Preliminary specification
File under Integrated Circuits, IC02
March 1991
Page 2
Philips SemiconductorsPreliminary specification
Teletext video processorSAA5191
FEATURES
• Adaptive data slicer
• Crystal-controlled data clock regeneration with a bit rate
of 6.9375 MHz
• Adaptive sync separator, horizontal phase detector and
13.5 MHz VCO to provide display phase locked loop
(PLL)
GENERAL DESCRIPTION
The SAA5191 is a bipolar integrated circuit that extracts
teletext data from the video signal (CVBS), regenerates
the teletext clock (TTC) and synchronizes the text display
to the television signals (VCS). This device operates in
conjunction with the Digital Video Teletext (back-end)
Decoder (DVTB - SAA9042A) or any other compatible
device.
• TV synchronization at teletext mode
QUICK REFERENCE DATA
SYMBOLPARAMETERMIN.TYP.MAX.UNIT
V
P
I
P
V
i CVBS
supply voltage (pin 16)−12−V
supply current−70−mA
CVBS input signal on pin 27 (peak-to-peak value)
at pin 2 LOW−1−V
at pin 2 open-circuit−2.5−V
V
o
outputs signals TTC and TTD
2.53.54.5V
(peak-to-peak value, pins 14, 15)
V
F13
13.5 MHz clock output signal
123V
(peak-to-peak value pin 17)
V
SYNC
video sync output signal (peak-to-peak value, pin 1) −−1V
SYNC output signal
TCS200450650mV
VCSvideo composite sync level on output pin 25
LOW−−0.4V
HIGH2.4−5.5V
T
amb
operating ambient temperature0−+70°C
ORDERING AND PACKAGE INFORMATION
EXTENDED TYPE
NUMBER
PINSPIN POSITIONMATERIALCODE
PACKAGE
SAA519128DILplasticSOT117
Note
1. SOT117-1;1996 November 14
March 19912
(1)
Page 3
Philips SemiconductorsPreliminary specification
Teletext video processorSAA5191
P
(data)
F13
(13.5 MHz
clock)
17
+12 V
P
V
TTD
15
TTC
14
(clock)
12
V
1311978651432
GND
XTAL
MEH149
13.875 MHz
handbook, full pagewidth
VCO
19
PHASE
DETECTOR
HORIZONTAL
PL CBB
P
V
PULSE
GENERATOR
LATCHES
DATA
SLICER
ADAPTIVE
SAA5191
CLOCK
DUAL
BUFFER
POLARITY
PHASE
DETECTOR
PHASE
SENSE
SENSE
"NO LOAD"
SHIFTER
DATA
EXTERNAL
BY 2
DIVIDER
OSCILLATOR
HF LOSS
COMPENSATOR
data
P
V
input
polarity
set sync
Fig.1 Block diagram.
25242322 1021201816
VCS
ADAPTIVE
27
composite
video
input
SYNC
SEPARATOR
28
TCS
SENSE
"NO INPUT"
March 19913
set video
input level
GAIN
SWITCH
26
sync output
Page 4
Philips SemiconductorsPreliminary specification
Teletext video processorSAA5191
PINNING
SYMBOLPINDESCRIPTION
STTV1sync output signal to TV (positive or negative going)
VILS2level select input of video input (LOW equals 1 V)
C
C
C
C
filt
store
ampl
zero
3video filtering capacitor of HF loss compensation
4HF storage capacitor
5amplitude capacitor
6zero level capacitor
EXD7external data current input (note 1)
C
time
C
CLK
8data timing capacitor for the adaptive data slicer
9clock phase detector capacitor
CBB10blanking insertion input
XTAL1113.875 MHz crystal (double of data rate)
CLF126.9375 MHz clock frequency filter
GND13ground (0 V)
TTC14teletext clock output (for computer controlled teletext)
TTD15teletext data output (for computer controlled teletext)
V
P
16+12 V supply voltage
F131713.5 MHz VCO output (for sandcastle generation)
OSCO18oscillator output to series LC-circuit or crystal
C
VCR
19short time constant capacitor at video recorder mode
(note 2)
OSCI20oscillator input from series LC-circuit or crystal
C
hor
21horizontal phase capacitor / VCR mode
PL22sandcastle input (generated in CCT)
R
T
C
T
23timing resistor for pulse generator
24timing capacitor for pulse generator
VCS25video composite sync output to CCT
C
BL
26black level capacitor
CVBS27composite video input signal from TV
TCS28text-composite/scan-composite sync input (TSC/SCS)
PIN CONFIGURATION
page
STTV
1
VILS
2
C
3
filt
C
4
store
C
5
ampl
C
6
zero
EXD
7
SAA5191
8
C
time
C
9
CLK
CCB
10
XTAL
11
CLF
12
GND
13
TTC
MEH150
Fig.2 Pin configuration.
28
27
26
25
24
23
22
21
20
19
18
17
16
1514
TCS
CVBS
C
BL
VCS
C
T
R
T
PL
C
hor
OSCI
C
VCR
OSCO
F13
V
P
TTD
Notes
1. Sliced teletext data from external: active HIGH level (current), low
impedance input.
2. While the loop is locking up.
March 19914
Page 5
Philips SemiconductorsPreliminary specification
Teletext video processorSAA5191
LIMITING VALUES
In accordance with the Absolute Maximum System (IEC 134).
SYMBOLPARAMETERMIN.MAX.UNIT
V
P
V
5
T
stg
T
amb
CHARACTERISTICS
= 12 V; T
V
P
=25°C and measurements taken in Fig.3, unless otherwise specified.
amb
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
V
P
I
P
supply voltage range (pin 16)10.812.013.2V
supply current5070105mA
Video input, sync separator and data slicer
V
i CVBS
input signal sync to white
(peak-to-peak value, pin 27)
sync amplitude (peak-to-peak value)0.1−1V
data slicing levelV2= LOW0.30.460.7V
V
2
input voltage LOW (pin 2)0−0.8V
input voltage HIGHopen-circuit equals HIGH 2.0−5.5V
I
2
input current LOW0−−150µA
input current HIGHV
Teletext data output (TTD)
V
22
phase lock pulse (PL) input voltage
(peak-to-peak value, pin 22)
V
o TTD
data output signal on pin 15
(peak-to-peak value)
V
15
C
L
, t
t
r
f
DC output voltagemean level345V
load capacitance on pin 15−−40pF
rise and fall time203045ns
Teletext clock output (TTC)
V
o TTC
clock output signal on pin 14
(peak-to-peak value)
V
14
C
L
t
, t
r
f
t
d
DC output voltagemean level345V
load capacitance on pin 14−−40pF
rise and fall time203045ns
delay time of falling edge relative to
other edges of TTD
supply voltage (pin 16)013.2V
voltage on pin 505.5V
storage temperature range−20125°C
operating ambient temperature range0+70°C
Z
≤ 250 Ω
S
V2= LOW0.711.4V
V
= HIGH1.752.53.5V
2
V
= HIGH0.751.151.75V
2
< 5.5 V0−1mA
2
phase locked0−3V
phase unlocked3.9−5.5V
2.53.54.5V
2.53.54.5V
−−± 20ns
March 19915
Page 6
Philips SemiconductorsPreliminary specification
Teletext video processorSAA5191
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Text/ scan composite sync input (TCS/SCS)
V
28
I
28
SYNC output buffer
V
o
V
1
I
1
Video composite sync output (VCS)
V
25
I
25
t
d
Horizontal phase detector and 13.5 MHz VCO
V
10
I
10
V
o
V
17
C
L
t
, t
r
f
input voltage LOW for TCS (pin 28)0−0.8V
input voltage HIGH for
input voltage LOW for
input voltage HIGH for
TCS2.0−7.0V
SCS0−1.5V
SCS3.5−7.0V
input currentV28 = 0 to 7 V−40−70−100µA
V
CVBS sync output signal on pin 1
= 10 to V
28
R
= 1.2 kΩ to V
L 1
P
P
−−± 5µA
−−1V
(peak-to-peak value)
TCS output signalR
DC output voltage at positive sync signalR
DC output voltage at negative sync signalR
= 1.2 kΩ to GND200450650mV
L 1
= 1.2 kΩ to GND1.01.42.0V
L 1
= 1.2 kΩ to V
L 1
P
9.010.111.0V
output current−−±3mA
output voltage LOW (pin 25)0−0.4V
output voltage HIGH2.4−5.5V
output current LOW0−0.5mA
output current HIGH0−−1.5mA
sync separator delay time250350400ns
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
A
A
UNIT
inches
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
max.
mm
OUTLINE
VERSION
SOT117-1
12
min.
max.
1.7
1.3
0.066
0.051
IEC JEDEC EIAJ
051G05MO-015AH
b
b
1
0.53
0.38
0.020
0.014
0.32
0.23
0.013
0.009
REFERENCES
cD EweM
(1)(1)
36.0
35.0
1.41
1.34
March 19918
14.1
13.7
0.56
0.54
(1)
92-11-17
95-01-14
Z
max.
1.75.10.514.0
0.0670.200.0200.16
L
3.9
15.80
3.4
15.24
EUROPEAN
PROJECTION
M
0.62
0.60
H
E
17.15
15.90
0.68
0.63
0.252.5415.24
0.010.100.60
ISSUE DATE
e
1
0.15
0.13
Page 9
Philips SemiconductorsPreliminary specification
Teletext video processorSAA5191
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook”
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
be necessary immediately after soldering to keep the temperature within the permissible limit.
(order code 9398 652 90011).
). If the printed-circuit board has been pre-heated, forced cooling may
stg max
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
March 19919
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