Page 1
INTEGRATED CIRCUITS
DATA SH EET
TDA1543
Dual 16-bit DAC (economy version)
2
(I
S input format)
Product specification
File under Integrated Circuits, IC01
February 1991
Page 2
Philips Semiconductors Product specification
Dual 16-bit DAC (economy version)
2
(I
S input format)
FEATURES
• Low distortion
• 16-bit dynamic range
• 4 × oversampling possible
• Single 5 V power supply
• No external components required
• No requirement for external deglitcher circuitry due to
fast settling output current
• Adjustable bias current
• Internal timing and control circuits
2
S input format: time multiplexed, two's complement,
• I
TTL.
ORDERING INFORMATION
EXTENDED
TYPE NUMBER
TDA1543
TDA1543T
(1)
(2)
PINS PIN POSITION MATERIAL CODE
8 DIL plastic SOT97
16 mini-pack plastic SO16L;SOT162A
TDA1543
GENERAL DESCRIPTION
The TDA1543 is a monolithic integrated dual 16-bit
digital-to-analog converter (DAC) designed as an
economy version for use in hi-fi digital audio equipment
such as Compact Disc players, digital tape or cassette
recorders, digital sound in TV sets and in digital amplifiers.
PACKAGE
Notes
1. SOT97-1; 1996 August 13.
2. SOT162-1 1996 August 13.
QUICK REFERENCE DATA
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
V
DD
I
DD
I
FS
supply voltage 3.0 5.0 8.0 V
supply current − 50 60 mA
full scale output current 1.95 2.30 2.65 mA
THD total harmonic distortion including noise −−75 −70 dB
at 0 dB − 0.018 0.032 %
THD total harmonic distortion including noise −−30 −23 dB
at −60 dB − 3.2 7.9 %
t
cs
current settling time to ± 1 LSB − 0.5 −µs
BR input bit rate at data input −− 9.2 Mbits/s
f
BCK
clock frequency at clock input −− 9.2 MHz
S/N signal-to-noise ratio at bipolar zero 90 96 − dB
TC
FS
full scale temperature coefficient at analog outputs
−±500 × 10
−6
− K
−1
(AOL; AOR)
T
amb
operating ambient temperature
−30 −+85 °C
range
P
I
tot
bias
total power dissipation − 250 − mW
bias current (adjustable) −0.6 − 5.0 mA
February 1991 2
Page 3
This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in
_white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in
white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ...
February 1991 3
3.3 nF
LEFT OUTPUT LATCH
RIGHT OUTPUT LATCH
I
BL
I
AOL
AOL
6
V
ref
1.2 kΩ
(2)
3.3 nF
V
left
out
Philips Semiconductors Product specification
Dual 16-bit DAC (economy version)
(I
2
S input format)
BCK
WS
DATA
ref
(1)
R
100
nF
1.2 kΩ
bias
(2)
5 V
V
out
right
TDA1543
LELE
LEFT BIT SWITCHES
5-BIT
PASSIVE
DIVIDER
1
2
CONTROL
&
TIMING
3
LE
11-BIT
PASSIVE
DIVIDER
CURRENT
SOURCE
LEFT INPUT LATCH
RIGHT INPUT LATCH
ADDRESS POINTER
RIGHT BIT SWITCHES
11-BIT
PASSIVE
DIVIDER
CURRENT
SOURCE
5-BIT
PASSIVE
DIVIDER
I
BL
REFERENCE
SOURCE
TDA1543
I
BR
AOR
8
I
AOR
V
I
BR
V
ref
7
I
ref
V
DD
5
ground
4
(1) Optional.
(2) 2 × 1/2 NE5532.
Fig.1 Block diagram.
handbook, full pagewidth
MEA110
Page 4
Philips Semiconductors Product specification
Dual 16-bit DAC (economy version)
2
(I
S input format)
PINNING
SYMBOL PIN DESCRIPTION
BCK 1 bit clock input
WS 2 word select input
DATA 3 data input
GND 4 ground
V
DD
AOL 6 left channel voltage output
V
ref
AOR 8 right channel output
PINNING
SYMBOL PIN
n.c. 1 not connected
n.c. 2 not connected
BCK 3 bit clock input
WS 4 word select input
DATA 5 data input
GND 6 ground
n.c. 7 not connected
n.c. 8 not connected
n.c. 9 not connected
n.c. 10 not connected
V
DD
AOL 12 left channel output
V
ref
AOR 14 right channel output
n.c. 15 not connected
n.c. 16 not connected
5 +5 V supply voltage
7 reference voltage output
DESCRIPTION
11 +5 V supply voltage
13 reference voltage output
handbook, halfpage
Fig.3 Pin configuration TDA1543T.
TDA1543
Fig.2 Pin configuration TDA1543.
1
n.c.
2
n.c.
3
BCK AOR
4
WS
DATA
GND
n.c.
n.c.
TDA1543T
5
6
7
8
MEA107
16
n.c.
15
n.c.
14
V
13
ref
12
AOL
11
V
DD
10
n.c.
9
n.c.
February 1991 4
Page 5
Philips Semiconductors Product specification
Dual 16-bit DAC (economy version)
2
(I
S input format)
V
DD
BCK
WS
DATA
TDA1543
V
DD
V
DD
TDA1543
(a) input pins BCK, WS and DATA.
I
I
bias
DAC
V
DD
TDA1543
TDA1543
MEA109
V
ref
AOL
AOR
(b) output pin V
(c) output pins AOL and AOR.
.
ref
Fig.4 Circuits at the input and output pins.
February 1991 5
Page 6
Philips Semiconductors Product specification
Dual 16-bit DAC (economy version)
2
(I
S input format)
FUNCTIONAL DESCRIPTION
The TDA1543 accepts input serial data formats in two's complement with any bit length. Left and right data words are
time multiplexed. The most significant bit (bit 1) must always be first. The format of data input is shown in Fig.5 and Fig.6.
This flexible input data format (I2S) allows easy interfacing with signal processing chips such as interpolation filters, error
correction circuits and audio signal processor circuits (ASP).
The high maximum input bit-rate and fast settling current facilitates application in 4 × oversampling systems. An
adjustable current is added to the output currents to bias output operational amplifiers (OP1; OP2) for maximum dynamic
range (see Fig.1).
With a LOW level on the word select (WS) input data is placed in the left input register and with a HIGH level on the WS
input data is placed in the right input register. The data in the input registers is simultaneously latched in the output
registers which control the bit switches.
The output current of the DAC is a sink current. The current I
source. The current I
is amplified with gain A
ref
to the bias currents (IBL; IBR) which are added to the output currents.
Ibias
at the V
ref
output is adjusted by a resistor or a current
ref
LIMITING VALUES
In accordance with the Absolute Maximum System (lEC 134)
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
T
T
T
DD
XTAL
stg
amb
supply voltage range 0 9 V
crystal temperature − +150 °C
storage temperature range −55 +150 °C
operating ambient temperature
−30 +85 °C
range
V
es
electrostatic handling* −2000 +2000 V
TDA1543
THERMAL RESISTANCE
SYMBOL PARAMETER TYP. UNIT
R
th j-a
from junction to ambient 100 K/W
* Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
February 1991 6
Page 7
Philips Semiconductors Product specification
Dual 16-bit DAC (economy version)
2
(I
S input format)
CHARACTERISTICS
V
= 5 V; T
DD
= + 25 °C; I
amb
= 0 mA; measured in the circuit of Fig.1; unless otherwise specified
ref
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply
V
DD
I
DD
supply voltage range 3.0 5.0 8.0 V
supply current note 1 − 50 60 mA
RR ripple rejection note 2 − 50 − dB
Digital inputs
input current pins (1, 2 and 3)
I
IL
I
IH
digital inputs LOW Vl= 0.8 V −−−0.4 mA
digital inputs HIGH Vl= 2.0 V −−20 µA
input frequency/bit rate
f
BCK
clock input pin 1 −−9.2 MHz
BR bit rate data input pin 3 −−9.2 Mbits/s
f
WS
word select input pin 2 −−192 kHz
Analog outputs (AOL; AOR)
Res resolution −−16 bits
output voltage compliance
V
OC(AC)
V
OC(DC)
I
FS
T
CFS
I
offset
I
bias
AI
bias
Analog outputs (V
V
ref
I
ref
AC −±25 − mV
DC 1.8 − VDD−1.2 V
full scale current 1.95 2.30 2.65 mA
full scale temperature coefficient −±500 ×
−6
10
offset current I
= 0 mA −0.1 0.0 0.1 mA
ref
bias current (adjustable) −0.6 − 5.0 mA
bias current gain 1.9 2.0 2.1
)
ref
reference voltage output 2.10 2.20 2.30 V
reference current output −0.3 − 2.5 mA
THD total harmonic distortion including noise at −75 −70 dB
0 dB;
note 3, Fig.7 0.018 0.032 %
THD total harmonic distortion including noise at −−30 −23 dB
−60 dB;
note 3, Fig.7 − 3.2 7.9 %
t
cs
settling time ±1 LSB − 0.5 −µs
α channel separation 85 90 − dB
|dIO| unbalance between outputs note 4 −<0.2 0.3 dB
| time delay between outputs −<0.2 −µs
|t
d
S/N signal-to-noise ratio at bipolar zero;
90 96 − dB
note 5
TDA1543
− K
−1
February 1991 7
Page 8
Philips Semiconductors Product specification
Dual 16-bit DAC (economy version)
2
(I
S input format)
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Timing (Fig.5)
t
r
t
f
t
CY
t
HB
t
LB
t
SU;DAT
t
HD;DAT
t
HD;WS
t
SU;WS
rise time −−32 ns
fall time −−32 ns
bit clock cycle time 108 −−ns
bit clock HIGH time 22 −−ns
bit clock LOW time 22 −−ns
data set-up time 32 −−ns
data hold time to bit clock note 6 2 −−ns
word select hold time note 6 2 −−ns
word select set-up time 32 −−ns
Notes to the characteristics
1. Measured at I
2. V
= 1% of supply voltage and f
ripple
= 0 mA and I
AOL
= 0 mA (code 8000H) and I
AOR
= 100 Hz.
ripple
= 0 mA.
bias
3. Measured with 1 kHz sinewave generated at a sampling rate of 192 kHz.
4. Measured with 1 kHz full scale sinewave generated at a sampling rate of 192 kHz.
5. At code 0000H.
6. At this point t
= 0 ns, this value has been fixed on 2 ns due to tolerances.
HD;DAT
TDA1543
Fig.5 Format of input signals (I2S format).
February 1991 8
Page 9
Philips Semiconductors Product specification
Dual 16-bit DAC (economy version)
2
(I
S input format)
DATA
BCK
WS
LSB MSB LSB MSB
LEFT
TDA1543
RIGHT
MEA112
Fig.6 Format of input signals.
agewidth
handbook, full pagewidth
(1) Measured including all distortion plus noise over a 20 kHz bandwidth at a level of −60 dB.
(2) Measured including all distortion plus noise over a 20 kHz bandwidth at a level of −24 dB.
(3) Measured including all distortion plus noise over a 20 kHz bandwidth at a level of −0 dB.
THD
(dB)
–20
–30
–40
–50
–60
– 70
–80
–90
10 10
2
10
3
(1)
(2)
(3)
frequency (Hz)
MEA111-1
10
THD
(%)
1
0.1
0.01
4
10
Fig.7 Distortion as a function of frequency (4FS).
February 1991 9
Page 10
Philips Semiconductors Product specification
Dual 16-bit DAC (economy version)
2
(I
S input format)
Notes to Fig.7
• The sample frequency 4FS: 176.4 kHz.
• The supply voltage at the measurement = + 5 V (DC).
• Ref: 0 dB is the output level of a full scale digital sine wave stimulus.
• The graphs are constructed from average values of a small amount of engineering samples therefore no guarantee
for typical values is implied.
• The arrows indicate the specification limits for 0 dB and −60 dB level signals.
TDA1543
February 1991 10
Page 11
Philips Semiconductors Product specification
Dual 16-bit DAC (economy version)
2
(I
S input format)
PACKAGE OUTLINES
DIP8: plastic dual in-line package; 8 leads (300 mil)
D
seating plane
A
L
Z
e
b
8
1
w M
b
1
b
2
5
TDA1543
SOT97-1
M
E
A
2
A
c
(e )
1
M
H
pin 1 index
E
1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
A
UNIT
max.
mm
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT97-1
12
min.
max.
050G01 MO-001AN
b
1.73
1.14
0.068
0.045
IEC JEDEC EIAJ
0.53
0.38
0.021
0.015
b
1
1.07
0.89
0.042
0.035
4
0 5 10 mm
scale
b
2
0.36
0.23
0.014
0.009
REFERENCES
(1) (1)
cD E e M
9.8
9.2
0.39
0.36
6.48
6.20
0.26
0.24
L
e
1
M
3.60
8.25
3.05
7.80
0.14
0.32
0.12
0.31
EUROPEAN
PROJECTION
E
10.0
0.39
0.33
H
8.3
w
max.
0.2542.54 7.62
1.154.2 0.51 3.2
0.010.10 0.30
0.0450.17 0.020 0.13
ISSUE DATE
92-11-17
95-02-04
(1)
Z
February 1991 11
Page 12
Philips Semiconductors Product specification
Dual 16-bit DAC (economy version)
2
(I
S input format)
SO16: plastic small outline package; 16 leads; body width 7.5 mm
D
c
y
Z
16
9
TDA1543
SOT162-1
E
H
E
A
X
v M
A
pin 1 index
1
e
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
mm
A
max.
2.65
0.10
A
1
0.30
0.10
0.012
0.004
A2A
2.45
2.25
0.096
0.089
0.25
0.01
b
3
p
0.49
0.32
0.36
0.23
0.019
0.013
0.014
0.009
UNIT
inches
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
8
w M
b
p
0 5 10 mm
scale
(1)E(1) (1)
cD
10.5
10.1
0.41
0.40
eHELLpQ
7.6
1.27
7.4
0.30
0.050
0.29
A
2
10.65
10.00
0.419
0.394
A
1
1.4
0.055
1.1
0.4
0.043
0.016
detail X
0.043
0.039
1.1
1.0
Q
3
0.25 0.1
0.01
A
θ
ywv θ
0.004
Z
0.9
0.4
0.035
0.016
o
8
o
0
(A )
L
p
L
0.25
0.01
OUTLINE
VERSION
SOT162-1
IEC JEDEC EIAJ
075E03 MS-013AA
REFERENCES
February 1991 12
EUROPEAN
PROJECTION
ISSUE DATE
95-01-24
97-05-22
Page 13
Philips Semiconductors Product specification
Dual 16-bit DAC (economy version)
2
(I
S input format)
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
(order code 9398 652 90011).
TDA1543
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
stg max
). If the
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
February 1991 13
Loading...