Datasheet TDA1521Q, TDA1521 Datasheet (Philips)

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Page 1

INTEGRATED CIRCUITS

DATA SH EET

TDA1521 TDA1521Q

2 x 12 W hi-fi audio power amplifier

Product speciﬁcation File under Integrated Circuits, IC01

July 1994

Page 2

Philips Semiconductors Product speciﬁcation

2 x 12 W hi-ﬁ audio power ampliﬁer

TDA1521

TDA1521Q

GENERAL DESCRIPTION

The TDA1521/TDA1521Q is a dual hi-fi audio power amplifier encapsulated in a 9-lead plastic power package. The device is especially designed for mains fed applications (e.g. stereo tv sound and stereo radio).

Features

• Requires very few external components

• Input muted during power-on and off

(no switch-on or switch-off clicks)

• Low offset voltage between output and ground

• Excellent gain balance between channels

• Hi-fi according to IEC 268 and DIN 45500

• Short-circuit-proof

• Thermally protected

QUICK REFERENCE DATA

Stereo applications

Supply voltage range V Output power at THD = 0,5%,

= ± 16 V P

Voltage gain G Gain balance between channels ∆G Ripple rejection SVRR typ. 60 dB Channel separation α typ. 70 dB Noise output voltage V

no(rms)

± 7,5 to ± 21,0 V

typ. 12 W typ. 30 dB typ. 0,2 dB

typ. 70 µV

PACKAGE OUTLINES

TDA1521: 9 leads in-line; plastic power (SOT131); SOT131-1; 1996 August 20. TDA1521Q: 9 leads SIL-bent-to-DIL; plastic power (SOT157); SOT157-2; 1996 August 20.

July 1994 2

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Philips Semiconductors Product speciﬁcation

2 x 12 W hi-ﬁ audio power ampliﬁer

TDA1521

TDA1521Q

Fig.1 Block diagram.

PINNING

1 −INV1 non-inverting input 1 2 INV1 inverting input 1

3 GND 4 OUT1 output 1

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ground (symmetrical)

⁄2 VP (asymmetrical)

5 −V 6 OUT2 output 2

7+V 8 INV2 inverting input 2 9 −INV2 non-inverting input 2

negative supply (symmetrical) ground (asymmetrical)

positive supply

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Philips Semiconductors Product speciﬁcation

2 x 12 W hi-ﬁ audio power ampliﬁer

TDA1521

TDA1521Q

FUNCTIONAL DESCRIPTION

This hi-fi stereo power amplifier is designed for mains fed applications. The circuit is designed for both symmetrical and asymmetrical power supply systems. An output power of 2 × 12 watts (THD = 0,5%) can be delivered into an 8 Ω load with a symmetrical power supply of ± 16 V.

The gain is fixed internally at 30 dB. Internal gain fixing gives low gain spread and very good balance between the amplifiers (0,2 dB).

A special feature of this device is a mute circuit which suppresses unwanted input signals during switching on and off. Referring to Fig.13, the 100 µF capacitor creates a time delay when the voltage at pin 3 is lower than an internally fixed reference voltage. During the delay the amplifiers remain in their DC operating mode but are isolated from the non-inverting inputs on pins 1 and 9.

Two thermal protection circuits are provided, one monitors the average junction temperature and the other the instantaneous temperature of the power transistors. Both protection circuits activate at 150 °C allowing safe operation to a maximum junction temperature of 150°C without added distortion.

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC 134)

PARAMETER CONDITIONS SYMBOL MIN. MAX. UNIT

Supply voltage pin 7 V

pin 5 −V

Non-repetitive peak

output current pins 4 and 6 I Total power dissipation see Fig.2 P Storage temperature range T Junction temperature T Short-circuit time: see note

outputs short-circuited

to ground symmetrical

(full signal drive) power supply t

asymmetrical power supply;

< 32 V

(unloaded); R

≥ 4 Ω t

OSM

tot stg j

= V

7-3

5-3

− +21 V

−−21 V

− 4A

−55 +150 °C

− 150 °C

− 1 hour

Note

For asymmetrical power supplies (at short circuiting of the load) the maximum supply voltage is limited to VP = 28 V. If the total internal resistance of the supply (Ri) > 4 Ω, the maximum unloaded supply voltage is increased to 32 V.

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Philips Semiconductors Product speciﬁcation

2 x 12 W hi-ﬁ audio power ampliﬁer

TDA1521

TDA1521Q

Fig.2 Power derating curve.

THERMAL RESISTANCE

From junction to case R

HEATSINK DESIGN EXAMPLE

With derating of 2,5 K/W, the value of heatsink thermal resistance is calculated as follows: given RL = 8 Ω and VP = ±16 V, the measured maximum dissipation is 14,6 W; then, for a maximum ambient temperature

of 65 °C, the required thermal resistance of the heatsink is

th h a–

Note: The internal metal block (heatsink) has the same potential as pin 5 (−V

150 65–

---------------------14 6,

25 33 K W⁄,=,–=

th j-c

= 2,5 K/W

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Philips Semiconductors Product speciﬁcation

2 x 12 W hi-ﬁ audio power ampliﬁer

TDA1521

TDA1521Q

CHARACTERISTICS

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Supply voltage range

operating mode V input mute mode V

P P

Repetitive peak

output current I

ORM

Operating mode: symmetrical power supply; test circuit as per Fig.12;

= ± 16 V; RL = 8 Ω; T

Total quiescent current without R Output power THD = 0,5% P

= 25 °C; f = 1 kHz

amb

THD = 10% P

tot

O O

Total harmonic

distortion P

= 6 W THD − 0,15 0,2 %

Power bandwidth THD = 0,5%

note 1 B 20 to

Voltage gain G Gain balance ∆G

Noise output voltage

(r.m.s, value); unweighted (20 Hz to 20 kHz) R

Input impedance |Z

= 2 kΩ V

no(rms)

 14 20 26 kΩ

Ripple rejection note 2 SVRR 40 60 − dB Channel separation RS= 0 Ωα 46 70 − dB Input bias current I

DC output offset with respect

voltage to ground V

OFF

Input mute mode: symmetrical power supply; test circuit as per Fig.12;

VP= ± 4V; RL= 8 Ω; T Total quiescent current without R Output voltage V

= 25 °C; f = 1 kHz

amb

= 600 mV V

tot

out

Noise output voltage

(r.m.s. value);

unweighted (20 Hz to 20 kHz) R

= 2 kΩ V

no(rms)

Ripple rejection note 2 SVRR 35 55 − dB DC output offset with respect

voltage to ground V

OFF

± 7,5 ± 16,0 ± 21,0 V ± 2,0 −±5,8 V

2,2 −−A

18 40 70 mA 10 12 − W 12 15 − W

20k Hz

29 30 31 dB

− 0,2 1,0 dB

− 70 140 µV

− 0,3 −µA

− 30 200 mV

9 3040mA

− 0,6 1,8 mV

− 70 140 µV

− 40 200 mV

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Philips Semiconductors Product speciﬁcation

2 x 12 W hi-ﬁ audio power ampliﬁer

TDA1521

TDA1521Q

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Operating mode: asymmetrical power supply; test circuit as per Fig.13;

= 24 V; RL= 8 Ω; T

Total quiescent current I Output power THD = 0,5% P

Total harmonic

distortion PO= 4 W THD − 0,13 0,2 % Power bandwidth THD = 0,5% 40 to

Voltage gain G Gain balance ∆G Noise output voltage

(r.m.s. value);

unweighted (20 Hz to 20 kHz) R Input impedance Z Ripple rejection SVRR 35 44 − dB Channel separation R

Notes

1. Power bandwidth at Po max −3 dB.

2. Ripple rejection at RS = 0 Ω, f = 100 Hz to 20 kHz; ripple voltage = 200 mV (r.m.s. value) applied to positive or negative supply rail.

= 25 °C; f = 1 kHz

amb

18 40 70 mA 56−W 6,5 8 − W

THD = 10% P

tot

o o

note 1 B 20k Hz

= 2 kΩ V

= 0 Ωα −45 − dB

no(rms)

 14 20 26 kΩ

29 30 31 dB

− 0,2 1 dB

− 70 140 µV

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Philips Semiconductors Product speciﬁcation

2 x 12 W hi-ﬁ audio power ampliﬁer

TDA1521

TDA1521Q

APPLICATION INFORMATION Input mute circuit

The input mute circuit operates only during switching on and off of the supply voltage. The circuit compares the 1/2 supply voltage (at pin 3) with an internally fixed reference voltage (V voltage at pin 3 is lower than V at pin 3 is determined by an internal voltage divider and the external 100 µF capacitor.

During switching on, a time delay is created between the reference voltage and the voltage at pin 3, during which the input terminal is disconnected, (as illustrated in Fig.3).

the non-inverting inputs (pins 1 and 9) are disconnected from the amplifier. The voltage

ref

), derived directly from the supply voltage. When the

ref

Fig.3 Input mute circuit; time delay.

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Philips Semiconductors Product speciﬁcation

2 x 12 W hi-ﬁ audio power ampliﬁer

TDA1521

TDA1521Q

Fig.4 Output power as a function of supply

voltage; symmetrical supply; RL = 8 Ω; f = 1 kHz.

Fig.5 Distortion as a function of frequency;

symmetrical supply; VP = ± 16 V; RL = 8 Ω; Po = 6 W.

Fig.6 Supply voltage ripple rejection;

symmetrical supply; VP = ± 16 V; VRR= 200 mV.

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Fig.7 Power dissipation as a function of

output power; symmetrical supply; VP = ± 16 V; RL = 8 Ω; f = 1 kHz.

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Philips Semiconductors Product speciﬁcation

2 x 12 W hi-ﬁ audio power ampliﬁer

TDA1521

TDA1521Q

Fig.8 Output power as a function of

supply voltage; asymmetrical supply; RL = 8 Ω; f = 1 kHz.

Fig.9 Distortion as a function of frequency;

asymmetrical supply; VS = 24 V; RL = 8 Ω; Po = 4 W.

Fig.10 Supply voltage ripple rejection;

asymmetrical supply; VS = 24 V; VRR = 200 mV.

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Fig.11 Output power as a function of

supply voltage; asymmetrical supply; RL = 4 Ω; f = 1 kHz.

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Philips Semiconductors Product speciﬁcation

2 x 12 W hi-ﬁ audio power ampliﬁer

TDA1521

TDA1521Q

(1) To be connected as close as possible to the IC

Fig.12 Test and application circuit; symmetrical power supply.

(1) To be connected as close as possible to the IC

Fig.13 Test and application circuit; asymmetrical power supply.

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Philips Semiconductors Product speciﬁcation

2 x 12 W hi-ﬁ audio power ampliﬁer

PACKAGE OUTLINES

SIL9P: plastic single in-line power package; 9 leads

TDA1521

TDA1521Q

SOT131-2

non-concave

view B: mounting base side

seating plane

DIMENSIONS (mm are the original dimensions)

UNIT A

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

max.

2.0

OUTLINE VERSION

SOT131-2

4.6

4.2

max.

1.1

0.75

0.48

0.60

0.38

IEC JEDEC EIAJ

(1)

24.0

23.6

REFERENCES

w M

0 5 10 mm

scale

deD

20.0

10 2.54

19.6

12.2

11.8

(1)

3.4

3.1

17.2

2.1

16.5

1.8

EUROPEAN

PROJECTION

0.25w0.03

ISSUE DATE

92-11-17 95-03-11

(1)

2.00

1.45

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Philips Semiconductors Product speciﬁcation

2 x 12 W hi-ﬁ audio power ampliﬁer

DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12 mm)

non-concave

view B: mounting base side

TDA1521

TDA1521Q

SOT157-2

0.75

0.60

0.48

24.0

0.38

23.6

(1)

deD

20.0

19.6

DIMENSIONS (mm are the original dimensions)

UNIT A A e

17.0

15.5

4.6

4.2

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

w M

12.2

10 5.08

11.8

0 5 10 mm

scale

(1)

12bp

2.54

5.08

LL3m

3.4

12.4

3.1

11.0

2.4

1.6

4.3

2.1

1.8

v M

(1)

0.8

0.25w0.03

2.00

1.45

OUTLINE VERSION

SOT157-2

IEC JEDEC EIAJ

REFERENCES

July 1994 13

EUROPEAN

PROJECTION

ISSUE DATE

92-10-12 95-03-11

Page 14

Philips Semiconductors Product speciﬁcation

2 x 12 W hi-ﬁ audio power ampliﬁer

SOLDERING Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in

“IC Package Databook”

our

Soldering by dipping or by wave

The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

(order code 9398 652 90011).

TDA1521

TDA1521Q

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

stg max

). If the

DEFINITIONS

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development. Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later. Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

July 1994 14

Datasheet TDA1521Q, TDA1521 Datasheet (Philips)

Specifications and Main Features

Frequently Asked Questions

User Manual

GENERAL DESCRIPTION

Features

QUICK REFERENCE DATA

Stereo applications

PACKAGE OUTLINES

PINNING

FUNCTIONAL DESCRIPTION

RATINGS

THERMAL RESISTANCE

HEATSINK DESIGN EXAMPLE

CHARACTERISTICS

PACKAGE OUTLINES

SOT131-2

SOT157-2

DEFINITIONS

LIFE SUPPORT APPLICATIONS