Datasheet STD12N10L Datasheet (SGS Thomson Microelectronics)

Page 1
STD12N10L
N - CHANNEL 100V - 0.12 - 12A TO-252
LOW THRESHOLD POWER MOS TRANSISTOR
TYPE V
DSS
R
DS(o n)
I
D
ST D12N 10L 100 V < 0.15 12 A
TYPICALR
AVALANCHERUGGEDTECHNOLOGY
100%AVALANCHETESTED
175
LOW THRESHOLDDRIVE
FORTHROUGH-HOLE VERSION CONTACT
o
C OPERATINGTEMPERATURE
DS(on)
= 0.12
SALESOFFICE
APPLICATIONS
HIGHCURRENT, HIGH SPEEDSWITCHING
SOLENOIDAND RELAYDRIVERS
MOTORCONTROL, AUDIOAMPLIFIERS
DC-DC& DC-AC CONVERTERS
AUTOMOTIVE ENVIRONMENT(INJECTION,
ABS, AIR-BG, LAMPDRIVERS,Etc.)
3
1
DPAK
TO-252
(Suffix ”T4”)
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Uni t
V
V
V
I
DM
P
T
() Pulse width limited by safe operating area
November 1999
Drain-source Voltage (VGS= 0) 100 V
DS
Drain- g at e Voltage (RGS=20kΩ) 100 V
DGR
Gate-source Voltage
GS
I
Drain Cur rent (c ont in uous ) at Tc=25oC12A
D
I
Drain Cur rent (c ont in uous ) at Tc=100oC8A
D
15 V
±
() Drain Current (pulsed) 48 A
Total Dissipation at Tc=25oC50W
tot
Derat ing F ac tor 0.33 W/ Sto rage Temperat ure -65 to 175
stg
T
Max. Operating Junction Tem pe r at ur e 175
j
o
C
o
C
o
C
1/9
Page 2
STD12N10L
THERMAL DATA
R
thj-case
R
thj-amb
R
thc-sink
T
Ther mal Resistanc e Junct ion-case Max Ther mal Resistanc e Junct ion-ambient Max Ther mal Resistanc e Case-sink Ty p Maximum Lead Te m perature For Soldering Purpos e
l
3
100
1.5
275
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS
=25oC unless otherwisespecified)
(T
case
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
ID=250µAVGS= 0 100 V
Break dow n Vo lt age
I
DSS
I
GSS
Zero Gate Voltage Drain Curre nt (V
GS
Gat e- bod y Leakag e Current (V
DS
=0)
=0)
V
=MaxRating
DS
=MaxRating Tc= 125oC
V
DS
V
= ± 15 V ± 100 nA
GS
1
10
ON()
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
R
DS(on)
I
D(on)
Gate Threshold Voltage VDS=VGSID= 250 µA11.62.5V Sta t ic Drain-s our c e On
Resistance
VGS=10V ID=6A
=5V ID=6A
V
GS
On State Drain Current VDS>I
D(on)xRDS(on )max
0.12
0.17
12 A
0.15
0.2
VGS=10V
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
g
(∗)Forward
fs
Tr ansc on duc tance
C
C
C
Input Capaci t ance
iss
Out put Capac itance
oss
Reverse Transfer
rss
Capacit a nc e
VDS>I
D(on)xRDS(on )maxID
=6A 6.5 10 S
VDS=25V f=1MHz VGS= 0 800
150
50
µ µA
Ω Ω
pF pF pF
A
2/9
Page 3
STD12N10L
ELECTRICAL CHARACTERISTICS
(continued)
SWITCHINGON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
Tur n-on Delay T ime Rise Time
t
r
VDD=50V ID=6A R
=4.7
G
VGS=5V
15 40
(Resis t iv e Load, see fig. 3)
Q Q Q
Tot al Gate C har ge
g
Gat e- Source Charge
gs
Gate-Drain Charge
gd
VDD=80V ID=12A VGS=5V 20
6
10
30 nC
SWITCHINGOFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
r(Voff)
t
t
Off-volt age Rise Time Fall T ime
f
Cross-over Tim e
c
VDD=80V ID=12A
=4.7 VGS=5V
R
G
(Indu ct iv e Load, see fig. 5)
12 12 25
SOURCEDRAINDIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
V
I
SDM
SD
Q
I
RRM
SD
t
Source-drain Current
(•)
Source-drain Current
12 48
(pulsed)
(∗)ForwardOnVoltage ISD=12A VGS=0 1.5 V
Reverse Recovery
rr
Time Reverse Recovery
rr
ISD= 12 A di/dt = 100 A/µs
=30V Tj=150oC
V
DD
(see test circuit, fig. 5)
145
580 Charge Reverse Recovery
8
Current
ns ns
nC nC
ns ns ns
A A
ns
µ
A
C
(∗) Pulsed:Pulse duration = 300µs, duty cycle 1.5% () Pulse width limited by safe operating area
3/9
Page 4
STD12N10L
Fig. 1:
UnclampedInductiveLoad TestCircuit
Fig. 3: SwitchingTimes Test Circuits For ResistiveLoad
Fig. 2:
UnclampedInductiveWaveform
Fig. 4: Gate Chargetest Circuit
Fig. 5:
Test Circuit For InductiveLoad Switching
And Diode Recovery Times
4/9
Page 5
TO-252 (DPAK) MECHANICAL DATA
STD12N10L
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 2.2 2.4 0.086 0.094 A1 0.9 1.1 0.035 0.043 A2 0.03 0.23 0.001 0.009
B 0.64 0.9 0.025 0.035 B2 5.2 5.4 0.204 0.212
C 0.45 0.6 0.017 0.023 C2 0.48 0.6 0.019 0.023
D 6 6.2 0.236 0.244
E 6.4 6.6 0.252 0.260
G 4.4 4.6 0.173 0.181
H 9.35 10.1 0.368 0.397 L2 0.8 0.031 L4 0.6 1 0.023 0.039
H
A
E
C2
L2
B2
==
==
DETAIL”A”
D
2
13
L4
A1
C
A2
DETAIL”A”
B
G
==
0068772-B
5/9
Page 6
STD12N10L
Information furnishedis believed to beaccurateand reliable.However, STMicroelectronics assumesno responsibilityfor the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under anypatent or patent rights ofSTMicroelectronics. Specificationmentioned in this publication are subjecttochange withoutnotice.This publication supersedes andreplaces all information previouslysupplied. STMicroelectronics products are not authorized for use as critical components in life supportdevices or systemswithout express written approval of STMicroelectronics.
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1999 STMicroelectronics – Printed in Italy – All Rights Reserved
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6/9
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