Datasheet SAA5252P, SAA5252T Datasheet (Philips)

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Page 1

INTEGRATED CIRCUITS

DATA SH EET

SAA5252

Line twenty-one acquisition and display (LITOD)

Product speciﬁcation Supersedes data of March 1995 File under Integrated Circuits, IC02

1996 Jul 18

Page 2

Philips Semiconductors Product speciﬁcation

Line twenty-one acquisition and display (LITOD) SAA5252

FEATURES

• Complete ‘stand-alone’ Line 21 decoder in one package

• On-chip display RAM allowing full page Text mode

• Enhanced character display modes

• Full colour captions

• RGB interface for standard colour decoder ICs

• Automatic handling of Field 2 data

• Automatic selection of (1H, 1V), (2H, 1V) or (2H, 2V)

scan modes

• Onboard OSD facility using Character generator

• RGB inputs to support existing OSD ICs

C-bus or ‘stand-alone’ pin control

• I

• Automatic data-ready signal generation on data

acquisition

• Can decode signals recorded on standard VHS and S-VHS tape.

GENERAL DESCRIPTION

The SAA5252 (LITOD) is a single-chip CMOS device, which will acquire, decode and display Line 21 Closed Captioning data from a 525-line composite video signal. Operation as an On-Screen Display (OSD) device is also possible. Normal and line progressive scan modes are supported.

QUICK REFERENCE DATA

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

syn

vid

amb

stg

supply voltage 4.5 5.0 5.5 V supply current − 30 − mA CVBS sync amplitude 0.1 0.3 0.6 V CVBS video amplitude 0.7 1.0 1.4 V operating ambient temperature −20 − +70 °C storage temperature −55 − +125 °C

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

SAA5252P DIP24 plastic dual in-line package; 24 leads (600 mil) SOT101-1 SAA5252T SO24 plastic small outline package; 24 leads; body width 7.5 mm SOT137-1

1996 Jul 18 2

Page 3

Philips Semiconductors Product speciﬁcation

Line twenty-one acquisition and display (LITOD) SAA5252

BLOCK DIAGRAM

SS DD

i.c.

OSCIN

OSCGND

OSCOUT

BLACK

IREF

CVBS

19 18

OSCILLATOR

SAA5252

23 24

SYNC SEPARATOR

ACQUISITION TIMING

ADC

7 86

DISPLAY

TIMING

CHARACTER

ROM

CODE

INTERPRETER

AND

ADDRESSING

AND

DATA

DETECTOR

Fig.1 Block diagram.

CHARACTER GENERATOR

ADDRESSING

PAGE

RAM

SERIAL/

PARALLEL

AND

PARITY

RGBREF

BLAN

ROUNDING

ITALICS

AND RGB

MULTIPLEXOR

I C

INTERFACE

CONTROL

I C/DC

14 13

9 10 11 12

G B

BLANIN RIN

GIN BIN

DR SDA

SCL

MBB623 - 1

1996 Jul 18 3

Page 4

Philips Semiconductors Product speciﬁcation

Line twenty-one acquisition and display (LITOD) SAA5252

PINNING

SYMBOL PIN DESCRIPTION

CVBS 1 composite video input; signal should be connected via a

100 nF capacitor

C/DC 2 input selects I2C or Direct Control

SDA 3 serial data port for I

direct control

SCL 4 serial clock input for I

direct control

DR 5 data-ready signal to microcontroller (active-LOW) or

mode select input for direct control

i.c. 6 internally connected; connect to V

operation V 7 vertical reference input for display timing H 8 horizontal reference input for display timing BLANIN 9 video blanking input from external OSD device RIN 10 RED video input from external OSD device GIN 11 GREEN video input from external OSD device BIN 12 BLUE video input from external OSD device B 13 BLUE video output G 14 GREEN video output R 15 RED video output BLAN 16 video blanking output RGBREF 17 input voltage deﬁning output HIGH level for RGB pins

for closed captioning output V

18 +5 V supply

19 0 V ground OSCOUT 20 oscillator output OSCIN 21 oscillator input OSCGND 22 oscillator ground BLACK 23 video black level storage input; connected to V

100 nF capacitor

IREF 24 reference current input; connected to V

resistor

C-bus or mode select input for

for normal

via 27 kΩ

via

CVBS

I C/DC

BLANIN

SDA

SCL

i.c.

RIN GIN BIN

2 3 4 5

6 V H

SAA5252

10 11 12

MBB622 - 1

Fig.2 Pin configuration.

24 23 22 21 20 19 18 17 16 15 14 13

IREF BLACK OSCGND

OSCIN OSCOUT

RGBREF

BLAN R

G B

1996 Jul 18 4

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Philips Semiconductors Product speciﬁcation

Line twenty-one acquisition and display (LITOD) SAA5252

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

Imax

Omax

dif

IOK

Omax

amb

stg

supply voltage (all supplies) −0.3 +6.5 V maximum input voltage (any input) note 1 −0.3 VDD+ 0.5 V maximum output voltage (any output) note 1 − VDD+ 0.5 V difference between VSS and OSCGND −±0.25 V DC input or output diode current −±20 mA maximum output current (each output) −±10 mA operating ambient temperature −20 +70 °C storage temperature −55 +125 °C electrostatic handling

human body model note 2 −2000 +2000 V machine model note 3 −200 +200 V

Notes

1. This maximum value has an absolute maximum of 6.5 V independent of V

2. The human body model ESD simulation is equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor, which produces a single discharge transient. Reference

to MIL-STD 883C method 3015.7)”

“Philips Semiconductors Test Method UZW-BO/FQ-A302 (similar

3. The machine model ESD simulation is equivalent to discharging a 200 pF capacitor via a resistor and series inductor with effective dynamic values of 25 Ω and 2.5 µH, which produces a damped oscillating discharge. Reference

“Philips Semiconductors Test Method UZW-BO/FQ-B302 (similar to EIAJ IC-121 Test Method 20 condition C)”

Quality

This device will meet the requirements of the in accordance with

“Quality Reference Handbook (order number 9397 750 00192)”

“Philips Semiconductors General Quality Specification UZW-BO/FQ-0601”

. This details the acceptance criteria

for all Q & R tests applied to the product.

1996 Jul 18 5

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Philips Semiconductors Product speciﬁcation

Line twenty-one acquisition and display (LITOD) SAA5252

CHARACTERISTICS

= 5 to 5.5 V; VSS=0V; T

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Supplies

DDtot

supply voltage 4.5 5.0 5.5 V total supply current − 30 − mA

Inputs

= −20 to +70 °C; unless otherwise speciﬁed.

amb

CVBS ( V

Z V

Z C

PIN 1)

syn vid(p-p)

dat

source I

IREF (PIN 24) R

H(PIN 8) V

Imax

PIN 7)

V( V

Imax

sync voltage amplitude 0.1 0.3 0.6 V video voltage amplitude

0.7 1.0 1.4 V

(peak-to-peak value) caption data voltage

0.25 0.35 0.49 V

amplitude source impedance −−250 Ω input switching voltage level

1.7 2.0 2.3 V

of sync separator input impedance 2.5 5 − kΩ input capacitance −−10 pF

resistor to ground − 27 − kΩ voltage on pin 24 −

⁄2V

− V

LOW level input voltage −0.3 − +0.8 V HIGH level input voltage 2.0 − VDD+ 0.5 V input leakage current VI=0toV

−10 − +10 µA maximum input current −1 − +1 mA input capacitance −−10 pF pulse rise time −−5µs pulse fall time −−5µs pulse width

scan mode 1H 1 12 63 µs scan mode 2H 1 6 31 µs

LOW level input voltage −0.3 − +0.8 V HIGH level input voltage 2.0 − VDD+ 0.5 V input leakage current VI=0toV

−10 − +10 µA maximum input current −1 − +1 mA input capacitance −−10 pF pulse rise time −−5ns pulse fall time −−5ns pulse width 1 −−µs

1996 Jul 18 6

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Philips Semiconductors Product speciﬁcation

Line twenty-one acquisition and display (LITOD) SAA5252

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

RGBREF (PIN, 17) V

input voltage −0.3 − V input leakage current VI= 0 to V

R, G AND B(PINS 15, 14 AND 13); note 1 V

LOW level input voltage −0.3 − 0.8 V HIGH level input voltage 2.0 − VDD+ 0.5 V input impedance 2.5 5.0 − kΩ

BLANIN (PIN 9) V

LOW level input voltage −0.3 − 0.8 V HIGH level input voltage 2.0 − VDD+ 0.5 V input leakage current VI =0toV input rise time between 10% and 90% −−80 ns input fall time between 90% and 10% −−80 ns

I2C/DC (PIN 2) V

LOW level input voltage 0 − 0.8 V HIGH level input voltage 2.0 − V input leakage current VI=0toV

SCL (PIN 4) V

clk

LOW level input voltage −0.3 − 1.5 V HIGH level input voltage 3.0 − VDD+ 0.5 V clock frequency 0 − 100 kHz input rise time between 10% and 90% −−2µs input fall time between 90% and 10% −−2µs input leakage current VI=0 toV input capacitance −−10 pF

Inputs/outputs

−10 − +10 µA

ERAMIC RESONATOR (PINS 20, 21 AND 22); see Fig.5

osc

oscillator frequency 11.82 12 12.18 MHz

C0 parallel capacitance − 5.35 − pF C1 series capacitance − 37.4 − pF L1 series inductance − 35.5 −µH R1 series resistance − 625Ω

black

PIN 23)

storage capacitor to ground − 100 − nF black level voltage for

1.8 2.15 2.5 V

BLACK ( C

black

nominal sync amplitude

input leakage current VI=0toV

−10 − +10 µA

1996 Jul 18 7

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Philips Semiconductors Product speciﬁcation

Line twenty-one acquisition and display (LITOD) SAA5252

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

SDA (PIN 3; OPEN DRAIN) V

DR (PIN 5; OPEN DRAIN) V

Outputs

LOW level input voltage −0.3 − +1.5 V HIGH level input voltage 3.0 − VDD+ 0.5 V input leakage current VI=0toV

−10 − +10 µA input capacitance −−10 pF input rise time between 10% and 90% −−2µs input fall time between 90% and 10% −−2µs LOW level output voltage IOL= 3 mA 0 − 0.5 V output fall time between 3 V and 1 V −−200 ns load capacitance −−400 pF

LOW level input voltage −0.3 − +1.5 V HIGH level input voltage 3.0 − VDD+ 0.5 V input leakage current VI=0toV

−10 − +10 µA LOW level output voltage IOL= 1.6 mA 0 − 0.4 V output fall time between 4 V and 1 V with

−−50 ns

3.3 kΩ to 5 V

load capacitance −−100 pF

R, G

AND B(PINS 15, 14 AND 13; CAPTION MODE)

LOW level output voltage IOL=+2mA 0 − 0.2 V HIGH level output voltage IOH= −2mA V17− 0.3 V output impedance −−200 Ω load capacitance −−50 pF output rise time between 10% and 90% −−10 ns output fall time between 90% and 10% −−10 ns

BLAN (PIN 16) V

V C t

skew

OL OH

LOW level output voltage IOL=+2mA 0 − 0.4 V HIGH level output voltage IOH= −2 mA 1.1 − 2.8 V load capacitance −−50 pF output rise time between 10% and 90% −−10 ns output fall time between 90% and 10% −−10 ns skew delay time between

display and R, G, B, BLAN

V17+ 0.4 V

−−10 ns

1996 Jul 18 8

Page 9

Philips Semiconductors Product speciﬁcation

Line twenty-one acquisition and display (LITOD) SAA5252

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I2C timing (see Fig.3)

LOW

HIGH

SU;DAT

HD;DAT

SU;STO

BUF

HD;STA

SU;STA

Note

1. These inputs are analog, VIL and VIH values are quoted as a guide for digital RGB users.

clock LOW time 4 −−µs clock HIGH time 4 −−µs data set-up time 250 −−ns data hold time 170 −−ns set-up time from clock

4 −−µs

HIGH-to-STOP START set-up time

4 −−µs

following a STOP START hold time 4 −−µs START set-up time

4 −−µs following clock LOW-to-HIGH transition

output rise time between 10% and 90% −−10 ns output fall time between 90% and 10% −−10 ns

handbook, full pagewidth

SDA

SCL

SDA

MBC764

BUF

LOW

HD;STA

SU;STA

Fig.3 I2C-bus timing diagram.

HD;DAT

HIGH

SU;DAT

SU;STO

1996 Jul 18 9

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Philips Semiconductors Product speciﬁcation

Line twenty-one acquisition and display (LITOD) SAA5252

APPLICATION INFORMATION

handbook, full pagewidth

CVBS

5 V

3.3

microcontroller

kΩ

microcontroller

100 nF

I C-bus

CVBS

I C/DC

SDA

SCL

BLANIN

RIN

GIN

BIN

i.c.

SAA5252

IREF

BLACK

OSCGND

OSCIN

OSCOUT

RGBREF

BLAN

27 kΩ

100 nF

C3 33 pF

33 pF

C7 100 nF

C6 10 µF

5 V

12 MHz

MBB624 - 2

C3 10 nF

(1)

5 V

(1) Value dependent on application.

Fig.4 Application diagram.

L1 R1

Fig.5 Ceramic resonator equivalent circuit.

1996 Jul 18 10

MEA560

Page 11

Philips Semiconductors Product speciﬁcation

Line twenty-one acquisition and display (LITOD) SAA5252

DISPLAY GENERATOR General description

The displayed characters are defined on a 5-by-12 matrix within a 7-by-13 window, allowing one blank pixel either side of the character and a blank pixel row above. There are a number of display options available controlled by Register 1, or external pins in ‘stand-alone’ mode.

The three display modes are video, text and caption, the device is powered up in the video mode.

The display generator reads the Pre-amble Address Code (PAC) then the data associated with that row. Each character is then rounded after which it can be italicized and/or underlined, depending on the PAC or mid-row codes, before being passed on to the output circuitry. Figure 6 shows the character set.

Table 1 Register map (WRITE)

00 DF

01 CLEAR CH 2/

02 −− − − ROW3 ROW2 ROW1 ROW0 03 −− − COL4 COL3 COL2 COL1 COL0 04 − OSD6 OSD5 OSD4 OSD3 OSD2 OSD1 OSD0

1/2 RGB, BLAN

+ve/−ve

1 NARROW/

H +ve/−ve

WIDE

Display of external On-Screen Display (OSD) facilities

The R, G, B and BLAN outputs of the display have the capability to be put in a 3-state mode allowing other OSD devices to take control of the television R, G, B and BLAN signals.

When the BLANIN is held HIGH then the R, G, B and BLAN outputs from display are disabled and the R, G, B and BLAN signals come directly from the RGBIN and BLANIN inputs. This will allow On-Screen Display to be placed on top of the captioning without any corruption, leaving the captions intact when the On-Screen Display is switched off (BLANIN goes LOW). In this form of operation the RGBIN and RGBOUT pins can be considered transparent; BLANIN goes through the normal output buffer to BLAN.

V +ve/−ve

ACQ OFF EN1 EN0 M1 M0

H3 H2 H1 H0

Table 2 Register map (READ)

80 POR 0 0 0

81 PARITY

ERROR

82 PARITY

ERROR

1996 Jul 18 11

DATA BIT 7

DATA BIT 6

DATA BIT 5

F1/F2 EDS PARITY

SHUTDOWN

DATA BIT 4

DATA BIT 3

DATA BIT 2

DATA READY

DATA BIT 1

Page 12

Philips Semiconductors Product speciﬁcation

Line twenty-one acquisition and display (LITOD) SAA5252

b3b2b1b

0 0 0 1

0 0 1 1

column

0 1234 567

r o w

00 0 0 0 white

white

underline

green

20 0 1 0

green

underline

40 1 0 0 blue

blue

50 1 0 1

underline

60 1 1 0 cyan

cyan

70 1 1 1

underline

81 0 0 0 red

011

signifies "flash on" command

signifies a transparent space

1 0 0 1

1 0 1 0

1 0 1 1

1 1 0 1

1 1 1 0

red

underline

yellow

yellow

underline

C1 1 0 0

magenta

magenta

underline

italics

italics

F1 1 1 1

underline

The ‘0’ and ‘zero’ use the same character, 4FH.

MBB625 - 2

Fig.6 Character set.

1996 Jul 18 12

Page 13

Philips Semiconductors Product speciﬁcation

Line twenty-one acquisition and display (LITOD) SAA5252

I2C INTERFACE Description of WRITE registers

The write subaddresses auto increment from 0 through to 4 at which point they stay until a new write subaddress is sent. Registers are set to all logic 0 at power-up.

Table 3 Register 0 WRITE (Control Byte 1)

BIT DESCRIPTION

D0 to D3 H0 to H3 set the offset position from the start of the horizontal sync pulse, set to a nominal value on reset. D4 Vertical sync pulse expected to be negative going logic 0 or positive-going logic 1. D5 Horizontal sync pulse expected to be negative going logic 0 or positive-going logic 1. D6 Video outputs will be positive going logic 0 or negative-going logic 1. D7 Data field select. When set to logic 0 Field 1 is decoded, when set to logic 1 Field 2 is decoded.

Table 4 Register 1 WRITE (Control Byte 2)

BIT DESCRIPTION

D0, D1 Display mode selection bits. Table 8 shows the possible display modes. D2, D3 Enhanced caption mode selection bits. Table 9 shows the possible enhanced caption modes. D4 When set to logic 1 acquisition of caption data is inhibited to allow the display to be used for

On-Screen Display purposes.

D5 Acquisition window selection. When set to logic 0 only Line 21 is checked for caption data. When set to

logic 1, lines 19 to 23 of both ﬁelds are checked, allowing encrypted video signals to be handled. D6 User channel selection. D7 Clears the page memory when set HIGH. The page memory will be within two ﬁelds (30 ms).

Table 5 Register 2 WRITE (On-Screen Display data row address)

BIT DESCRIPTION

D0 to D3 Row 0 to 3 sets the row address for On-Screen Display. This stored value will be incremented by overﬂow

increments of Register 3.

Table 6 Register 3 WRITE (On-Screen Display data column address)

BIT DESCRIPTION

D0 to D4 Columns 0 to 4 sets the column address for On-Screen Display. This stored value will be incremented by

writes to Register 4.

Table 7 Register 4 WRITE (On-Screen Display data)

BIT DESCRIPTION

D0 to D6 OSD0 to OSD6, On-Screen Display data bits writing to this register causes Register 3 to increment its

stored value.

1996 Jul 18 13

Page 14

Philips Semiconductors Product speciﬁcation

Line twenty-one acquisition and display (LITOD) SAA5252

Table 8 Display modes

DISPLAY MODE OPTIONS M1 M0

Video only 0 0 Text mode 0 1 Normal caption mode 1 0 Enhanced caption mode 1 1

Table 9 Enhanced caption modes

ENHANCED CAPTION MODES EN1 EN0

Enhanced caption modes EN1 EN0 Shadowed character/Video background 0 0 Shadowed character/Mesh background 0 1 Normal character/Video background 1 0 Normal character/Mesh background 1 1

Description of READ registers

The read subaddresses auto increment from 80H through to 82H at which point they stay until a new read subaddress is sent.

All the bits in Table 10 are reset to logic 0 after the register is read.

Table 10 Register 80H READ (status)

BIT DESCRIPTION

D0 Data ready (new data has been acquired). D1 Parity error shut-down, goes HIGH when SAA5252 has a parity shut-down condition. D2 Indicates the following bytes are extended data service bytes. D3 Indicates Field 1 or Field 2 data bytes.

D7 Indicates Power-On Reset (POR) has occurred, all I

Table 11 Register 81H READ (ﬁrst data byte)

BIT DESCRIPTION

D0 to D6 Data Bit 1 to Data Bit 7 (see note 1). D7 Parity error flag bit. Bit goes HIGH when a parity error has occurred.

Note

1. In the Line 21, specification data bits are numbered D1 to D8.

C-bus write registers have been reset to logic 0.

Table 12 Register 82H READ (second data byte)

BIT DESCRIPTION

D0 to D6 Data Bit 1 to Data Bit 7 (see note 1). D7 Parity error flag bit. Bit goes HIGH when a parity error has occurred.

Note

1. In the Line 21, specification data bits are numbered D1 to D8.

1996 Jul 18 14

Page 15

Philips Semiconductors Product speciﬁcation

Line twenty-one acquisition and display (LITOD) SAA5252

Interface to microcontroller using I2C-bus

The interface to the microcontroller is via the two-wire serial I2C-bus, and optionally by a Data-Ready signal (DR). On power up the microcontroller initializes the device by an I2C-bus WRITE to Registers 0 (Control Byte 1). The I2C-bus subaddress is then auto incremented to point to Register 1 (Control Byte 2). These two registers configure the device to the users requirements.

If the device is to be used for data acquisition only, then there are three methods by which the microcontroller can be informed of the arrival of valid Line 21 data:

• It can poll the DR pin, if the function has been enabled, and wait for it to go LOW.

• It can use the negative edge of the DR signal to cause an interrupt.

• It can poll the Data Ready bit (bit D0 of the status byte, I2C-bus READ Register 0).

When valid data is detected, the microcontroller must initiate an I2C-bus READ of Registers 80H, 81H and 82H. The first and second data bytes from the most recently received Line 21 are in Register 81H and Register 82H respectively.

The DR pin, and the Data Ready bit (Status bit D0) will be cleared after any register has been read. POR is reset after Register 80H has been read.

‘STAND-ALONE’ (NON I2C-BUS) OPERATION

To set the SAA5252 for ‘stand-alone’ operation pin 2 (I2C/DC) is tied LOW. This will change the operation of the SCL, SDA and DR pins to mode select inputs which will select as shown in Table 13.

In the caption mode the SAA5252 operates in the basic Normal character/Black background mode. This complies with the FCC ruling. In the Enhanced caption mode the set-up will be Shadowed character/Video background. SDA and SCL in the ‘stand-alone’ operation act as bits M0 and M1 in Table 8.

Table 13 Stand-alone modes

DR SCL SDA

0 0 0 video mode Channel 1 0 0 1 text mode Channel 1 0 1 0 normal captions Channel 1 0 1 1 enhanced captions Channel 1 1 0 0 video mode Channel 2 1 0 1 text mode Channel 2 1 1 0 normal captions Channel 2 1 1 1 enhanced captions Channel 2

MODE OF

OPERATION

CHANNEL

RECEPTION

1996 Jul 18 15

Page 16

Philips Semiconductors Product speciﬁcation

Line twenty-one acquisition and display (LITOD) SAA5252

PACKAGE OUTLINES

DIP24: plastic dual in-line package; 24 leads (600 mil)

seating plane

pin 1 index

SOT101-1

w M

(e )

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

max.

OUTLINE VERSION

SOT101-1

1 2

min.

max.

1.7

1.3

0.066

0.051

IEC JEDEC EIAJ

051G02 MO-015AD

0.53

0.38

0.021

0.015

0.32

0.23

0.013

0.009

REFERENCES

cD E e M

32.0

31.4

1.26

1.24

1996 Jul 18 16

14.1

13.7

0.56

0.54

(1)(1)

3.9

3.4

EUROPEAN

PROJECTION

15.80

15.24

0.62

0.60

17.15

15.90

0.68

0.63

0.15

0.13

ISSUE DATE

0.252.54 15.24

0.010.10 0.60

92-11-17 95-01-23

max.

2.25.1 0.51 4.0

0.0870.20 0.020 0.16

(1)

Page 17

Philips Semiconductors Product speciﬁcation

Line twenty-one acquisition and display (LITOD) SAA5252

SO24: plastic small outline package; 24 leads; body width 7.5 mm

pin 1 index

w M

SOT137-1

detail X

(A )

v M

0 5 10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

OUTLINE

VERSION

SOT137-1

max.

2.65

0.10

A1A2A

0.30

2.45

0.10

2.25

0.012

0.096

0.004

0.089

IEC JEDEC EIAJ

075E05 MS-013AD

0.25

0.01

0.49

0.32

0.36

0.23

0.019

0.013

0.014

0.009

UNIT

inches

Note

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

(1)E(1) (1)

15.6

7.6

7.4

0.30

0.29

1.27

0.050

15.2

0.61

0.60

REFERENCES

1996 Jul 18 17

eHELLpQ

10.65

10.00

0.42

0.39

1.4

0.055

1.1

0.4

0.043

0.016

1.1

1.0

0.043

0.039

PROJECTION

0.25

0.25 0.1

0.01

EUROPEAN

ywv θ

0.9

0.4

0.004

ISSUE DATE

0.035

0.016

92-11-17

95-01-24

o o

Page 18

Philips Semiconductors Product speciﬁcation

Line twenty-one acquisition and display (LITOD) SAA5252

SOLDERING Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our

“IC Package Databook”

(order code 9398 652 90011).

DIP

OLDERING BY DIPPING OR BY WA VE

S The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T

stg max

). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

EPAIRING SOLDERED JOINTS

R Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

REFLOW SOLDERING Reflow soldering techniques are suitable for all SO

packages.

Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.

AVE SOLDERING

W Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.

• The longitudinal axis of the package footprint must be parallel to the solder flow.

• The package footprint must incorporate solder thieves at the downstream end.

During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

EPAIRING SOLDERED JOINTS

R Fix the component by first soldering two diagonally-

opposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.

1996 Jul 18 18

Page 19

Philips Semiconductors Product speciﬁcation

Line twenty-one acquisition and display (LITOD) SAA5252

DEFINITIONS

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development. Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later. Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

PURCHASE OF PHILIPS I

C COMPONENTS

Purchase of Philips I components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.

C components conveys a license under the Philips’ I2C patent to use the

1996 Jul 18 19

Page 20

Philips Semiconductors – a worldwide company

Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773

Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 708 296 8556

China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700

Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. +45 32 88 2636, Fax. +45 31 57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO,

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Tel. +49 40 23 52 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS,

Tel. +30 1 4894 339/911, Fax. +30 1 4814 240

Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.

Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722

Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,

Tel. +972 3 645 0444, Fax. +972 3 648 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

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Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. +1 800 234 7381, Fax. +1 708 296 8556

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. +31 40 27 83749, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO,

Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327

Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. +7 095 926 5361, Fax. +7 095 564 8323 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. +65 350 2538, Fax. +65 251 6500

Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494

South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 São Paulo, SÃO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849

Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730

Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1, P.O. Box 22978, TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707

Ukraine: PHILIPS UKRAINE, 2A Akademika Koroleva str., Office 165, 252148 KIEV, Tel. +380 44 476 0297/1642, Fax. +380 44 476 6991

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 708 296 8556

Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. +381 11 825 344, Fax.+381 11 635 777

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

Printed in The Netherlands 537021/01/04/pp20 Date of release: 1996 Jul 18 Document order number: 9397 750 00975

Internet: http://www.semiconductors.philips.com/ps/ (1) SAA5252_4 June 26, 1996 11:51 am

Datasheet SAA5252P, SAA5252T Datasheet (Philips)

Specifications and Main Features

Frequently Asked Questions

User Manual

FEATURES

GENERAL DESCRIPTION

QUICK REFERENCE DATA

ORDERING INFORMATION

BLOCK DIAGRAM

PINNING

LIMITING VALUES

Quality

CHARACTERISTICS

APPLICATION INFORMATION

Display of external On-Screen Display (OSD) facilities

Description of READ registers

Interface to microcontroller using I2C-bus

‘STAND-ALONE’ (NON I2C-BUS) OPERATION

PACKAGE OUTLINES

SOT101-1

SOT137-1

DEFINITIONS

LIFE SUPPORT APPLICATIONS