Datasheet TDA1517P, TDA1517 Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

TDA1517; TDA1517P

2 × 6 W stereo power amplifier

Product specification
Supersedes data of 1995 Dec 15
File under Integrated Circuits, IC01

1998 Apr 28

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

FEATURES

• Requires very few external components

• High output power

• Fixed gain

• Good ripple rejection

GENERAL DESCRIPTION

The TDA1517 is an integrated class-B dual output
amplifier in a plastic single in-line medium power package
with fin (SIL9MPF) and a plastic heat-dissipating dual
in-line package (HDIP18). The device is primarily
developed for multi-media applications.

• Mute/standby switch

• AC and DC short-circuit safe to ground and V

P

• Thermally protected

• Reverse polarity safe

• Capability to handle high energy on outputs (VP=0V)

• No switch-on/switch-off plop

• Electrostatic discharge protection.

QUICK REFERENCE DATA

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

V

P

I

ORM

I

q(tot)

I

sb

I

sw

|Z

| input impedance 50 −−kΩ

I

P

o

SVRR supply voltage ripple rejection f

α

cs

G

v

V

no(rms)

T

c

supply voltage 6.0 14.4 18.0 V
repetitive peak output current −−2.5 A
total quiescent current − 40 80 mA
standby current − 0.1 100 µA
switch-on current −−40 µA

output power RL=4Ω; THD = 0.5% − 5 − W

R

=4Ω; THD = 10% − 6 − W

L

= 100 Hz to 10 kHz 48 −−dB

i

channel separation 40 −−dB
closed loop voltage gain 19 20 21 dB
noise output voltage (RMS value) − 50 −µV
crystal temperature −−150 °C

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

TDA1517 SIL9MPF plastic single in-line medium power package with fin; 9 leads SOT110-1
TDA1517P HDIP18 plastic heat-dissipating dual in-line package; 18 leads SOT398-1

1998 Apr 28 2

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

BLOCK DIAGRAM

handbook, full pagewidth

non-inverting

supply voltage
ripple rejection

input 1

output

1

60
kΩ

2

kΩ

stand-by

switch

x 1

3

VA

15 kΩ

15 kΩ

mute switch

VA

18 kΩ

V

P

18 kΩ

C

mute
reference
voltage

m

4

output 1

power stage

8

mute/stand-by

switch input

stand-by
reference
voltage

mute
switch

TDA1517

2

kΩ

non-inverting

input 2

9

input

reference

voltage

60
kΩ

SGND

VA

mute switch

signal

ground
275

Fig.1 Block diagram.

1998 Apr 28 3

6

output 2

C

m

power stage

power
ground
(substrate)

MLC351

V

PGND

P

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

PINNING

SYMBOL PIN DESCRIPTION

−INV1 1 non-inverting input 1
SGND 2 signal ground
SVRR 3 supply voltage ripple rejection output
OUT1 4 output 1
PGND 5 power ground
OUT2 6 output 2
V

P

M/SS 8 mute/standby switch input

−INV2 9 non-inverting input 2

7 supply voltage

dbook, halfpage

INV1

SGND

SVRR

OUT1

PGND

OUT2

V

M/SS

INV2

1
2
3
4
5

TDA1517
6
7

P

8
9

MLC352

Fig.2 Pin configuration for SOT110-1.

FUNCTIONAL DESCRIPTION

The TDA1517 contains two identical amplifiers with
differential input stages. The gain of each amplifier is fixed
at 20 dB. A special feature of the device is the
mute/standby switch which has the following features:

• Low standby current (<100 µA)

• Low mute/standby switching current

(low cost supply switch)

• Mute condition.

dbook, halfpage

Pins 10to 18 should be connected to GND or floating.

INV1

SGND

SVRR

OUT1

PGND

OUT2

V

M/SS

INV2

1
2
3
4
5

TDA1517P
6
7

P

8
9

18
17
16
15
14
13
12
11
10

MLC353

Fig.3 Pin configuration for SOT398-1.

1998 Apr 28 4

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

P

V

P(sc)

V

P(r)

ERG

O

I

OSM

I

ORM

P

tot

T

stg

T

amb

T

c

supply voltage − 18 V
AC and DC short-circuit safe voltage − 18 V
reverse polarity − 6V
energy handling capability at outputs VP=0V − 200 mJ
non-repetitive peak output current − 4A
repetitive peak output current − 2.5 A
total power dissipation see Fig.4 − 15 W
storage temperature −55 +150 °C
operating ambient temperature −40 +85 °C
crystal temperature − 150 °C

THERMAL RESISTANCE

SYMBOL TYPE NUMBER PARAMETER VALUE UNIT

R

th j-c

R

th j-p

R

th j-a

18

handbook, halfpage

P

(W)

12

6

0

25 0 50 150

TDA1517 thermal resistance from junction to case 8 K/W
TDA1517P thermal resistance from junction to pins 15 K/W
TDA1517; TDA1517P thermal resistance from junction to ambient 50 K/W

MLC354

(1)

(2)

100

o

T ( C)

amb

(1) R
(2) R

th j-c
th j-p

= 8 K/W.
= 15 K/W.

Fig.4 Power derating curve.

1998 Apr 28 5

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

DC CHARACTERISTICS

V

= 14.4 V; T

P

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supply

V

P

I

q(tot)

V

O

Mute/standby switch

V

8

Mute condition

V

O

Standby condition

I

sb

V

sw

=25°C; measured in Fig.6; unless otherwise specified.

amb

supply voltage note 1 6.0 14.4 18.0 V
total quiescent current − 40 80 mA
DC output voltage − 6.95 − V

switch-on voltage level see Fig.5 8.5 −−V

output signal in mute position V

=1V; fi=20Hzto15kHz −−2mV

I(max)

DC current in standby condition −−100 µA
switch-on current − 12 40 µA

Note

1. The circuit is DC adjusted at V

= 6 to 18 V and AC operating at VP= 8.5 to 18 V.

P

1998 Apr 28 6

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

AC CHARACTERISTICS

V

= 14.4 V; RL=4Ω; f = 1 kHz; T

P

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

P

o

output power THD = 0.5%; note 1 4 5 − W

THD total harmonic distortion P
f

lr

f

hr

G

v

low frequency roll-off at −3 dB; note 2 − 45 − Hz
high frequency roll-off at −1dB 20 −−kHz
closed loop voltage gain 19 20 21 dB

SVRR supply voltage ripple rejection note 3

on 48 −−dB
mute 48 −−dB
standby 80 −−dB

|Z

| input impedance 50 60 75 kΩ

i

V

no

noise output voltage

on R
on R
mute note 5 − 50 −µV

α

cs

| channel unbalance − 0.1 1 dB

|∆G

v

channel separation Rs=10Ω 40 −−dB

=25°C; measured in Fig.6; unless otherwise specified.

amb

THD = 10%; note 1 5.5 6.0 − W

=1W − 0.1 − %

o

=0Ω; note 4 − 50 −µV

s

=10Ω; note 4 − 70 100 µV

s

Notes

1. Output power is measured directly at the output pins of the IC.

2. Frequency response externally fixed.

3. Ripple rejection measured at the output with a source impedance of 0 Ω, maximum ripple amplitude of 2 V (p-p) and
a frequency between 100 Hz and 10 kHz.

4. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz.

5. Noise output voltage independent of R

(VI= 0 V).

s

1998 Apr 28 7

Philips Semiconductors Product specification

,

,

2 × 6 W stereo power amplifier TDA1517; TDA1517P

handbook, halfpage

18

V

11

(V)

,,,,,

ON (I = 40 mA)

P

,,,,,

8.5

6.4
mute (I = 40 mA)

P

3.3

2

standby (I 100 µA)

0

Fig.5 Standby, mute and on conditions.

APPLICATION INFORMATION

MLC355

P

handbook, full pagewidth

input 1

220 nF

standby switch

100

input

reference

voltage

internal

1/2 V

µF

3

87

P

100 nF

TDA1517

1 9

20 dB 20 dB

6

signal

ground

2 5

power

ground

4

1000 µF 1000 µF

60 kΩ60 kΩ

MLC356

Fig.6 Application circuit diagram.

220 nF

2200
µF

input 2

V

P

1998 Apr 28 8

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

PACKAGE OUTLINES

SIL9MPF: plastic single in-line medium power package with fin; 9 leads

D

D

1

q

P

pin 1 index

P

1

q

2

q

1

SOT110-1

A

2

A

3

A

A

4

E

seating plane

19

Z

b

e

2

b

b

1

0 5 10 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT

mm

A

18.5

17.8

max.

3.7

2

A

8.7

8.0

A

3

4

15.8

15.4

b

0.67

0.50

b

1

2

1.40

1.14

bcD

1.40

1.14

0.48

0.38

21.8

21.4

(1)

D

1

21.4

20.7

A

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE

VERSION

IEC JEDEC EIAJ

REFERENCES

SOT110-1

w M

(1)

E

eLPP

6.48

6.20

2.54

3.9

3.4

L

c

Q

(1)

w

0.25

Z

max.

1.0

2.75

2.50

1

3.4

3.2

q

Q

1.75

15.1

1.55

14.9

EUROPEAN

PROJECTION

q1q

2

5.9

4.4

5.7

4.2

ISSUE DATE

92-11-17
95-02-25

1998 Apr 28 9

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

HDIP18: plastic heat-dissipating dual in-line package; 18 leads

D

seating plane

L

Z

18

pin 1 index

e

b

SOT398-1

M

E

A

2

A

A

1

b

w M

1

b

2

10

E

c

(e )

1

M

H

1

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

A

A

A

UNIT

mm

inches

max.

12

min.

max.

b

1.40

1.14

0.06

0.04

b

1

0.67

0.50

0.03

0.02

b

1.05

0.75

0.04

0.03

cD E e M

2

0.47

21.85

0.38

21.35

0.02

0.87

0.01

0.84

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE
VERSION

IEC JEDEC EIAJ

REFERENCES

SOT398-1

1998 Apr 28 10

9

(1) (1)

6.5

6.2

0.26

0.24

L

3.9

3.1

0.15

0.12

M

8.32

8.02

0.33

0.32

E

0.34

0.30

e

1

EUROPEAN

PROJECTION

H

8.7

7.7

w

max.

0.252.54 7.62

0.010.10 0.30

0.040.19 0.02 0.15

ISSUE DATE

1.04.7 0.51 3.7

(1)

Z

94-04-13
95-01-25

Philips Semiconductors Product specification

2 × 6 W stereo power amplifier TDA1517; TDA1517P

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(order code 9398 652 90011).

Soldering by dipping or by wave

The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

stg max

). If the

LIFE SUPPORT APPLICA TIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1998 Apr 28 11

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© Philips Electronics N.V. 1998 SCA59
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Printed in The Netherlands 545102/25/03/pp12 Date of release: 1998Apr 28 Document order number: 9397 750 03772