DDA
0.5V
DDA
0.55V
DDA
V
input resistance fi= 1 kHz − 12 − kΩ input capacitance − 20 − pF
2000 Dec 19 18
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Philips Semiconductors Productspecification
Economy audio CODEC UDA1345TS
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Digital-to-analog converter
V
ref(D)
R
o(ref)
R
o
I
o(max)
R
L
C
L
Notes
1. All power supply pins (VDDand VSS) must be connected to the same external power supply unit.
2. When higher capacitive loads must be driven then a 100 Ω resistor must be connected in series with the DAC output in order to prevent oscillations in the output operational amplifier.
reference voltage with respect to V V
reference output resistance − 12.5 − kΩ
ref(D)
SSA
0.45V
DDA
0.5V
DDA
0.55V
DDA
V
DAC output resistance − 0.13 3.0 Ω maximum output current (THD + N)/S < 0.1%;
− 1.7 − mA
RL= 800 Ω load resistance 3 −− kΩ load capacitance note 2 −−200 pF
2000 Dec 19 19
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Philips Semiconductors Productspecification
Economy audio CODEC UDA1345TS

11 AC CHARACTERISTICS (ANALOG)

V
DDD=VDDA=VDDO
(pins 1, 11, 22 and 27); unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Analog-to-digital converter
V
i(rms)
∆V
i
(THD + N)/S total harmonic distortion plus
S/N signal-to-noise ratio Vi= 0 V; A-weighted
α
cs
PSRR power supply rejection ratio f
Digital-to-analog converter
V
o(rms)
∆V
o
(THD + N)/S total harmonic distortion plus
S/N signal-to-noise ratio code = 0; A-weighted
α
cs
PSRR power supply rejection ratio f
= 3.0 V; fi= 1 kHz; fs = 44.1 kHz; T
=25°C; RL=5kΩ; all voltages referenced to ground
amb
input voltage (RMS value) notes 1 and 2 − 1.0 − V unbalance between channels − 0.1 − dB
at 0 dB
noise-to-signal ratio
fs= 44.1 kHz −−85 −80 dB fs= 96 kHz −−80 −75 dB
at −60 dB; A-weighted
fs= 44.1 kHz −−36 −30 dB
= 96 kHz −−34 −30 dB
f
s
fs= 44.1 kHz 90 96 − dB fs= 96 kHz 90 94 − dB
channel separation − 100 − dB
ripple
V
ripple(p-p)
= 1 kHz;
=1%
− 30 − dB
output voltage (RMS value) note 3 − 900 − mV unbalance between channels − 0.1 − dB
at 0 dB
noise-to-signal ratio
fs= 44.1 kHz −−85 −80 dB fs= 96 kHz −−80 −71 dB
at −60 dB; A-weighted
fs= 44.1 kHz −−37 −30 dB fs= 96 kHz −−35 −30 dB
fs= 44.1 kHz 90 100 − dB fs= 96 kHz 90 98 − dB
channel separation − 100 − dB
ripple
V
ripple(p-p)
= 1 kHz;
=1%
− 60 − dB
Notes
1. The input voltage can be up to 2 V (RMS) when the current through the ADC input pin is limited to approximately 1 mA by using a series resistor.
2. The input voltage to the ADC scales proportionally with the power supply voltage.
3. The output voltage of the DAC scales proportionally with the power supply voltage.
2000 Dec 19 20
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Philips Semiconductors Productspecification
Economy audio CODEC UDA1345TS

12 AC CHARACTERISTICS (DIGITAL)

V
DDD=VDDA=VDDO
(pins 1, 11, 22 and 27); unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
System clock timing; see Fig.7
T
sys
t
CWL
t
CWH
t
r
t
f
Serial input/output data timing; see Fig.8 t
BCK
t
BCKH
t
BCKL
t
r
t
f
t
s(DATAI)
t
h(DATAI)
t
d(DATAO−BCK)
t
d(DATAO−WS)
t
h(DATAO)
t
s(WS)
t
h(WS)
Address and data transfer mode timing; see Figs 4 and 5 T
cy
t
HC
t
LC
t
s(MA)
t
h(MA)
t
s(MT)
t
h(MT)
= 2.7 to 3.6 V; T
system clock cycle f
f
LOW-level pulse width f
sys
f
HIGH-level pulse width f
sys
= −20 to +85 °C; RL=5kΩ; all voltages referenced to ground
amb
= 256fs; note 1 39 88 488 ns
sys
f
= 384fs; note 1 26 59 325 ns
sys
f
= 512fs; note 2 36 44 244 ns
sys
< 19.2 MHz 0.30T
sys
f
≥ 19.2 MHz 0.40T
sys
< 19.2 MHz 0.30T
sys
≥ 19.2 MHz 0.40T
f
sys
− 0.70T
sys
− 0.60T
sys
− 0.70T
sys
− 0.60T
sys
sys sys sys sys
ns ns ns
ns rise time −−20 ns fall time −−20 ns
bit clock period
1
⁄
128fs
−−ns bit clock HIGH time 34 −−ns bit clock LOW time 34 −−ns rise time −−20 ns fall time −−20 ns data input set-up time 20 −−ns data input hold time 0 −−ns data output delay time (from BCK
−−80 ns
falling edge) data output delay time (from WS edge) MSB-justified format −−80 ns data output hold time 0 −−ns word select set-up time 20 −−ns word select hold time 10 −−ns
L3CLOCK cycle time 500 −−ns L3CLOCK HIGH period 250 −−ns L3CLOCK LOW period 250 −−ns L3MODE set-up time address mode 190 −−ns L3MODE hold time address mode 190 −−ns L3MODE set-up time data transfer mode 190 −−ns L3MODE hold time data transfer mode 190 −−ns
2000 Dec 19 21
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Philips Semiconductors Productspecification
Economy audio CODEC UDA1345TS
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
t
s(DAT)
t
h(DAT)
t
halt
Notes
1. Sampling range from 5 to 100 kHz is supported, with fs= 44.1 kHz typical.
2. Sampling range from 5 to 55 kHz is supported, with fs= 44.1 kHz typical.
L3DATA set-up time data transfer mode
190 −−ns
and address mode
L3DATA hold time data transfer mode
30 −−ns
and address mode
L3MODE halt time 190 −−ns
handbook, full pagewidth
handbook, full pagewidth
WS
BCK
t
CWH
t
CWL
T
sys
MGR984
Fig.7 System clock timing.
t
BCKH
t
r
t
f
t
BCKL
T
cy
t
h(WS)
t
d(DATAO-WS)
t
s(WS)
t
h(DATAO)
t
d(DATAO-BCK)
DATAO
DATAI
Fig.8 Serial interface timing.
2000 Dec 19 22
t
s(DATAI)
t
h(DATAI)
MGL885
Page 23
Philips Semiconductors Productspecification
h
Economy audio CODEC UDA1345TS

13 APPLICATION INFORMATION

Theapplication information as givenin Fig.9, is anoptimum application environment. Simplification ispossible at the cost of some performance degradation. The following notes apply:
• The capacitors at the output of the DAC can be reduced. It should be noted that the cut-off frequency of the DC filter also changes.
• The capacitors at the input of the ADC can also be reduced. It should be noted that the cut-off frequency of the capacitor with the 12 kW input resistance of the ADC will also change.
andbook, full pagewidth
3 V
ground
system
clock
overload
flag
left
input
right input
8LM32A07
8LM32A07
X4
X5
L1
L2
C1
47 µF
(16 V)
C6
47 µF
(16 V)
C12
100 µF
(16 V)
R30
47 Ω
C11
100 µF
(16 V)
V
DDA
V
DDD
SYSCLK
DATAO
BCK
DATAI
MP1
VINL
VINR
MP2 MP3 MP4
WS
12
18 16
17 19
9
3
5
13 14 15
100 µF
(16 V)
100 nF
(63 V)
V
SSA(ADC)
1
V
DDA
R21
C2
C21
1 Ω
R24
26711
10 Ω
C25
100 nF
V
DDA(ADC)VADCNVADCPVSSD
(63 V)
UDA1345TS
V
27
SSO
C26
100 nF
(63 V)
C7
100 µF
(16 V)
V
25
DDO
V
R25 1 Ω
DDO
22
V
SSA(DAC)
C27
100 nF
(63 V)
C10
100 µF
(16 V)
V
23
DDA
V
DDD
10
V
DDA(DAC)
R29 1 Ω
R28 10 Ω
V
DDD
V
ref(A)
4
VOUTL
26
VOUTR
24
V
ref(D)
28
C5
47 µF (16 V)
C8
47 µF (16 V)
C22 100 nF (63 V)
C23 100 nF (63 V)
R22 10 kΩ
R27 10 kΩ
C3 47 µF (16 V)
R23
100 Ω
R26
100 Ω
C4 47 µF (16 V)
X2
X3
MGS877
left
output
right
output
Fig.9 Application diagram.
2000 Dec 19 23
Page 24
Philips Semiconductors Productspecification
Economy audio CODEC UDA1345TS

14 PACKAGE OUTLINE

SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm

SOT341-1

D
c
y
Z
28 15
A
2
A
pin 1 index
114
w M
b
e
p
1
E
H
E
detail X
Q
L
p
L
(A )
A
X
v M
A
A
3
θ
0 2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A1A2A3b
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
A
max.
0.21
mm
2.0
OUTLINE
VERSION
SOT341-1 MO-150
0.05
1.80
0.25
1.65
IEC JEDEC EIAJ
0.38
0.25
p
0.20
0.09
(1)E(1) (1)
cD
10.4
5.4
10.0
REFERENCES
0.65 1.25
5.2
2000 Dec 19 24
eHELLpQZywv θ
7.9
7.6
1.03
0.63
0.9
0.7
EUROPEAN
PROJECTION
0.13 0.10.2
1.1
0.7
ISSUE DATE
95-02-04 99-12-27
o
8
o
0
Page 25
Philips Semiconductors Productspecification
Economy audio CODEC UDA1345TS

15 SOLDERING

15.1 Introduction to soldering surface mount
packages
Thistextgivesa very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011). There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for certainsurfacemountICs,but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.
15.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied tothe printed-circuit board by screen printing,stencilling or pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 250 °C. The top-surface temperature of the packages should preferable be kept below 220 °C for thick/large packages, and below 235 °C for small/thin packages.
15.3 Wave soldering
Conventional single wave soldering is not recommended forsurfacemountdevices(SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically developed.
If wave soldering is used the following conditions must be observed for optimal results:
• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e): – larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
• Forpackageswithleadson four sides, the footprint must be placed at a 45° angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners.
During placement and before soldering, thepackage must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
15.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C.
When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.
2000 Dec 19 25
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Philips Semiconductors Productspecification
Economy audio CODEC UDA1345TS
15.5 Suitability of surface mount IC packages for wave and reflow soldering methods
PACKAGE
WAVE REFLOW
(1)
BGA, LFBGA, SQFP, TFBGA not suitable suitable
SOLDERING METHOD
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS not suitable
(3)
PLCC
, SO, SOJ suitable suitable LQFP, QFP, TQFP not recommended SSOP, TSSOP, VSO not recommended
(2)
(3)(4) (5)
suitable
suitable suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2000 Dec 19 26
Page 27
Philips Semiconductors Productspecification
Economy audio CODEC UDA1345TS

16 DATA SHEET STATUS

DATA SHEET STATUS
Objective specification Development This data sheet contains the design target or goal specifications for
Preliminary specification Qualification This data sheet contains preliminary data, and supplementarydata will be
Product specification Production This data sheet contains final specifications. Philips Semiconductors
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
17 DEFINITIONS Short-form specification The data in a short-form
specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook.
Limiting values definition  Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device attheseor at any other conditions above thosegiven inthe Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information  Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make norepresentationorwarrantythatsuchapplicationswillbe suitable for the specified use without further testing or modification.
PRODUCT
STATUS

DEFINITIONS

product development. Specification may change in any manner without notice.
published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.

18 DISCLAIMERS Life support applications These products are not

designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected toresult in personal injury. Philips Semiconductorscustomersusingorsellingtheseproducts for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes  Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for theuseofanyof these products, conveys no licence or title under any patent, copyright, or mask work right to these products,and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
(1)
2000 Dec 19 27
Page 28
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Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Pakistan: see Singapore Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW, Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
2092 JOHANNESBURG, P.O. Box 58088 Newville 2114, Tel. +27 11 471 5401, Fax. +27 11 471 5398
South America: Al. Vicente Pinzon, 173, 6th floor, 04547-130 SÃO PAULO, SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 821 2382
Spain: Balmes 22, 08007 BARCELONA, Tel. +34 93 301 6312, Fax. +34 93 301 4107
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2741 Fax. +41 1 488 3263
Taiwan: Philips Semiconductors, 5F, No. 96, Chien Kuo N. Rd., Sec. 1, TAIPEI, Taiwan Tel. +886 2 2134 2451, Fax. +886 2 2134 2874
Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 60/14 MOO 11, Bangna Trad Road KM. 3, Bagna, BANGKOK 10260, Tel. +66 2 361 7910, Fax. +66 2 398 3447
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye, ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors, Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
© Philips Electronics N.V. SCA All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
2000
Internet: http://www.semiconductors.philips.com
70
Printed in The Netherlands 753503/03/pp28 Date of release: 2000 Dec 19 Document order number: 9397 750 07498
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