Product specification
File under Integrated Circuits, IC01
June 1989
Page 2
Philips SemiconductorsProduct specification
AM/FM radio receiver circuitTEA5591
GENERAL DESCRIPTION
The TEA5591 is an integrated radio circuit which is designed for use in portable receivers and clock radios. The IC is
also applicable to mains-fed AM an AM/FM receivers and car radio-receivers. The main advantage of this IC is its ability
to operate over a wide range of supply voltages without loss of performance. The AM circuit incorporates a balanced
mixer and a ‘one-pin’ oscillator, which operates in the 0.6 MHz to 30 MHz frequency range, with amplitude control. The
circuit also includes an IF amplifier, a detector and an AGC circuit which controls the IF amplifier and the mixer. The FM
circuit incorporates an RF amplifier, a balanced mixer and a ‘one-pin’ oscillator together with two AC coupled IF amplifiers
(with distributed selectivity), a quadrature demodulator for the ceramic filter and internal AFC.
Features
• DC AM/FM switch facility
• Three internal separate stabilizers to enable operation over a wide range of supply voltages (1.8 to 15 V)
• All pins (except pin 9) are ESD protected.
QUICK REFERENCE DATA
PARAMETERCONDITIONSSYMBOLMIN.TYP.MAX.UNIT
Supply voltage (pin 8)V
P
Supply current
AM partI
FM partI
Operating ambient temperature rangeT
AM performance (pin 13)
m = 0.3
(AM)−1419mA
P
(FM)−1723mA
P
amb
RF sensitivity
RF input voltageV
RF input voltage(S+N)/N = 26 dBV
Signal plus noise-to-noise ratioV
AF output voltageV
= 10 mVV
o
= 1 mV(S+N)/N−48−dB
i
i
i
o
Total harmonic distortionTHD−0.7−%
FM performance (pin 1)
∆f = 22.5 kHz
RF sensitivity
RF input voltage
−3 dB before limitingV
i
Signal plus noise-to-noise ratio for:
RF input signal voltage (V
)V
i
AF output voltageV
= 3.0 µV(S+N)/N2326−dB
i
= 1 mV(S+N)/N−60−dB
V
i
= 100 µVV
i
o
Total harmonic distortionTHD−0.8−%
1.83.015V
−15−+60°C
−3.5−µV
−17−µV
−50−mV
−2.34.0µV
7590−mV
PACKAGE OUTLINE
20-lead DIL; plastic (SOT146); SOT146-1; 1996 August 14.
June 19892
Page 3
Philips SemiconductorsProduct specification
AM/FM radio receiver circuitTEA5591
June 19893
Fig.1 Block diagram.
Page 4
Philips SemiconductorsProduct specification
AM/FM radio receiver circuitTEA5591
June 19894
Fig.2 Equivalent circuit diagram.
Page 5
Philips SemiconductorsProduct specification
AM/FM radio receiver circuitTEA5591
PINNING
Fig.3 Pinning diagram.
June 19895
Page 6
Philips SemiconductorsProduct specification
AM/FM radio receiver circuitTEA5591
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETERCONDITIONSSYMBOLMIN.MAX.UNIT
Supply voltage (pin 8)V
Storage temperature rangeT
Operating ambient temperature rangeT
Total power dissipationP
P
stg
amb
tot
−18V
−65+ 150°C
−15+ 60°C
see Fig.4
Fig.4 Power derating curve.
June 19896
Page 7
Philips SemiconductorsProduct specification
AM/FM radio receiver circuitTEA5591
DC CHARACTERISTICS
All voltages are referenced to pin 3; all input currents are positive; all parameters are measured in Fig.5 at nominal
supply voltage V
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
A
UNIT
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
max.
mm
OUTLINE
VERSION
SOT146-1
12
min.
max.
1.73
1.30
0.068
0.051
IEC JEDEC EIAJ
SC603
b
b
1
0.53
0.38
0.021
0.015
0.014
0.009
REFERENCES
cD E eM
0.36
0.23
(1)(1)
26.92
26.54
1.060
1.045
June 198921
6.40
6.22
0.25
0.24
10
(1)
M
e
L
1
3.60
8.25
3.05
7.80
0.14
0.32
0.12
0.31
EUROPEAN
PROJECTION
H
E
10.0
0.2542.547.62
8.3
0.39
0.010.100.30
0.33
ISSUE DATE
w
92-11-17
95-05-24
Z
max.
2.04.20.513.2
0.0780.170.0200.13
Page 22
Philips SemiconductorsProduct specification
AM/FM radio receiver circuitTEA5591
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
(order code 9398 652 90011).
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
stg max
). If the
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
June 198922
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