The NE32584C is a Hetero Junction FET that utilizes the
hetero junction to create high mobility electrons. Its excellent
low noise and high associated gain make it suitable for DBS,
TVRO and another commercial systems.
FEATURES
• Super Low Noise Figure & High Associated Gain
NF = 0.45 dB TYP., Ga = 12.5 dB TYP. at f = 12 GHz
• Gate Length : Lg d 0.2 Pm
• Gate Width..: Wg = 200 Pm
ORDERING INFORMATION
SUPPLYING
FORM
NE32584C-SLSTICKL = 1.7 mm MIN.D
NE32584C-T1Tape & reel
1000 pcs./reel
NE32584C-T1ATape & reel
5000 pcs./reel
L = 1.0 r 0.2 mm
L = 1.0 r 0.2 mm
MARKINGLEAD LENGTHPART NUMBER
NE32584C
PACKAGE DIMENSIONS
(Unit: mm)
1.78 ±0.2
L
D
2
1.78 ±0.2
L
3
1
L
0.5 TYP. 1.7 MAX.0.1
4
L
0.5 TYP.
ABSOLUTE MAXIMUM RATINGS (TA = 25
Drain to Source VoltageV
Gate to Source VoltageV
Drain CurrentI
Gate CurrentI
Total Power DissipationP
Channel TemperatureT
Storage TemperatureT
RECOMMENDED OPERATING CONDITION (TA = 25
CHARACTERISTICSYMBOLMIN.TYP.MAX.Unit
Drain to Source VoltageV
Drain CurrentI
Input PowerP
Document No. P12275EJ2V0DS00 (2nd edition)
(Previous No. TC-2515)
Date Published February 1997 N
Printed in Japan
Gate to Source Leak CurrentI
Saturated Drain CurrentI
Gate to Source Cutoff VoltageV
Transconductanceg
GSO
DSS
GS(off)
m
0.510
P
AVGS = ð3 V
206090mAVDS = 2 V, VGS = 0 V
ð0.2ð0.7ð2.0VVDS = 2 V, ID = 100 PA
4560mSVDS = 2 V, ID = 10 mA
Noise FigureNF0.450.55dBVDS = 2 V, ID = 10 mA, f = 12 GHz
Associated GainG
a
11.012.5dB
TYPICAL CHARACTERISTICS (TA = 25 qqqqC)
TOTAL POWER DISSIPATION vs.
250
AMBIENT TEMPERATURE
200
150
100
50
Pout - Total Power Dissipation - mW
050100150200250
T
A - Ambient Temperature - ¡C
100
80
60
40
- Drain Current - mA
D
I
20
01.53.0
DRAIN CURRENT vs.
DRAIN TO SOURCE VOLTAGE
V
V
DS
- Drain to Source Voltage - V
GS
= 0 V
–0.2 V
–0.4 V
–0.6 V
–0.8 V
60
40
20
ID - Drain Current - mA
0
–2.0–1.00
2
DRAIN CURRENT vs.
GATE TO SOURCE VOLTAGE
V
V
GS - Gate to Source Voltage - V
DS = 2 V
MAXIMUM AVAILABLE GAIN, FORWARD
INSERTION GAIN vs. FREQUENCY
24
20
16
2
|S
21s
|
12
- Forward Insertion Gain - dB
2
8
|
21s
MSG. - Maximum Stable Gain - dB
MAG. - Maximum Available Gain - dB
|S
0
f - Frequency - GHz
MSG.
V
DS
= 2 V
ID = 10 mA
MAG.
3020141086321
Page 3
Gain Calculations
NE32584C
21
S
~
MSG. = K =
MAG. = (K r K
~
12
S
~
~
21
S
~
~
12
S
~
~
NOISE FIGURE, ASSOCIATED GAIN vs.
FREQUENCY
2
1)
ð
—
G
a
= S11 • S22 ð S21 • S
'
VDS = 2 V
I
D
1.0
NF - Noise Figure - dB
0.5
NF
0
1301410864202
f - Frequency - GH
Z
1 +
= 10 mA
~'~
2
2~S
ð ~S
ð ~S
~
12
21
S
~~
~
12
2
11
24
20
16
12
- Associated Gain - dB
a
G
8
4
2
22
~
NOISE FIGURE, ASSOCIATED GAIN vs.
DRAIN CURRENT
DS
= 2 V
V
f = 12 GH
2.0
1.5
1.0
NF - Noise Figure - dB
0.5
0
Z
G
a
NF
D
- Drain Current - mA
I
14
13
12
11
10
- Associated Gain - dB
a
G
302010
3
Page 4
NE32584C
S-PARAMETERS
VDS = 2 V, ID = 10 mA
START 2 GHz, STOP 18 GHz, STEP 500 MHz
S11
1.0
5
0
4
3
–0.5
2
–1.0
1
2.00.5
–2.0
Rmax. = 1
Marker
1 : 4 GHz
2 : 8 GHz
3 : 12 GHz
1
4 : 16 GHz
5 : 18 GHz
2
3
4
+45°
0
–45°
Rmax. = 0.25
S12
+90°
+135°
∞
±180°
5
–135°
–90°
±180°
+135°
S21
+90°
+45°
1
–90°
2
3
4
5
R
–45°–135°
max. = 5
0
0
S22
1.0
2.00.5
5
4
3
2
–1.0
1
–2.0–0.5
Rmax. = 1
∞
4
Page 5
S-PARAMETER
MAG. AND ANG.
VDS = 2 V, ID = 10 mA
NE32584C
FREQUENCYS
Z
GH
MAG.ANG.MAG.ANG.MAG.ANG.MAG.ANG.
11
21
S
12
S
(deg.)(deg.)(deg.)(deg.)
2.0.983ð29.74.648148.4.02769.0.532ð22.6
2.5.973ð37.24.590140.5.03365.3.520ð28.3
3.0.960ð43.94.543133.2.03860.2.508ð33.3
3.5.943ð51.04.428125.8.04455.7.491ð39.3
4.0.922ð58.04.351118.2.04950.2.472ð45.1
4.5.912ð64.24.296111.3.05445.6.458ð51.3
5.0.890ð70.44.174104.5.05741.6.442ð57.3
5.5.870ð76.44.11997.4.06237.7.428ð63.6
6.0.856ð81.84.00591.0.06432.7.416ð70.1
6.5.840ð87.63.94084.1.06829.7.403ð76.0
7.0.827ð92.53.87778.1.06925.1.395ð82.4
7.5.816ð97.63.80571.4.07221.8.385ð88.5
8.0.801ð102.33.72065.3.07418.4.376ð94.0
8.5.784ð107.53.66558.8.07514.9.372ð99.9
9.0.776ð112.13.60452.6.07511.0.364ð105.2
9.5.752ð116.43.52947.0.0779.0.359ð112.7
10.0.734ð119.83.49141.5.0784.9.357ð118.8
10.5.713ð124.83.43535.6.0792.5.351ð126.0
11.0.702ð128.13.43829.7.082ð1.5.353ð133.7
11.5.685ð131.73.43424.0.084ð5.9.352ð140.6
12.0.670ð136.13.42917.6.084ð8.4.357ð147.5
12.5.649ð139.73.44311.6.085ð12.8.364ð155.0
13.0.632ð143.83.4235.1.085ð17.3.373ð161.3
13.5.607ð148.23.414ð1.6.086ð22.1.384ð168.0
14.0.588ð151.53.416ð7.5.086ð25.3.393ð174.7
14.5.559ð156.13.443ð14.1.088ð28.8.406178.1
15.0.535ð161.63.462ð20.8.089ð34.2.422171.4
15.5.506ð165.43.519ð27.4.092ð39.4.437164.2
16.0.474ð171.63.564ð34.3.092ð43.6.451156.3
16.5.445ð177.13.644ð41.8.095ð52.4.466150.0
17.0.397175.63.678ð49.8.097ð58.3.483142.0
17.5.356167.73.754ð58.6.097ð66.4.484134.8
18.0.299157.73.792ð67.6.094ð74.5.488126.3
22
S
5
Page 6
AMP. PARAMETERS
VDS = 2 V, ID = 10 mA
NE32584C
FREQUENCYGUmax.GAmax.| S21 |
Z
GH
2.029.5813.35ð31.40.16.04414.791.44
2.527.2713.24ð29.58.19.04412.671.37
3.025.4613.15ð28.44.25.04011.021.30
3.523.6512.93ð27.10.30.0419.531.20
4.022.1312.77ð26.26.37.0428.261.09
4.521.4312.66ð25.40.39.0397.741.02
5.020.1612.41ð24.82.44.0386.81.94
5.519.3212.29ð24.18.48.0396.14.88
6.018.6212.05ð23.83.52.0365.74.83
6.518.0011.91ð23.39.55.0385.32.77
7.017.5011.77ð23.16.59.0345.00.74
7.517.0711.61ð22.83.60.0374.76.70
8.016.5311.41ð22.62.64.0344.46.66
8.516.0611.28ð22.46.68.0364.13.65
9.015.7511.14ð22.44.72.0354.00.62
9.515.1810.95ð22.27.76.0313.62.60
10.014.8110.86ð22.21.81.03034.8493.36.59
10.514.3810.72ð22.02.85.03334.1813.09.57
11.014.2510.73ð21.68.84.0332.95.58
11.514.0410.72ð21.53.87.0322.75.57
12.013.8810.70ð21.55.89.0352.59.59
12.513.7310.74ð21.41.91.0342.38.62
13.013.5610.69ð21.36.94.03631.7042.22.65
13.513.3510.66ð21.34.98.03726.6091.99.69
14.013.2410.67ð21.321.00.03326.2431.85.73
14.513.1515.6110.74ð21.111.00.03727.1851.63.78
15.013.1015.7110.79ð21.051.01.03726.4531.46.85
15.513.1415.5910.93ð20.761.00.03628.8741.29.92
16.013.1315.2611.04ð20.771.01.03928.8261.11.99
16.513.2515.6511.23ð20.461.00.04230.042.961.06
17.013.2115.4511.31ð20.251.00.04431.112.751.16
17.513.2414.7311.49ð20.281.04.04926.111.591.16
18.013.1614.2011.58ð20.551.09.05022.789.411.18
dBdBdBdBnsdBdBdB
2
| S12 |
2
KDelayMason’sUG1G2
6
Page 7
S-PARAMETER
MAG. AND ANG.
VDS = 2 V, ID = 15 mA
NE32584C
FREQUENCYS
Z
GH
MAG.ANG.MAG.ANG.MAG.ANG.MAG.ANG.
11
21
S
12
S
(deg.)(deg.)(deg.)(deg.)
2.0.981ð30.45.265147.5.06271.1.484ð21.9
3.0.955ð44.85.113132.2.03760.9.460ð32.3
4.0.911ð59.04.878116.9.04752.4.426ð43.9
5.0.877ð71.44.647103.2.05543.1.396ð55.2
6.0.839ð82.94.43289.7.06135.6.371ð67.4
7.0.809ð93.54.26876.8.06728.1.351ð79.2
8.0.781ð103.14.08564.1.07022.6.334ð90.4
9.0.752ð112.73.94251.5.07515.5.325ð101.0
10.0.710ð120.63.80540.6.0799.1.319ð114.1
11.0.679ð128.73.73628.7.0822.3.318ð129.0
12.0.646ð136.23.72316.8.084ð5.0.324ð142.9
13.0.608ð143.93.7124.4.085ð13.4.343ð156.3
14.0.562ð151.53.699ð8.2.088ð20.8.365ð169.8
15.0.504ð160.63.738ð21.4.091ð29.5.395176.1
16.0.446ð170.53.845ð34.9.093ð40.4.429160.6
17.0.367177.03.949ð50.4.096ð54.5.466145.5
18.0.273160.94.050ð68.1.099ð72.1.473130.2
S-PARAMETER
MAG. AND ANG.
VDS = 2 V, ID = 20 mA
22
S
FREQUENCYS
Z
GH
MAG.ANG.MAG.ANG.MAG.ANG.MAG.ANG.
11
21
S
12
S
(deg.)(deg.)(deg.)(deg.)
2.0.979ð30.65.586147.1.02569.2.456ð21.4
3.0.950ð45.15.411131.7.03561.0.431ð31.4
4.0.907ð59.35.136116.3.04552.8.398ð42.3
5.0.869ð71.74.882102.6.05344.7.368ð53.4
6.0.832ð83.24.64489.2.05937.0.345ð65.3
7.0.801ð93.64.45976.4.06530.1.327ð76.8
8.0.772ð103.14.25563.7.07024.7.312ð87.4
9.0.744ð112.84.10851.3.07418.1.303ð97.7
10.0.702ð120.33.95840.2.07711.4.298ð110.8
11.0.671ð128.33.89128.5.0824.8.297ð125.7
12.0.634ð136.03.87116.7.086ð2.3.304ð139.0
13.0.597ð143.33.8564.3.087ð11.1.325ð153.3
14.0.551ð150.53.839ð8.2.090ð18.9.348ð166.8
15.0.495ð159.33.877ð21.6.094ð29.0.384179.4
16.0.434ð169.23.976ð34.7.094ð38.0.421163.1
17.0.357179.64.079ð50.2.098ð53.0.458148.0
18.0.261164.44.195ð67.7.098ð68.9.469132.4
22
S
7
Page 8
S-PARAMETER
MAG. AND ANG.
VDS = 1 V, ID = 10 mA
NE32584C
FREQUENCYS
Z
GH
MAG.ANG.MAG.ANG.MAG.ANG.MAG.ANG.
11
21
S
12
S
(deg.)(deg.)(deg.)(deg.)
2.0.987ð29.74.627148.3.02870.0.475ð22.4
3.0.964ð43.95.522133.2.04059.5.451ð33.0
4.0.927ð58.04.335118.2.05150.7.416ð44.9
5.0.894ð70.54.158104.5.06041.7.386ð57.0
6.0.860ð82.03.98791.0.06933.0.361ð69.9
7.0.833ð92.53.85478.2.07325.6.340ð82.0
8.0.806ð102.33.70165.4.07817.4.321ð94.2
9.0.780ð112.33.58752.8.08210.4.310ð105.3
10.0.739ð120.13.47541.6.0864.9.303ð119.5
11.0.710ð128.43.41729.8.090ð3.4.300ð135.2
12.0.673ð136.63.41517.7.092ð11.5.305ð149.4
13.0.634ð144.63.4105.3.092ð19.3.321ð163.9
14.0.588ð152.53.399ð7.4.095ð27.4.342ð177.3
15.0.532ð162.03.455ð20.7.100ð39.0.372168.5
16.0.473ð172.93.557ð34.3.103ð50.0.403152.2
17.0.392173.73.667ð49.9.107ð64.7.435137.4
18.0.298155.73.768ð67.9.111ð80.8.435121.6
S-PARAMETER
MAG. AND ANG.
VDS = 3 V, ID = 10 mA
22
S
FREQUENCYS
Z
GH
MAG.ANG.MAG.ANG.MAG.ANG.MAG.ANG.
11
21
S
12
S
(deg.)(deg.)(deg.)(deg.)
2.0.989ð29.24.146149.0.02769.6.548ð21.8
3.0.967ð43.14.067134.1.03859.5.525ð32.5
4.0.934ð57.23.923119.1.04850.5.492ð44.2
5.0.901ð69.63.779105.5.05541.0.464ð55.9
6.0.872ð81.03.64592.0.06234.5.439ð68.9
7.0.847ð91.73.54279.1.06625.9.420ð81.0
8.0.823ð101.63.41266.2.07019.2.400ð92.8
9.0.798ð111.63.31953.5.07112.8.391ð104.0
10.0.757ð119.43.22642.4.0757.3.382ð117.6
11.0.730ð127.73.18330.3.0770.3.376ð132.8
12.0.698ð135.93.18818.2.081ð6.0.379ð146.0
13.0.661ð144.13.1925.7.081ð13.0.395ð159.7
14.0.617ð152.53.185ð7.1.082ð20.4.415ð172.7
15.0.561ð162.23.239ð20.4.084ð29.2.440173.9
16.0.503ð173.33.353ð33.9.087ð38.8.474159.0
17.0.428172.53.459ð49.6.091ð52.5.506145.2
18.0.332153.53.579ð67.5.092ð68.5.515130.6
22
S
8
Page 9
NOISE PARAMETER
<TYPICAL CONSTANT NOISE FIGURE CIRCLE>
0.6
NE32584C
1
2
VDS = 2 V
I
D
= 10 mA
f = 12 GH
Z
0.2
Γ
opt
*
0.7 dB
0
0.2
0.8 dB
0.61.02.0
–0.2
–0.6
–1
<NOISE PARAMETER>
VDS = 2 V, ID = 10 mA
opt.
Freq.
(GHz)
NF
(dB)
min.
G
(dB)
a
MAG.ANG. (deg.)
2.00.2920.00.86220.27
4.00.3018.30.76450.25
6.00.3316.50.69700.18
8.00.3615.00.63960.11
10.00.4013.60.591220.08
12.00.4512.50.541470.04
14.00.5412.00.481710.04
16.00.6811.80.40ð1650.05
18.00.8511.50.31ð1440.06
*
5
∞
–5
–2
Rn/50
9
Page 10
NE32584C
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product.
Please consult with our sales offices in case other soldering process is used, or in case soldering is done under
different conditions.
<TYPES OF SURFACE MOUNT DEVICE>
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
(C10535E).
[NE32584C]
Soldering processSoldering conditionsSymbol
Infrared ray reflowPeak package’s surface temperature: 230 °C or below,
Reflow time: 30 seconds or below (210 °C or higher),
Number of reflow process: 1, Exposure limit*: None
Partial heating methodTerminal temperature: 230 °C or below,
Flow time: 10 seconds or below,
Exposure limit*: None
Exposure limit before soldering after dry-pack package is opened.
*
Storage conditions: 25 °C and relative humidity at 65 % or less.
Do not apply more than a single process at once, except for “Partial heating method”.
Note
PRECAUTION
Avoid high static voltage and electric fields, because this device is Hetero Junction field effect
transistor with shottky barrier gate.
Caution
The Great Care must be taken in dealing with the devices in this guide.
The reason is that the material of the devices is GaAs (Gallium Arsenide), which is
designated as harmful substance according to the law concerned.
Keep the law concerned and so on, especially in case of removal.
IR30-00
10
Page 11
[MEMO]
NE32584C
11
Page 12
NE32584C
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on
a customer designated "quality assurance program" for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96. 5
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