15.1Introduction to soldering surface mount
packages
15.2Reflow soldering
15.3Wave soldering
15.4Manual soldering
15.5Suitability of surface mount IC packages for
wave and reflow soldering methods
16DATA SHEET STATUS
17DEFINITIONS
18DISCLAIMERS
2000 Dec 192
Page 3
Philips SemiconductorsProductspecification
Economy audio CODECUDA1345TS
1FEATURES
1.1General
• Low power consumption
• 2.4 to 3.6 V power supply range with 3.0 V typical
• 5 V tolerant TTL compatible digital inputs
• 256, 384 and 512fs system clock
• Supports sampling frequencies from 8 to 100 kHz
• Non-inverting ADC plus integrated high-pass filter to
cancel DC offset
• The ADC supports 2 V (RMS) input signals
• Overload detector for easy record level control
• Separate power control for ADC and DAC
• Integrated digital interpolation filter plus non-inverting
DAC
• Functions controllable either by L3 microcontroller
interface or via static pins
• The UDA1345TSis pinand function compatible withthe
UDA1344TS
• Small package size (SSOP28).
1.2Multiple format input interface
• I2S-bus, MSB-justified up to 24 bits and LSB-justified
16, 18 and 20 bits format compatible
• Three combined data formatswith MSB data output and
LSB 16, 18 and 20 bits data input
• 1fs input and output format data rate.
1.3DAC digital sound processing
The sound processing features of the UDA1345TS can
only be used in L3 microcontroller mode:
• Digital dB-linear volume control (low microcontroller
load) via L3 microcontroller with 1 dB steps
• Digital de-emphasis for 32, 44.1 and 48 kHz
• Soft mute via cosine roll-off (in 1024 samples).
1.4Advanced audio configuration
• Stereo single-ended input configuration
• Stereo line output (under microcontroller volume
control), no post filter required
• High linearity, dynamic range and low distortion.
2GENERAL DESCRIPTION
The UDA1345TS is a single-chip stereo Analog-to-Digital
Converter (ADC) and Digital-to-Analog Converter (DAC)
with signal processing features employing bitstream
conversion techniques. The low power consumption and
low voltage requirements make the device eminently
suitable for use in low-voltage low-power portable digital
audio equipment which incorporates recording and
playback functions.
The UDA1345TS supports the I2S-bus data format with
word lengths of upto 24 bits, theMSB justified dataformat
with word lengths of up to 20 bits and the LSB justified
serial data format with word lengths of 16, 18 and 20 bits.
The UDA1345TS also supports three combined data
formats with MSB justified data output and LSB 16, 18
and 20 bits data input.
The UDA1345TS can be used either with static pin control
or under L3 microcontroller interface. In L3 mode the
UDA1345TS has basic sound features in playback mode
such as de-emphasis, volume control and soft mute.
Note: in contrast to the UDA1344TS, the UDA1345TS
does not have bass-boost and treble.
3ORDERING INFORMATION
TYPE NUMBER
NAMEDESCRIPTIONVERSION
UDA1345TSSSOP28plastic shrink small outline package; 28 leads; body width 5.3 mmSOT341-1
2000 Dec 193
PACKAGE
Page 4
Philips SemiconductorsProductspecification
Economy audio CODECUDA1345TS
4QUICK REFERENCE DATA
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX. UNIT
Supplies
V
DDA(ADC)
V
DDA(DAC)
V
DDD
I
DDA(ADC)
I
DDA(DAC)
I
DDO(DAC)
I
DDD
T
amb
Analog-to-digital converter
V
i(rms)
(THD + N)/S total harmonic distortion-plus-noise to
S/Nsignal-to-noise ratioV
α
cs
Digital-to-analog converter
V
o(rms)
(THD + N)/S total harmonic distortion plus
α
cs
S/Nsignal-to-noise ratiocode = 0; A-weighted
ADC analog supply voltage2.43.03.6V
DAC analog supply voltage2.43.03.6V
digital supply voltage2.43.03.6V
ADC analog supply currentoperating mode−1014mA
1. The input voltage can be up to 2 V (RMS) when the current through the ADC input pin is limited to approximately
1 mA by using a series resistor.
2. The input voltage to the ADC scales proportionally with the power supply voltage.
3. The output voltage of the DAC scales proportionally with the power supply voltage.
powerconsumption in recordand playback
−64−mW
mode
power consumption in playback only mode−36−mW
power consumption in record only mode−46−mW
power consumption in Power-down mode−2.2−mW
2000 Dec 195
Page 6
Philips SemiconductorsProductspecification
Economy audio CODECUDA1345TS
5BLOCK DIAGRAM
handbook, full pagewidth
VINL
V
DDD
V
SSD
DATAO
BCK
WS
DATAI
MP1
V
DDA(ADC)VSSA(ADC)
21
35
10
11
18
16
17
19
9
0 dB/6 dB
SWITCH
DC-CANCELLATION FILTER
V
ADCP
ADC
DECIMATION FILTER
DIGITAL INTERFACE
INTERPOLATION FILTER
V
764
ADC
ADCN
V
ref(A)
0 dB/6 dB
SWITCH
L3-BUS
INTERFACE
21
20
13
14
15
12
UDA1345TS
NOISE SHAPER
VINR
8
MC1
MC2
MP5
MP2
MP3
MP4
SYSCLK
DAC
VOUTL
26
25272322
V
DDO
V
SSO
V
DDA(DAC)VSSA(DAC)
Fig.1 Block diagram.
2000 Dec 196
DAC
V
ref(D)
24
VOUTR
28
MGS875
Page 7
Philips SemiconductorsProductspecification
Economy audio CODECUDA1345TS
6PINNING
SYMBOLPINTYPEDESCRIPTION
V
SSA(ADC)
V
DDA(ADC)
VINL3analog input padADC input left
V
ref(A)
VINR5analog input padADC input right
V
ADCN
V
ADCP
MC185 V tolerant digital input pad with internal pull-down padmode control 1 (pull-down)
MP195V tolerant slew rate controlled digital output padmulti purpose pin 1
V
DDD
V
SSD
SYSCLK125 V tolerant digital Schmitt triggered input padsystem clock 256, 384 or 512f
MP2133-level input padmulti purpose pin 2
MP3145 V tolerant digital Schmitt triggered input padmulti purpose pin 3
MP4153-level input padmulti purpose pin 4
BCK165 V tolerant digital Schmitt triggered input padbit clock input
WS175 V tolerant digital Schmitt triggered input padword select input
DATAO185 V tolerant slew rate controlled digital output paddata output
DATAI195 V tolerant digital Schmitt triggered input paddata input
MP5205 V tolerant digital Schmitt triggered input padmulti purpose pin 5 (pull down)
MC2215 V tolerant digital input pad with internal pull-down padmode control 2 (pull-down)
V
SSA(DAC)
V
DDA(DAC)
VOUTR24analog output padDAC output right
V
DDO
VOUTL26analog output padDAC output left
V
SSO
V
ref(D)
1analog ground padADC analog ground
2analog supply padADC analog supply voltage
4analog padADC reference voltage
6analog padADC negative reference voltage
7analog padADC positive reference voltage
10digital supply paddigital supply voltage
11digital ground paddigital ground
s
22analog ground padDAC analog ground
23analog supply padDAC analog supply voltage
25analog supply padoperational amplifier supply voltage
27analog ground padoperational amplifier ground
28analog padDAC reference voltage
2000 Dec 197
Page 8
Philips SemiconductorsProductspecification
Economy audio CODECUDA1345TS
7.1Analog-to-Digital Converter (ADC)
handbook, halfpage
V
SSA(ADC)
V
DDA(ADC)
1
2
VINL
3
V
4
ref(A)
VINR
5
V
V
SYSCLK
ADCN
ADCP
MC1
MP1
V
DDD
V
SSD
MP2
MP3
6
7
UDA1345TS
8
9
10
11
12
13
Fig.2 Pin configuration.
MGS876
28
27
26
25
24
23
22
21
20
19
18
17
16
1514
V
ref(D)
V
SSO
VOUTL
V
DDO
VOUTR
V
DDA(DAC)
V
SSA(DAC)
MC2
MP5
DATAI
DATAO
WS
BCK
MP4
The stereo ADC of the UDA1345TS consists of two
5th-order Sigma-Delta modulators. They have a modified
Ritchie-coder architecture in a differential switched
capacitor implementation. The oversampling ratio is 64.
7.2Analog front-end
The analog front-end isequipped with aselectable 0 dB or
6 dB gain block (the pin to select this mode is given in
Section 7.10). This block can be used in applications in
which both 1 V (RMS) and 2 V (RMS) input signals can be
input to the UDA1345TS.
In applications in which a 2 V (RMS) input signal is used,
a12kΩresistor must be used inseries with theinput ofthe
ADC.This forms a voltage divider together with the internal
ADC resistor and ensures that only 1 V (RMS) maximum
is input to the IC. Using this application for a 2 V (RMS)
input signal, the switch must be set to 0 dB. When a
1 V (RMS) input signal is input to the ADC in the same
application, the gain switch must be set to 6 dB.
An overview of the maximum input voltages allowed
againstthepresence of an external resistor andthe setting
of the gain switch is given in Table 1; the power supply
voltage is assumed to be 3 V.
7FUNCTIONAL DESCRIPTION
The UDA1345TS accommodates slave mode only, this
means that in all applications the system devices must
provide the system clocks (being the system clock itself
and the digital audio interface signals).
Thesystem clock must be locked in frequency to the audio
digital interface input signals.
The BCK clock can be up to 128fs, or in other words the
BCK frequency is 128 times the Word Select (WS)
frequency or less: f
= < 128 × fWS.
BCK
Important: the WS edge MUST fall on the negative edge
oftheBCK at all times for properoperationof the digital I/O
data interface.
Note: the sampling frequency range is from 8 to 100 kHz,
however for the 512fs clock mode the sampling range is
from 8 to 55 kHz.
Table 1 Application modes using input gain stage
RESISTOR
(12 kΩ)
INPUT GAIN
SWITCH
MAXIMUM
INPUT
VOLTAGE
Present0 dB2 V (RMS)
Present6 dB1 V (RMS)
Absent0 dB1 V (RMS)
Absent6 dB0.5 V (RMS)
7.3Decimation filter (ADC)
Thedecimationfrom 64fsto1fsis performed in two stages.
The first stage realizes a 4th-order characteristic.
sin x
----------- x
This filter decreases the sample rate by 8. The second
stage consists of 2 half-band filters and a recursive filter,
each decimating by a factor of 2.
2000 Dec 198
Page 9
Philips SemiconductorsProductspecification
Economy audio CODECUDA1345TS
Table 2 Digital decimation filter characteristics
ITEMCONDITIONSVALUE (dB)
Pass-band ripple0 − 0.45f
Stop band>0.55f
Dynamic range0 − 0.45f
Overall gain when
DC−1.16
s
s
s
±0.05
−60
114
a 0 dB signal is
input to ADC to
digital output
Note:thedigitaloutputlevel is inversely proportional to the
ADC analog power supply. This means that with a
constant analog input level and increasing power supply
the digital output level will decrease proportionally.
7.4Interpolation filter (DAC)
The digital filter interpolates from 1 to 128fsby means of a
cascade of a recursive filter and an FIR filter.
Table 3 Digital interpolation filter characteristics
ITEMCONDITIONSVALUE (dB)
Passband ripple0 − 0.45f
Stopband>0.55f
s
Dynamic range0 − 0.45f
s
s
±0.03
−65
116.5
GainDC−3.5
7.7The Filter Stream DAC (FSDAC)
The FSDAC is a semi-digital reconstruction filter that
converts the 1-bit data stream of the noise shaper to an
analog output voltage. The filter coefficients are
implemented as current sources and are summed at
virtual ground of the output operational amplifier. In this
way very high signal-to-noise performance and low clock
jitter sensitivity is achieved. A post filter is not needed due
to the inherent filter function of the DAC. On-board
amplifiers convert the FSDAC output current to an output
voltage signal capable of driving a line output.
The output voltage of the FSDAC is scaled proportionally
with the power supply voltage.
7.8Power control
Intheeventthatthe DAC is powered-up or powered-down,
a cosine roll-off mute will be performed (when powering
down) or a cosine roll-up de-mute (when powering up) will
be performed. This is in order to prevent clicks when
powering up or down. This power-on/off mute takes
32 × 4 = 128 samples.
7.9L3MODE or static pin control
The UDA1345TS can be used under L3 microcontroller
interface mode or under static pin control. The mode can
be set via the Mode Control (MC) pins MC1 (pin 8) and
MC2 (pin 21). The function of these pins is given in
Table 4.
7.5Double speed
SInce the device supports a sampling range of
8 to 100 kHz, the device can support double speed (e.g.
for 44.1 kHz and 48 kHz sampling frequency) by just
doubling the system speed. In double speed all features
are available.
7.6Noise shaper (DAC)
The 3rd-order noise shaper operates at 128fs. It shifts
in-band quantization noise to frequencies well above the
audio band. This noise shaping technique enables high
signal-to-noise ratios to be achieved. The noise shaper
output is converted into an analog signal using a filter
stream digital-to-analog converter.
2000 Dec 199
Table 4 Mode Control pins MC1 and MC2
MODEMC2MC1
L3MODELOWLOW
Test modesLOWHIGH
HIGHLOW
Static pin modeHIGHHIGH
Important: in L3MODE the UDA1345TS is completely pin
and function compatible with the UDA1340M and the
UDA1344TS.
Note: the UDA1345TS does NOT supportbass-boost and
treble.
Page 10
Philips SemiconductorsProductspecification
Economy audio CODECUDA1345TS
7.10L3 microcontroller mode
The UDA1345TS is set to the L3 microcontroller mode by
setting both MC1 (pin 8) and MC2 (pin 21) LOW.
The definition of the control registers is given in
Section 7.12.
7.10.1PINNING DEFINITION
The pinning definition underL3 microcontroller interface is
given in Table 5.
Table 5 Pinning definition under L3 control
SYMBOL PINDESCRIPTION
MP19OVERFL output
MP213 L3MODE input
MP314 L3CLOCK input
MP415 L3DATA input
MP520 ADC 1 V or 2 V (RMS) input control
7.10.2S
YSTEM CLOCK
Under L3 control the options are 256, 384 and 512fs.
7.10.3MULTIPLE FORMAT INPUT/OUTPUT INTERFACE
The UDA1345TS supports the following data input/output
formats under L3 control:
• I2S-bus with data word length of up to 24 bits
• MSB-justifiedserialformat with data word length ofup to
20 bits
• LSB-justified serial format with data word lengths of
16, 18 or 20 bits
• Three combined data formatswith MSB data output and
LSB 16, 18 and 20 bits data input.
The formats are illustrated in Fig.3. Left and right data
channel words are time multiplexed.
7.10.4ADC INPUT VOLTAGE CONTROL
The UDA1345TS supports a 2 V (RMS) input using a
series resistor of 12 kΩ as described in Section 7.2. In
L3 microcontroller mode, the gain can be selected via
pin MP5.
When MP5 is set LOW, 0 dB gain is selected. When MP5
is set HIGH, 6 dB gain is selected.
7.10.5O
VERLOAD DETECTION (ADC)
In practice the output is used to indicate whenever the
output data, in either the left or right channel, is greater
than −1 dB (the actual figure is −1.16 dB) of the maximum
possible digital swing. When this condition is detected the
OVERFL output is forced HIGH for at least 512fs cycles
(11.6 ms at fs= 44.1 kHz). This time-out is reset for each
infringement.
7.10.6DC CANCELLATION FILTER (ADC)
An optional IIR high-pass filter is provided to remove
unwanted DC components. The operation is selected by
themicrocontrollerviatheL3-bus. The filter characteristics
are given in Table 6.
7.11.2SYSTEM CLOCK
Under static pin control the options are 256fs and 384fs.
With pin MP3 (pin 14) the mode can be set as is given in
Table 8.
Table 8 System clock settings under static pin mode
MODEMP3
256f
system clockLOW
s
384f
system clockHIGH
s
7.11.3MUTE AND DE-EMPHASIS
Under static pin control via MP2 de-emphasis and mute
can be selected forthe playback path.The definition of the
MP2 pin is given in Table 9.
Table 9 Settings for pin MP2
MODEMP2
No de-emphasis and muteLOW
De-emphasis 44.1 kHz0.5V
DDD
MutedHIGH
7.11.5ADC
INPUT VOLTAGE CONTROL
The UDA1345TS supports a 2 V (RMS) input using a
series resistor as described in Section 7.2.
In static pin mode the 3-level pin MP4 (pin 15) is used to
select 0 or 6 dB gain mode. When MP4 is set LOW the
ADC is powered-down. When MP4 is set to half the power
supply voltage, then 6 dB gain is selected, and when MP4
is set HIGH then 0 dB gain is selected.
Table 11 MP4 mode settings (static mode)
MODEMP4
ADC Power-down modeLOW
6 dB gain modeMID
0 dB gain modeHIGH
7.11.4M
ULTIPLE FORMAT INPUT/OUTPUT INTERFACE
The data input/output formats supported under static pin
control are as follows:
• I2S-bus with data word length of up to 24 bits
• MSB-justifiedserialformat with data word length ofup to
24 bits
• Two combined data formats with MSB data output and
LSB 16 and 20 bits data input.
The data formats can be selected using pins MP1 (pin 9)
and MP5 (pin 20) as given in Table 10.
Table 10 Data format settings under static pin control
The formats are illustrated in Fig.3. Left and right data
channel words are time multiplexed.
2000 Dec 1911
Page 12
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2000 Dec 1912
ndbook, full pagewidth
Philips SemiconductorsProductspecification
Economy audio CODECUDA1345TS
WS
BCK
DATA
WS
BCK
DATA
WS
BCK
DATA
WS
BCK
LEFT
>=8>=8
MSB B2MSBLSBLSB MSBB2
LEFT
1321
>=8>=8
MSB B2MSBLSBLSB MSB B2B2
LEFT
15161
MSBLSBB2
LEFT
RIGHT
321321
INPUT FORMAT I
RIGHT
32
MSB-JUSTIFIED FORMAT
2
B15
LSB-JUSTIFIED FORMAT 16 BITS
2151617181
2
S-BUS
RIGHT
215161
MSBLSBB2B15
RIGHT
2151617181
DATA
WS
BCK
DATA
MSB B2B3B4
LEFT
MSB B2B3B4B5B6
LSB
B17
LSB-JUSTIFIED FORMAT 18 BITS
21516171819201
LSB
B19
LSB-JUSTIFIED FORMAT 20 BITS
Fig.3 Serial interface formats.
MSB B2B3B4
RIGHT
MSB B2B3B4B5B6
B17
B19
LSB
21516171819201
LSB
MGG841
Page 13
Philips SemiconductorsProductspecification
Economy audio CODECUDA1345TS
7.12L3 interface
The UDA1345TS has a microcontroller input mode. In the
microcontroller mode, all of the digital sound processing
features and the system controlling features can be
controlledby the microcontroller. The controllablefeatures
are:
• System clock frequency
• Data input format
• Power control
• DC filtering
• De-emphasis
• Volume
• Mute.
Theexchange of data andcontrol information between the
microcontroller and the UDA1345TS is accomplished
through a serial hardware interface comprising the
following pins:
• L3DATA: microcontroller interface data line
• L3MODE: microcontroller interface mode line
• L3CLOCK: microcontroller interface clock line.
Informationtransfervia the microcontroller bus is LSB first,
and is organized in accordance with the so called ‘L3’
format, in which two different modes of operation can be
distinguished; address mode and data transfer mode
(see Figs 4 and 5).
The address mode is required to select a device
communicating via the L3-bus and to define the
destination register set for the data transfer mode. Data
transfer for the UDA1345TS can only be in one direction:
for the UDA1345TS, data can onlybe written to the device.
Important: since the UDA1345TS does not have a
Power-up reset circuit, after power up the L3 interface
registers MUST be initialized.
7.12.1ADDRESS MODE
The address mode is used to select a device for
subsequent data transfer and to define the destination
register set (DATA or STATUS). The address mode is
characterized by L3MODE being LOW and a burst of
8 pulses on L3CLOCK, accompanied by 8 data bits.
The fundamental timing is shown in Fig.4. Data
bits 0 and 1 indicate the type of subsequent data transfer
as given in Table 12.
Table 12 Selection of data transfer
BIT 1BIT 0TRANSFER
00DATA (volume, de-emphasis, mute,
and power control)
01not used
10STATUS(system clock frequency, data
input format and DC filter)
11not used
Data bits 7 to 2 represent a6-bit device address, with bit 7
being the MSB and bit 2 the LSB. The address of the
UDA1345TS is 000101 (bit 7 to bit 2). In theevent that the
UDA1345TS receives a different address, it will deselect
its microcontroller interface logic.
7.12.2DATA TRANSFER MODE
The selection preformed in the address mode remains
active during subsequent data transfers, until the
UDA1345TS receives a new address command.
The fundamental timing of data transfers is essentially the
same as in the address mode, shown in Fig.4. The
maximum input clock and data rate is 128fs. All transfers
are byte wise,i.e. they are based on groups of 8 bits. Data
will be stored in the UDA1345TS after the eighth bit of a
byte has been received. A multibyte transfer is illustrated
in Fig.6.
7.12.2.1Programming the sound processing and other
features
The feature values are stored in independent registers.
Thefirstselectionoftheregistersisachievedbythe choice
of data type that is transferred, being DATA or STATUS.
This is performed in the address mode, bit 1 and bit 0
(see Table 12). The second selection is performed by the
2 MSBs of the data byte (bit 7 and bit 6). The other bits in
the data byte (bit 5 to bit 0) are the values that are placed
in the selected registers.
When the data transfer of type DATA is selected, the
features Volume, De-emphasis, Mute and Power control
can be controlled. Whenthe data transferof type STATUS
is selected, the features system clock frequency, data
input format and DC filter can be controlled.
2000 Dec 1913
Page 14
Philips SemiconductorsProductspecification
Economy audio CODECUDA1345TS
handbook, full pagewidth
L3MODE
L3CLOCK
L3DATA
t
h(MA)
t
BIT 0
t
LC
t
s(MA)
t
s(DAT)
HC
Fig.4 Timing address mode.
t
h(DAT)
t
s(MA)
t
h(MA)
T
cy
BIT 7
MGL883
t
t
s(MT)
halt
BIT 0
t
HC
t
LC
t
h(DAT)
handbook, full pagewidth
L3MODE
L3CLOCK
L3DATA
write
Fig.5 Timing for data transfer mode.
2000 Dec 1914
t
s(DAT)
t
halt
T
cy
t
h(DAT)
BIT 7
t
h(MT)
MGL884
Page 15
Philips SemiconductorsProductspecification
Economy audio CODECUDA1345TS
t
handbook, full pagewidth
L3MODE
L3CLOCK
L3DATA
halt
address
addressdata byte #1data byte #2
Fig.6 Multibyte transfer.
Table 13 Data transfer of type status
LAST IN TIMEFIRST IN TIME
REGISTER SELECTED
BIT 7BIT 6BIT 5BIT 4BIT 3BIT 2BIT 1BIT 0
00SC1SC0IF2IF1IF0DCSystem Clock frequency (5 : 4);
data Input Format (3 : 1); DC-filter
Table 14 Data transfer of type data
LAST IN TIMEFIRST IN TIME
REGISTER SELECTED
BIT 7BIT 6BIT 5BIT 4BIT 3BIT 2BIT 1BIT 0
00VC5VC4VC3VC2VC1VC0Volume Control (5 : 0)
01000000not used
100DE1DE0MT00De-Emphasis (4 : 3); MuTe
110000PC1PC0Power Control (1 : 0)
MGD018
2000 Dec 1915
Page 16
Philips SemiconductorsProductspecification
Economy audio CODECUDA1345TS
7.12.2.2System clock frequency
A 2-bit value (SC1 and SC0) to select the used external
clock frequency (see Table 15).
Table 15 System clock frequency settings
SC1SC0FUNCTION
00512f
01384f
10256f
s
s
s
11not used
7.12.2.3Data input format
A 3-bit value (IF2 to IF0) to select the used data format
(see Table 16).
A 1-bit value to enable the digital DAC mute (playback).
Table 20 DAC mute
MTFUNCTION
0no muting
1muting
7.12.2.5Volume control
A 6-bit value to program the left and right channel volume
attenuation (VC5 to VC0). The range is 0 dB to −∞ dB in
steps of 1 dB (see Table 18).
2000 Dec 1916
Page 17
Philips SemiconductorsProductspecification
Economy audio CODECUDA1345TS
7.12.2.8Power control
A 2-bit value to disable the ADC and/or DAC to reduce power consumption.
Table 21 Power control settings
PC1PC0
FUNCTION
ADCDAC
00offoff
01offon
10onoff
11onon
8LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages referenced to ground;
V
DDD=VDDA=VDDO
=3V; T
=25°C; unless otherwise specified.
amb
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
DDD
T
xtal(max)
T
stg
T
amb
V
es
I
lu(prot)
digital supply voltagenote 1−5.0V
maximum crystal temperature−150°C
storage temperature−65+125°C
ambient temperature−40+85°C
electrostatic handlingaccording to JEDEC II specification
latch-up protection currentT
amb
= 125 °C;
−200mA
VDD= 3.6 V
I
sc(DAC)
short-circuit current of DACT
=0°C; VDD=3V;
amb
note 2
output short-circuited
to V
SSA(DAC)
output short-circuited
to V
DDA(DAC)
−450mA
−325mA
Notes
1. All V
and VSS connections must be made to the same power supply.
DD
2. DAC operation after short-circuiting cannot be warranted.
9THERMAL CHARACTERISTICS
SYMBOLPARAMETERCONDITIONSVALUEUNIT
R
th(j-a)
thermal resistance from junction to
in free air90K/W
ambient
2000 Dec 1917
Page 18
Philips SemiconductorsProductspecification
Economy audio CODECUDA1345TS
10 DC CHARACTERISTICS
V
DDD=VDDA=VDDO
(pins 1, 11, 22 and 27); unless otherwise specified.
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Supplies
V
DDA(ADC)
V
DDA(DAC)
V
DDD
I
DDA(ADC)
I
DDA(DAC)
I
DDO(DAC)
I
DDD
Digital input pins (5V tolerant TTL compatible)
V
IH
V
IL
V
IH(th)
V
IL(th)
V
hys
input leakage current−−10µA
I
LI
C
i
3-level input pins (MP2; MP4)
V
IH
V
IM
V
IL
Digital output pins
V
OH
V
OL
Analog-to-digital converter
V
ref(A)
R
o(ref)
R
i
C
i
= 3.0 V; fs = 44.1 kHz; T
=25°C; RL=5kΩ; note 1; all voltages referenced to ground
amb
ADC analog supply voltage2.43.03.6V
DAC analog supply voltage2.43.03.6V
digital supply voltage2.43.03.6V
ADC analog supply currentoperating mode−1014mA
1. All power supply pins (VDDand VSS) must be connected to the same external power supply unit.
2. When higher capacitive loads must be driven then a 100 Ω resistor must be connected in series with the DAC output
in order to prevent oscillations in the output operational amplifier.
reference voltagewith respect to V
V
reference output resistance−12.5−kΩ
ref(D)
SSA
0.45V
DDA
0.5V
DDA
0.55V
DDA
V
DAC output resistance−0.133.0Ω
maximum output current(THD + N)/S < 0.1%;
(pins 1, 11, 22 and 27); unless otherwise specified.
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Analog-to-digital converter
V
i(rms)
∆V
i
(THD + N)/S total harmonic distortion plus
S/Nsignal-to-noise ratioVi= 0 V; A-weighted
α
cs
PSRRpower supply rejection ratiof
Digital-to-analog converter
V
o(rms)
∆V
o
(THD + N)/S total harmonic distortion plus
S/Nsignal-to-noise ratiocode = 0; A-weighted
α
cs
PSRRpower supply rejection ratiof
= 3.0 V; fi= 1 kHz; fs = 44.1 kHz; T
=25°C; RL=5kΩ; all voltages referenced to ground
amb
input voltage (RMS value)notes 1 and 2−1.0−V
unbalance between channels−0.1−dB
at 0 dB
noise-to-signal ratio
fs= 44.1 kHz−−85−80dB
fs= 96 kHz−−80−75dB
at −60 dB; A-weighted
fs= 44.1 kHz−−36−30dB
= 96 kHz−−34−30dB
f
s
fs= 44.1 kHz9096−dB
fs= 96 kHz9094−dB
channel separation−100−dB
ripple
V
ripple(p-p)
= 1 kHz;
=1%
−30−dB
output voltage (RMS value)note 3−900−mV
unbalance between channels−0.1−dB
at 0 dB
noise-to-signal ratio
fs= 44.1 kHz−−85−80dB
fs= 96 kHz−−80−71dB
at −60 dB; A-weighted
fs= 44.1 kHz−−37−30dB
fs= 96 kHz−−35−30dB
fs= 44.1 kHz90100−dB
fs= 96 kHz9098−dB
channel separation−100−dB
ripple
V
ripple(p-p)
= 1 kHz;
=1%
−60−dB
Notes
1. The input voltage can be up to 2 V (RMS) when the current through the ADC input pin is limited to approximately
1 mA by using a series resistor.
2. The input voltage to the ADC scales proportionally with the power supply voltage.
3. The output voltage of the DAC scales proportionally with the power supply voltage.
2000 Dec 1920
Page 21
Philips SemiconductorsProductspecification
Economy audio CODECUDA1345TS
12 AC CHARACTERISTICS (DIGITAL)
V
DDD=VDDA=VDDO
(pins 1, 11, 22 and 27); unless otherwise specified.
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
System clock timing; see Fig.7
T
sys
t
CWL
t
CWH
t
r
t
f
Serial input/output data timing; see Fig.8
t
BCK
t
BCKH
t
BCKL
t
r
t
f
t
s(DATAI)
t
h(DATAI)
t
d(DATAO−BCK)
t
d(DATAO−WS)
t
h(DATAO)
t
s(WS)
t
h(WS)
Address and data transfer mode timing; see Figs 4 and 5
T
cy
t
HC
t
LC
t
s(MA)
t
h(MA)
t
s(MT)
t
h(MT)
= 2.7 to 3.6 V; T
system clock cyclef
f
LOW-level pulse widthf
sys
f
HIGH-level pulse widthf
sys
= −20 to +85 °C; RL=5kΩ; all voltages referenced to ground
amb
= 256fs; note 13988488ns
sys
f
= 384fs; note 12659325ns
sys
f
= 512fs; note 23644244ns
sys
< 19.2 MHz0.30T
sys
f
≥ 19.2 MHz0.40T
sys
< 19.2 MHz0.30T
sys
≥ 19.2 MHz0.40T
f
sys
−0.70T
sys
−0.60T
sys
−0.70T
sys
−0.60T
sys
sys
sys
sys
sys
ns
ns
ns
ns
rise time−−20ns
fall time−−20ns
bit clock period
1
⁄
128fs
−−ns
bit clock HIGH time34−−ns
bit clock LOW time34−−ns
rise time−−20ns
fall time−−20ns
data input set-up time20−−ns
data input hold time0−−ns
data output delay time (from BCK
−−80ns
falling edge)
data output delay time (from WS edge) MSB-justified format−−80ns
data output hold time0−−ns
word select set-up time20−−ns
word select hold time10−−ns
L3CLOCK cycle time500−−ns
L3CLOCK HIGH period250−−ns
L3CLOCK LOW period250−−ns
L3MODE set-up timeaddress mode190−−ns
L3MODE hold timeaddress mode190−−ns
L3MODE set-up timedata transfer mode190−−ns
L3MODE hold timedata transfer mode190−−ns
2000 Dec 1921
Page 22
Philips SemiconductorsProductspecification
Economy audio CODECUDA1345TS
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
t
s(DAT)
t
h(DAT)
t
halt
Notes
1. Sampling range from 5 to 100 kHz is supported, with fs= 44.1 kHz typical.
2. Sampling range from 5 to 55 kHz is supported, with fs= 44.1 kHz typical.
L3DATA set-up timedata transfer mode
190−−ns
and address mode
L3DATA hold timedata transfer mode
30−−ns
and address mode
L3MODE halt time190−−ns
handbook, full pagewidth
handbook, full pagewidth
WS
BCK
t
CWH
t
CWL
T
sys
MGR984
Fig.7 System clock timing.
t
BCKH
t
r
t
f
t
BCKL
T
cy
t
h(WS)
t
d(DATAO-WS)
t
s(WS)
t
h(DATAO)
t
d(DATAO-BCK)
DATAO
DATAI
Fig.8 Serial interface timing.
2000 Dec 1922
t
s(DATAI)
t
h(DATAI)
MGL885
Page 23
Philips SemiconductorsProductspecification
h
Economy audio CODECUDA1345TS
13 APPLICATION INFORMATION
Theapplication information as givenin Fig.9, is anoptimum application environment. Simplification ispossible at the cost
of some performance degradation. The following notes apply:
• The capacitors at the output of the DAC can be reduced. It should be noted that the cut-off frequency of the DC filter
also changes.
• The capacitors at the input of the ADC can also be reduced. It should be noted that the cut-off frequency of the
capacitor with the 12 kW input resistance of the ADC will also change.
andbook, full pagewidth
3 V
ground
system
clock
overload
flag
left
input
right
input
8LM32A07
8LM32A07
X4
X5
L1
L2
C1
47 µF
(16 V)
C6
47 µF
(16 V)
C12
100 µF
(16 V)
R30
47 Ω
C11
100 µF
(16 V)
V
DDA
V
DDD
SYSCLK
DATAO
BCK
DATAI
MP1
VINL
VINR
MP2
MP3
MP4
WS
12
18
16
17
19
9
3
5
13
14
15
100 µF
(16 V)
100 nF
(63 V)
V
SSA(ADC)
1
V
DDA
R21
C2
C21
1 Ω
R24
26711
10 Ω
C25
100 nF
V
DDA(ADC)VADCNVADCPVSSD
(63 V)
UDA1345TS
V
27
SSO
C26
100 nF
(63 V)
C7
100 µF
(16 V)
V
25
DDO
V
R25
1 Ω
DDO
22
V
SSA(DAC)
C27
100 nF
(63 V)
C10
100 µF
(16 V)
V
23
DDA
V
DDD
10
V
DDA(DAC)
R29
1 Ω
R28
10 Ω
V
DDD
V
ref(A)
4
VOUTL
26
VOUTR
24
V
ref(D)
28
C5
47 µF
(16 V)
C8
47 µF
(16 V)
C22
100 nF
(63 V)
C23
100 nF
(63 V)
R22
10 kΩ
R27
10 kΩ
C3
47 µF
(16 V)
R23
100 Ω
R26
100 Ω
C4
47 µF
(16 V)
X2
X3
MGS877
left
output
right
output
Fig.9 Application diagram.
2000 Dec 1923
Page 24
Philips SemiconductorsProductspecification
Economy audio CODECUDA1345TS
14 PACKAGE OUTLINE
SSOP28: plastic shrink small outline package; 28 leads; body width 5.3 mm
SOT341-1
D
c
y
Z
2815
A
2
A
pin 1 index
114
w M
b
e
p
1
E
H
E
detail X
Q
L
p
L
(A )
A
X
v M
A
A
3
θ
02.55 mm
scale
DIMENSIONS (mm are the original dimensions)
UNITA1A2A3b
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
A
max.
0.21
mm
2.0
OUTLINE
VERSION
SOT341-1 MO-150
0.05
1.80
0.25
1.65
IEC JEDEC EIAJ
0.38
0.25
p
0.20
0.09
(1)E(1)(1)
cD
10.4
5.4
10.0
REFERENCES
0.651.25
5.2
2000 Dec 1924
eHELLpQZywv θ
7.9
7.6
1.03
0.63
0.9
0.7
EUROPEAN
PROJECTION
0.130.10.2
1.1
0.7
ISSUE DATE
95-02-04
99-12-27
o
8
o
0
Page 25
Philips SemiconductorsProductspecification
Economy audio CODECUDA1345TS
15 SOLDERING
15.1Introduction to soldering surface mount
packages
Thistextgivesa very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certainsurfacemountICs,but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
15.2Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
tothe printed-circuit board by screen printing,stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.
15.3Wave soldering
Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• Forpackageswithleadson four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, thepackage must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
15.4Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
2000 Dec 1925
Page 26
Philips SemiconductorsProductspecification
Economy audio CODECUDA1345TS
15.5Suitability of surface mount IC packages for wave and reflow soldering methods
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2000 Dec 1926
Page 27
Philips SemiconductorsProductspecification
Economy audio CODECUDA1345TS
16 DATA SHEET STATUS
DATA SHEET STATUS
Objective specificationDevelopmentThis data sheet contains the design target or goal specifications for
Preliminary specificationQualificationThis data sheet contains preliminary data, and supplementarydata will be
Product specificationProductionThis data sheet contains final specifications. Philips Semiconductors
Note
1. Please consult the most recently issued data sheet before initiating or completing a design.
17 DEFINITIONS
Short-form specification The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
attheseor at any other conditions above thosegiven inthe
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Application information Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
norepresentationorwarrantythatsuchapplicationswillbe
suitable for the specified use without further testing or
modification.
PRODUCT
STATUS
DEFINITIONS
product development. Specification may change in any manner without
notice.
published at a later date. Philips Semiconductors reserves the right to
make changes at any time without notice in order to improve design and
supply the best possible product.
reserves the right to make changes at any time without notice in order to
improve design and supply the best possible product.
18 DISCLAIMERS
Life support applications These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected toresult in personal injury. Philips
Semiconductorscustomersusingorsellingtheseproducts
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Right to make changes Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
theuseofanyof these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products,and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
(1)
2000 Dec 1927
Page 28
Philips Semiconductors – a w orldwide compan y
Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors,
Marketing Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN,
The Netherlands, Fax. +31 40 27 24825
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
2000
Internet: http://www.semiconductors.philips.com
70
Printed in The Netherlands753503/03/pp28 Date of release: 2000 Dec 19Document order number: 9397 750 07498
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