Description
The ICX204AK is a diagonal 6mm (Type 1/3)
interline CCD solid-state image sensor with a square
pixel array and 800K effective pixels. Progressive
scan allows all pixels' signals to be output
independently. Also, the adoption of high frame rate
readout mode supports 60 frames per second. This
chip features an electronic shutter with variable
charge-storage time which makes it possible to
realize full-frame still image without a mechanical
shutter. High resolution and high color reproductivity
are achieved through the use of R, G, B primary color
mosaic filters. Further, high sensitivity and low dark
current are achieved through the adoption of HAD
(Hole-Accumulation Diode) sensors.
This chip is suitable for applications such as
electronic still cameras, PC input cameras, etc.
Features
• Progressive scan allows individual readout of the
image signals from all pixels.
• High horizontal and vertical resolution (both approx.
600TV-lines) still image without a mechanical shutter.
• Supports high frame rate readout mode
(effective 256 lines output, 15MHz drive: 45 frame/s,
20MHz drive: 60 frame/s)
• Square pixel
• Horizontal drive frequency: Typ.: 15MHz, Max.: 20MHz
• No voltage adjustments
(reset gate and substrate bias are not adjusted.)
• R, G, B primary color mosaic filters on chip
• High resolution, high color reproductivity,
high sensitivity, low dark current
• Low smear, excellent antiblooming characteristics
• Continuous variable-speed shutter
• Recommended range of exit pupil distance: –20 to –100mm
Device Structure
• Interline CCD image sensor
• Image size: Diagonal 6mm (Type 1/3)
• Total number of pixels: 1077 (H) × 788 (V) approx. 850K pixels
• Number of effective pixels: 1034 (H) × 779 (V) approx. 800K pixels
• Number of active pixels: 1024 (H) × 768 (V) approx. 790K pixels (diagonal 5.952mm)
• Chip size: 5.80mm (H) × 4.92mm (V)
• Unit cell size: 4.65µm (H) × 4.65µm (V)
• Optical black: Horizontal (H) direction: Front 3 pixels, rear 40 pixels
Vertical (V) direction: Front 7 pixels, rear 2 pixels
• Number of dummy bits: Horizontal 29
Vertical 1
• Substrate material: Silicon
Diagonal 6mm (Type 1/3) Progressive Scan CCD Image Sensor with Square Pixel for Color Cameras
– 1 –
E97X05B99
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
ICX204AK
16 pin DIP (Plastic)
∗
Wfine CCD is a registered trademark of Sony Corporation.
Represents a CCD adopting progressive scan, primary color filter and square pixel.
A
A
A
Pin 1
V
3
40
2
7
Pin 9
H
Optical black position
(Top View)
AAA
AAA
AAA
– 2 –
ICX204AK
Pin No. Symbol Description Pin No. Symbol Description
1
2
3
4
5
6
7
8
Vφ3
Vφ2B
Vφ1
Vφ2A
GND
NC
NC
VOUT
Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
GND
Signal output
9
10
11
12
13
14
15
16
VDD
GND
φSUB
CSUB
VL
φRG
Hφ1
Hφ2
Supply voltage
GND
Substrate clock
Substrate bias
∗1
Protective transistor bias
Reset gate clock
Horizontal register transfer clock
Horizontal register transfer clock
Pin Description
Note) : Photo sensor
V
OUT
NC
NC
GND
Vφ
2A
Vφ
1
Vφ
2B
Vφ
3
V
DD
GND
φSUB
C
SUB
V
L
φRG
Hφ
1
Hφ
2
G
B
G
B
G
B
G
R
G
R
G
R
G
R
G
B
G
B
G
B
G
R
G
R
G
R
G
R
Horizontal register
Vertical register
Note)
1
2
3
4
5
6
7
8
9
10
11
12
13
14 15
16
Block Diagram and Pin Configuration
(Top View)
∗1
DC bias is generated within the CCD, so that this pin should be grounded externally through a capacitance
of 0.1µF.
– 3 –
ICX204AK
Against φSUB
Against GND
Against VL
Between input
clock pins
Storage temperature
Operating temperature
Absolute Maximum Ratings
–40 to +10
–50 to +15
–50 to +0.3
–40 to +0.3
–25 to
–0.3 to +18
–10 to +18
–10 to +5
–0.3 to +28
–0.3 to +15
to +15
–5 to +5
–13 to +13
–30 to +80
–10 to +60
V
V
V
V
V
V
V
V
V
V
V
V
V
°C
°C
VDD, VOUT, φRG – φSUB
Vφ2A, Vφ2B – φSUB
Vφ1, Vφ3, VL – φSUB
Hφ1, Hφ2, GND – φSUB
CSUB – φSUB
VDD, VOUT, φRG, CSUB – GND
Vφ1, Vφ2A, Vφ2B, Vφ3 – GND
Hφ1, Hφ2 – GND
Vφ2A, Vφ2B – VL
Vφ1, Vφ3, Hφ1, Hφ2, GND – VL
Voltage difference between vertical clock input pins
Hφ1 – Hφ2
Hφ1, Hφ2 – Vφ3
Item Ratings Unit Remarks
∗2
+24V (Max.) when clock width < 10µs, clock duty factor < 0.1%.
+16V (Max.) is guaranteed for turning on or off power supply.
∗2
– 4 –
ICX204AK
Clock Voltage Conditions
Item
Readout clock voltage
VVT
VVH02A
VVH1, VVH2A,
VVH2B, VVH3
VVL1, VVL2A,
VVL2B, VVL3
Vφ1, Vφ2A,
Vφ2B, Vφ3
| VVL1 – VVL3 |
VVHH
VVHL
VVLH
VVLL
VφH
VHL
VφRG
VRGLH – VRGLL
VRGL – VRGLm
VφSUB
14.55
–0.05
–0.2
–8
7
3.0
–0.05
3.0
21.55
15.0
0
0
–7.5
7.5
3.3
0
3.3
22.5
15.45
0.05
0.05
–7
8
0.1
0.9
1.3
1.0
0.9
3.6
0.05
3.6
0.4
0.5
23.45
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
1
2
2
2
2
2
2
2
2
2
3
3
4
4
4
5
VVH = VVH02A
VVL = (VVL1 + VVL3)/2
High-level coupling
High-level coupling
Low-level coupling
Low-level coupling
Low-level coupling
Low-level coupling
Horizontal transfer
clock voltage
Reset gate clock
voltage
Substrate clock voltage
Vertical transfer clock
voltage
Symbol Min. Typ. Max. Unit
Waveform
diagram
Remarks
Bias Conditions
Item
Supply voltage
Protective transistor bias
Substrate clock
Reset gate clock
VDD
VL
φSUB
φRG
14.55
15.0
∗1
∗2
∗2
15.45 V
Symbol Min. Typ. Max. Unit Remarks
DC Characteristics
Item
Supply current
IDD 5.5 mA
Symbol Min. Typ. Max. Unit Remarks
∗1
VL setting is the VVL voltage of the vertical transfer clock waveform, or the same power supply as the VL
power supply for the V driver should be used.
∗2
Do not apply a DC bias to the substrate clock and reset gate clock pins, because a DC bias is generated
within the CCD.
– 5 –
ICX204AK
Clock Equivalent Circuit Constant
Item
Capacitance between vertical transfer clock and
GND
CφV1
CφV2A
CφV2B
CφV3
CφV12A
CφV2B1
CφV2A3
CφV32B
CφV13
CφV2A2B
CφH1, CφH2
CφHH
CφRG
CφSUB
R1
R2A
R2B
R3
RGND
RφH
1500
1800
2700
2200
390
680
560
1000
1800
33
18
43
3
390
91
68
62
30
43
10
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
pF
Ω
Ω
Ω
Ω
Ω
Ω
Capacitance between vertical transfer clocks
Capacitance between horizontal transfer clock
and GND
Capacitance between horizontal transfer clocks
Capacitance between reset gate clock and GND
Capacitance between substrate clock and GND
Vertical transfer clock series resistor
Vertical transfer clock ground resistor
Horizontal transfer clock series resistor
Symbol Min. Typ. Max. Unit Remarks
RφH RφH
Hφ2Hφ1
CφH1 CφH2
CφHH
Vφ1
CφV12A
Vφ2A
Vφ2B Vφ3
CφV32B
CφV2A3CφV2B1
CφV13
CφV1 CφV2A
CφV2B CφV3
RGND
R2B
R1
R3
R2A
Vertical transfer clock equivalent circuit Horizontal transfer clock equivalent circuit
CφV2A2B
– 6 –
ICX204AK
Drive Clock Waveform Conditions
(1) Readout clock waveform
(2) Vertical transfer clock waveform
II II
100%
90%
10%
0%
VVT
tr twh tf
φM
0V
φM
2
Vφ1
Vφ3
Vφ2A, Vφ2B
VVH1
VVHH VVH
VVHL
VVLH
VVL1
VVL01
VVL
VVLL
VVH3
VVHH VVH
VVHL
VVLH
VVL03
VVL
VVLL
VφV1 = VVH1 – VVL01
VφV2A = VVH02A – VVL2A
VφV2B = VVH02B – VVL2B
VφV3 = VVH3 – VVL03
VVH = VVH02A
VVL = (VVL01 + VVL03) / 2
VVL3 = VVL03
VVLH
VVL2A, VVL2B
VVLL
VVL
VVH
VVHH
VVH02A, VVH02B
VVH2A, VVH2B
VVHL
VT
Note) Readout clock is used by composing vertical transfer clocks Vφ2A and Vφ2B.
– 7 –
ICX204AK
twh tftr
90%
10%
V
HL
twl
Hφ1
two
Hφ2
VRGL
VRGLL
VRGLH
twl
V
RGH
RG waveform
VRGLm
tr
VφH
2
twh tf
V
CR
Point A
(3) Horizontal transfer clock waveform
(4) Reset gate clock waveform
VφH
VφRG
Cross-point voltage for the Hφ1 rising side of the horizontal transfer clocks Hφ1 and Hφ2 waveforms is VCR.
The overlap period for twh and twl of horizontal transfer clocks Hφ1 and Hφ2 is two.
VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from
Point A in the above diagram until the rising edge of RG.
In addition, VRGL is the average value of VRGLH and VRGLL.
VRGL = (VRGLH + VRGLL)/2
Assuming VRGH is the minimum value during the interval twh, then:
VφRG = VRGH – VRGL.
Negative overshoot level during the falling edge of RG is VRGLm.
(5) Substrate clock waveform
90%
100%
10%
0%
V
SUB
(A bias generated within the CCD)
tr twh tf
φM
φM
2
VφSUB
– 8 –
ICX204AK
Readout clock
Vertical transfer
clock
During
imaging
During
parallel-serial
conversion
Reset gate clock
Substrate clock
VT
Vφ1, Vφ2A,
Vφ2B, Vφ3
Hφ1
Hφ2
Hφ1
Hφ2
φRG
φSUB
2.3
12.5
12.5
7
2.5
17
17
8.2
10
2.2
12.5
12.51717
8.2
34
0.5
8
8
0.01
0.01
3
12.5
12.5
0.5
15
0.5
8
8
0.01
0.01
3
350
12.5
12.5
0.5
µs
ns
ns
µs
ns
µs
During readout
∗1
∗2
During drain
charge
Horizontal
transfer clock
Item Symbol
twh twl tr tf
Min. Typ.
Max.
Min. Typ.
Max.
Min. Typ.
Max.
Min. Typ.
Max.
Unit Remarks
Horizontal transfer clock Hφ1, Hφ2 10.5 17 ns
Item
Symbol
two
Min. Typ.
Max.
Unit
Remarks
∗1
When vertical transfer clock driver CXD1267AN is used.
∗2
tf ≥ tr – 2ns, and the cross-point voltage (VCR) for the Hφ1 rising side of the Hφ1 and Hφ2 waveforms must be
at least VφH/2 [V].
Clock Switching Characteristics
Relative Response
0
0.2
0.4
0.6
0.8
1
Wave Length [nm]
400 500 600 700
R
G
B
Spectral Sensitivity Characteristics (excludes lens characteristics and light source characteristics)
– 9 –
ICX204AK
Image Sensor Characteristics (Ta = 25°C)
Item
G sensitivity
Sensitivity
comparison
Saturation signal
Smear
Video signal shading
Uniformity between video
signal channels
Dark signal
Dark signal shading
Line crawl G
Line crawl R
Line crawl B
Lag
Sg
Rr
Rb
Vsat
Sm
SHg
∆Srg
∆Sbg
Vdt
∆Vdt
Lcg
Lcr
Lcb
Lag
320
0.4
0.3
450
400
0.55
0.45
0.001
0.7
0.6
0.004
20
25
8
8
6
2
3.8
3.8
3.8
0.5
mV
mV
%
%
%
%
%
mV
mV
%
%
%
%
1
1
1
2
3
4
4
5
5
6
7
8
8
8
9
1/30s accumulation
Ta = 60°C
No electronic shutter
Zone 0 and I
Zone 0 to II'
Ta = 60°C, 20 frame/s
Ta = 60°C, 20 frame/s
Symbol
Min. Typ. Max. Unit
Measurement
method
Remarks
Zone Definition of Video Signal Shading
5
4
779 (V)
44
1034 (H)
V
10
H
8
H
8
V
10
Effective pixel region
Ignored region
Zone 0, I
Zone II, II'
R
B
Measurement System
CCD
C.D.S
S/H
AMP
CCD signal output [∗A]
Gr/Gb channel signal output [∗B]
Gr/Gb
S/H
R/B
R/B channel signal output [∗C]
Note) Adjust the amplifier gain so that the gain between [∗A] and [∗B], and between [∗A] and [∗C] equals 1.
– 10 –
ICX204AK
Image Sensor Characteristics Measurement Method
Color coding and readout of this image sensor
The primary color filters of this image sensor are arranged in the layout
shown in the figure on the left (Bayer arrangement).
Gr and Gb denote the G signals on the same line as the R signal and
the B signal, respectively.
All pixel signals are output successively in a 1/20s period.
The R signal and Gr signal lines and the Gb signal and B signal lines are output successively.
Horizontal register
Gb
R
Gb
R
B
Gr
B
Gr
Gb
R
Gb
R
B
Gr
B
Gr
Color Coding Diagram
– 11 –
ICX204AK
Readout modes
The diagram below shows the output methods for the following two readout modes.
G
R
G
R
R
G
R
B
G
B
G
G
B
G
7
6
5
4
3
2
1
V
OUT
7
6
5
4
3
2
1
V
OUT
G
R
R
G
R
G
R
G
R
G
B
G
B
G
B
12
11
10
9
8
12
11
10
9
8
G
R
G
R
R
G
B
G
G
B
G
B
G
B
G
B
G
B
G
Progressive scan mode
High frame rate readout mode
Note) Blacked out portions in the diagram indicate pixels which are not read out.
Output starts from the line 7 in high frame rate readout mode.
1. Progressive scan mode
In this mode, all pixel signals are output in non-interlace format in 1/20s.
The vertical resolution is approximately 600TV-lines and all pixel signals within the same exposure period
are read out simultaneously, making this mode suitable for high resolution image capturing.
2. High frame rate readout mode
All effective areas are scanned in approximately 1/60s by reading out one line for every three lines. The
vertical resolution is approximately 200TV-lines.
This readout mode emphasizes processing speed over vertical resolution.
– 12 –
ICX204AK
Measurement conditions
1) In the following measurements, the device drive conditions are at the typical values of the progressive scan
mode, bias and clock voltage conditions.
2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical
black level (OB) is used as the reference for the signal output, which is taken as the value of the Gr/Gb
signal output or the R/B signal output of the measurement system.
Definition of standard imaging conditions
1) Standard imaging condition I:
Use a pattern box (luminance: 706cd/m2, color temperature of 3200K halogen source) as a subject. (Pattern
for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter
and image at F5.6. The luminous intensity to the sensor receiving surface at this point is defined as the
standard sensitivity testing luminous intensity.
2) Standard imaging condition II:
Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles.
Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted
to the value indicated in each testing item by the lens diaphragm.
3) Standard imaging condition III:
Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles.
Use a testing standard lens (exit pupil distance –33mm) with CM500S (t = 1.0mm) as an IR cut filter. The
luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm.
1. G sensitivity, sensitivity comparison
Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of
1/100s, measure the signal outputs (VGr, VGb, VR and VB) at the center of each Gr, Gb, R and B channel
screen, and substitute the values into the following formulas.
VG = (VGr + VGb)/2
Sg = VG × 100/30 [mV]
Rr = VR/VG
Rb = VB/VG
2. Saturation signal
Set to standard imaging condition II. After adjusting the luminous intensity to 20 times the intensity with the
average value of the Gr signal output, 150mV, measure the minimum values of the Gr, Gb, R and B signal
outputs.
3. Smear
Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, first adjust the average value of
the Gr signal output to 150mV. Measure the average values of the Gr signal output, Gb signal output, R
signal output and B signal output (Gra, Gba, Ra, Ba), and then adjust the luminous intensity to 500 times
the intensity with the average value of the Gr signal output, 150mV. After the readout clock is stopped and
the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum
value (VSm [mV]) independent of the Gr, Gb, R and B signal outputs, and substitute the values into the
following formula.
Sm = Vsm ÷ × × × 100 [%] (1/10V method conversion value)
1
500
Gra + Gba + Ra + Ba
4
1
10
– 13 –
ICX204AK
4. Video signal shading
Set to standard imaging condition III. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity
so that the average value of the Gr signal output is 150mV. Then measure the maximum (Grmax [mV]) and
minimum (Grmin [mV]) values of the Gr signal output and substitute the values into the following formula.
SHg = (Grmax – Grmin)/150 × 100 [%]
5. Uniformity between video signal channels
After measuring 4, measure the maximum (Rmax [mV]) and minimum (Rmin [mV]) values of the R signal
and the maximum (Bmax [mV]) and minimum (Bmin [mV]) values of the B signal, and substitute the values
into the following formulas.
∆Srg = (Rmax – Rmin)/150 × 100 [%]
∆Sbg = (Bmax – Bmin)/150 × 100 [%]
6. Dark signal
Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature 60°C and
the device in the light-obstructed state, using the horizontal idle transfer level as a reference.
7. Dark signal shading
After measuring 6, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark
signal output and substitute the values into the following formula.
∆Vdt = Vdmax – Vdmin [mV]
8. Line crawl
Set to standard imaging condition II. Adjusting the luminous intensity so that the average value of the Gr
signal output is 150mV, and then insert R, G and B filters and measure the difference between G signal
lines (∆Glr, ∆Glg, ∆Glb [mV]) as well as the average value of the G signal output (Gar, Gag, Gab).
Substitute the values into the following formula.
Lci = ∆Gli/Gai × 100 [%] (i = r, g, b)
9. Lag
Adjust the Gr signal output value generated by strobe light to 150mV. After setting the strobe light so that it
strobes with the following timing, measure the residual signal (Vlag). Substitute the value into the following
formula.
Lag = (Vlag/150) × 100 [%]
Vlag (lag)Gr signal output 150mV
Light
VD
Strobe light
timing
Output
V2A
– 14 –
ICX204AK
Drive Circuit
22/16V
3.3/20V
47
1.8k
–7.5V
3.3/16V
1/35V
0.1
1M
2SK1875
CCD OUT
2200p
100k
0.1
CXD1267AN
XSUB
XV1
XV2A
XSG1
XV2B
XSG2
XV3
15V
22/20V
Vφ
3
Vφ
2B
Vφ
1
Vφ
2A
GND
NC
NC
V
OUT
Hφ
2
Hφ
1
φRG
V
L
C
SUB
φSUB
GND
V
DD
ICX204
(BOTTOM VIEW)
Hφ2
Hφ1
φRG
0.01
0.1
1
2
3
4
5
6
7
8
9
10
11
12
13
1415
16
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
1
– 15 –
ICX204AK
XV1
XV2A/XV2B
XV3
HD
V1
V2A/V2B
V3
42.4µs (848 bits)
2.55µs (51 bits)
0.1µs (2 bits)
XSG1/XSG2
Sensor readout clocks XSG1 and XSG2 are used by composing XV2A and XV2B.
Sensor Readout Clock Timing Chart Progressive Scan Mode
– 16 –
ICX204AK
HD
V1
V2A
V3
42.4µs (848 bits)
0.1µs (2 bits)
V2B
2.55µs (51 bits)
5.0µs (100 bits)
XV1
XV2A/XV2B
XV3
XSG1
XSG2
Sensor readout clock XSG1 is used by composing XV2A.
2.7µs (54 bits)
10 bits
8 bits
Sensor Readout Clock Timing Chart High Frame Rate Readout Mode
– 17 –
ICX204AK
HD
V1
V2A
V3
CCD
OUT
788
790
VD
1
9
10
792
792
1
1 2 3 4 5 6 7 1 2 3
V2B
5 6 7 1 21 2 3 4 3 4
779
Drive Timing Chart (Vertical Sync) Progressive Scan Mode
– 18 –
ICX204AK
VD
HD
V1
V2B
V3
CCD
OUT
260
265
270
275
280
285
525
1
10
15
20
5
757
760
763
766
10
13
16
769
772
7
10
13
16
7
19
22
25
28
31
19
22
25
28
31
V2A
FLD
BLK
262
520
757
760
763
766
769
772
Note) Vertical OB and aperture lines 1, 4, 775 and 778 are not output.
Drive Timing Chart (Vertical Sync) High Frame Rate Readout Mode
– 19 –
ICX204AK
V1
V2A
V3
RG
SHP
SHD
CLK
HD
BLK
94
246
SUB
H1
H2
1
100
1
64
1
40
1
80
1
44
1
60
1
44
1
24
1
60
1
1270
1
1
1
209
1
241
1
1
48
1
56
V2B
1
40
1
80
1
80
2.0µs
Note) 1 unit: 50ns
164
238
29
45
45
Drive Timing Chart (Horizontal Sync) Progressive Scan Mode
– 20 –
ICX204AK
V1
V2A
V3
RG
SHP
SHD
CLK
HD
BLK
94
246
SUB
H1
H2
1 28
28
1 10 20
1
1
10
1 64
1
1270
1
1 1
1
238
29
241
1
1
44
1 56
V2B
1 26
1 28
1 26
1 28
1
26
1 28
1 26
1 28
1
26
1
1 10 20
1 26
1 28
1 26
1 28
1 26
1
18
1 28
1 26
1 28
1 26
1 28
1
Note) 1unit: 50ns
45
45
209
164
Drive Timing Chart (Horizontal Sync) High Frame Rate Readout Mode
– 21 –
ICX204AK
Notes on Handling
1) Static charge prevention
CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following
protective measures.
a) Either handle bare handed or use non-chargeable gloves, clothes or material.
Also use conductive shoes.
b) When handling directly use an earth band.
c) Install a conductive mat on the floor or working table to prevent the generation of static electricity.
d) Ionized air is recommended for discharge when handling CCD image sensor.
e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges.
2) Soldering
a) Make sure the package temperature does not exceed 80°C.
b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W
soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently.
c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering
tool, use a thermal controller of the zero cross On/Off type and connect it to ground.
3) Dust and dirt protection
Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and
dirt. Clean glass plates with the following operation as required, and use them.
a) Perform all assembly operations in a clean room (class 1000 or less).
b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should
dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized
air is recommended.)
c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass.
d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when
moving to a room with great temperature differences.
e) When a protective tape is applied before shipping, just before use remove the tape applied for
electrostatic protection. Do not reuse the tape.
4) Installing (attaching)
a) Remain within the following limits when applying a static load to the package. Do not apply any load more
than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited
portions. (This may cause cracks in the package.)
b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the
package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for
installation, use either an elastic load, such as a spring plate, or an adhesive.
Compressive strength
50N
Cover glass
Plastic package
50N
1.2Nm
Torsional strength
– 22 –
ICX204AK
c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated
voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area,
and indicated values should be transferred to the other locations as a precaution.
d) The notch of the package is used for directional index, and that can not be used for reference of fixing.
In addition, the cover glass and seal resin may overlap with the notch of the package.
e) If the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be
generated by the fragments of resin.
f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyano-
acrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference)
5) Others
a) Do not expose to strong light (sun rays) for long periods, color filters will be discolored. When high
luminance objects are imaged with the exposure level control by electronic-iris, the luminance of the
image-plane may become excessive and discolor of the color filter will possibly be accelerated. In such a
case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the power-off
mode should be properly arranged. For continuous using under cruel condition exceeding the normal
using condition, consult our company.
b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or
usage in such conditions.
c) The brown stain may be seen on the bottom or side of the package. But this does not affect the CCD
characteristics.
PACKAGE STRUCTURE
0.3
16pin DIP (450mil)
H
V
2.5
2.5
8.4
0.5
1.2
5.7
6.1
10.3
12.2 ± 0.1
9.5
11.4 ± 0.1
11.43
0.25
0° to 9°
8
1
16
9
2-R0.5
2.5
11.6
9.2
2.5
1.2
3.35 ± 0.15
3.1
1.27
3.5 ± 0.3
0.46
0.3
1.27
0.69
(For the first pin only)
1. “A” is the center of the effective image area.
2. The two points “B” of the package are the horizontal reference.
The point “B'” of the package is the vertical reference.
3. The bottom “C” of the package, and the top of the cover glass “D”
are the height reference.
4. The center of the effective image area relative to “B” and “B'”
is (H, V) = (6.1, 5.7) ± 0.15mm.
5. The rotation angle of the effective image area relative to H and V is ± 1°.
6. The height from the bottom “C” to the effective image area is 1.41 ± 0.10mm.
The height from the top of the cover glass “D” to the effective image area is 1.94 ± 0.15mm.
7. The tilt of the effective image area relative to the bottom “C” is less than 50µm.
The tilt of the effective image area relative to the top “D” of the cover glass is less than 50µm.
8. The thickness of the cover glass is 0.75mm, and the refractive index is 1.5.
9. The notches on the bottom of the package are used only for directional index, they must
not be used for reference of fixing.
C
B
A
D
M
B'
~
~
~
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE WEIGHT
Plastic
GOLD PLATING
42 ALLOY
0.9g
– 23 –
ICX204AK
Package Outline Unit: mm
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