
Philips Semiconductors Preliminary specification
Stereo cassette head
TDA1523
preamplifier and equalizer
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); note 1.
SYMBOL PARAMETER MIN. MAX. UNIT
V
P
I
fb
P
tot
T
amb
T
stg
Note
1. All pins except 2 and 6 (feedback) can be connected to VP (pin 7) or ground (pin 4).
CHARACTERISTICS
V
= 8.5 V; T
P
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply (pin 7)
V
P
I
P
Inputs (pins 3 or 5)
V
ni(rms)
V
ni
I
ni
, I
I
3
5
Z
input impedance f = 1 kHz; note 1 200 −−kΩ
i
Outputs (pins 14 or 8); see Fig.7
V
o
I
O
V
O
V
no(rms)
V
no
V
no
Z
output impedance f = 1 kHz; note 1 −−1kΩ
o
supply voltage (pin 7) 7.5 12 V
feedback current (pins 2 and 6) − 10 mA
total power dissipation − 300 mW
operating ambient temperature −30 +85 °C
storage temperature −55 +150 °C
=25°C; see test circuit Fig.1; unless otherwise specified.
amb
supply voltage 7.5 − 12 V
supply current − 5 − mA
unweighted noise input voltage
(RMS value)
noise input voltage RS= 0; f = 1 kHz; measured
f = 20 Hz to 20 kHz;
measured in Fig.3
− 1.6 −
− 5 −
in Fig.3; see also Fig.5
noise input current f = 1 kHz; measured in Fig.3;
− 1.2 −
see also Fig.6
DC input current at pins 3 and 5 −−−2µA
output voltage Vi= 0.3 mV; f = 315 Hz − 0.72 − V
THD = 1%; f = 1 kHz 1.0 −−V
output source current V
≥ 7.5 V; mute off −5 −10 − mA
1-4
DC output voltage − 3.7 − V
weighted noise output voltage;
RS= 300 Ω; LS=80mH − 700 −µV
DIN A (RMS value)
weighted noise output voltage
CCITT (peak value) R
CCIR (peak value) R
unweighted noise output voltage;
= 300 Ω; LS=80mH − 1200 −µV
S
= 300 Ω; LS=80mH − 1600 −µV
S
RS= 300 Ω; LS=80mH − 1800 −µV
DIN 45405 (peak value)
µV
nV
----------- Hz
pA
----------- Hz
1996 Feb 26 5

Philips Semiconductors Preliminary specification
Stereo cassette head
preamplifier and equalizer
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
(order code 9398 652 90011).
TDA1523
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
stg max
). If the
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1996 Feb 26 13

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SCDS47 © Philips Electronics N.V. 1996
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517021/1100/01/pp16 Date of release: 1996 Feb 26
Document order number: 9397 750 00694