Datasheet TEA1110AT, TEA1110A Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TEA1110A

Low voltage versatile telephone
transmission circuit with dialler
interface

Product specification
Supersedes data of 1996 Nov 26
File under Integrated Circuits, IC03

1997 Apr 22

Philips Semiconductors Product specification

Low voltage versatile telephone
transmission circuit with dialler interface

FEATURES

• Low DC line voltage; operates down to 1.6 V (excluding
voltage drop over external polarity guard)

• Voltage regulator with adjustable DC voltage

• Provides a supply for external circuits

• Symmetrical high impedance inputs (64 kΩ) for

dynamic, magnetic or piezo-electric microphones

• Asymmetrical high impedance input (32 kΩ) for electret
microphones

• DTMF input with confidence tone
MUTE input for pulse or DTMF dialling

•

• Receiving amplifier for dynamic, magnetic or

piezo-electric earpieces

• AGC line loss compensation for microphone and
earpiece amplifiers.

QUICK REFERENCE DATA

I

= 15 mA; VEE=0V; R

line

=20Ω; AGC pin connected to VEE; Z

SLPE

unless otherwise specified.

APPLICATION

• Line powered telephone sets, cordless telephones, fax

GENERAL DESCRIPTION

The TEA1110A is a bipolar integrated circuit that performs
all speech and line interface functions required in fully
electronic telephone sets. It performs electronic switching
between speech and dialling. The IC operates at a line
voltage down to 1.6 V DC (with reduced performance) to
facilitate the use of telephone sets connected in parallel.

All statements and values refer to all versions unless
otherwise specified.

machines, answering machines.

= 600 Ω; f = 1 kHz; T

line

amb

TEA1110A

=25°C;

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

line

line current operating range normal operation 11 − 140 mA

with reduced performance 1 − 11 mA
V
I

CC

V
G

∆G

LN

CC

vtrx

vtrx

DC line voltage 3.35 3.65 3.95 V
internal current consumption VCC= 2.9 V − 1.1 1.4 mA
supply voltage for peripherals IP=0mA − 2.9 − V
typical voltage gain

microphone amplifier (not adjustable) V
receiving amplifier range V

gain control range for microphone and

= 4 mV (RMS) − 43.7 − dB

MIC

= 4 mV (RMS) 19 − 33 dB

IR

I

=85mA − 5.9 − dB

line

receiving amplifiers with respect to
I

=15mA

line

∆G

vtrxm

gain reduction for microphone and

MUTE = LOW − 80 − dB

receiving amplifiers

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TEA1110A DIP14 plastic dual in-line package; 14 leads (300 mil) SOT27-1
TEA1110AT SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1

1997 Apr 22 2

Philips Semiconductors Product specification

Low voltage versatile telephone
transmission circuit with dialler interface

BLOCK DIAGRAM

handbook, full pagewidth

7

DTMF

IR

5

ATT.

V I

V I

V I

GAR

QR MUTE

13 12 6

CURRENT

REFERENCE

TEA1110A

V

14

CC

LN

1

MIC+

MIC−

10

9

V

EE

V I

AGC

CIRCUIT

AGC

LOW VOLTAGE

CIRCUIT

TEA1110A(T)

3

2811
SLPE

REG

MGG736

Fig.1 Block diagram.

1997 Apr 22 3

Philips Semiconductors Product specification

Low voltage versatile telephone
transmission circuit with dialler interface

PINNING

SYMBOL PIN DESCRIPTION

LN 1 positive line terminal
SLPE 2 slope (DC resistance) adjustment
REG 3 line voltage regulator decoupling
n.c. 4 not connected
DTMF 5 dual-tone multi-frequency input
MUTE 6 mute input to select speech or

dialling mode (active LOW)
IR 7 receiving amplifier input
AGC 8 automatic gain control/

line loss compensation
MIC− 9 inverting microphone amplifier input
MIC+ 10 non-inverting microphone amplifier

input
V

EE

QR 12 receiving amplifier output
GAR 13 receive gain adjustment
V

CC

11 negative line terminal

14 supply voltage for speech circuit and

peripherals

handbook, halfpage

LN

1

SLPE

2
3

REG

4

n.c.

TEA1110A(T)

5

DTMF

6

MUTE

7

IR

MGG735

Fig.2 Pin configuration.

TEA1110A

14

V

CC

13

GAR

12

QR

11

V

EE

10

MIC+

9

MIC−

8

AGC

FUNCTIONAL DESCRIPTION

All data given in this chapter are typical values, except
when otherwise specified.

Supply (pins LN, SLPE, V

and REG)

CC

The supply for the TEA1110A and its peripherals is
obtained from the telephone line. See Fig.3.

The IC generates a stabilized reference voltage (V
between pins LN and SLPE. V

is temperature

ref

ref

)

compensated and can be adjusted by means of an
external resistor (RVA). V

equals 3.35 V and can be

ref

increased by connecting RVA between pins REG
and SLPE (see Fig.4), or decreased by connecting R

VA

between pins REG and LN. The voltage at pin REG is
used by the internal regulator to generate V
decoupled by C

, which is connected to VEE. This

REG

and is

ref

capacitor, converted into an equivalent inductance
(see Section “Set impedance”), realizes the set
impedance conversion from its DC value (R

SLPE

) to its AC
value (RCC in the audio-frequency range). The voltage at
pin SLPE is proportional to the line current.

The voltage at pin LN is:

V
I

V

LN

SLPEIlineICC

refRSLPEISLPE

– IP– I∗–=

×+=

Where:

= line current

I

line

ICC= current consumption of the IC
IP= supply current for peripheral circuits
I* = current consumed between LN and VEE.

The preferred value for R

is 20 Ω. Changing R

SLPE

SLPE

will
affect more than the DC characteristics; it also influences
the microphone and DTMF gains, the gain control
characteristics, the sidetone level and the maximum
output swing on the line.

1997 Apr 22 4

Philips Semiconductors Product specification

Low voltage versatile telephone
transmission circuit with dialler interface

handbook, full pagewidth

R

exch

V

exch

R

line

I

line

I

SLPE

LN
114

I

sh

V

d

2
SLPE

R

SLPE

20 Ω

R

CC

619 Ω

from pre amp

V

CC

I

I*

CC

C

VCC

100 µF

TEA1110A

311

REG

C

REG

4.7 µF

V

EE

TEA1110A

I

P

peripheral

circuits

MGG737

Fig.3 Supply configuration.

The internal circuitry of the TEA1110A is supplied from
pin VCC. This voltage supply is derived from the line
voltage by means of a resistor (R
decoupled by a capacitor C

VCC

) and must be

CC

. It may also be used to
supply peripheral circuits such as dialling or control
circuits. The V

voltage depends on the current

CC

consumed by the IC and the peripheral circuits as shown
by the formula:

V
V

R
supply, and I

V

CC

CC0

CCint

CC0RCCintIPIrec

VLNR

×–=

CCICC

is the internal equivalent resistance of the voltage

is the current consumed by the output

rec

–()×–=

(see also Figs 5 and 6).

stage of the earpiece amplifier.
The DC line current flowing into the set is determined by

the exchange supply voltage (V
resistance (R
(R

) and the reference voltage (V

line

), the DC resistance of the telephone line

exch

), the feeding bridge

exch

). With line currents

ref

below 7.5 mA, the internal reference voltage (generating
V

) is automatically adjusted to a lower value. This means

ref

that more sets can operate in parallel with DC line voltages
(excluding the polarity guard) down to an absolute
minimum voltage of 1.6 V. At currents below 7.5 mA, the
circuit has limited sending and receiving levels. This is
called the low voltage area.

6.0

handbook, halfpage

V

ref

(V)

5.0

4.0

(1)

(2)

3.0

4

10

(1) Influence of RVA on V
(2) V

without influence of RVA.

ref

5

10

.

ref

6

10

Fig.4 Reference voltage adjustment by RVA.

RVA (Ω)

MGD176

10

7

1997 Apr 22 5

Philips Semiconductors Product specification

Low voltage versatile telephone
transmission circuit with dialler interface

Set impedance

In the audio frequency range, the dynamic impedance is
mainly determined by the RCC resistor. The equivalent
impedance of the circuit is illustrated in Fig.7.

Microphone amplifier (pins MIC+ and MIC−)

The TEA1110A has symmetrical microphone inputs.
The input impedance between pins MIC+ and MIC− is
64 kΩ (2 × 32 kΩ). The voltage gain from pins MIC+/MIC−
to pin LN is set at 43.7 dB (typ).

Automatic gain control is provided on this amplifier for line
loss compensation.

Receiving amplifier (pins IR, GAR and QR)

The receiving amplifier has one input (IR) and one output
(QR). The input impedance between pin IR and pin V
20 kΩ. The voltage gain from pin IR to pin QR is set at
33 dB (typ). The gain can be decreased by connecting an
external resistor R

between pins GAR and QR; the

GAR

adjustment range is 14 dB. Two external capacitors C
(connected between GAR and QR) and C
between GAR and VEE) ensure stability. The C

GARS

(connected

GAR

capacitor provides a first-order low-pass filter. The cut-off
frequency corresponds to the time constant
C

GAR

× (R

GARint

// R

GAR

). R

is the internal resistor

GARint

which sets the gain with a typical value of 125 kΩ.
The condition C

GARS

=10×C

must be fulfilled to

GAR

ensure stability.
The output voltage of the receiving amplifier is specified for

continuous wave drive. The maximum output swing
depends on the DC line voltage, the RCC resistor, the I
current consumption of the circuit, the IP current
consumption of the peripheral circuits and the load
impedance.

EE

GAR

is

CC

TEA1110A

and V
currents to be increased (the ratio between I
not affected by the resistor). The AGC function is disabled
when pin AGC is left open-circuit.

Mute function (pin

The mute function performs the switching between the
speech mode and the dialling mode. WhenMUTE is LOW,
the DTMF input is enabled and the microphone and
receiving amplifiers inputs are disabled. When MUTE is
HIGH, the microphone and receiving amplifiers inputs are
enabled while the DTMF input is disabled. A pull-up
resistor is included at the input.

DTMF amplifier (pin DTMF)

When the DTMF amplifier is enabled, dialling tones may
be sent on line. These tones can be heard in the earpiece
at a low level (confidence tone).

The TEA1110A has an asymmetrical DTMF input.
The input impedance between DTMF and V
The voltage gain from pin DTMF to pin LN is 25.3 dB.

The automatic gain control has no effect on the DTMF
amplifier.

handbook, halfpage

. This resistor enables the I

EE

MUTE)

2.5

I

P

(mA)

2

1.5

start

and I

line

stop

and I

start

is 20 kΩ.

EE

MBE783

stop

is

Automatic gain control is provided on this amplifier for line
loss compensation.

Automatic gain control (pin AGC)

The TEA1110A performs automatic line loss
compensation. The automatic gain control varies the gain
of the microphone amplifier and the gain of the receiving
amplifier in accordance with the DC line current.
The control range is 5.9 dB (which corresponds
approximately to a line length of 5 km for a 0.5 mm
diameter twisted-pair copper cable with a DC resistance of
176 Ω/km and an average attenuation of 1.2 dB/km).
The IC can be used with different configurations of feeding
bridge (supply voltage and bridge resistance) by
connecting an external resistor R

between pins AGC

AGC

1997 Apr 22 6

1

0.5

0

01234

(1) With RVA resistor.
(2) Without RVA resistor.

(1)(2)

VCC (V)

Fig.5 Typical current IP available from VCC for

peripheral circuits at I

= 15 mA.

line

Philips Semiconductors Product specification

Low voltage versatile telephone
transmission circuit with dialler interface

handbook, halfpage

R

CCintVCC

V

CCO

I

rec

V

EE

PERIPHERAL

CIRCUIT

I

MBE792

Fig.6 VCC supply voltage for peripherals.

P

TEA1110A

SIDETONE SUPPRESSION

The TEA1110A anti-sidetone network comprising
RCC//Z
suppresses the transmitted signal in the earpiece.
Maximum compensation is obtained when the following
conditions are fulfilled:

R

SLPERast1

k

Z

bal

The scale factor k is chosen to meet the compatibility with
a standard capacitor from the E6 or E12 range for Z

In practice, Z
the line length. Therefore, the value of Z
average line length which gives satisfactory sidetone
suppression with short and long lines. The suppression
also depends on the accuracy of the match between Z
and the impedance of the average line.

, R

, R

line

ast1

× R

R

ast2

=

----------------------------------------------------------------------­R

ast1RSLPE

kZ

×=

line

line

, R

ast2

ast3

CC

R

+()×()

ast3RSLPE

×()

varies considerably with the line type and

, R

SLPE

R

+()×=

ast2Rast3

and Z

bal

should be for an

bal

(see Fig.8 )

bal

.

bal

REG

× R

V

SLPE

LN

SLPE

EE

× RP.

L

EQ

V

R

SLPE

20 Ω

ref

R

P

REG V

C

REG

4.7 µF

R

CC

619 Ω

CC

C

VCC

100 µF

MBE788

handbook, halfpage

Leq=C
RP= internal resistance.
RP= 15.5kΩ.

Fig.7 Equivalent impedance between LN and VEE.

The anti-sidetone network for the TEA1110A (as shown in
Fig.12) attenuates the receiving signal from the line by
32 dB before it enters the receiving amplifier.
The attenuation is almost constant over the whole audio
frequency range.

A Wheatstone bridge configuration (see Fig.9) may also
be used.

More information on the balancing of an anti-sidetone
bridge can be obtained in our publication

Handbook for Wired Telecom Systems, IC03b”

“Applications

, order

number 9397 750 00811.

1997 Apr 22 7

Philips Semiconductors Product specification

Low voltage versatile telephone
transmission circuit with dialler interface

handbook, full pagewidth

R

R

SLPE

CC

Z

line

V

EE

LN

SLPE

TEA1110A

R

ast1

I

m

R

ast3

IR

Z

R

ast2

Z

bal

ir

MBE787

handbook, full pagewidth

Fig.8 Equivalent circuit of TEA1110A family anti-sidetone bridge.

LN

R

R

CC

SLPE

SLPE

Z

line

V

EE

Z

bal

ast1

IR

Z

ir

R

A

MBE786

I

m

R

Fig.9 Equivalent circuit of an anti-sidetone network in a Wheatstone bridge configuration.

1997 Apr 22 8

Philips Semiconductors Product specification

Low voltage versatile telephone

TEA1110A

transmission circuit with dialler interface

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

LN

V

n(max)

I

line

P

tot

T

stg

T

amb

HANDLING

This device meets class 2 ESD test requirements [Human Body Model (HBM)], in accordance with

“MIL STD 883C - method 3015”

positive continuous line voltage VEE− 0.4 12 V
repetitive line voltage during switch-on or

− 0.4 13.2 V

V

EE

line interruption
maximum voltage on all pins VEE− 0.4 VCC+ 0.4 V
line current R

SLPE

=20Ω;

− 140 mA

see Figs 10 and 11

total power dissipation T

TEA1110A − 588 mW

=75°C;

amb

see Figs 10 and 11

TEA1110AT − 384 mW
storage temperature −40 +125 °C
operating ambient temperature −25 +75 °C

.

THERMAL CHARACTERISTICS

SYMBOL PARAMETER VALUE UNIT

R

th j-a

thermal resistance from junction to ambient in free air;

85 K/W

mounted on epoxy board 40.1 × 19.1 × 1.5 mm (TEA1110A)
thermal resistance from junction to ambient in free air;

130 K/W

mounted on epoxy board 40.1 × 19.1 × 1.5 mm (TEA1110AT)

1997 Apr 22 9

Philips Semiconductors Product specification

Low voltage versatile telephone
transmission circuit with dialler interface

150

handbook, halfpage

I

line

(mA)

130

110

90

70

50

30

212

(1) T

=45°C; P

amb

(2) T

=55°C; P

amb

(3) T

=65°C; P

amb

(4) T

=75°C; P

amb

(1)

(2)
(3)

(4)

46810

V

LNVSLPE

= 0.615W.

tot

= 0.538W.

tot

= 0.461W.

tot

= 0.384W.

tot

MBH275

(V)

150

handbook, halfpage

I

line

(mA)

130

110

90

70

50

30

212

(1) T

=35°C; P

amb

(2) T

=45°C; P

amb

(3) T

=55°C; P

amb

(4) T

=65°C; P

amb

(5) T

=75°C; P

amb

TEA1110A

MGD859

(1)

(2)

(3)

(4)
(5)

46810

= 1.058W.

tot

= 0.941W.

tot

= 0.823W.

tot

= 0.705W.

tot

= 0.588W.

tot

_

V

V

LN

SLPE

(V)

Fig.10 SO14 Safe operating area (TEA1110AT).

Fig.11 DIP14 Safe operating area (TEA1110A).

1997 Apr 22 10

Philips Semiconductors Product specification

Low voltage versatile telephone

TEA1110A

transmission circuit with dialler interface

CHARACTERISTICS

I

= 15 mA; VEE=0V; R

line

unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies (pins V

V

ref

, VCC, SLPE and REG)

LN

stabilized voltage between LN and
SLPE

V

V

LN

LN(exR)

DC line voltage I

DC line voltage with an external
resistor R

∆V

LN(T)

DC line voltage variation with
temperature referred to 25 °C

I

CC

V
R

CC

CCint

internal current consumption VCC= 2.9 V − 1.1 1.4 mA
supply voltage for peripherals IP=0mA − 2.9 − V
equivalent supply voltage resistance IP= 0.5 mA − 550 620 Ω

Microphone amplifier (pins MIC+ and MIC−)

 input impedance

Z

i

differential between pins
MIC+ and MIC−

single-ended between pins

MIC+/MIC− and V
G
∆G

vtx

vtx(f)

voltage gain from MIC+/MIC− to LN V
gain variation with frequency

referred to 1 kHz

∆G

vtx(T)

gain variation with temperature

referred to 25 °C
CMRR common mode rejection ratio − 80 − dB
V

LN(max)(rms)

maximum sending signal

(RMS value)
V

notx

noise output voltage at pin LN; pins

MIC+/MIC− shorted through 200 Ω

=20Ω; AGC pin connected to VEE; Z

SLPE

VA

EE

= 600 Ω; f = 1 kHz; T

line

amb

=25°C;

3.1 3.35 3.6 V

=1mA − 1.6 − V

line

=4mA − 2.3 − V

I

line

= 15 mA 3.35 3.65 3.95 V

I

line

= 140 mA −−6.9 V

I

line

R

VA(SLPE−REG)

T

= −25 to +75 °C −±30 − mV

amb

=27kΩ− 4.4 − V

− 64 − kΩ

− 32 − kΩ

= 4 mV (RMS) 42.7 43.7 44.7 dB

MIC

f = 300 to 3400 Hz −±0.2 − dB

T

= −25 to +75 °C −±0.3 − dB

amb

I

= 15 mA; THD = 2% 1.4 1.7 − V

line

I

= 4 mA, THD = 10% − 0.8 − V

line

psophometrically

−−78.5 − dBmp

weighted (P53 curve)

Receiving amplifier (pins IR, QR and GAR)

Z

 input impedance − 20 − kΩ

i

G
∆G

vrx

vrx(f)

voltage gain from IR to QR VIR= 4 mV (RMS) 32 33 34 dB

gain variation with frequency

f = 300 to 3400 Hz −±0.2 − dB

referred to 1 kHz
∆G

vrx(T)

gain variation with temperature

T

= −25 to +75 °C −±0.3 − dB

amb

referred to 25 °C

1997 Apr 22 11

Philips Semiconductors Product specification

Low voltage versatile telephone

TEA1110A

transmission circuit with dialler interface

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

∆G

vrxr

V

o(rms)

V

norx(rms)

Automatic gain control (pin AGC)

∆G

vtrx

I

start

I

stop

DTMF amplifier (pin DTMF)

Zi input impedance − 20 − kΩ
G

vdtmf

∆G

vdtmf(f)

∆G

vdtmf(T)

G

vct

gain voltage reduction range external resistor

−−14 dB
connected between
GAR and QR

maximum receiving signal (RMS
value)

IP= 0 mA sine wave
drive; RL= 150 Ω;

− 0.25 − V

THD = 2%

= 0 mA sine wave

I

P

− 0.35 − V
drive; RL= 450 Ω;
THD = 2%

noise output voltage at pin QR
(RMS value)

G

= 33 dB;

vrx

IR open-circuit;

−−87 − dBVp

RL= 150 Ω;
psophometrically
weighted (P53 curve)

gain control range for microphone

I

=85mA − 5.9 − dB

line

and receiving amplifiers with respect
to I

=15mA

line

highest line current for maximum

− 23 − mA

gain
lowest line current for minimum gain − 56 − mA

voltage gain from DTMF to LN V

= 20 mV (RMS);

DTMF

24.1 25.3 26.5 dB
MUTE = LOW

gain variation with frequency

f = 300 to 3400 Hz −±0.2 − dB

referred to 1 kHz
gain variation with temperature

T

= −25 to +75 °C −±0.4 − dB

amb

referred to 25 °C
voltage gain from DTMF to QR

(confidence tone)

V

= 20 mV (RMS);

DTMF

RL= 150 Ω

−−15 − dB

Mute function (pin

V

IL

V

IH

I

MUTE

∆G

vtrxm

MUTE)

LOW level input voltage VEE− 0.4 − VEE+ 0.3 V
HIGH level input voltage VEE+ 1.5 − VCC+ 0.4 V
input current 1.5 µA
gain reduction for microphone and

MUTE = LOW 80 dB

receiving amplifiers

1997 Apr 22 12

Philips Semiconductors Product specification

Low voltage versatile telephone
transmission circuit with dialler interface

APPLICATION INFORMATION

pd5

R

470 kΩ

pd4

R

470 kΩ

BC558

supply for

peripheral

VCC

RCC619 Ω

signal from

C

dial and

control circuits

circuits

100 µF

R

pd6

PD

input

BC547

BF473

TEA1110A

68 kΩ

pd3

R

1 MΩ

MGG738

pd2

R

470 kΩ

ndbook, full pagewidth

ast1

R

130 kΩ

10 Ω

protect

R

CC

V

DTMF

QR

C

BAS11

95 V

VDR

TEA1110A(T)

GAR

MIC+

GAR

100 pF

ast2

R

3.92 kΩ

LN

IR

IR

C

4 ×

MUTE

GARS

C

V

MIC−

1 nF

EE

C

SLPE REG AGC

ast3

R

390 Ω

BZX79C10

REG

SLPE

R

4.7 µF

20 Ω

bal

Z

pd1

R

BSN254

470 kΩ

BZX79C10

BC547


limit

R

3.9 Ω

Fig.12 Typical application of the TEA1110A in sets with Pulse Dialling or Flash facilities.

a/b

line

telephone

b/a

1997 Apr 22 13

Philips Semiconductors Product specification

Low voltage versatile telephone
transmission circuit with dialler interface

PACKAGE OUTLINES

SO14: plastic small outline package; 14 leads; body width 3.9 mm

D

c

y

Z

14

8

TEA1110A

SOT108-1

E

H

E

A

X

v M

A

pin 1 index

1

e

0 2.5 5 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

mm

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

A

max.

1.75

0.069

A

1

0.25

0.10

0.0098

0.0039

A2A

1.45

1.25

0.057

0.049

0.25

0.01

b

3

p

0.49

0.25

0.36

0.19

0.019

0.0098

0.014

0.0075

(1)E(1)

cD

8.75

8.55

0.35

0.34

7

w M

b

p

scale

eHELLpQZywv θ

4.0

1.27

3.8

0.16

0.050

0.15

6.2

5.8

0.24

0.23

A

2

1.05

0.041

Q

A

1

detail X

1.0

0.7

0.4

0.6

0.028

0.039

0.024

0.016

(A )

L

p

L

0.25

0.01 0.004

A

3

θ

0.25 0.1

0.01

(1)

0.7

0.3

0.028

0.012

o

8

o

0

OUTLINE

VERSION

SOT108-1

IEC JEDEC EIAJ

076E06S MS-012AB

REFERENCES

1997 Apr 22 14

EUROPEAN

PROJECTION

ISSUE DATE

91-08-13
95-01-23

Philips Semiconductors Product specification

Low voltage versatile telephone
transmission circuit with dialler interface

DIP14: plastic dual in-line package; 14 leads (300 mil)

D

seating plane

L

Z

14

e

b

TEA1110A

SOT27-1

M

E

A

2

A

A

1

w M

b

1

8

c

(e )

1

M

H

pin 1 index

1

0 5 10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A

A

UNIT

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

max.

mm

OUTLINE
VERSION

SOT27-1

1 2

min.

max.

1.73

1.13

0.068

0.044

IEC JEDEC EIAJ

050G04 MO-001AA

b

b

1

0.53

0.38

0.021

0.015

0.36

0.23

0.014

0.009

REFERENCES

cD

scale

(1) (1)

19.50

18.55

0.77

0.73

7

Ee M

6.48

6.20

0.26

0.24

E

(1)

Z

L

e

1

3.60

3.05

0.14

0.12

M

E

8.25

7.80

0.32

0.31

EUROPEAN

PROJECTION

10.0

8.3

0.39

0.33

H

ISSUE DATE

w

0.2542.54 7.62

0.010.10 0.30

92-11-17
95-03-11

max.

2.24.2 0.51 3.2

0.0870.17 0.020 0.13

1997 Apr 22 15

Philips Semiconductors Product specification

Low voltage versatile telephone
transmission circuit with dialler interface

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

DIP

OLDERING BY DIPPING OR BY WA VE

S
The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

EPAIRING SOLDERED JOINTS

R
Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

SO

REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO

packages.

(order code 9398 652 90011).

). If the

stg max

TEA1110A

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

AVE SOLDERING

W
Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.

• The longitudinal axis of the package footprint must be
parallel to the solder flow.

• The package footprint must incorporate solder thieves at
the downstream end.

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

EPAIRING SOLDERED JOINTS

R
Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

1997 Apr 22 16

Philips Semiconductors Product specification

Low voltage versatile telephone

TEA1110A

transmission circuit with dialler interface

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1997 Apr 22 17

Philips Semiconductors Product specification

Low voltage versatile telephone
transmission circuit with dialler interface

NOTES

TEA1110A

1997 Apr 22 18

Philips Semiconductors Product specification

Low voltage versatile telephone
transmission circuit with dialler interface

NOTES

TEA1110A

1997 Apr 22 19

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United States: 811 EastArques Avenue, SUNNYVALE, CA94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing &Sales Communications,
Building BE-p, P.O.Box 218, 5600MD EINDHOVEN, TheNetherlands, Fax.[phone]

© Philips Electronics N.V. 1997 SCA54
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 417027/1200/02/pp20 Date of release: 1997 Apr 22 Document order number: 9397 75002077