Datasheet ICX084AK Datasheet (Sony)

Page 1

Description

The ICX084AK is a diagonal 6mm (Type 1/3) interline CCD solid-state image sensor with a square pixel array which supports VGA format. Progressive scan allows all pixels signals to be output independently within approximately 1/30 second. This chip features an electronic shutter with variable charge-storage time which makes it possible to realize full-frame still image without a mechanical shutter. High resolution and high color reproductivity are achieved through the use of R, G, B primary color mosaic filters. Further, high sensitivity and low dark current are achieved through the adoption of HAD (Hole-Accumulation Diode) sensors.

This chip is suitable for applications such as electronic still cameras, PC input cameras, etc.

Features

• Progressive scan allows individual readout of the

image signals from all pixels.

• High vertical resolution (480TV-lines) still image

without a mechanical shutter.

• Square pixel unit cell

• Supports VGA format

• Horizontal drive frequency: 12.27MHz

• No voltage adjustments

(reset gate and substrate bias are not adjusted.)

• R, G, B primary color mosaic filters on chip

• High resolution, high color reproductivity, high

sensitivity, low dark current

• Continuous variable-speed shutter

1/30 (typ.) to 1/10000s

• Low smear

• Excellent antiblooming characteristics

• Horizontal register: 5V drive

• 16-pin high precision plastic package (enables dual-

surface standard)

Device Structure

• Interline CCD image sensor

• Image size: Diagonal 6mm (Type 1/3)

• Number of effective pixels: 659 (H) × 494 (V) approx. 330K pixels

• Total number of pixels: 692 (H) × 504 (V) approx. 350K pixels

• Chip size: 5.84mm (H) × 4.94mm (V)

• Unit cell size: 7.4µm (H) × 7.4µm (V)

• Optical black: Horizontal (H) direction: Front 2 pixels, rear 31 pixels

Vertical (V) direction: Front 8 pixels, rear 2 pixels

• Number of dummy bits: Horizontal 16

Vertical 5

• Substrate material: Silicon

– 1 –

ICX084AK

E95101E99

Diagonal 6mm (Type 1/3) Progressive Scan CCD Image Sensor with Square Pixel for Color Cameras

Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.

16 pin DIP (Plastic)

Pin 1

Pin 9

Optical black position

(Top View)

∗

Wfine CCD is a registered trademark of Sony Corporation. Represents a CCD adopting progressive scan, primary color filter and square pixel.

AAA AAA AAA

Page 2

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ICX084AK

Pin No. Symbol Description Pin No. Symbol Description

1 2 3

4 5 6 7 8

Vφ3 Vφ2 Vφ1

NC GND CGG GND VOUT

Vertical register transfer clock Vertical register transfer clock Vertical register transfer clock

GND Output amplifier gate

∗1

GND Signal output

9 10 11

12 13 14 15 16

VDD SUBCIR GND

φSUB VL RG Hφ1 Hφ2

Supply voltage Supply voltage for the substrate

voltage generation GND

Substrate clock Protective transistor bias Reset gate clock Horizontal register transfer clock Horizontal register transfer clock

Pin Description

Note)

Note) : Photo sensor

OUT

GND

Vφ

SUBCIR

GND

φSUB

Hφ

Horizontal register

G B G B R G R G G B G B R G R G G B G B R G R G

Vertical register

14 15

Block Diagram and Pin Configuration

(Top View)

Item

–0.3 to +36 –0.3 to +18

–22 to +9

–15 to +16

to +10 to +15

to +16 –16 to +16 –10 to +15 –55 to +10

–65 to +0.3 –0.3 to +27.5 –0.3 to +20.5 –0.3 to +17.5

–30 to +80 –10 to +60

V V V V V V V V V V V V V

V °C °C

∗2

Ratings Unit Remarks

Absolute Maximum Ratings

∗2

+24V (Max.) when clock width < 10µs, clock duty factor < 0.1%.

Substrate clock φSUB – GND

VDD, VOUT, CGG, SUBCIR – GND

Supply voltage

VDD, VOUT, CGG, SUBCIR – φSUB Vφ1, Vφ2, Vφ3 – GND

Clock input voltage

Vφ1, Vφ2, Vφ3 – φSUB Voltage difference between vertical clock input pins Voltage difference between horizontal clock input pins Hφ1, Hφ2 – Vφ3 Hφ1, Hφ2 – GND Hφ1, Hφ2 – φSUB VL – φSUB Vφ2, Vφ3 – VL RG– GND Vφ1, Hφ1, Hφ2, GND– VL Storage temperature Operating temperature

∗1

DC bias is applied within the CCD, so that this pin should be grounded externally through a capacitance of 1000pF or more.

Page 3

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ICX084AK

Item

VDD VL φSUB

14.55 15.4515.0

∗1 ∗2

Symbol Min. Typ. Max. Unit Remarks

Bias Conditions

DC Characteristics

Supply voltage Protective transistor bias Substrate clock

Item

Supply current IDD 6 8 mA

Symbol Min. Typ. Max.

Unit

Remarks

Item

Readout clock voltage

VVT VVH02 VVH1, VVH2, VVH3 VVL1, VVL2, VVL3 Vφ1, Vφ2, Vφ3 I VVL1 – VVL3 I VVHH VVHL VVLH VVLL VφH VHL

VφRG VRGLH – VRGLL VRGH VφSUB

14.55 –0.05

–0.2 –8.0

6.8

4.75

–0.05

4.5

VDD

+0.4

21.5

15.0 0 0

–7.5

7.5

5.0 0

5.0

VDD

+0.6

22.5

15.45

0.05

0.05 –7.0

8.05

0.1

1.0

2.3

1.0

5.25

0.05

5.5

0.8

VDD

+0.8

23.5

V V V V V V V V V V V V

V V

1 2 2 2 2 2 2 2 2 2 3 3

4 4

VVH = VVH02

VVL = (VVL1 + VVL3)/2

High-level coupling High-level coupling Low-level coupling Low-level coupling

Input through 0.01µF capacitance

Low-level coupling

Horizontal transfer clock voltage

Reset gate clock voltage

Substrate clock voltage

Vertical transfer clock voltage

Symbol Min. Typ. Max. Unit

Waveform

diagram

Remarks

Clock Voltage Conditions

∗1

VL setting is the VVL voltage of the vertical transfer clock waveform, or the same power supply as the VL power supply for the V driver should be used.

∗2

Set SUBCIR pin to open when applying a DC bias to the substrate clock pin.

Page 4

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ICX084AK

Clock Equivalent Circuit Constant

Item

Capacitance between vertical transfer clock and GND

CφV1 CφV2 CφV3 CφV12 CφV23 CφV31

CφH1, CφH2

CφHH

CφRG

CφSUB R1, R2

R3 RGND RφH1, RφH2 RφRG

560

470 1500 1500 1500 1000

570

20 56 43 10 39

pF pF pF pF pF pF

Ω Ω Ω Ω Ω

Capacitance between vertical transfer clocks

Capacitance between horizontal transfer clock and GND

Vertical transfer clock series resistor

Vertical transfer clock ground resistor Horizontal transfer clock series resistor Reset gate clock series resistor

Symbol Min. Typ. Max. Unit

Remarks

Vertical transfer clock equivalent circuit Horizontal transfer clock equivalent circuit

RφRG

RGφ

Cφ

Reset gate clock equivalent circuit

RφH1 RφH2

Hφ2

CφH1 CφH2

CφHH

Vφ1

CφV12

Vφ2

Vφ3

CφV2

RGND

CφV1

Cφv31

Cφv23

Hφ1

CφV3

Capacitance between horizontal transfer clocks

Capacitance between reset gate clock and GND

Capacitance between substrate clock and GND

Page 5

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ICX084AK

Drive Clock Waveform Conditions

(1) Readout clock waveform

(2) Vertical transfer clock waveform

II II

100%

90%

10%

VVT

tr twh tf

φM

Vφ1

Vφ3

Vφ2

VVH1

VVHH VVH

VVHL

VVLH

VVL1

VVL01

VVL

VVLL

VVH3

VVHH

VVH

VVHL

VVLH

VVL03

VVL

VVLL

VφV1 = VVH1 – VVL01 VφV2 = VVH02 – VVL2 VφV3 = VVH3 – VVL03

VVH = VVH02 VVL = (VVL01 + VVL03)/2 VVL3 = VVL03

VVLH

VVL2

VVLL

VVL

VVH

VVHH

VVH02

VVH2

VVHL

Note) Readout clock is used by composing vertical transfer clocks Vφ2 and Vφ3.

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ICX084AK

(3) Horizontal transfer clock waveform

tr twh tf

90%

10%

twl

Vφ

VHL

Hφ1, Hφ2

(4) Reset gate clock waveform

Point A

twl

Vφ

VRGH

VRGL + 0.5V V

RGL

VRGLH

RG waveform

VRGLL

Hφ1 waveform

twhtr tf

2.5V

VRGLH is the maximum value and VRGLL is the minimum value of the coupling waveform during the period from Point A in the above diagram until the rising edge of RG. In addition, VRGL is the average value of VRGLH and VRGLL.

VRGL = (VRGLH + VRGLL)/2

Assuming VRGH is the minimum value during the interval twh, then:

VφRG = VRGH – VRGL

(5) Substrate clock waveform

90%

100%

10%

SUB

tr twh tf

φM

φSUB

VφSUB

(A bias generated within the CCD)

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ICX084AK

Readout clock Vertical transfer

clock

During imaging

During parallelserial conversion

Reset gate clock

Substrate clock

VT Vφ1,

Vφ2, Vφ3 Hφ1 Hφ2 Hφ1 Hφ2

φRG

φSUB

2.3

26.5

1.5

2.5

31.5

1.8

25 25

31.5 30

62.5

0.5

10 10

0.01

0.01 3

17.5 15

0.5

10 10

0.01

0.01 3

350

17.5 15

0.5

µs

During readout

∗1

∗2

During drain charge

Horizontal transfer clock

Item Symbol

twh twl tr tf

Min. Typ.

Max.

Min. Typ.

Max.

Min. Typ.

Max.

Min. Typ.

Max.

Unit Remarks

Horizontal transfer clock Hφ1, Hφ2 21.5 25.5

∗3

Item

Symbol

two

Min. Typ.

Max.

Unit

Remarks

∗1

When vertical transfer clock driver CXD1267AN is used.

∗2

tf ≥ tr – 2ns, and the cross-point voltage (VCR) for the Hφ1 rising side of the Hφ1 and Hφ2 waveforms must be at least 2.5V.

∗3

The overlap period for twh and twl of horizontal transfer clocks Hφ1 and Hφ2 is two.

Clock Switching Characteristics

Page 8

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ICX084AK

Image Sensor Characteristics (Ta = 25°C)

Item

G sensitivity Sensitivity

comparison Saturation signal

Smear

Video signal shading

Uniformity between video signal channels

Dark signal Dark signal shading Line crawl G Line crawl R Line crawl B Lag

Sg Rr Rb Vsat Sm

SHg

∆Srg ∆Sbg

Vdt ∆Vdt Lcg Lcr Lcb Lag

300

0.3

0.4

500

450

0.45

0.55

0.005

0.6

0.7

0.015 20 25

8 8 4 1

3.8

0.5

% % % %

% mV mV

1 1 1 2 3 4 4 5 5 6 7 8 8 8 9

Ta = 60°C

Zone 0 and I

Zone 0 to II'

Ta = 60°C Ta = 60°C

Symbol Min. Typ. Max. Unit

Measurement method

Remarks

Zone Definition of Video Signal Shading

494 (V)

1212

659 (H)

H 8

Effective pixel region

Zone 0, I

Zone II, II'

Ignored region

R B

Measurement System

CCD

C.D.S

S/H

AMP

CCD signal output [∗A]

Gr/Gb channel signal output [∗B]

Gr/Gb

S/H

R/B

R/B channel signal output [∗C]

Note) Adjust the amplifier gain so that the gain between [∗A] and [∗B], and between [∗A] and [∗C] equals 1.

Page 9

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ICX084AK

Image Sensor Characteristics Measurement Method

Measurement conditions

1) In the following measurements, the device drive conditions are at the typical values of the bias and clock voltage conditions.

2) In the following measurements, spot blemishes are excluded and, unless otherwise specified, the optical black level (OB) is used as the reference for the signal output, which is taken as the value of the Gr/Gb signal output or the R/B signal output of the measurement system.

Color coding and readout of this image sensor

The primary color filters of this image sensor are arranged in the layout shown in the figure on the left (Bayer arrangement). Gr and Gb denote the G signals on the same line as the R signal and the B signal, respectively.

All pixels signals are output successively in a 1/30s period. The R signal and Gr signal lines and the Gb signal and B signal lines are output successively.

Horizontal register

Color Coding Diagram

Page 10

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ICX084AK

Definition of standard imaging conditions

1) Standard imaging condition I : Use a pattern box (luminance 706cd/m2, color temperature of 3200K halogen source ) as a subject. (Pattern for evaluation is not applicable.) Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter and image at F5.6. The luminous intensity to the sensor receiving surface at this point is defined as the standard sensitivity testing luminous intensity.

2) Standard imaging condition II : Image a light source (color temperature of 3200K) with a uniformity of brightness within 2% at all angles. Use a testing standard lens with CM500S (t = 1.0mm) as an IR cut filter. The luminous intensity is adjusted to the value indicated in each testing item by the lens diaphragm.

1. G sensitivity, sensitivity comparison Set to standard imaging condition I. After selecting the electronic shutter mode with a shutter speed of 1/100s, measure the signal outputs (VGr, VGb, VR and VB) at the center of each Gr, Gb, R and B channel screens, and substitute the values into the following formula.

VG = (VGr + VGb)/2 Sg = VG × [mV] Rr = VR/VG Rb = VB/VG

2. Saturation signal Set to standard imaging condition II. After adjusting the luminous intensity to 20 times the intensity with the average value of the Gr signal output, 150mV, measure the minimum values of the Gr, Gb, R and B signal outputs.

3. Smear Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, first adjust the average value of the Gr signal output to 150mV. Measure the average values of the Gr signal output, Gb signal output, R signal output and B signal output (Gra, Gba, Ra and Ba), and then adjust the luminous intensity to 500 times the intensity with average value of the Gr signal output, 150mV. After the readout clock is stopped and the charge drain is executed by the electronic shutter at the respective H blankings, measure the maximum value (VSm [mV]), independent of the Gr, Gb, R and B signal outputs, and substitute the values into the following formula.

Sm = VSm ÷ × × × 100 [%] (1/10V method conversion value)

4. Video signal shading Set to standard imaging condition II. With the lens diaphragm at F5.6 to F8, adjust the luminous intensity so that the average value of the Gr signal output is 150mV. Then measure the maximum (Grmax [mV]) and minimum (Grmin [mV]) values of the Gr signal output and substitute the values into the following formula.

SHg = (Grmax – Grmin)/150 × 100 [%]

100

500

Gra + Gba + Ra + Ba

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ICX084AK

5. Uniformity between video signal channels After measuring 4, measure the maximum (Rmax [mV]) and minimum (Rmin [mV]) values of the R signal and the maximum (Bmax [mV]) and minimum (Bmin [mV]) values of the B signal, and substitute the values into the following formula.

∆Srg = (Rmax – Rmin)/150 × 100 [%] ∆Sbg = (Bmax – Bmin)/150 × 100 [%]

6. Dark signal Measure the average value of the signal output (Vdt [mV]) with the device ambient temperature 60°C and the device in the light-obstructed state, using the horizontal idle transfer level as a reference.

7. Dark signal shading After measuring 6, measure the maximum (Vdmax [mV]) and minimum (Vdmin [mV]) values of the dark signal output and substitute the values into the following formula.

∆Vdt = Vdmax – Vdmin [mV]

8. Line crawl Set to standard imaging condition II. Adjust the luminous intensity so that the average value of the Gr signal output is 150mV, and then insert R, G, and B filters and measure the difference between G signal lines (∆Glr, ∆Glg, ∆Glb [mV]) as well as the average value of the G signal output (Gar, Gag, Gab). Substitute the values into the following formula.

Lci = × 100 [%] (i = r, g, b)

9. Lag Adjust the Gr signal output value generated by strobe light to 150mV. After setting the strobe light so that it strobes with the following timing, measure the residual signal (Vlag). Substitute the value into the following formula.

Lag = (Vlag/150) × 100 [%]

Vlag (Lag)Gr signal output 150mV

Light

Strobe light

timing

Output

∆Gli

Gai

Page 12

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ICX084AK

Drive Circuit

CCD OUT

Hφ

CXD1267AN

0.01

100

3.9k

–7.5V

2SK523

ICX084

( BOTTOM VIEW )

Hφ

φSUB

GND

SUBCIR

Vφ

GND

OUT

22/16V

3.3/16V

3.3/20V

0.01

15V

XV1

XV2

XSG

XV3

XSUB

22/20V

1/20V

100k

0.1

1/35V

100k

2200p

1 2 3 4 5 6 7 8

16 15 14 13 12 11 10 9

1000p

Page 13

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ICX084AK

Wave Length [nm]

Relative Response

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

400 500 600 700

Spectral Sensitivity Characteristics

(Includes lens characteristics, excludes light source characteristics)

Sensor Readout Clock Timing Chart

42.4µs (520 bits)

2.53µs (31 bits)

2.04µs (25 bits)

XV1 XV2 XV3

XSG

Sensor readout clock XSG is used by composing XV2 and XV3.

Page 14

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ICX084AK

Drive Timing Chart (Vertical Sync)

CCD

OUT

508

5 6 7 8 1 21 2 3 4 3 4

510

525

1 2 3

494

Page 15

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ICX084AK

Drive Timing Chart (Horizontal Sync)

SHP

SHD

CLK

HD/SYNC

BLK

132

SUB

1 12

1 24

1 12

780

107

12316

125

1 12

Page 16

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ICX084AK

Notes on Handling

1) Static charge prevention CCD image sensors are easily damaged by static discharge. Before handling be sure to take the following protective measures. a) Either handle bare handed or use non-chargeable gloves, clothes or material.

Also use conductive shoes. b) When handling directly use an earth band. c) Install a conductive mat on the floor or working table to prevent the generation of static electricity. d) Ionized air is recommended for discharge when handling CCD image sensor. e) For the shipment of mounted substrates, use boxes treated for the prevention of static charges.

2) Soldering a) Make sure the package temperature does not exceed 80°C. b) Solder dipping in a mounting furnace causes damage to the glass and other defects. Use a ground 30W

soldering iron and solder each pin in less than 2 seconds. For repairs and remount, cool sufficiently.

c) To dismount an image sensor, do not use a solder suction equipment. When using an electric desoldering

tool, use a thermal controller of the zero cross On/Off type and connect it to ground.

3) Dust and dirt protection Image sensors are packed and delivered by taking care of protecting its glass plates from harmful dust and dirt. Clean glass plates with the following operation as required, and use them. a) Perform all assembly operations in a clean room (class 1000 or less). b) Do not either touch glass plates by hand or have any object come in contact with glass surfaces. Should

dirt stick to a glass surface, blow it off with an air blower. (For dirt stuck through static electricity ionized

air is recommended.) c) Clean with a cotton bud and ethyl alcohol if the grease stained. Be careful not to scratch the glass. d) Keep in a case to protect from dust and dirt. To prevent dew condensation, preheat or precool when

moving to a room with great temperature differences. e) When a protective tape is applied before shipping, just before use remove the tape applied for

electrostatic protection. Do not reuse the tape.

4) Installing (attaching) a) Remain within the following limits when applying a static load to the package. Do not apply any load more

than 0.7mm inside the outer perimeter of the glass portion, and do not apply any load or impact to limited portions. (This may cause cracks in the package.)

b) If a load is applied to the entire surface by a hard component, bending stress may be generated and the

package may fracture, etc., depending on the flatness of the bottom of the package. Therefore, for installation, use either an elastic load, such as a spring plate, or an adhesive.

Compressive strength

50N

Cover glass

Plastic package

50N

1.2Nm

Torsional strength

Page 17

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ICX084AK

c) The adhesive may cause the marking on the rear surface to disappear, especially in case the regulated

voltage value is indicated on the rear surface. Therefore, the adhesive should not be applied to this area, and indicated values should be transferred to the other locations as a precaution.

d) The notch of the package is used for directional index, and that can not be used for reference of fixing.

In addition, the cover glass and seal resin may overlap with the notch of the package.

e) If the lead bend repeatedly and the metal, etc., clash or rub against the package, the dust may be

generated by the fragments of resin.

f) Acrylate anaerobic adhesives are generally used to attach CCD image sensors. In addition, cyano-

acrylate instantaneous adhesives are sometimes used jointly with acrylate anaerobic adhesives. (reference)

5) Others a) Do not expose to strong light (sun rays) for long periods, color filters will be discolored. When high

luminance objects are imaged with the exposure level control by electronic-iris, the luminance of the image-plane may become excessive and discolor of the color filter will possibly be accelerated. In such a case, it is advisable that taking-lens with the automatic-iris and closing of the shutter during the power-off mode should be properly arranged. For continuous using under cruel condition exceeding the normal using condition, consult our company.

b) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or

usage in such conditions.

c) The brown stain may be seen on the bottom or side of the package. But this does not affect the CCD

characteristics.

Page 18

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ICX084AK

Package Outline Unit: mm

PACKAGE STRUCTURE

0.3

16pin DIP (450mil)

2.5

8.4

0.5

1.2

5.7

6.1

10.3

12.2 ± 0.1

9.5

11.4 ± 0.1

11.43

0.25

0° to 9°

2-R0.5

2.5

11.6

9.2

2.5

1.2

3.35 ± 0.15

3.1

1.27

3.5 ± 0.3

0.46

0.3

1.27

0.69

(For the first pin only)

1. “A” is the center of the effective image area.

2. The two points “B” of the package are the horizontal reference.

The point “B'” of the package is the vertical reference.

3. The bottom “C” of the package, and the top of the cover glass “D”

are the height reference.

4. The center of the effective image area relative to “B” and “B'”

is (H, V) = (6.1, 5.7) ± 0.15mm.

5. The rotation angle of the effective image area relative to H and V is ± 1°.

6. The height from the bottom “C” to the effective image area is 1.41 ± 0.10mm.

The height from the top of the cover glass “D” to the effective image area is 1.94 ± 0.15mm.

7. The tilt of the effective image area relative to the bottom “C” is less than 50µm.

The tilt of the effective image area relative to the top “D” of the cover glass is less than 50µm.

8. The thickness of the cover glass is 0.75mm, and the refractive index is 1.5.

9. The notches on the bottom of the package are used only for directional index, they must

not be used for reference of fixing.

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE WEIGHT

Plastic

GOLD PLATING

42 ALLOY

0.9g