12 W BTL or 2 x 6 W stereo car
radio power amplifier
Product specification
File under Integrated Circuits, IC01
May 1992
Page 2
Philips SemiconductorsProduct specification
12 W BTL or 2 x 6 W stereo car radio
TDA1519B
power amplifier
GENERAL DESCRIPTION
The TDA1519B is an integrated class-B dual output amplifier in a 9-lead single in-line (SIL) plastic medium power
package. The device is primarily developed for car radio applications.
Features
• Requires very few external components for Bridge Tied
Load (BTL)
• Stereo or BTL application
• High output power
• Low offset voltage at output (important for BTL)
• Fixed gain
• Good ripple rejection
• Mute/stand-by switch
• Load dump protection
QUICK REFERENCE DATA
PARAMETERCONDITIONSSYMBOLMIN.TYP.MAX.UNIT
Supply voltage range
operatingV
non-operatingV
load dump protectedV
Repetitive peak output
currentI
Total quiescent currentI
Stand-by currentI
Switch-on currentI
Input impedance
The TDA1519B contains two identical amplifiers with differential input stages. The gain of each amplifier is fixed at
40 dB. A special feature of this device is the mute/stand-by switch which has the following features:
• Low stand-by current (< 100 µA)
• Low mute/stand-by switching current (low cost supply switch)
• Mute condition.
positive supply voltage
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
PARAMETERCONDITIONSSYMBOLMIN.MAX.UNIT
Supply voltage
operatingV
non-operatingV
P
P
−18V
−30V
load dump protectedduring 50 ms;
≥ 2.5 msV
t
r
P
−45V
AC and DC short-circuit-safe
voltageV
Reverse polarityV
PSC
PR
−18V
−6V
Energy handling capability
at outputsVP = 0 V−200mJ
Non-repetitive peak output currentI
Repetitive peak output currentI
Total power dissipationsee Fig.2P
Crystal temperatureT
Storage temperature rangeT
OSM
ORM
tot
c
stg
−4A
−2.5A
−15W
−150°C
−55+150°C
May 19924
Page 5
Philips SemiconductorsProduct specification
12 W BTL or 2 x 6 W stereo car radio
power amplifier
TDA1519B
Fig.2 Power derating curve.
DC CHARACTERISTICS
= 14.4 V; T
V
P
= 25 °C; measurements taken using Fig.3; unless otherwise specified
amb
PARAMETERCONDITIONSSYMBOLMIN.TYP.MAX.UNIT
Supply
Supply voltage rangenote 1V
Total quiescent currentI
DC output voltagenote 2V
DC output offset voltage|∆V
Mute/stand-by switch
Switch-on voltage levelV
Mute condition
Output signal in mute positionV
= 1 V (max.);
I
f = 20 Hz to 15 kHzV
DC output offset voltage|∆V
Stand-by condition
DC current in stand-by conditionI
Switch-on currentI
P
tot
O
|−−250mV
4-6
ON
V
mute
O
|−−250mV
4-6
V
sb
sb
sw
6.014.418.0V
−4080mA
−6.95−V
8.5−−V
3.3−6.4V
−−20mV
0−2V
−−100µA
−1240µA
May 19925
Page 6
Philips SemiconductorsProduct specification
12 W BTL or 2 x 6 W stereo car radio
TDA1519B
power amplifier
AC CHARACTERISTICS
=14.4 V; RL= 4 Ω; f = 1 kHz; T
V
P
PARAMETERCONDITIONSSYMBOLMIN.TYP.MAX.UNIT
Stereo application
Output powernote 3
Output power at V
= 13.2 Vnote 3
P
Total harmonic distortionP
Low frequency roll-offnote 4
High frequency roll-off−1 dBf
Closed loop voltage gainG
Supply voltage ripple rejection
ONnotes 5 and 6RR40−−dB
ONnotes 5 and 7RR45−−dB
mutenotes 5, 6 and 7RR45−−dB
stand-bynotes 5, 6 and 7RR80−−dB
Input impedance|Z
Noise output voltage (RMS value)note 8
= 25 °C; measurements taken using Fig.3; unless otherwise specified
amb
THD = 0.5%P
THD = 10%P
THD = 0.5%P
THD = 10%P
= 1 WTHD−0.1−%
o
−3 dBf
= 0 ΩV
S
= 10 kΩV
S
= 10 kΩα40−−dB
S
o
o
o
o
L
H
v
|50 6075kΩ
i
no(rms)
no(rms)
no(rms)
|−0.11dB
v
45−W
5.56.0−W
−3.5−W
−4.8−W
−45−Hz
20−−kHz
394041dB
−150−µV
−250500µV
−120−µV
May 19926
Page 7
Philips SemiconductorsProduct specification
12 W BTL or 2 x 6 W stereo car radio
TDA1519B
power amplifier
AC CHARACTERISTICS
= 14.4 V; RL= 8 Ω; f = 1 kHz; T
V
P
PARAMETERCONDITIONSSYMBOLMIN.TYP.MAX.UNIT
BTL application
Output powernote 3
Output power at V
= 13.2 Vnote 3
P
Total harmonic distortionP
Power bandwidthTHD = 0.5%;
Low frequency roll-offnote 4
High frequency roll-off−1 dBf
Closed loop voltage gainG
Supply voltage ripple rejection
ONnotes 5 and 6RR34−−dB
ONnotes 5 and 7RR48−−dB
mutenotes 5, 6 and 7RR48−−dB
stand-bynotes 5, 6 and 7RR80−−dB
Input impedance|Z
Noise output voltage
(RMS value)note 8
ONR
ONR
mutenote 9V
= 25 °C; measurements taken using Fig.4; unless otherwise specified
amb
THD = 0.5%P
THD = 10%P
THD = 0.5%P
THD = 10%P
= 1 WTHD−0.1−%
o
= −1 dB;35 to
P
o
w.r.t. 15 WB
−1 dBf
= 0 ΩV
S
= 10 kΩV
S
o
o
o
o
w
L
H
v
|253038kΩ
i
no(rms)
no(rms)
no(rms)
810−W
1112−W
−7.5−W
−10−W
−15 000−Hz
−45−Hz
20−−kHz
454647dB
−200−µV
−350700µV
−180−µV
Notes to the characteristics
1. The circuit is DC adjusted at V
= 6 V to 18 V and AC operating at VP= 8.5 V to 18 V.
P
2. At 18 V < VP< 30 V the DC output voltage ≤ VP/2.
3. Output power is measured directly at the output pins of the IC.
4. Frequency response externally fixed.
5. Ripple rejection measured at the output with a source impedance of 0 Ω (maximum ripple amplitude of 2 V).
6. Frequency f = 100 Hz.
7. Frequency between 1 kHz and 10 kHz.
8. Noise voltage measured in a bandwidth to 20 Hz to 20 kHz.
9. Noise output voltage independent of RS (VI= 0 V).
May 19927
Page 8
Philips SemiconductorsProduct specification
12 W BTL or 2 x 6 W stereo car radio
power amplifier
APPLICATION INFORMATION
TDA1519B
Fig.3 Stereo application circuit diagram.
Fig.4 BTL application circuit diagram.
May 19928
Page 9
Philips SemiconductorsProduct specification
12 W BTL or 2 x 6 W stereo car radio
power amplifier
TDA1519B
Fig.5 Total quiescent current (I
) as a function of supply voltage (VP).
tot
Fig.6 Output power (Po) as a function of supply voltage (VP) for stereo application at RL= 4 Ω, f = 1 kHz.
May 19929
Page 10
Philips SemiconductorsProduct specification
12 W BTL or 2 x 6 W stereo car radio
power amplifier
TDA1519B
Fig.7Total harmonic distortion (THD) as a function of output power (Po) for stereo application
at RL= 4 Ω, f = 1 kHz.
Fig.8Total harmonic distortion (THD) as a function of operating frequency (f) for stereo application
at RL= 4 Ω, Po= 1 W.
May 199210
Page 11
Philips SemiconductorsProduct specification
12 W BTL or 2 x 6 W stereo car radio
power amplifier
PACKAGE OUTLINE
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
D
D
1
q
P
P
1
q
2
q
1
TDA1519B
SOT110-1
A
2
A
3
pin 1 index
seating plane
19
Z
b
DIMENSIONS (mm are the original dimensions)
A
A
18.5
17.8
max.
3.7
2
A
A
3
4
8.7
15.8
8.0
15.4
UNIT
mm
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
e
2
b
0.67
0.50
b
1
2
1.40
0.48
1.14
0.38
bcD
1.40
1.14
b
b
1
0510 mm
scale
(1)
D
1
21.8
21.4
21.4
20.7
w M
(1)
E
eLPP
6.48
6.20
2.54
3.9
3.4
A
A
4
L
Q
q1q
q
Q
1
3.4
3.2
1.75
1.55
15.1
14.9
4.4
4.2
2.75
2.50
c
5.9
5.7
E
2
w
0.25
(1)
Z
max.
1.0
OUTLINE
VERSION
SOT110-1
IEC JEDEC EIAJ
REFERENCES
May 199211
EUROPEAN
PROJECTION
ISSUE DATE
92-11-17
95-02-25
Page 12
Philips SemiconductorsProduct specification
12 W BTL or 2 x 6 W stereo car radio
power amplifier
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
(order code 9398 652 90011).
TDA1519B
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
stg max
). If the
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
May 199212
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