Datasheet STP11NM80, STB11NM80 Datasheet (SGS Thomson Microelectronics)

Page 1
STP11NM80 - STB11NM80
STF11NM80 - STW11NM80
N-CHANNEL 800V - 0.35- 11A TO-220/FP/D2PAK/TO-247
TARGET DATA
TYPE V
STP11NM80 STF11NM80 STB11NM80 STW11NM80
TYPICAL RDS(on) = 0.35
LOW GATE INPUT RESISTANCE
LOW INPUT CAPACITANCE AND GATE
800 V 800 V 800 V 800 V
DSS
R
DS(on)Rds(on)*Qg
< 0.40 < 0.40 < 0.40 < 0.40
14 *nC 14 *nC 14 *nC 14 *nC
I
D
11 A 11 A 11 A 11 A
CHARGE
BEST R
* Qg IN THE INDUSTRY
ds(on)
DESCRIPTION
The MDmesh™ is a new revolutionary MOSFET technology that associates the Multiple Drain pro­cess with the Company’s PowerMESH™ horizontal layout. The resulting product has an outstanding low on-resistance, impressively high dv/dt and excellent avalanche characteristics. The adoption of the Company’s proprietary strip technique yields overall dynamic performance that is significantly better than that of similar competition’s products.
3
2
1
D2PAK
TO-220
3
2
1
TO-220FP
TO-247
INTERNAL SCHE MATIC DIAGRAM
3
1
3
2
1
APPLICATIONS
The 800 V MDmes h™ family is very su itable for sin­gle switch applications in particular for Flyback and Forward converter topologies.
ORDERING INFORMATION
SALES TYPE MARKING PACKAGE PACKAGING
STP11NM80 P11NM80 TO-220 TUBE STF11NM80 F11NM80 TO-220FP TUBE
STB11NM80T4 B11NM80
STW11NM80 W11NM80 TO-247 TUBE
June 2003
2
PAK
D
TAPE & REEL
1/10
Page 2
STP11NM80 - ST B 11NM 80 - S TF11NM 80 - STW11NM 80
ABSOLUTE M AXIMUM RATINGS
Symbol Parameter Value Unit
TO-220/D
Drain-source Voltage (VGS=0) Drain-gate Voltage (RGS=20kΩ) Gate- source Voltage ± 30 V Drain Current (continuous) at TC= 25°C Drain Current (continuous) at TC= 100°C
()
Drain Current (pulsed) 44 44 (*) A Total Dissipation at TC= 25°C
I
V
DM
P
V
DGR
V
I I
TOT
DS
GS
D D
Derating Factor 1.2 0.28 W/°C
dv/dt(1) Peak Diode Recovery voltage slope 15 V/ns
T
stg
T
j
Storage Temperature Max. Operating Junction Temperature
()Pulse width limited by safe operating area
<11A, di/dt<400A/µs, VDD<V
(1)I
SD
(*) Limited only by the Maximum Temperature Allowed
(BR)DSS,TJ<TJMAX
2
PAK
TO-247
TO-220FP
800 V 800 V
11 11 (*) A
4.7 4.7 (*) A
150 35 W
–65 to 150 °C
THERMAL DATA
2
TO-247
PAK
TO-220FP
TO-220/D
Rthj-case Thermal Resistance Junction-case Max 0.83 3.6 °C/W Rthj-amb Thermal Resistance Junction-ambient Max 62.5 °C/W
T
l
Maximum Lead Temperature For Soldering Purpose 300 °C
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
I
AR
E
AS
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
max)
j
Single Pulse Avalanche Energy (starting T
= 25 °C, ID= 2.5A, VDD=50V)
j
ELECTRICAL CHARACT ERISTICS (T
= 25 °C UNLESS OTHERWISE SPECIFIED)
CASE
TBD A
TBD mJ
ON/OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
I
DSS
I
GSS
V
GS(th)
R
DS(on)
Drain-source Breakdown Voltage
Zero Gate Voltage Drain Current (V
GS
Gate-body Leakage Current (V
DS
=0) Gate Threshold Voltage Static Drain-source On
Resistance
ID= 250 µA, VGS= 0 800 V
V
= Max Rating
DS
=0)
VDS= Max Rating, TC=125°C V
= ±30V 100 nA
GS
V
DS=VGS,ID
= 250 µA 3
4
VGS=10V,ID= 5.5 A 0.35 0.40
10 µA
100 µA
5V
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Page 3
STP11NM80 - STB11NM80 - STF11NM80 - STW11NM80
ELECTRICAL CHARACT ERISTICS (CO NTINUED)
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(1) Forward Transconductance VDS>I
g
fs
D(on)xRDS(on)max,
ID= 7.5 A
V
C
iss
C
oss
C
rss
Input Capacitance Output Capacitance 1000 pF Reverse Transfer
=30V,f=1MHz,VGS=0
DS
Capacitance
R
G
Gate Input Resistance f=1 MHz Gate DC Bias = 0
Test Signal Level = 20mV Open Drain
(1)Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
t
d(on)
Q Q Q
Turn-on Delay Time
t
r
g gs gd
Rise Time 14 ns Total Gate Charge
Gate-Source Charge 10 nC Gate-Drain Charge 24 nC
=400V,ID= 5.5 A
DD
R
= 4.7 ,VGS= 10V
G
(see test circuit, Figure 3) V
=400V,ID=11A,
DD
VGS=10V
5S
1900 pF
18 pF
2
27 ns
40 58 nC
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
t
r(Voff)
t
f
t
c
Off-voltage Rise Time Fall Time 11 ns Cross-over Time 21 ns
= 640 V, ID= 11A,
DD
=4.7Ω , VGS=10V
R
G
(see test circuit, Figure 5)
6ns
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
VSD(1)
t
rr
Q
rr
I
RRM
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
Source-drain Current 11 A
(2)
Source-drain Current (pulsed) 44 A Forward On Voltage Reverse Recovery Time Reverse Recovery Charge 6.5 µC
ISD=11A,VGS=0 I
= 11 A, di/dt = 100A/µs,
SD
VDD=100V,Tj=150°C (see test circuit, Figure 5)
496 ns
Reverse Recovery Current 26 A
1.5 V
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Page 4
STP11NM80 - ST B 11NM 80 - S TF11NM 80 - STW11NM 80
Fig. 2: Unclamped Inductive WaveformFig. 1: Unclamped Inductive Load Test Circuit
Fig. 3: Switching Times Test Circuit For
Resistive Load
Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times
Fig. 4: Gate Charge test Circuit
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Page 5
STP11NM80 - STB11NM80 - STF11NM80 - STW11NM80
TO-220 MECHANICAL DATA
DIM.
A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034
b1 1.15 1.70 0.045 0.066
c 0.49 0.70 0.019 0.027 D 15.25 15.75 0.60 0.620 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.194 0.202
F 1.23 1.32 0.048 0.052 H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107
L 13 14 0.511 0.551 L1 3.50 3.93 0.137 0.154
L20 16.40 0.645 L30 28.90 1.137
øP 3.75 3.85 0.147 0.151
Q 2.65 2.95 0.104 0.116
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
5/10
Page 6
STP11NM80 - ST B 11NM 80 - S TF11NM 80 - STW11NM 80
TO-220FP MECHANICAL DATA
DIM.
A 4.4 4.6 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108 E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039 F1 1.15 1.7 0.045 0.067 F2 1.15 1.7 0.045 0.067
G 4.95 5.2 0.195 0.204 G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 .0385 0.417 L5 2.9 3.6 0.114 0.141 L6 15.9 16.4 0.626 0.645 L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
E
A
D
B
6/10
L3
L6
L7
F1
F
G1
H
F2
123
L4
L2
L5
G
Page 7
STP11NM80 - STB11NM80 - STF11NM80 - STW11NM80
D2PAK MECHANICAL DATA
DIM.
MIN. TYP MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009
B 0.7 0.93 0.027 0.036 B2 1.14 1.7 0.044 0.067
C 0.45 0.6 0.017 0.023 C2 1.23 1.36 0.048 0.053
D 8.95 9.35 0.352 0.368 D1 8 0.315
E 10 10.4 0.393 E1 8.5 0.334
G 4.88 5.28 0.192 0.208
L 15 15.85 0.590 0.625 L2 1.27 1.4 0.050 0.055 L3 1.4 1.75 0.055 0.068
mm. inch
M 2.4 3.2 0.094 0.126
R 0.4 0.015 V2
3
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1
Page 8
STP11NM80 - ST B 11NM 80 - S TF11NM 80 - STW11NM 80
TO-247 MECHANICAL DATA
DIM.
A 4.85 5.15 0.19 0.20
A1 2.20 2.60 0.086 0.102
b 1.0 1.40 0.039 0.055 b1 2.0 2.40 0.079 0.094 b2 3.0 3.40 0.118 0.134
c 0.40 0.80 0.015 0.03 D 19.85 20.15 0.781 0.793 E 15.45 15.75 0.608 0.620 e5.45 0.214 L 14.20 14.80 0.560 0.582
L1 3.70 4.30 0.14 0.17 L2 18.50 0.728 øP 3.55 3.65 0.140 0.143 øR 4.50 5.50 0.177 0.216
S5.50 0.216
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
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Page 9
STP11NM80 - STB11NM80 - STF11NM80 - STW11NM80
D2PAK FOOTPRINT
TAPE AND REEL SHIPMENT (suffix ”T4”)*
TUBE SHIPMENT (no suffix)*
REEL MECHANICAL DATA
DIM.
A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0795 G 24.4 26.4 0.960 1.039 N 100 3.937 T 30.4 1.197
mm inch
MIN. MAX. MIN. MAX.
TAPE MECHANICAL DATA
DIM.
A0 10. 5 10.7 0.413 0.421 B0 15.7 15 .9 0.618 0.626
D 1.5 1.6 0.059 0.063
D1 1.59 1.61 0. 062 0.063
E 1.65 1.85 0.065 0.073
F 11.4 11.6 0.449 0.456 K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082
R 50 1.574
T 0.25 0.35 0.0098 0.0137
W 23.7 24.3 0.933 0.956
* on sal es type
mm inch
MIN. MAX. MIN. MAX.
BASE QTY BULK QTY
1000 1000
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STP11NM80 - ST B 11NM 80 - S TF11NM 80 - STW11NM 80
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of u se of such inf ormat ion nor for any in fring ement of p aten ts or othe r ri ghts of th ird p arties whic h may resul t f rom its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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