Derat ing Factor0.33W/
St or a ge Tem perature-65 to 175
stg
Max. Operating Junctio n Temperatur e175
T
j
o
o
o
C
C
C
1/10
Page 2
STD15N06
THERMAL DATA
R
thj-case
R
thj-amb
R
thc-sink
T
AVALANCHE CHARACTERISTICS
SymbolParameterMax ValueUni t
I
AR
E
E
I
AR
Thermal Resistance Junction - cas eMax
Thermal Resistance Junction- ambientMax
Thermal Resistance Case-sinkTyp
Maximum Lead T emperature For Soldering Purp ose
l
Avalanc h e Cu rr ent , Repet itive or Not-R epetitive
(pulse width limited by Tjmax, δ <1%)
Single Pul se Avalanche Ener gy
AS
(starti ng Tj=25oC, ID=IAR,VDD=25V)
Repetitive Avalanc he Energ y
AR
(pulse width limited by Tjmax, δ <1%)
Avalanc h e Cu rr ent , Repet itive or Not-R epetitive
(Tc= 100oC, puls e width limited by Tjmax, δ <1%)
3
100
1.5
275
15A
50mJ
12mJ
10A
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS (T
=25oC unless otherwise specified)
case
OFF
SymbolParameterTest Co ndition sMin.Typ.Max.Unit
V
(BR)DSS
Drain - s ource
ID=250µAVGS=060V
Break d own Volta ge
I
DSS
I
GSS
Zer o Gate Voltage
Drain Current (V
GS
Gat e- body Leakage
=0)
=MaxRating
V
DS
V
= Max R ating x 0.8 Tc=125oC
DS
250
1000µAµA
VGS= ± 20 V± 100nA
Current (VDS=0)
ON (∗)
SymbolParameterTest Co ndition sMin.Typ.Max.Unit
V
GS(th)
R
DS(on)
I
D(on)
Gate Threshold Voltage VDS=VGSID=250µA234V
St at ic Drain-s our ce O n
Resistance
On St ate Dra in Current VDS>I
VGS=10V ID=7.5A
VGS=10V ID=7.5A Tc= 100oC
D(on)xRDS(on)max
0.0750.1
0.2
15A
VGS=10V
DYNAMIC
SymbolParameterTest Co ndition sMin.Typ.Max.Unit
(∗)Forward
g
fs
Tr ansconductance
C
C
C
Input Capacitance
iss
Out put Capacitance
oss
Reverse Transfer
rss
Capacitance
VDS>I
D(on)xRDS(on)maxID
=7.5A35S
VDS=25V f=1MHz VGS=0550
230
80
700
290
100
Ω
Ω
pF
pF
pF
2/10
Page 3
STD15N06
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
SymbolParameterTest Co ndition sMin.Typ.Max.Unit
t
d(on)
(di/dt)
Q
Q
Q
Turn-on Time
t
Rise Time
r
Turn-on C urrent SlopeVDD=40V ID=15A
on
Total Gate Charge
g
Gat e- Source Charge
gs
Gate-Drain Charge
gd
SWITCHING OFF
SymbolParameterTest Co ndition sMin.Typ.Max.Unit
t
r(Voff)
t
Off -voltage R ise Time
t
Fall Time
f
Cross-over Time
c
SOURCE DRAIN DIODE
VDD=30V ID=7.5A
RG=47 ΩVGS=10V
40
17060250
(see te st circ uit figure)
170A/µs
RG=47 ΩVGS=10V
(see te st circ uit figure)
VDD=48V ID=15A VGS=10V23
10
8
VDD=48V ID=15A
RGS=47 Ω VGS=10V
(see te st circ uit figure)
50
70
130
34nC
70
100
170
ns
ns
nC
nC
ns
ns
ns
SymbolParameterTest Co ndition sMin.Typ.Max.Unit
I
I
SDM
SD
Source-drain Current
(•)
Source-drain Current
15
60
(pulsed)
V
(∗)For w ar d On Volt ageISD=15A VGS=01.5V
SD
t
Reverse Recovery
rr
Time
Q
Reverse Recovery
rr
ISD= 15 Adi/dt = 100 A /µs
VDD=25V Tj= 150oC
60
0.16
Charge
I
RRM
Reverse Recovery
5
Current
(∗) Pulsed:Pulse duration = 300 µs, dutycycle 1.5 %
(•) Pulse widthlimited by safeoperating area
Safe Operating AreaThermal Impedance
A
A
ns
µC
A
3/10
Page 4
STD15N06
Derating Curve
Transfer Characteristics
Output Characteristics
Transconductance
Static Drain-source On Resistance
4/10
Gate Charge vs Gate-source Voltage
Page 5
Capacitance VariationsNormalized Gate Threshold Voltage vs
Temperature
Normalized On Resistance vs TemperatureTurn-on Current Slope
STD15N06
Cross-over TimeTurn-off Drain-source Voltage Slope
5/10
Page 6
STD15N06
Switching SafeOperating AreaAccidental Overload Area
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