The SuperME SH™ series is obtained through an
extreme optimization of ST’s we ll established stripbased PowerMESH™ layout. In addition to pushing
on-resistance significantly down, special careis taken to ensure a very good dv/dt capability for the
most demanding applications. Such series complements S T full range of high voltage MOSFETs including revolutionary MDm es h™ products.
TO-220
1
3
2
TO-220FP
TO-247
INTERNAL SCHEMATIC DIAGRAM
3
2
1
APPLICATIONS
■ HIGH CURRENT, HIGH SPEED SWITCHING
■ SWITCH MODE POWER SUPPLIES
■ DC-AC CONVERTERS FOR WELDING, UPS
AND MOTOR DRIVE
ORDERING INFORMATION
SALES TYPEMARKINGPACKAGEPACKAGING
STP10NK80ZP10NK80ZTO-220TUBE
STP10NK80ZFPP10NK80ZFPTO-220FPTUBE
STW10NK80ZW10NK80ZTO-247TUBE
1/11February 2003
Page 2
STP10NK80Z - STP10NK80ZF P - STW10NK80Z
ABSOLUTE MAXIMUM RATINGS
SymbolParameterValueUnit
STP10NK80ZSTP10NK80ZFP STW10NK80Z
V
DS
V
DGR
V
GS
I
D
I
D
IDM()
P
TOT
V
ESD(G-S)
dv/dt (1)Peak Diode Recovery voltage slope4.5V/ns
V
ISO
T
j
T
stg
() Pulse width limited by safe operating area
(1) I
≤9A, di/dt ≤200A/µs, VDD≤ V
SD
(*) Limited only by maximum temperature allowed
Drain-source Voltage (VGS=0)
Drain-gate Voltage (RGS=20kΩ)
800V
800V
Gate- source Voltage± 30V
Drain Current (continuous) at TC= 25°C
Drain Current (continuous) at TC= 100°C
99 (*)9A
66 (*)6A
Drain Current (pulsed)3636 (*)36A
Total Dissipation at TC= 25°C
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
E
AS
Single Pulse Avalanche Energy
(starting T
max)
j
= 25 °C, ID=IAR,VDD=50V)
j
9A
290mJ
GATE-SOURCE ZENER DIODE
SymbolParameterTest ConditionsMin.Typ.Max.Unit
BV
GSO
Gate-Source Breakdown
Igs=± 1mA (Open Drain)30V
Voltage
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s
ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be
applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and
cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the
usage of external components.
2/11
Page 3
STP10NK80Z - STP10NK 80ZFP - STW10NK80Z
ELECTRICAL CHARACTERISTICS (TCASE =25°C UNLESS OT HERWISE SPECIFIED)
ON/OFF
SymbolParameterTest ConditionsMin.Typ.Max.Unit
V
(BR)DSS
Drain-source
Breakdown Voltage
I
DSS
I
GSS
V
GS(th)
R
DS(on)
Zero Gate Voltage
Drain Current (V
GS
=0)
Gate-body Leakage
Current (V
DS
=0)
Gate Threshold Voltage
Static Drain-source On
Resistance
DYNAMIC
SymbolParameterTest ConditionsMin.Typ.Max.Unit
(1)Forward TransconductanceVDS=15V,ID= 4.5 A9.6S
g
fs
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
(3)Equivalent Output
C
oss eq.
C
iss
C
oss
C
rss
Capacitance
SWITCHING ON
SymbolParameterTest ConditionsMin.Typ.Max.Unit
t
d(on)
Q
Q
Q
t
r
g
gs
gd
Turn-on Delay Time
Rise Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the
consequences of u se of such inf ormat ion nor for any in fring ement of p aten ts or othe r ri ghts of th ird p arties whic h may resul t f rom
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or
systems without express written approval of STMicroelectronics.
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