Datasheet TEA5581T, TEA5581 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TEA5581
TEA5581T

PLL stereo decoder

Product specification
File under Integrated Circuits, IC01

June 1989

Philips Semiconductors Product specification

PLL stereo decoder

TEA5581

TEA5581T

GENERAL DESCRIPTION

The TEA5581 PLL stereo decoder is for car and medium-fi radios. It incorporates all the features provided by the
TEA5580 together with a source selector, muting circuit and output amplifiers with adjustable gain. It also features a
switch for radio or cassette function and a 228 kHz voltage-controlled oscillator (VCO) that is locked to the 19 kHz stereo
pilot tone by a phase-locked loop (PLL) system. Subcarrier frequencies of 19, 38, 57 and 114 kHz are regenerated via
I2L logic from the VCO output.

The PLL phase detector suppresses phase distortion due to the 57 kHz pilot tone from the German ‘Verkehrs Warnfunk’
(VWF) traffic warning system. Typical suppression of the 19 kHz stereo pilot tone is 40 dB. Adjacent channel interference
is prevented by the use of two demodulators, one driven by the 38 kHz decoding signal and the other at 114 kHz to
suppress the third harmonic of the multiplexed input signal.

The gain of the input amplifier can be adjusted by an external resistor and the circuit includes compensation for an IF
filter typical roll-off frequency of 50 kHz (2 dB down at 38 kHz).

The supply voltage range of the circuit is 7 V to 16 V.

Features

• Wide supply voltage range

• Automatic mono/stereo switching (pilot presence detector)

• Smooth stereo-to-mono change-over at weak signals (signal-dependent stereo channel separation)

• LED driver for stereo/mono indicator

• Suppresses:

third harmonics (114 kHz) of multiplexed signal to prevent interference from strong adjacent channels;
phase distortion due to the 57 kHz signal from VWF transmitters

• Pilot cancelling circuit to give added suppression of 19 kHz stereo pilot tone (up to 25 dB)

• IF filter roll-off compensation

• Source selector for radio or cassette input (typ. 90 dB)

• Mute circuit for 90 dB (typ.) muting of the output level

• Matrix and two output buffers with adjustable gain (max. 20 dB).

PACKAGE OUTLINES

TEA5581 : 16-lead DIL; plastic (SOT38); SOT38-1; 1996 August 16.
TEA5581T: 16-lead mini-pack; plastic (SO16L; SOT162A); SOT162-1; 1996 August 16.

June 1989 2

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June 1989 3

Philips Semiconductors Product specification

PLL stereo decoder

Fig.1 Block diagram.

TEA5581T

TEA5581

Philips Semiconductors Product specification

PLL stereo decoder

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)

PARAMETER CONDITIONS SYMBOL MIN. MAX. UNIT

Supply voltage range V
LED-driver current (peak value) −I
Total power dissipation P
Storage temperature range T
Operating ambient

temperature range T

Electrostatic handling* V

From junction to ambient in free air

SOT38 R
SOT162 R

3-5

3M
tot
stg

amb
es

, V

9-5

− 18 V

− 75 mA

see derating curve Fig.2

−65 +150 °C

−30 +80 °C

TEA5581

TEA5581T

+600 V

th j-a
th j-a

75 K/W
95 K/W

Fig.2 Power derating curve.

*

Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor.

June 1989 4

Philips Semiconductors Product specification

PLL stereo decoder

DC CHARACTERISTICS

Measured in the circuit of Fig.7; V = 8.5 V; T
positive into the IC.

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Supply voltage R1 = 75 Ω V
Total current consumption without LED driver I
Power dissipation P
Voltage

pin 15 V
pins 12 and 16 V

DC output current

pins 2 and 14 −I14, −I

Output current

pin 3 −I

Switch “VCO-OFF”

voltage

Switch “VCO-OFF”

current

= 25 °C; all DC voltages are with respect to pin 5; all currents are

amb

TEA5581

TEA5581T

S

tot

tot

15

, V

12

16

3

V

7

I

7

7.0 8.5 18 V

− 15 20 mA

− 125 − mW

− 2.1 − V

3.2 3.6 4.0 V

225 320 450 µA

2

−−20 mA

− 2.2 − V

− 50 75 µA

June 1989 5

Philips Semiconductors Product specification

PLL stereo decoder

AC CHARACTERISTICS

Measured in the circuit of Fig.7; V
(peak-to-peak); V

= 32 mV (9%); fm= 1 kHz; oscillator adjusted to 228 kHz at Vi= 0 V; values are measured with an

pilot

external roll-off network of 50 kHz (2 dB down at 38 kHz) at the input (dashed components R
otherwise specified

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Transimpedance V
Input current (RMS value) I
Overall gain mono; R3 = 47 kΩ G
AF output voltage

(RMS value) V

AF output voltage

(RMS value) V

Total harmonic distortion note 1;

Output voltage THD = 1% V
Output channel

unbalanced V

Channel separation IF roll-off

S/N ratio bandwidth

SDS control

Channel separation V
Full stereo channel separation

Full mono channel separation

Stereo/mono switch

Switching to:

stereo V
mono V

Hysteresis ∆V

= 8.5 V; T

S

V

O (rms)

= 25 °C; AC measurements have an input MUX-signal of 1 V

amb

O/II

I(rms)

o(Vo/Vi

= V

12

= V

2

14

0.13 0.15 0.17 V/µA

−− 12 µA

) 9.0 10.0 11.0 dB

0.95 1.14 1.33 V

16

−− 500 mV

= 1 V THD − 0.1 0.5 %

= V

12

= V

12

− 1.5 − V

16

− 0.2 1.0 dB

16

frequency = 50 kHz
L = 1; R = 0 α 26 40 − dB

20 Hz to 16 kHz S/N − 76 − dB
bandwidth IEC 79
(curve Din A) S/N − 82 − dB
see Fig.6

= 1.0 V α 510 15 dB

4

≥ 26 dB V

≤ 1 dB V

4

4

− 1.2 1.25 V

0.75 0.8 − V

note 2; see Fig.5;
R4 = 180 kΩ

pilot
pilot

I

− 14 20 mV
4 −−mV

− 4.5 − mV

TEA5581

TEA5581T

and CSin Fig.7); unless

S

June 1989 6

Philips Semiconductors Product specification

PLL stereo decoder

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Carrier and harmonic
suppression at the output

Pilot signal suppression f = 19 kHz;

Subcarrier suppression

f = 38 kHz α

f = 57 kHz α
f = 228 kHz α
Intermodulation suppression note 4

fm= 10 kHz spurious signal

= 13 kHz spurious signal

f

m

VWF tone suppression

f = 57 kHz note 5 α
SCA tone rejection

f = 67 kHz note 6 α
ACI rejection note 7

f = 114 kHz α

f = 190 kHz α

Ripple rejection

Ripple rejection f = 100 Hz;

VCO

Oscillator frequency

adjustable with R5 f
Capture range deviation from

Temperature coefficient uncompensated TC −−200×100

note 3

R4 = 180 kΩ; note 2;
see Figs 3 and 4 α

f

= 1 kHz α

s

f

= 1 kHz α

s

V

= 100 mV;

ripple

mono RR

osc

19

38
57
228

2

3

57

67

114
190

100

32 40 − dB

− 50 − dB

− 50 − dB

− 75 − dB

− 50 − dB

− 50 − dB

− 80 − dB

− 70 − dB

− 90 − dB

− 60 − dB

− 50 − dB

− 228 − kHz

228 kHz centre
frequency;
V

= 32 mV ∆f/f − 6 − %

pilot

TEA5581

TEA5581T

−6

− K

− 1

June 1989 7

Philips Semiconductors Product specification

PLL stereo decoder

TEA5581

TEA5581T

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Source selector

Suppression of

MPX signal V10≥ 2 V α 80 90 − dB
Switching level cassette to radio

voltage V

current I

Output amplifiers

Gain note 8; R

/R7 G

6

Output impedance Z
External load impedance |Z
Suppression (mute) V

= ≤ 0,8 V α 84 90 − dB

11

DC offset

voltage at

outputs during

mute switching mute OFF-to-ON ∆V

mute ON-to-OFF ∆V

Muting circuit

Input voltage mute ON V

mute OFF V

Input current mute ON I

mute OFF I

IL

IL

v

o

|5−−kΩ

I

, ∆V

12

, ∆V

12

IL

IH
IL
IH

−− 0.8 V

− 10 25 µA

−− 20 dB

− 200 500 Ω

− 1.0 − mV

16

− 2.0 − mV

16

−− 0.8 V

2.0 − V

S

− 10 25 µA

−− 1 µA

V

June 1989 8

Philips Semiconductors Product specification

PLL stereo decoder

Notes to the characteristics

1. Guaranteed for mono, mono + pilot and stereo.

2. Also adjustable.

3. Reference output voltage at 1 kHz (measured channel R, pin 16).

4. Intermodulation suppression (Beat-Frequency Components):
V

α

α

o signal()

-------------------------------------------------------------- -

2

V

o spurious()

V

o signal()

-------------------------------------------------------------- -

3

V

o spurious()

measured with 91% mono signal; f

5. Traffic radio (VWF) tone suppression:

=

α

-------------------------------------------------------------------------------------

57

V

o spurious()

measured with 91% stereo signal; f

mod

= 23 Hz).

with f

6. SCA (Subsidiary Communication Authorization) tone rejection:

V

α

o signal()

-------------------------------------------------------------- -

67

V

o spurious()

at 1kHz()

at 1 kHz()

at 1kHz()

at 1 kHz()

V

o signal()

at 1kHz()

at 1 kHz 23 Hz±()

at 1kHz()

at 9kHz()

210kHz×()= 19 kHz–;=

f

s

f

313kHz×()= 38kHz–;=

s

= 10 or 13 kHz; 9% pilot signal.

m

= 1 kHz; 9% pilot signal; 5% traffic subcarrier (f = 57 kHz; 60% AM modulated

m

f

238kHz×()= 67 kHz–;=

s

TEA5581

TEA5581T

measured with 81% mono signal; f

= 1 kHz; 9% pilot signal; 10% SCA-subcarrier (fs= 67 kHz, unmodulated).

m

7. ACI (Adjacent Channel Interference) rejection at:

V

α

114

α

190

o signal()

-------------------------------------------------------------­V

o spurious()

V

o signal()

-------------------------------------------------------------­V

o spurious()

measured with 90% mono signal; f

at 1kHz()

f

at 4kHz()

s

at 1kHz()

f

at 4kHz()

s

= 1 kHz; 9% pilot signal; 1% spurious signal (fs= 110 or 186 kHz, unmodulated).

s

338kHz×()= 110 kHz–;=

538kHz×()= 186 kHz–;=

8. Maximum permitted value of feedback resistor = 220 kΩ.

June 1989 9

Philips Semiconductors Product specification

PLL stereo decoder

TEA5581

TEA5581T

(1) 220 kΩ
(2) 180 kΩ
(3) 150 kΩ

Fig.3 Pilot suppression plotted against resistance (R4).

Fig.4 Pilot suppression plotted against pilot input voltage level.

June 1989 10

Philips Semiconductors Product specification

PLL stereo decoder

TEA5581

TEA5581T

(1) Switching from mono to stereo.
(2) Switching from stereo to mono.

Fig.5 Pilot sensitivity against resistance (R4).

Fig.6 Channel separation against V

June 1989 11

SDS.

Philips Semiconductors Product specification

PLL stereo decoder

APPLICATION INFORMATION

TEA5581

TEA5581T

(1) 25% tolerance (all other resistors have a 5% tolerance).
(2) 1% tolerance (NPO).

Fig.7 Application diagram.

June 1989 12

Philips Semiconductors Product specification

PLL stereo decoder

PACKAGE OUTLINE

DIP16: plastic dual in-line package; 16 leads (300 mil); long body

D

seating plane

L

Z

16

e

b

b

1

9

A

1

w M

TEA5581

TEA5581T

SOT38-1

M

E

A

2

A

c

(e )

1

M

H

pin 1 index

1

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

UNIT

mm

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

A

max.

4.7 0.51 3.7

OUTLINE
VERSION

SOT38-1

min.

A

1 2

max.

0.15

IEC JEDEC EIAJ

050G09 MO-001AE

b

1.40

1.14

0.055

0.045

b

0.53

0.38

0.021

0.015

1

cEe M

0.32

0.23

0.013

0.009

REFERENCES

D

21.8

21.4

0.86

0.84

8

scale

(1) (1)

6.48

6.20

0.26

0.24

E

(1)

Z

e

0.30

1

0.15

0.13

M

L

3.9

3.4

E

8.25

7.80

0.32

0.31

EUROPEAN

PROJECTION

9.5

8.3

0.37

0.33

w

H

0.2542.54 7.62

0.010.100.0200.19

ISSUE DATE

92-10-02
95-01-19

max.

2.2

0.087

June 1989 13

Philips Semiconductors Product specification

PLL stereo decoder

SO16: plastic small outline package; 16 leads; body width 7.5 mm

D

c

y

Z

16

9

TEA5581

TEA5581T

SOT162-1

E

H

E

A

X

v M

A

pin 1 index

1

e

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

mm

A

max.

2.65

0.10

A

1

0.30

0.10

0.012

0.004

A2A

2.45

2.25

0.096

0.089

0.25

0.01

b

3

p

0.49

0.36

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

8

w M

b

p

0 5 10 mm

scale

(1)E(1) (1)

cD

0.32

10.5

0.23

10.1

0.41

0.40

eHELLpQ

7.6

1.27

7.4

0.30

0.050

0.29

A

2

10.65

10.00

0.419

0.394

A

1

1.4

0.055

1.1

0.4

0.043

0.016

detail X

0.043

0.039

1.1

1.0

Q

3

0.01

A

θ

ywv θ

0.25 0.1

0.004

Z

0.9

0.4

0.035

0.016

o

8

o

0

(A )

L

p

L

0.25

0.01

OUTLINE
VERSION

SOT162-1

IEC JEDEC EIAJ

075E03 MS-013AA

REFERENCES

June 1989 14

EUROPEAN

PROJECTION

ISSUE DATE

95-01-24
97-05-22

Philips Semiconductors Product specification

PLL stereo decoder

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

DIP

SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

R

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.

(order code 9398 652 90011).

). If the

stg max

TEA5581

TEA5581T

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

AVE SOLDERING

W
Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

R

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

June 1989 15

Philips Semiconductors Product specification

PLL stereo decoder

TEA5581

TEA5581T

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

June 1989 16