Datasheet MSA180RS, MSA180MS-K Datasheet (OKI)

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Page 1

E2D0049-39-21

¡ Semiconductor

This version: Feb. 1999

Previous version: May. 1997

MSA180¡ Semiconductor

MSA180

Piezo Speaker Amplifier

GENERAL DESCRIPTION

The MSA180 is a piezo speaker driver for OKI's speech synthesizers. Its voltage gain can be adjusted by a factor of up to 10. The differential output provides an amplitude of twice the voltage supply. A separate output connects to the base of an external transistor for controlling system voltage. A standby function eliminates power loss when no input signal is present.

FEATURES

• Power supply voltage : 2.0 V to 6.0 V (single supply voltage)

• Low current consumption : 4.2 mA typ (VCC=3 V, no load)

• Standby current : <1 mA

• Differential output : Twice the supply voltage (maximum output amplitube)

• Package options : 8-pin plastic DIP (DIP8-P-300-2.54) (Product name: MSA180RS) 8-pin plastic SOP (SOP8-P-250-1.27-K) (Product name: MSA180MS-K) Chip

BLOCK DIAGRAM

MODE1 MODE2

GND

Logic

18 kW

2.2 kW

AV=20

–

1.3 kW

=20

–

6.6 kW6.6 kW

BASE

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PIN CONFIGURATION (TOP VIEW)

MSA180¡ Semiconductor

MODE2

GND

MODE1

BASE

8-Pin Plastic DIP or 8-Pin Plastic SOP

PIN DESCRIPTIONS

Pin Type Description

6V 3 GND — Ground pin. 2A

8 MODE1 I

1 MODE2 I

7 BASE O

4 SP O

5SPO

Symbol

— Power supply pin.

I Voice signal input pin.

This pin switches the device between operation and standby modes. The IC is in operation mode if V standby mode if V

MODE2 must be connected to V This pin switches the device between operation and standby modes. The IC is in operation mode if V standby mode if V

MODE1 must be connected to GND. This pin is connected to the base of an external transistor. If an external transistor is not used to control system voltage, this pin must be left open. This is a speaker output pin that provides signals with the same phase as the input. This is a speaker output pin that provides signals with an inverted phase to the input.

< 0.3 V on the MODE1 pin. When MODE1 is used,

> VCC–0.3 V on MODE1 pin. When MODE2 is used

> 1.0 V on the MODE1 pin and is in

< VCC–1.0 V on MODE1 pin and is in

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ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Condition Rating Unit Remarks

Power Supply Voltage V

Input Voltage V

Maximum Output Current I

OMAX

Power Dissipation P

Junction Temperature T Storage Temperature T

jMAX

STG

— –0.3 to +6.5 V —

— –0.3 to VCC+0.3 V

VCC=3 V ±80 mA SP, SP

Ta=25°C

— 110 °C Chip — –55 to +150 °C —

RECOMMENDED OPERATING CONDITIONS

MSA180¡ Semiconductor

(Ta=25°C unless otherwise specified)

MODE1 MODE2

BASE

400 mW DIP type 340 mW SOP type

Parameter Symbol Min. Max. UnitCondition

Power Supply Voltage V Load Impedance Z Peak Load Current I

"H" Input Voltage

"L" Input Voltage

Operating Temperature T

O-P

IH1

IH2

IL1

IL2

Applied to MODE1 pin Applied to MODE2 pin Applied to MODE1 pin Applied to MODE2 pin

2.0 6.0 V—

200 — W—

— ±30 mA—

1.0 — V

VCC–0.3 — V

— 0.3 V —V

–1.0 V

–40 +85 °C—

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ELECTRICAL CHARACTERISTICS

Parameter Symbol Condition Min. Typ. Max. Unit

Voltage Gain

AIN Input Resistance R

Output DC Voltage

Output DC Offset Voltage

SP, SP Output "H" Voltage V SP, SP Output "L" Voltage V

Operating Current I

Circuit Current in Standby Mode I

AIN Input DC Bias Voltage V

MODE1 "H" Input Current I MODE2 "H" Input Current I MODE1 "L" Input Current I MODE2 "L" Input Current I

Base Output Current

A A

CCS

IH1

IH2

IL1

IL2

BO1

BO2

AIN

(Ta=25°C, V

=2 V to 6 V unless otherwise specified)

AINÆSP 4.25 5 5.75 V/V AINÆSP 4.25 5 5.75 V/V

AINÆ(SP-SP) 8.5 10 11.5 V/V

— 17.2 24.6 32.0 kW

=2 V 0.7 1.0 1.3 V

No signal

SP-SP

OUT

=6 V 2.5 3.5 4.6 V

=2 V — — 0.2 V

=6 V — — 0.6 V

=–10 mA VCC–0.25 — — V

=10 mA — — 0.25 V

=3 V

=•

BASE=Open

— 4.2 6.2 mA

MODE1=MODE2=GND

MODE1=MODE2=V

AIN=Open

—— 1 µAMODE1=GND

MODE2=V

VCC=2 V 0.18 0.26 0.34 V

=6 V 0.52 0.74 0.96 V

MODE1=V MODE2=V

— — 160 µA

—— 1 µA MODE1=GND –1 — — µA MODE2=GND –160 — — µA

VCC=2 V

0.4 — — mA

BASE=V

VCC=6 V

1.6 — — mA

BASE=V

MSA180¡ Semiconductor

*1 Typical value is VO = V

*2 Maximum value is DVO = V *3 Typical value is V

AIN

= V

¥ 0.625 – 0.25.

¥ 0.1.

¥ 0.12 + 0.02.

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MSA180¡ Semiconductor

APPLICATION CIRCUITS

How to Adjust Gain

Gain control adjustment of the input signal level is shown below. When using OKI's speech synthesizer devices, insert a diode in series with the variable resistor to reduce pop noise.

Signal

100 kW

0.1 mF

BASE

MODE2

MODE1

MSA180

PIEZO SPEAKER

GND

The circuit below also implements gain adjustment for a higher impedance signal source.

Signal

20 kW

0.1 mF

BASE

MODE2

MODE1

MSA180

GND

PIEZO SPEAKER

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MSA180¡ Semiconductor

How to Connect the Piezo Speaker

To achieve the full gain level of 10 V, even at a low supply voltage (VCC=3 V), connect a coil in series with the piezo speaker.

BASE

MODE2

MODE1

MSA180

COIL

PIEZO SPEAKER

GND

The resonance frequency that occurs in the circuit containing the coil and the piezo speaker is :

fQ =

2p C

¥ L

[Hz]

Where CL is the piezo capacitance and LL the coil inductance. For instance, if the piezo capacitance is 0.1 mF and fQ is in a range of 2 to 3 kHz, then the coil inductance should be 30 mH.

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MSA180¡ Semiconductor

Application Example for Circuits Containing the MSM6378A/MSM6379 Speech Synthesizers

This example shows how to connect the MSA180 with an MSM6378A or MSM6379 speech synthesizer using an external transistor and the MODE1 pin. The analog output of both synthesizers lowers to 0 V in their standby mode. For this reason, the voice signal can be used to control operation and standby modes of the MSA180. The circuit also controls the voltage via an external transistor. If this function is not used, leave the BASE pin open.

START SWITCH

MSM6378A

or MSM6379

GND

AOUT

R2 R1

MODE2

MODE1

BASE V

MSA180

GND

PIEZO SPEAKER

Operation Flow

1. When the start switch is pressed, power is supplied to the VDD pins on the MSM6378A or MSM6379, and operation mode is invoked. Voice output level then rises.

2. When operation mode is involved, the voice signal rises above the GND level, and MODE1 on MSA180 goes high (H).

3. The BASE pin on MSA180 goes low (L) to drive the external transistor for power-supply control.

4. The audio IC continues to operate using the external transistor as a power supply. The device continues to operate and voice sounds, even if the start switch is released at this time.

5. When the sound ends, MODE1 on MSA180 falls low (L), the voice signal falls to GND level, and standby mode ensues.

6. The external transistor for power-supply control is switched off, switching the voice synthesizer off because the power supply is switched off.

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MSA180¡ Semiconductor

Supplemental Information When Using a Voice Signal on the MODE1 Pin

When using the voice signal on MODE1, as in the circuit below, care must be taken regarding the voice input level. Application of the voice signal below V

level to the MODE1 pin causes the

IH1

MSA180 to switch into standby mode, interrupting the voice reproduction flow, and causing undesired noises.

Signal

MODE2

MODE1

BASE V

MSA180

PIEZO SPEAKER

GND

When using a voice signal lower than VIH, refer to the circuit below. With a low-pass filter consisting of R2 and C2, voice levels lower than V such that the input voltage on MODE1 is greater than V

Signal

R2 R1

are passed through. However, select values for R2 and C2

IH1

IH2

BASE V

MODE2

MSA180

PIEZO SPEAKER

MODE1

GND

The cutoff frequency of the low-pass filter is calculated as follows:

fC =

2p ¥ R2

¥ C2

[Hz]

For instance, if the cutoff frequency is 50 Hz, C2 is 0.1 mF and R2 is 30 kW. For a lower cutoff frequency, use a larger value for C2 or R2.

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MSA180¡ Semiconductor

Application Example for Circuits Containing MSM6375/MSM6650 Family Speech Synthesizers

The example below shows how to connect the MSA180 with the MSM6375 or MSM6650 family speech synthesizers using the synthesizer's BUSY output to control operation and standby mode of the MSA180. As voice output stops, BUSY rises to the "H" level. For this reason, MODE2 is used to control operation and standby modes of the MSA180.

MSM6650

or MSM6375

GND

AOUT

BUSY

MODE2

MODE1

BASE V

MSA180

GND

PIEZO SPEAKER

Notes: 1. The diode on A

2. This circuit makes use of the BUSY output of the speech synthesizer.

3. As the voice reproduction stops, BUSY outputs a "H" level to MODE2, setting the stand-

by function.

4. If MODE2 is used, MODE1 must be connected to GND.

5. Leave the BASE pin open if it is not used.

reduces pop noise.

OUT

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MSA180¡ Semiconductor

Application Example for Circuits Containing the MSM6388/MSM6588 Speech Recorders

The example below shows how to connect the MSA180 with the MSM6388 or MSM6588 family speech recording ICs using the recorders' STBY output to control operation and standby mode of the MSA180. As voice output stops, STBY rises to the "H" level. For this reason, MODE2 is used to control operation and standby modes of the MSA180.

MSM6388

or MSM6588

GND

AOUT

CS3(STBY)

MODE2

MODE1

BASE V

MSA180

GND

PIEZO SPEAKER

Notes: 1. The diode on A

2. This circuit makes use of the STBY output of the speech synthesizer.

3. As the voice reproduction stops, STBY outputs a "H" level to MODE2, setting the standby function.

4. If MODE2 is used, MODE1 must be connected to GND.

5. Leave the BASE pin open if it is not used.

reduces pop noise.

OUT

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MSA180¡ Semiconductor

Application Examples for Circuits Containing a Microcontroller or Other Peripheral Devices

The circuit below uses a voice signal which rises high in operation mode. The MODE1 pin is used. Be sure to connect the MODE2 pin to VCC pin.

Signal

BASE V

MODE2

PIEZO SPEAKER

Control Signal Input

MODE1

MSA180

GND

Note: If the BASE pin is not used, leave it open.

In the circuit below, the signal falls low in operation mode. The MODE2 pin is used. Be sure to connect the MODE1 pin to the GND pin.

Control Signal Input

Signal

Note: If the BASE pin is not used, leave it open.

BASE V

MODE2

MSA180

MODE1

GND

PIEZO SPEAKER

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OPERATING CHARACTERISTICS

MSA180¡ Semiconductor

Power Supply Voltage

No-Load Circuit Current

14 12 10

8 6 4 2

No-load circuit current [mA]

23456

Power supply [V]

Output "H" Voltage Characteristic

[V]

–V

–0.5

vs.

VCC=6 V

No-Load Circuit Current

vs.

Temperature Characteristic

14 12

VCC=6 V

8 6

VCC=3 V

VCC=2 V

4 2

No-load circuit current [mA]

–50 0 25 50 100

–25 75

Temperature [°C]

Output "H" Voltage

vs.

Temperature Characteristic

[V]

–V

–0.5

VCC=3 V

Ta=85°C

–1

VCC=2 V VCC=3 V

–1.5

Output "H" voltage V

–2

020304060

10 50 0 20 30 40 60

Output "L" Voltage Characteristic

[V]

1.5

0.5

Output "L" voltage V

020304060

10 50 0 20 30 40 60

Output current [mA]

VCC=3 V

VCC=2 V

Output current [mA]

VCC=6 V

–1

–1.5

Output "H" voltage V

–2

10 50

Temperature Characteristic

[V]

1.5

VCC=3 V

Ta=–40°C

0.5

Output "L" voltage V

10 50

Ta=25°C

Ta=–40°C

Output current [mA]

Output "L" Voltage

vs.

Ta=25°C

Ta=85°C

Output current [mA]

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MSA180¡ Semiconductor

[Magnification]

Ta=25°C

Voltage gain, A

23456

120 100

VCC=6 V

80 60

Power Supply Voltage

vs.

Voltage Gain

Ta=85°C

Ta=–40°C

Power Supply Voltage [V]

MODE1 Input voltage

vs.

Input Current

Voltage Gain

vs.

Temperature Characteristics

VCC=3 V

[Magnification]

VCC=2 V

Voltage gain, A

–25 75

–50 0 25 50 100

Temperature [°C]

MODE2 Input Voltage

vs.

Input Current

–20

VCC=2 V

–40 –60

VCC=3 V

VCC=6 V

MODE1 input current [µA]

–20

02346

1502346

MODE1 input voltage [V]

BASE Pin Output Current

vs.

Temperature Characteristic

2.5

VCC=6 V

1.5

0.5

BASE pin output current [mA]

02346

BASE voltage [V]

Ta=25°C

Ta=–40°C

Ta=85°C

–80

MODE2 input current [µA]

–100

VCC=6 V

–120

MODE2 input voltage [V]

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PAD CONFIGURATION

• Chip Layout Chip size : 2.00 mm ¥ 2.00 mm

Chip thickness : 350 µm ± 30 µm Pad size : 110 µm ¥ 110 µm

Board potential : GND potential

2 1 8 7

MSA180¡ Semiconductor

Y-axis

X-axis

3645

Pad Coordinates (Chip center: X=0, Y=0)

Pad name X-coordinate [mm] Y-coordinate [mm]Pad

MODE2 –655 8351

GND –835 –8353

SP –185 –7894 SP 121 –7895

BASE 793 8357

MODE1 613 8358

–835 8352

815 –8356

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PACKAGE DIMENSIONS

DIP8-P-300-2.54

MSA180¡ Semiconductor

(Unit : mm)

Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)

Epoxy resin 42 alloy Solder plating 5 mm or more

0.46 TYP.

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SOP8-P-250-1.27-K

Mirror finish

MSA180¡ Semiconductor

(Unit : mm)

Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)

Epoxy resin 42 alloy Solder plating 5 mm or more

0.10 TYP.

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person on the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).

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E2Y0002-29-11

NOTICE

1. The information contained herein can change without notice owing to product and/or

technical improvements. Before using the product, please make sure that the information being referred to is up-to-date.

2. The outline of action and examples for application circuits described herein have been

chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs.

3. When designing your product, please use our product below the specified maximum

ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature.

4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or

unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range.

5. Neither indemnity against nor license of a third party’s industrial and intellectual property

right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party’s right which may result from the use thereof.

6. The products listed in this document are intended for use in general electronics equipment

for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems.

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