Datasheet TDA1517P-N2, TDA1517-N3-S5, TDA1517-N3, TDA1517-N2-S5, TDA1517-N2 Datasheet (Philips)

DATA SH EET

Product specification
Supersedes data of 1995 Dec 15
File under Integrated Circuits, IC01

1998 Apr 28

INTEGRATED CIRCUITS

TDA1517; TDA1517P

2 × 6 W stereo power amplifier

1998 Apr 28 2

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

FEATURES

• Requires very few external components

• High output power

• Fixed gain

• Good ripple rejection

• Mute/standby switch

• AC and DC short-circuit safe to ground and V

P

• Thermally protected

• Reverse polarity safe

• Capability to handle high energy on outputs (VP=0V)

• No switch-on/switch-off plop

• Electrostatic discharge protection.

GENERAL DESCRIPTION

The TDA1517 is an integrated class-B dual output
amplifier in a plastic single in-line medium power package
with fin (SIL9MPF) and a plastic heat-dissipating dual
in-line package (HDIP18). The device is primarily
developed for multi-media applications.

QUICK REFERENCE DATA

ORDERING INFORMATION

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

supply voltage 6.0 14.4 18.0 V

I

ORM

repetitive peak output current −−2.5 A

I

q(tot)

total quiescent current − 40 80 mA

I

sb

standby current − 0.1 100 µA

I

sw

switch-on current −−40 µA

|Z

I

| input impedance 50 −−kΩ

P

o

output power RL=4Ω; THD = 0.5% − 5 − W

R

L

=4Ω; THD = 10% − 6 − W

SVRR supply voltage ripple rejection f

i

= 100 Hz to 10 kHz 48 −−dB

α

cs

channel separation 40 −−dB

G

v

closed loop voltage gain 19 20 21 dB

V

no(rms)

noise output voltage (RMS value) − 50 −µV

T

c

crystal temperature −−150 °C

TYPE

NUMBER

PACKAGE

NAME DESCRIPTION VERSION

TDA1517 SIL9MPF plastic single in-line medium power package with fin; 9 leads SOT110-1
TDA1517P HDIP18 plastic heat-dissipating dual in-line package; 18 leads SOT398-1

1998 Apr 28 3

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

BLOCK DIAGRAM

Fig.1 Block diagram.

handbook, full pagewidth

mute/stand-by

switch input

MLC351

output 1

15 kΩ

15 kΩ

x 1

VA

stand-by

switch

V

P

mute
switch

stand-by
reference
voltage

18 kΩ

18 kΩ

2

kΩ

60
kΩ

mute switch

C

m

power stage

4

8

mute switch

VA

VA

C

m

2

kΩ

60
kΩ

power stage

6

275

SGND

signal

ground

PGND

output 2

non-inverting

input 1

non-inverting

input 2

9

supply voltage
ripple rejection

output

3

1

TDA1517

mute
reference
voltage

input

reference

voltage

V

P

power
ground
(substrate)

1998 Apr 28 4

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

PINNING

SYMBOL PIN DESCRIPTION

−INV1 1 non-inverting input 1
SGND 2 signal ground
SVRR 3 supply voltage ripple rejection output
OUT1 4 output 1
PGND 5 power ground
OUT2 6 output 2
V

P

7 supply voltage

M/SS 8 mute/standby switch input

−INV2 9 non-inverting input 2

Fig.2 Pin configuration for SOT110-1.

dbook, halfpage

MLC352

1
2
3
4
5
6
7
8
9

P

V

OUT2

SGND

INV1

INV2

TDA1517

OUT1

M/SS

SVRR

PGND

Fig.3 Pin configuration for SOT398-1.

Pins 10to 18 should be connected to GND or floating.

dbook, halfpage

MLC353

1
2
3
4
5
6
7
8
9

18
17
16
15
14
13
12
11
10

P

V

OUT2

SGND

INV1

INV2

TDA1517P

OUT1

M/SS

SVRR

PGND

FUNCTIONAL DESCRIPTION

The TDA1517 contains two identical amplifiers with
differential input stages. The gain of each amplifier is fixed
at 20 dB. A special feature of the device is the
mute/standby switch which has the following features:

• Low standby current (<100 µA)

• Low mute/standby switching current

(low cost supply switch)

• Mute condition.

1998 Apr 28 5

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

THERMAL RESISTANCE

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

supply voltage − 18 V

V

P(sc)

AC and DC short-circuit safe voltage − 18 V

V

P(r)

reverse polarity − 6V

ERG

O

energy handling capability at outputs VP=0V − 200 mJ

I

OSM

non-repetitive peak output current − 4A

I

ORM

repetitive peak output current − 2.5 A

P

tot

total power dissipation see Fig.4 − 15 W

T

stg

storage temperature −55 +150 °C

T

amb

operating ambient temperature −40 +85 °C

T

c

crystal temperature − 150 °C

SYMBOL TYPE NUMBER PARAMETER VALUE UNIT

R

th j-c

TDA1517 thermal resistance from junction to case 8 K/W

R

th j-p

TDA1517P thermal resistance from junction to pins 15 K/W

R

th j-a

TDA1517; TDA1517P thermal resistance from junction to ambient 50 K/W

Fig.4 Power derating curve.

(1) R

th j-c

= 8 K/W.

(2) R

th j-p

= 15 K/W.

handbook, halfpage

25 0 50 150

12

0

MLC354

100

T ( C)

o

amb

P

(W)

18

6

(1)

(2)

1998 Apr 28 6

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

DC CHARACTERISTICS

V

P

= 14.4 V; T

amb

=25°C; measured in Fig.6; unless otherwise specified.

Note

1. The circuit is DC adjusted at V

P

= 6 to 18 V and AC operating at VP= 8.5 to 18 V.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

P

supply voltage note 1 6.0 14.4 18.0 V

I

q(tot)

total quiescent current − 40 80 mA

V

O

DC output voltage − 6.95 − V

Mute/standby switch

V

8

switch-on voltage level see Fig.5 8.5 −−V

Mute condition

V

O

output signal in mute position V

I(max)

=1V; fi=20Hzto15kHz −−2mV

Standby condition

I

sb

DC current in standby condition −−100 µA

V

sw

switch-on current − 12 40 µA

1998 Apr 28 7

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

AC CHARACTERISTICS

V

P

= 14.4 V; RL=4Ω; f = 1 kHz; T

amb

=25°C; measured in Fig.6; unless otherwise specified.

Notes

1. Output power is measured directly at the output pins of the IC.

2. Frequency response externally fixed.

3. Ripple rejection measured at the output with a source impedance of 0 Ω, maximum ripple amplitude of 2 V (p-p) and
a frequency between 100 Hz and 10 kHz.

4. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.

5. Noise output voltage independent of R

s

(VI= 0 V).

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

P

o

output power THD = 0.5%; note 1 4 5 − W

THD = 10%; note 1 5.5 6.0 − W

THD total harmonic distortion P

o

=1W − 0.1 − %

f

lr

low frequency roll-off at −3 dB; note 2 − 45 − Hz

f

hr

high frequency roll-off at −1dB 20 −−kHz

G

v

closed loop voltage gain 19 20 21 dB

SVRR supply voltage ripple rejection note 3

on 48 −−dB
mute 48 −−dB
standby 80 −−dB

|Z

i

| input impedance 50 60 75 kΩ

V

no

noise output voltage

on R

s

=0Ω; note 4 − 50 −µV

on R

s

=10Ω; note 4 − 70 100 µV

mute note 5 − 50 −µV

α

cs

channel separation Rs=10Ω 40 −−dB

|∆G

v

| channel unbalance − 0.1 1 dB

1998 Apr 28 8

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

Fig.5 Standby, mute and on conditions.

handbook, halfpage

8.5

0

MLC355

V

18

6.4

3.3
2

11

(V)

,,,,,

,

,,,,,

,

ON (I = 40 mA)

P

mute (I = 40 mA)

P

standby (I 100 µA)

P

APPLICATION INFORMATION

Fig.6 Application circuit diagram.

handbook, full pagewidth

MLC356

100 nF

P

V

TDA1517

87

standby switch

220 nF

input 1

1000 µF 1000 µF

input

reference

voltage

2 5

signal

ground

power

ground

1 9

220 nF

input 2

4

6

3

2200
µF

internal

1/2 V

P

100
µF

60 kΩ60 kΩ

20 dB 20 dB

1998 Apr 28 9

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

PACKAGE OUTLINES

UNIT

A

A

max.

2

A

3

b

1

D

1

b

2

bcD

(1)

E

(1)

Z

max.

(1)

eLPP

1

q1q

2

q

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

18.5

17.8

3.7

8.7

8.0

A

4

15.8

15.4

1.40

1.14

0.67

0.50

1.40

1.14

0.48

0.38

21.8

21.4

21.4

20.7

6.48

6.20

3.4

3.2

2.54

1.0

5.9

5.7

4.4

4.2

3.9

3.4

15.1

14.9

Q

1.75

1.55

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

2.75

2.50

SOT110-1

92-11-17
95-02-25

0 5 10 mm

scale

0.25

w

D

E

A

A

c

A

2

3

A

4

q

1

q

2

L

Q

w M

b

b

1

b

2

D

1

P

q

1

Z

e

19

P

seating plane

pin 1 index

SIL9MPF: plastic single in-line medium power package with fin; 9 leads

SOT110-1

1998 Apr 28 10

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

UNIT

A

max.

12

b

1

(1) (1)

(1)

b

2

cD E e M

Z

H

L

REFERENCES

OUTLINE
VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC JEDEC EIAJ

mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

SOT398-1

94-04-13
95-01-25

A

min.

A

max.

b

max.

w

M

E

e

1

1.40

1.14

0.67

0.50

0.47

0.38

21.85

21.35

6.5

6.2

3.9

3.1

0.252.54 7.62

8.32

8.02

8.7

7.7

1.04.7 0.51 3.7

inches

0.06

0.04

0.03

0.02

0.02

0.01

1.05

0.75

0.04

0.03

0.87

0.84

0.26

0.24

0.15

0.12

0.010.10 0.30

0.33

0.32

0.34

0.30

0.040.19 0.02 0.15

M

H

c

(e )

1

M

E

w M

b

1

b

2

e

A

A

1

A

2

L

seating plane

Z

D

E

18

1

10

9

b

pin 1 index

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

HDIP18: plastic heat-dissipating dual in-line package; 18 leads

SOT398-1

1998 Apr 28 11

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(order code 9398 652 90011).

Soldering by dipping or by wave

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact

with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

DEFINITIONS

LIFE SUPPORT APPLICA TIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

Internet: http://www.semiconductors.philips.com

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© Philips Electronics N.V. 1998 SCA59
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

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under patent- or other industrial or intellectual property rights.

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Printed in The Netherlands 545102/25/03/pp12 Date of release: 1998Apr 28 Document order number: 9397 750 03772