Datasheet TDA1541A Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA1541A

Stereo high performance 16-bit
DAC

Product specification
File under Integrated Circuits, IC01

February 1991

Philips Semiconductors Product specification

Stereo high performance 16-bit DAC TDA1541A

FEATURES

• High sound quality

• High performance: low noise and distortion, wide

dynamic range

• 4 × or 8 × oversampling possible

• Selectable two-channel input format

GENERAL DESCRIPTION

The TDA1541A is a stereo 16-bit digital-to-analog
converter (DAC). The ingenious design of the electronic
circuit guarantees a high performance and superior sound
quality. The TDA1541A is therefore extremely suitable for
use in top-end hi-fi digital audio equipment such as high
quality Compact Disc players or digital amplifiers.

• TTL compatible inputs.

ORDERING INFORMATION

EXTENDED TYPE

NUMBER

TDA1541A

(1)

PINS PIN POSITION MATERIAL CODE

28 DIL plastic SOT117

PACKAGE

Note

1. SOT117; SOT117-1; 1996 August 09.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

−V

−V

I

DD

−I

−I

DD

DD1
DD2

DD1
DD2

supply voltage; pin 28 4.5 5.0 5.5 V
supply voltage; pin 26 4.5 5.0 5.5 V
supply voltage; pin 15 14.0 15.0 16.0 V
supply current; pin 28 − 27 40 mA
supply current; pin 26 − 37 50 mA
supply current; pin 15 − 25 35 mA

THD total harmonic distortion including noise −−95 −90 dB

at 0 dB − 0.0018 0.0032 %

THD total harmonic distortion including noise −−42 − dB

at −60 dB − 0.79 − %

NL non-linearity at T

t

cs

current settling time to ± 1LSB − 0.5 −µs

BR input bit rate at data input;

(pin 3 and 4)

f

BCK

TC

T
P

FS

amb
tot

clock frequency at clock input −−6.4 MHz
full scale temperature coefficient at analog

operating ambient temperature range −40 − +85 °C
total power dissipation − 700 − mW

=

amb

−20 to +85 °C

(AOL;AOR)

− 0.5 1.0 LSB

−−6.4 Mbits/s

−

±200 ×

-6

10

− K

-1

February 1991 2

Philips Semiconductors Product specification

Stereo high performance 16-bit DAC TDA1541A

(1) TDA1542.
(2) 2 × NE5534 or equivalent.

Fig.1 Block diagram.

February 1991 3

Philips Semiconductors Product specification

Stereo high performance 16-bit DAC TDA1541A

PINNING

SYMBOL PIN DESCRIPTION

(1)

LE/WS

(1)

BCK
DATA L

(1)

/DATA
DATA R

(1)

GND(A) 5 analog ground
AOR 6 right channel output
DECOU 7 to 13 decoupling
GND (D) 14 digital ground
V

DD2

15 −15 V supply voltage
COSC 16,17 oscillator
DECOU 18 to 24 decoupling
AOL 25 left channel output
V

DD1

OB/TWC
V

DD

(1)

26 −5 V supply voltage

27 mode select input

28 +5 V supply voltage

latch enable input/ word select

1

input

2 bit clock input

data left channel input/ data

3

input (selected format)

4 data right channel input

Note

1. See Table 1 data selection input.
Fig.2 Pin configuration

FUNCTIONAL DESCRIPTION

The TDA1541A accepts input sample formats in time multiplexed mode or simultaneous mode up to 16-bit word length.
The most significant bit (MSB) must always be first. The flexible input data format allows easy interfacing with signal
processing chips such as interpolation filters, error correction circuits, pulse code modulation adaptors and audio signal
processors (ASP).

The high maximum input bit-rate and fast setting facilitates application in 8 × oversampling systems
(44.1 kHz to 352.8 kHz or 48 kHz to 384 kHz) with the associated simple analog filtering function (low order, linear phase
filter).

Input data selection (see also Table 1)
With the input

OB/TWC connected to ground, data input (offset binary format) must be in time multiplexed mode. It is
accompanied with a word select (WS) and a bit clock input (BCK) signal. The converted samples appear at the output,
at the first positive going transition of the bit clock signal after a negative going transition of the word select signal.

With OB/TWC connected to VDD the mode is the same but the data format must be in the two’s complement.
When input OB/TWC input is connected to V

the two channels of data (L/R) are input simultaneously via DATA L and

DD1

DATA R, accompanied with BCK and a latch-enable input (LE). With this mode selected the data must be in offset binary.
The converted samples appear at the output at the positive going transition of the latch enable signal.

The format of the data input signals is shown in Fig.5 and 6.

February 1991 4

Philips Semiconductors Product specification

Stereo high performance 16-bit DAC TDA1541A

True 16-bit performance is achieved by each channel using three 2-bit active dividers, operating on the dynamic element
matching principle, in combination with a 10-bit passive current divider, based on emitter scaling. All digital inputs are
TTL compatible.

Table 1 Input data selection

OB/TWC MODE PIN 1 PIN 2 PIN 3 PIN 4

−5 V simultaneous LE BCK DATA L DATA R
0 V time MUX OB WS BCK DATA OB not used
+5 V time MUX TWC WS BCK DATA TWC not used

Where:

LE = latch enable
WS = word select,

LOW = left channel;

HIGH = right channel
BCK = bit clock
DATA L = data left
DATA R = data right
DATA OB = data offset binary
DATA TWC = data two’s complement
MUX OB = mulitplexed offset binary
MUX TWC = multiplexed two’s

2

complement = I

S- format

LIMITING VALUES

In accordance with the Absolute Maximum System (IEC 134)

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

−V

−V

T
T
V

DD

DD1

DD2
stg
amb
es

supply voltage; pin 28 0 7 V
supply voltage; pin 26 0 7 V
supply voltage; pin 15 0 17 V
storage temperature range −55 +150 °C
operating ambient temperature range −40 +85 °C
electrostatic handling* −1000 +1000 V

* Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.

THERMAL RESISTANCE

SYMBOL PARAMETER TYP. UNIT

R

th j-a

from junction to ambient 30 K/W

February 1991 5

Philips Semiconductors Product specification

Stereo high performance 16-bit DAC TDA1541A

CHARACTERISTICS

= 5 V; −V

V

DD

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

DD

−V

DD1

−V

DD2

V

GND(A)

−V

GND(D)

I

DD

−I

DD1

−I

DD2

Inputs

−I

IL

I

IH

I
I
I

f

BCK

 +5 V −−1µA

OB/TWC

 0 V −−20 µA

OB/TWC

−5 V −−40 µA

OB/TWC

BR bit rate data input pin 3 and 4 −−6.4 Mbits/s
f

WS

f

LE

C

I

Analog outputs (AOL;AOR; see note 1)
Res resolution − 16 − bits

I

FS

 zero scale current − 25 50 nA

I

ZS

T

CFS

= 5 V; −V

DD1

= 15 V; T

DD2

= +25 °C; measured in the circuit of Fig.1; unless otherwise specified

amb

supply voltage; pin 28 4.5 5.0 5.5 V
supply voltage; pin 26 4.5 5.0 5.5 V
supply voltage; pin 15 14.0 15.0 16.0 V
voltage difference between

analog and digital ground

−0.3 0 +0.3 V

supply current; pin 28 − 27 40 mA
supply current; pin 26 − 37 50 mA
supply current; pin 15 − 25 35 mA

input current pins (1, 2, 3 and 4)

digital inputs LOW VI = 0.8 V −−0.4 mA
digital inputs HIGH VI = 2.0 V −−20 µA

Digital input currents (pin 27)

input frequency/bit rate
clock input pin 2 −−6.4 MHz

word select input pin 2 −−200 kHz
latch enable input 1 −−200 kHz
input capacitance of digital inputs − 12 − pF

full scale current 3.4 4.0 4.6 mA

full scale temperature coefficient T

=

amb

−20 to +85 °C

−

±200 ×

−6

10

− K

−1

Analog outputs (V

E

L

E

L

E

dL

E

dL

integral linearity error T
integral linearity error T

differential linearity error T

differential linearity error T

ref

)

= 25 °C − 0.5 1.0 LSB

amb

=

amb

−20 to +85 °C
= 20 °C,

amb

note 2

=

amb

−20 to +85 °C

−−1.0 LSB

− 0.5 1.0 LSB

−−1.0 LSB

THD total harmonic distortion at 0 dB; note 3 −100 −−dB

− 0.0010 − %

February 1991 6

Philips Semiconductors Product specification

Stereo high performance 16-bit DAC TDA1541A

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

THD total harmonic distortion including noise

at 0 dB;
note 3, Fig. 3, 4

THD total harmonic distortion including noise

at −60 dB;
note 3, Fig. 3, 4

t

cs

settling time ±1 LSB − 0.5 −µs

α channel separation 90 98 − dB

| unbalance between outputs note 4 − < 0.1 0.3 dB

|d

IO

| time delay between outputs −−0.2 µs

|t

d

SSVR supply voltage ripple rejection V

= +5 V;

DD

note 4

SSVR supply voltage ripple rejection V

DD1

= −5 V;

note 4

SSVR supply voltage ripple rejection V

= −15 V;

DD2

note 4
S/N signal-to-noise ratio at bipolar zero − 110 − dB
S/N signal-to-noise ratio at full scale 98 104 − dB

−

−

−

−

−95

0.0018

−42

0.79

−90

0.0032

−

−

dB

%

dB

%

−−76 − dB

−−84 − dB

−−58 − dB

Timing (Fig. 5 and 6)

t

r

t

f

t

CY

t

HB

t

LB

t

FBRL

t

RBFL

t

SU;DAT

t

HD;DAT

t

HD;WS

t

SU;WS

rise time −−32 ns
fall time −−32 ns
bit clock cycle time 156 −−ns
bit clock HIGH time 46 −−ns
bit clock LOW time 46 −−ns
bit clock fall time to latch enable

rise time
bit clock rise time to latch enable

fall time

0 −−ns

0 −−ns

data set-up time 32 −−ns
data hold time to bit clock 0 −−ns
word select hold time 0 −−ns
word select set-up time 32 −−ns

Notes to the characteristics

1. To ensure no performance losses, permitted output voltage compliance is ±25 mV maximum.

2. Selections have been made with respect to the maximum differential linearity error (EdL):

TDA1541A/N2 bit 1-16 EdL < 1 LSB

TDA1541A/N2/R1 bit 1-16 EdL < 2 LSB

TDA1541A/N2/S1 bit 1-7 EdL < 0.5 LSB

bit 8-15 EdL < 1 LSB
bit 16 EdL< 0.75 LSB

February 1991 7

Philips Semiconductors Product specification

Stereo high performance 16-bit DAC TDA1541A

The S1 version has been specially selected to achieve extremely good performance even for small signals.

3. Measured using a 1 kHz sinewave generated at a sampling rate of 176.4 kHz.

4. V

= 100 mV and f

ripple

ripple

= 100 Hz.

(1) Measured including all distortion plus noise at a signal level of −60 dB.
(2) Measured including all distortion plus noise at a signal level of −0 dB.

Fig.3 Distortion as a function of frequency (4FS).

Notes to Fig.3

• The sample frequency 4FS: 176.4 kHz.

• Ref: 0 dB is the output level of a full scale digital sine wave stimulus.

February 1991 8

Philips Semiconductors Product specification

Stereo high performance 16-bit DAC TDA1541A

(1) Measured including all distortion plus noise at a signal level of −60 dB.
(2) Measured including all distortion plus noise at a signal level of −0 dB.

Fig.4 Distortion as a function of frequency (8FS).

Notes to Fig.4

• The sample frequency 8FS: 352.8 kHz.

• Ref: 0 dB is the output level of a full scale digital sine wave stimulus.

February 1991 9

Philips Semiconductors Product specification

Stereo high performance 16-bit DAC TDA1541A

Fig.5 Format of input signals; time multiplexed (I2S format).

Fig.6 Format of input signals; simultaneous data.

February 1991 10

Philips Semiconductors Product specification

Stereo high performance 16-bit DAC TDA1541A

PACKAGE OUTLINE

handbook, full pagewidth

DIP28: plastic dual in-line package; 28 leads (600 mil)

SOT117-1

seating plane

L

Z

28

1

pin 1 index

D

A

2

A

A

1

e

b

w M

b

1

15

E

14

c

M

(e )

M

E

1

H

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A

A

UNIT

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

max.

mm

OUTLINE

VERSION

SOT117-1

1 2

min.

max.

1.7

1.3

0.066

0.051

IEC JEDEC EIAJ

051G05 MO-015AH

b

b

1

0.53

0.38

0.020

0.014

0.32

0.23

0.013

0.009

REFERENCES

cD E weM

(1) (1)

36.0

35.0

1.41

1.34

February 1991 11

14.1

13.7

0.56

0.54

(1)

92-11-17
95-01-14

Z

max.

1.75.1 0.51 4.0

0.0670.20 0.020 0.16

L

3.9

3.4

EUROPEAN

PROJECTION

M

15.80

15.24

0.62

0.60

H

E

17.15

15.90

0.68

0.63

0.252.54 15.24

0.010.10 0.60

ISSUE DATE

e

1

0.15

0.13

Philips Semiconductors Product specification

Stereo high performance 16-bit DAC TDA1541A

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

Soldering by dipping or by wave

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

(order code 9398 652 90011).

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

stg max

). If the

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

February 1991 12