Product specification
File under Integrated Circuits, IC02
November 1986
Page 2
Philips SemiconductorsProduct specification
Teletext video processorSAA5231
GENERAL DESCRIPTION
The SAA5231 is a bipolar integrated circuit intended as a successor to the SAA5030. It extracts Teletext Data from the
video signal, regenerates Teletext Clock and synchronizes the text display to the television syncs. The integrated circuit
is intended to work in conjunction with CCT (Computer Controlled Teletext), EUROM or other compatible devices.
15. Teletext data output (TTD)
Data output for CCT.
16. Supply voltage VCC (+ 12 V typ.)
17. Clock output (F6)
6 MHz clock output for timing and sandcastle generation in CCT.
18. Oscillator output (6 MHz)
A series resonant circuit is connected between this pin and pin 20 to control the nominal frequency of the VCO.
19. Filter 2
A filter with a short time constant is connected to this pin for the horizontal phase detector. It is used in the video
recorder mode and while the loop is locking up.
November 198610
Page 11
Philips SemiconductorsProduct specification
Teletext video processorSAA5231
20. Oscillator input (6 MHz)
See pin 18.
21. Filter 1
A filter with a long time constant is connected to this pin for the horizontal phase detector.
22. Sandcastle input pulse (PL/CBB)
This input accepts a sandcastle waveform, which is formed from PL and CBB from the CCT.
Signal timing is shown in Fig.5.
23. Pulse timing resistor
The current for the pulse generator is defined by a 68 Ω resistor connected to this pin.
24. Pulse timing capacitor
The timing of the pulse generator is determined by a 220 pF capacitor connected to this pin.
25. Video composite sync output (VCS)
The output signal is for CCT.
26. Black level
The black level for the adaptive sync separator is stored by a 68 nF capacitor connected to this pin.
27. Composite video input (CVS)
The composite video signal is input via a 2,2 µF clamping capacitor to the adaptive sync separator.
28. Text composite sync input (TCS)/Scan composite sync input (SCS)
TCS is input from CCT or SCS from external sync circuit. SCS is expected when there is no load resistor at pin 1.
If pin 28 is not connected the sync output on pin 1 will be the composite video input at pin 27, internally buffered.
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
A
UNIT
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
max.
mm
OUTLINE
VERSION
SOT117-1
12
min.
max.
1.7
1.3
0.066
0.051
IEC JEDEC EIAJ
051G05MO-015AH
b
b
1
0.53
0.38
0.020
0.014
0.32
0.23
0.013
0.009
REFERENCES
cD EweM
(1)(1)
36.0
35.0
1.41
1.34
November 198612
14.1
13.7
0.56
0.54
(1)
92-11-17
95-01-14
Z
max.
1.75.10.514.0
0.0670.200.0200.16
L
3.9
3.4
EUROPEAN
PROJECTION
M
15.80
15.24
0.62
0.60
H
E
17.15
15.90
0.68
0.63
0.252.5415.24
0.010.100.60
ISSUE DATE
e
1
0.15
0.13
Page 13
Philips SemiconductorsProduct specification
Teletext video processorSAA5231
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
“IC Package Databook”
our
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
(order code 9398 652 90011).
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
stg max
). If the
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
November 198613
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