Page 1
STGP14NC60KD - STGF14NC60KD
STGB14NC60KD
N-CHANNEL 14A - 600V - TO-220/TO-220FP/D2PAK
SHORT CIRCUIT RATED PowerMESH™ IGBT
Table 1: General Feature s
TYPE V
STGB14NC60KD
STGF14NC60KD
STGP14NC60KD
■ LOWER ON-VOLTAGE DROP (V
■ OFF LOSSES INCLUDE TAIL CURRENT
■ LOWER C
■ SWITCHING LOSSES INCLUDE DIODE
RES
CESVCE(sat)
600 V
600 V
600 V
/ C
RATIO
IES
@25°C
< 2.5 V
< 2.5 V
< 2.5 V
(Max)
cesat
IC (#)
@100°C
14 A
7 A
14 A
)
RECOVERY ENERGY
■ VERY SOFT U LTRA F AST REC OVER Y
ANTIPARALLEL DIODE
■ NEW GENERATION PRODUCTS WITH
TIGHTER PARAMETER DISTRUBUTION
DESCRIPTION
Using the latest high voltage technology bas ed on
a patented strip layout, STMicroelectronics has
design ed an adva nced fam ily of IGBT s, the P ow
erMESH™ IGBTs, with outstanding performances.
The suffix “K” identifies a family optimized for high
freque ncy mot or cont rol appl icat ions wi th shor t cir
cuit withstand capability.
APPLICATIONS
■ HIGH FREQUENCY INVERTERS
■ SMPS and PFC IN BOTH HARD SWITCH AND
RESONANT TOPOLOGIES
■ MOTOR DRIVERS
Figure 1: Package
2
TO-220
2
PAK
D
Figure 2: Internal Schematic Diagram
-
-
2
TO-220FP
1
Table 2: Order Codes
SALES TYPE MARKING PACKAGE PACKAGING
STGB14NC60KDT4 GB14NC60KD
STGF14NC60KD GF14NC60KD TO-220FP TUBE
STGP14NC60KD GP14NC60KD TO-220 TUBE
D2PAK
TAPE & REEL
Rev.2
1/14 July 2005
Page 2
STGP14NC60KD - STGF14NC60KD - STGB14NC60KD
Table 3: Abso lute Ma ximu m ratings
Symbol Parameter Value Unit
STGB14NC60KD
STGP14NC60KD
V
Collector-Emitter Voltage (VGS = 0)
CES
V
Emitter-Collector Voltage 20 V
ECR
V
Gate-Emitter Voltage ±20 V
GE
I
Collector Current (continuous) at TC = 25°C (#)
C
I
Collector Current (continuous) at TC = 100°C (#)
C
I
( )
Collector Current (pulsed) 50 A
CM
I
Diode RMS Forward Current at TC = 25°C
F
P
Total Dissipation at TC = 25°C
TOT
25 11 A
14 7 A
80 25 W
Derating Factor 0.64 0.20 W/°C
V
Insulation Withstand Voltage A.C.(t = 1 sec; Tc = 25°C) -- 2500 V
ISO
T
Storage Temperature
stg
T
Operating Junction Temperature
j
( ) Pulse width limited by Max Junction Temperature.
Table 4: Thermal Data
Min. Typ. Max.
Rthj-case Thermal Resistance Junction-case TO-220
D²PAK
TO-220FP 5.0 °C/W
Rthj-amb Thermal Resistance Junction-ambient 62.5 °C/W
T
Maximum Lead Temperature for Soldering
L
Purpose (1.6 mm from case, for 10 sec.)
STGF14NC60KD
600 V
20 A
– 55 to 150 °C
1.56 °C/W
300 °C
ELECTRICAL CHARACTERISTICS (T
=25°C UNLESS OTHERWISE SPECIFIED)
CASE
Table 5: Main Parameters
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
BR(CES)
V
V
(#) Calculated according to the iterative formula:
ICTC()
2/14
Collector-Emitter
Breakdown Voltage
I
Collector cut-off Current
CES
(VGE = 0)
I
Gate-Emitter Leakage
GES
Current (VCE = 0)
Gate Threshold Voltage
GE(th)
Collector-Emitter Saturation
CE(sat)
Voltage
T
--------------------------------------------------------------------------------------------------
=
R
THJ C–VCESAT MAX ()TCIC
JMAXTC
IC= 1 mA, VGE= 0 600 V
VCE= Max Rating, TC= 25°C
VCE= Max Rating, TC= 125°C
10
1
VGE= ±20V , VCE= 0 ±100 nA
VCE= VGE, IC= 250 µA
VGE= 15V, IC= 7A
VGE= 15V, IC= 7A, Tc= 125°C
–
, ()×
5 7 V
2.0
1.8
2.5 V
µA
mA
V
Page 3
STGP14NC60KD - STGF14NC60KD - STGB14NC60KD
ELECTRICAL CHARACTERISTICS (CONTINUED)
Table 6: Dynamic
Symbol Parameter Test Conditions Min. Typ. Max. Unit
gfs (1)
C
C
C
Q
Q
t
Forward Transconductance
Input Capacitance
ies
Output Capacitance 86 pF
oes
Reverse Transfer
res
Capacitance
Q
Total Gate Charge
g
Gate-Emitter Charge
ge
Gate-Collector Charge
gc
Short Circuit Withstand Time VCE = 0.5 V
scw
Table 7: Switching On
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
(di/dt)
t
d(on)
(di/dt)
Turn-on Delay Time
Current Rise Time
t
r
Turn-on Current Slope
on
Turn-on Delay Time
Current Rise Time
t
r
Turn-on Current Slope
on
Table 8: Switching Off
Symbol Parameter Test Conditions Min. Typ. Max. Unit
tr(V
)
Off Voltage Rise Time
off
td(
tr(V
td(
Turn-off Delay Time
)
off
Current Fall Time
t
f
)
Off Voltage Rise Time
off
Turn-off Delay Time
)
off
Current Fall Time
t
f
VCE = 15 V , IC = 7 A 3 S
VCE = 25 V, f= 1 MHz, VGE = 0
760 pF
15.5 pF
VCE = 390 V, IC = 7 A,
VGE = 15 V
(see Figure 21)
RG = 10 Ω, V GE = 12 V
BR(CES),Tj
= 125°C,
VCC = 390 V, IC = 7 A
RG= 10 Ω , VGE= 15V, Tj= 25°C
(see Figure 19)
VCC = 390 V, IC = 7 A
RG= 10 Ω , VGE= 15V, Tj= 125°C
(see Figure 19)
Vcc = 390 V, IC = 7 A,
RGE = 10 Ω , V GE = 15 V
TJ = 25 °C
34.4
8.1
16.4
10 µs
22.5
8.5
700
22
9.5
680
60
116
75
(see Figure 19)
Vcc = 390 V, IC = 7 A,
RGE = 10 Ω , V GE = 15 V
Tj = 125 °C
(see Figure 19)
24
196
144
nC
nC
nC
ns
ns
A/µs
ns
ns
A/µs
ns
ns
ns
ns
ns
ns
Table 9: Switching Energy
Symbol Parameter Test Conditions Min. Typ. Max. Unit
Eon (2)
E
off
E
Eon (2)
E
off
E
(1) Pulsed: Pulse duration = 300 µs, duty cycle 1.5%
(2) Eon is the turn-on l osses when a typical di ode i s used i n the test ci rcuit in fi gure 2. If the IG BT is o ffered in a pac kage with a co -pack diode ,
the co-pack diode is used as external diode. IGBTs & DIODE are at the same temperature (25°C and 125°C)
(3)Turn-off losses include also the tail of the collector current.
Turn-on Switching Losses
Turn-off Switching Losses
(3)
Total Switching Losses
ts
Turn-on Switching Losses
Turn-off Switching Losses
(3)
Total Switching Losses
ts
VCC = 390 V, IC = 7 A
RG= 10 Ω , VGE= 15V, Tj= 25°C
(see Figure 19)
VCC = 390 V, IC = 7 A
RG= 10 Ω , VGE= 15V, Tj= 125°C
(see Figure 19)
82
155
237
131
370
501
µJ
µJ
µJ
µJ
µJ
µJ
3/14
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STGP14NC60KD - STGF14NC60KD - STGB14NC60KD
Table 10: Collector-Emitter Diode
Symbol Parameter Test Condiction Min. Typ. Max. Unit
V
Forward O n-Voltage If = 3.5 A
f
If = 3.5 A, Tj = 125 °C
t
Reverse Recovery Time
rr
t
a
Q
I
Q
I
Reverse Recovery Charge
rr
Reverse Recovery Current
rrm
Softness factor of the diode
S
t
Reverse Recovery Time
rr
t
a
Reverse Recovery Charge
rr
Reverse Recovery Current
rrm
Softness factor of the diode
S
If = 7 A, VR = 40 V,
Tj = 25 °C, di/dt = 100 A/µs
0.68
If = 7 A, VR = 40 V,
Tj = 125 °C, di/dt = 100 A/µs
0.79
1.3
1.1
37
22
40
2.1
61
34
98
3.2
1.9
V
V
ns
ns
nC
A
ns
ns
nC
A
4/14
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STGP14NC60KD - STGF14NC60KD - STGB14NC60KD
Figure 3: Output Characteristics
Figure 4: Transconductance
Figure 6: Transf er Characterist ics
Figure 7: Collector-Emitter On Voltage vs Temperature
Figure 5: Collector-Emitter On Voltage vs Collector Current
Figure 8 : Nor malize d G ate T hresh old v s Te mperature
5/14
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STGP14NC60KD - STGF14NC60KD - STGB14NC60KD
Figure 9: Normalized Breakdown Voltage vs
Temperature
Figure 10: Capacitance Variations
Figure 12: Gate Charge vs Gate-Emitte r Voltage
Figure 13: Tot al Switchin g Losse s vs Temperature
Figure 11: Total Switching Losses vs Gate Resistance
6/14
Figure 14: Total Switching Losses vs Collector
Current
Page 7
STGP14NC60KD - STGF14NC60KD - STGB14NC60KD
Figure 15: Thermal Impedance For TO-220/
D²PAK
Figure 16: Thermal Impedance For TO-220FP
Figure 17: Turn-Off SOA
Figure 18: Emitter-Collector Diode
Characteristics
7/14
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STGP14NC60KD - STGF14NC60KD - STGB14NC60KD
Figure 19: Test Circuit for Inductive Load
Switching
Figure 20: Switching Waveforms
Figure 21: Gate Charge Test Circuit
Figure 22: Diode Recovery Times Waveform
8/14
Page 9
STGP14NC60KD - STGF14NC60KD - STGB14NC60KD
D2PAK MECHANICAL DATA
TO -24 7 M E CHA NICAL DATA
DIM.
A 4.4 4.6 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.7 0.93 0.027 0.036
B2 1.14 1.7 0.044 0.067
C 0.45 0.6 0.017 0.023
C2 1.23 1.36 0.048 0.053
D 8.95 9.35 0.352 0.368
D1 8 0.315
E 10 10.4 0.393
E1 8.5 0.334
G 4.88 5.28 0.192 0.208
L 15 15.85 0.590 0.625
L2 1.27 1.4 0.050 0.055
L3 1.4 1.75 0.055 0.068
M 2.4 3.2 0.094 0.126
R0 . 4 0 . 0 1 5
V2 0º 4º
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
3
1
9/14
Page 10
STGP14NC60KD - STGF14NC60KD - STGB14NC60KD
TO-220FP MECHANICAL DATA
DIM.
A 4.4 4.6 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039
F1 1.15 1.7 0.045 0.067
F2 1.15 1.7 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 0.630
L3 28.6 30.6 1.126 1.204
L4 9.8 10.6 .0385 0.417
L5 2.9 3.6 0.114 0.141
L6 15.9 16.4 0.626 0.645
L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
E
A
D
B
L3
L6
L7
F1
F
10/14
G1
H
F2
123
L4
L2
L5
G
Page 11
STGP14NC60KD - STGF14NC60KD - STGB14NC60KD
TO-220 MECHANICAL DATA
DIM.
A 4.40 4.60 0.173 0.181
b 0.61 0.88 0.024 0.034
b1 1.15 1.70 0.045 0.066
c 0.49 0.70 0.019 0.027
D 15.25 15.75 0.60 0.620
E 10 10.40 0.393 0.409
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.194 0.202
F 1.23 1.32 0.048 0.052
H1 6.20 6.60 0.244 0.256
J1 2.40 2.72 0.094 0.107
L 13 14 0.511 0.551
L1 3.50 3.93 0.137 0.154
L20 16.40 0.645
L30 28.90 1.137
øP
Q 2.65 2.95 0.104 0.116
MIN. TYP M AX. MIN. TYP. MAX.
3.75 3.85 0.147 0.151
mm. inch
11/14
Page 12
STGP14NC60KD - STGF14NC60KD - STGB14NC60KD
D2PAK FOOTPRINT
TAPE AND REEL SHIPMENT
TAPE MECHANICAL DAT A
DIM.
A0 10.5 10.7 0.413 0.421
B0 15.7 15.9 0.618 0.626
D 1.5 1.6 0.059 0.063
D1 1.59 1.61 0.062 0.063
E 1.65 1.85 0.065 0.073
F 11.4 11.6 0.449 0. 456
K0 4.8 5.0 0.189 0.197
P0 3.9 4.1 0.153 0.161
P1 11.9 12.1 0.468 0.476
P2 1.9 2.1 0.075 0.082
R 50 1.574
T 0.25 0.35 0.0098 0.0137
W 23.7 24.3 0.933 0.956
* on sales type
mm inch
MIN. MAX. MIN. MAX.
REEL MECHANICAL DATA
DIM.
A 330 12.992
B 1.5 0.059
C 12.8 13.2 0. 504 0.520
D 20.2 0795
G 24.4 26.4 0.960 1.039
N 100 3.937
T 30.4 1.197
mm inch
MIN. MAX. MIN. MAX.
BASE QTY BULK QTY
1000 1000
12/14
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STGP14NC60KD - STGF14NC60KD - STGB14NC60KD
Table 11: Revisi on His t ory
Date Revision Description of Changes
14-Jun-2005 1 New release
22-Jul-2005 2 Complete version
13/14
Page 14
STGP14NC60KD - STGF14NC60KD - STGB14NC60KD
nformation furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequence
f use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is grante
y implicatio n or ot h er wis e under an y pat e nt or pa te nt r igh ts of STMi c r oel ec tro ni c s. Sp ec i fi ca ti on s me nti o ne d in th is p ub li c ati on ar e s ub jec
o change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are no
uthorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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