Datasheet HSDL-5420, HSDL-4400, HSDL-4420, HSDL-5400 Datasheet (HP)

High-Performance IR Emitter
and IR PIN Photodiode in
Subminiature SMT Package

H

Technical Data

Features

• Subminiature Flat Top and
Dome Package

Size – 2x2 mm

• IR Emitter

875 nm TS AlGaAs
Intensity – 17 mW/sr
Speed – 40 ns

• Wide Range of Drive
Currents

500 µA to 500 mA

• IR Detector

PIN Photodiode
High Sensitivity
Speed – 7.5 ns

• Flexible Lead
Configurations

Surface Mount or
Through Hole

Applications

• Short Distance IR Links

• IrDA Compatible

• Small Handheld Devices

Pagers
Industrial Handhelds

• Diffuse LANs

• Wireless Audio

Description

Flat Top Package

The HSDL-4400 Series of flat top
IR emitters use an untinted,
nondiffused, truncated lens to
provide a wide radiation pattern
that is useful for short distance
communication where alignment
of the emitter and detector is not
critical. The HSDL-5400 Series of
flat top IR detectors uses the
same truncated lens design as the
HSDL-4400 Series of IR emitters
with the added feature of a black
tint that acts as an optical filter to
reduce the effects of ambient
light, such as sun, incandescent
and fluorescent light from
interfering with the IR signal.

Dome Package

The HSDL-4420 Series of dome
IR emitters uses an untinted,
nondiffused lens to provide a 24
degree viewing angle with high
on-axis intensity. The HSDL-5420
Series of IR detectors uses the
same lens design as the HSDL­4420 IR emitter and optical filter
used in the HSDL-5400 IR
detector.

HSDL-44XX IR Emitter

Series

HSDL-54XX IR Detector

Series

Lead Configuration

All of these devices are made by
encapsulating LED and PIN
photodiode chips on axial lead
frames to form molded epoxy
subminiature packages. A variety
of lead configurations is available
and includes: surface mount gull
wing, yoke lead, or Z-bend and
through hole lead bends at 2.54
mm (0.100 inch) center spacing.

Technology

The subminiature solid state
emitters utilize a highly optimized
LED material, transparent sub­strate aluminum gallium arsenide,
TS AlGaAs. This material has a
very high radiant efficiency,
capable of producing high light
output over a wide range of drive
currents and temperature.

4-68

5964-9018E

Device Selection Guide

IR Emitters

Part Number Device Description

[1]

Device Outline Drawing

HSDL-4400 LED, Flat Top, 110 deg A
HSDL-4420 LED, Dome, 24 deg B

IR Detectors

Part Number Device Description

[1]

Device Outline Drawing

HSDL-5400 PIN Photodiode, Flat Top, 110 deg C
HSDL-5420 PIN Photodiode, Dome, 28 deg D

Package Configuration Options

Package Outline

Option Code Package Configuration Description Drawing

011 Gull Wing Lead, Tape and Reel
021 Yoke Lead, Tape and Reel
031 Z-Bend, Tape and Reel

[2]

1L1 2.54 mm (0.100 in) Long Leads; Thru Hole H

Center Lead Spacing 10.4 mm (0.410 in) Lead

1S1 Short Leads; I

No Option Straight Leads

[3]

[2]

[2]

3.7 mm (0.145 in)

E, J, M

Surface

Mount Lead

F, K, M
G, L, M

Prototyping A, B, C, D

Notes:

1. IR Emitters have untinted, nondiffused lenses and IR Detectors have black tinted, nondiffused lenses.

2. Emitters and detectors are supplied in 12 mm embossed tape on 178 mm (7 inch) diameter reels, with 1500 units
per reel. Minimum order quantity and order increment are in quantity of reels only.

3. Emitters and detectors are supplied in bulk form in bags of 50 units.

4-69

Package Dimensions

(A) Flat Top Emitters

1.91

(0.075)

2.41

(0.095)

1.14

1.40

(0.045)
(0.055)

0.58

0.43

(0.023)
(0.017)

0.50 (0.020) REF.

1.40

1.65

(0.460)

11.68
(0.420)

10.67

BOTH SIDES

(0.055)
(0.065)

NOTE 3
ANODE

CATHODE

STRIPE

2.08

2.34

(0.082)
(0.092)

NOTE 3

(B) Dome Emitters

0.76

(0.030)
(0.035)

R.

2.08

2.34

11.68

10.67
BOTH SIDES

(0.082)
(0.092)

(0.460)
(0.420)

0.94

1.24

0.89

0.50 (0.020) REF.

0.18

0.23

(0.037)
(0.049)

2.92 (0.115)
MAX.

CATHODE

STRIPE
NOTE 3

0.76 (0.030) MAX.

(0.007)
(0.009)

0.18

0.23

NOTE 3
ANODE

1.91

2.16

(0.007)
(0.009)

2.03 (0.080)

1.78 (0.070)

(0.075)
(0.085)

0.79 (0.031)

0.53 (0.021)

1.91

2.16

(0.075)
(0.085)

0.20 (0.008) MAX.

0.63

(0.025)

0.38

(0.015)

CATHODE

1.65

(0.065)

1.91

(0.075)

DIA.

0.46

0.56

0.25 (0.010) MAX.*
NOTE 2

(0.018)
(0.022)

0.46

CATHODE

1.65

(0.065)
(0.075)

DIA.

0.25 (0.010) MAX.*
NOTE 2

1.91

0.20 (0.008) MAX.

NOTES:

1. ALL DIMENSIONS ARE IN MILLIMETRES (INCHES).

2. PROTRUDING SUPPORT TAB IS CONNECTED TO ANODE LEAD.

3. LEAD POLARITY FOR THESE TS AlGaAs SUBMINIATURE LAMPS IS OPPOSITE TO THE
LEAD POLARITY OF SUBMINIATURE LAMPS USING OTHER LED TECHNOLOGIES.
CATHODE STRIPE MARKING IS BLACK.

0.56

(0.018)
(0.022)

4-70

(C) Flat Top Detectors

1.91

(0.075)

2.41

(0.095)

CATHODE

STRIPE

2.08

2.34

(0.082)
(0.092)

NOTE 3

(D) Dome Detectors

0.76

(0.030)
(0.035)

R.

0.94

1.24

(0.037)
(0.049)

2.92 (0.115)
MAX.

0.89

1.14

1.40

0.76 (0.030) MAX.

0.18

(0.007)

0.23

(0.009)

(0.045)
(0.055)

0.18

0.23

1.91

2.16

(0.007)
(0.009)

2.03 (0.080)

1.78 (0.070)

(0.075)
(0.085)

0.58

0.43

(0.023)
(0.017)

0.50 (0.020) REF.

11.68

10.67
BOTH SIDES

ANODE

1.65

(0.065)

1.91

(0.075)

0.20 (0.008) MAX.

1.40

1.65

(0.460)
(0.420)

DIA.

(0.055)
(0.065)

CATHODE

0.46

0.56

0.25 (0.010) MAX.*
NOTE 2

(0.018)
(0.022)

(0.018)
(0.022)

0.79 (0.031)

0.53 (0.021)

CATHODE

STRIPE

2.08

(0.082)

2.34

(0.092)

0.50 (0.020) REF.

(0.460)

11.68
(0.420)

10.67

BOTH SIDES

ANODE

1.65

(0.065)
(0.075)

DIA.

1.91

0.20 (0.008) MAX.

NOTES:

1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).

2. PROTRUDING SUPPORT TAB IS CONNECTED TO CATHODE LEAD.

3. CATHODE STRIPE MARKING IS SILVER.

NOTE 3

CATHODE

0.46

0.56

0.25 (0.010) MAX.*
NOTE 2

1.91

2.16

(0.075)
(0.085)

0.63

0.38

(0.025)
(0.015)

4-71

Package Dimensions

The following notes affect the
package outline drawings E
through I.

1. The pinout represents the
HSDL-54XX IR detectors
where the protruding support
tab is closest to the anode
lead. While the pinout is
reversed for the HSDL-44XX

(E) Gull Wing Lead, Option 011

0.76 (0.030) MAX.

IR emitters where the pro­truding support tab is closest
to the cathode lead.

2. The protruding support tab of
the HSDL-54XX is connected
to the cathode lead. While the
protruding support tab of the
HSDL-44XX is connected to
the anode lead.

(F) “Yoke” Lead, Options 021

0.76 (0.030) MAX.

4-72

ALL DIMENSIONS ARE IN MILLIMETRES (INCHES)

(G) Z-Bend Lead, Options 031

(H) Thru Hole Lead Option 1L1

0.76 (0.030) MAX.

(I) Thru Hole Lead Option 1S1

4-73

Package Dimensions: Surface Mount Tape and Reel Options

(J) 12 mm Tape and Reel, Gull Wing Lead, Option 011

NOTES:

1. EMPTY COMPONENT POCKETS SEALED WITH TOP COVER TAPE.

GULL WING LEAD

SUBMINIATURE PACKAGE

2. 7 INCH REEL – 1500 PIECES PER REEL.

3. MINIMUM LEADER LENGTH AT EITHER END OF THE TAPE IS 500 mm.

4. THE MAXIMUM NUMBER OF CONSECUTIVE MISSING DEVICES IS TWO.

5. IN ACCORDANCE WITH ANSI/EIA RS-481 SPECIFICATIONS, THE
CATHODE IS ORIENTED TOWARDS THE TAPE SPROCKETS HOLE.

At the time of this publication XX/96, Light Emitting Diodes (LEDs) that are contained in this product are regulated for
eye safety in Europe by the Commission for European Electrotechnical Standardization (CENELEC) EN60825-1. Please
refer to Application Brief I-008 for more information.

4-74

(K) 12 mm Tape and Reel, “Yoke” Lead, Option 021

“YOKE” LEAD
SUBMINIATURE PACKAGE

4-75

(L) 12 mm Tape and Reel, Z-Bend Lead, Option 031

Z-BEND LEAD

SUBMINIATURE PACKAGE

4-76

(M) 12 mm Tape and Reel

4-77

HSDL-44XX Absolute Maximum Ratings

Parameter Symbol Min. Max. Unit Ref.

Peak Forward Current (Duty Factor = 20%, I

FPK

Pulse Width = 100 µs)
DC Forward Current I
Power Dissipation P
Reverse Voltage (IR = 100 µA) V
Transient Forward Current (10 µs Pulse) I
Operating Temperature T
Storage Temperature T
Junction Temperature T

FDC

DISS

R

FTR

O

S

J

5V

-40 85 °C

-55 100 °C

Lead Solder Temperature 260/5 s °C
[1.6 mm (0.063 in.) from body]

Reflow Soldering Temperatures

Convection IR 235/90 s °C
Vapor Phase 215/180 s °C

Notes:

1. The transient peak current in the maximum nonrecurring peak current the device can withstand without damaging the LED die and
the wire bonds.

500 mA Fig. 7, 8

100 mA Fig. 6
180 mW

1.0 A [1]

110 °C

HSDL-44XX Electrical Characteristics at T

= 25°C

A

Parameter Symbol Min. Typ. Max. Unit Condition Ref.

Forward Voltage V

F

Forward Voltage ∆VF/∆T -2.1 mV/°CI
Temperature Coefficient -2.1 I

Series Resistance R
Diode Capacitance C
Reverse Voltage V
Thermal Resistance, Rθ

S

O

R

jp

1.30 1.50 1.70 V I

1.40 1.67 1.85 I

2.15 I

2.8 Ω I

= 50 mA Fig. 2

FDC

= 100 mA

FDC

= 250 mA

FPK

= 50 mA Fig. 3

FDC

= 100 mA

FDC

= 100 mA

FDC

40 pF 0 V, 1 MHz

520 VI

= 100 µA

R

170 °C/W

Junction to Pin

4-78

HSDL-44XX Optical Characteristics at T

Parameter Symbol Min. Typ. Max. Unit Condition Ref.

Radiant Optical Power

= 25°C

A

HSDL-4400 P

HSDL-4420 P

O

O

16 mW I
30 I

16 mW I
30 I

FDC
FDC

FDC
FDC

Radiant On-Axis Intensity

HSDL-4400 I

HSDL-4420 I

E

E

Radiant On-Axis Intensity ∆IE/∆T -0.35 %/°CI
Temperature Coefficient -0.35 I

1 3 8 mW/sr I

6I

15 I

9 17 30 mW/sr I

32 I
85 I

FDC
FDC
FPK

FDC
FDC
FPK

FDC
FDC

Viewing Angle

HSDL-4400 2θ
HSDL-4420 2θ

Peak Wavelength λ

PK

1/2

1/2

860 875 895 nm I

Peak Wavelength ∆λ/∆T 0.25 nm/°CI

110 deg I

24 deg I

FDC

FDC

FDC

FDC

Temperature Coefficient
Spectral Width at FWHM ∆λ 37 nm I
Optical Rise and Fall tr/t

f

40 ns I

FDC

FPK

Times, 10%-90%
Bandwidth f

c

9 MHz I

FDC

± 10 mA

= 50 mA
= 100 mA

= 50 mA
= 100 mA

= 50 mA Fig. 4, 5
= 100 mA

= 250 mA

= 50 mA Fig. 4, 5
= 100 mA

= 250 mA

= 50 mA
= 100 mA

= 50 mA Fig. 9
= 50 mA Fig. 10

= 50 mA Fig. 1
= 50 mA

= 50 mA Fig. 1

= 50 mA

= 50 mA Fig. 11

4-79

HSDL-54XX Absolute Maximum Ratings

Parameter Symbol Min. Max. Unit

Power Dissipation P
Reverse Voltage (IR = 100 µA) V
Operating Temperature T
Storage Temperature T
Junction Temperature T

DISS

R

O

S

J

-40 85 °C

-55 100 °C

Lead Solder Temperature [1.6 mm (0.063 in.) from body] 260/5 s °C
Reflow Soldering Temperatures

Convection IR 235/90 s °C
Vapor Phase 215/180 s °C

150 mW

40 V

110 °C

HSDL-54XX Electrical Characteristics at T

= 25°C

A

Parameter Symbol Min. Typ. Max. Unit Condition Ref.

Forward Voltage V
Breakdown Voltage V

BR

F

40 V IR = 100 µA,

1.80 V I

= 50 mA

FDC

Ee = 0 mW/cm

Reverse Dark Current I

D

15nAV

= 5 V, Fig. 12

R

Ee = 0 mW/cm

Series Resistance R

S

2000 Ω VR = 5 V,

Ee = 0 mW/cm

Diode Capacitance C

O

5pFV

= 0 V, Fig. 16

R

Ee = 0 mW/cm
f = 1 MHz

Open Circuit Voltage V

OC

375 mV Ee = 1 mW/cm

λPK = 875 nm

Temperature Coefficient of VOC∆VOC/∆T -2.2 mV/K Ee = 1 mW/cm

λPK = 875 nm

Short Circuit Current I

SC

HSDL-5400 1.6 µA

Ee = 1 mW/cm

λPK = 875 nm

HSDL-5420 4.3 µA

Temperature Coefficient of I

∆ISC/∆T 0.16 %/K Ee = 1 mW/cm

SC

λPK = 875 nm

Thermal Resistance, Rθ

jp

170 °C/W

Junction to Pin

2

2

2

2

2

2

2

2

4-80

HSDL-54XX Optical Characteristics at T

= 25°C

A

Parameter Symbol Min. Typ. Max. Unit Condition Ref.

Photocurrent

HSDL-5400 I

PH

0.8 1.6 µA

HSDL-5420 3.0 6.0

Ee = 1 mW/cm

λPK = 875 nm

VR = 5 V

Temperature Coefficient ∆IPH/∆T 0.1 %/K Ee = 1 mW/cm
of I

PH

λPK = 875 nm

VR = 5 V

Radiant Sensitive Area A 0.15 mm

2

Absolute Spectral Sensitivity S 0.5 A/W Ee = 1 mW/cm

λPK = 875 nm

VR = 5 V

Viewing Angle

HSDL-5400 2θ

1/2

110 deg Fig. 18

HSDL-5420 28 Fig. 19

Wavelength of Peak λ

PK

875 nm Ee = 1 mW/cm

Sensitivity VR = 5 V
Spectral Bandwidth ∆λ 770- nm Ee = 1 mW/cm

1000 VR = 5 V

Quantum Efficiency η 70 % Ee = 1 mW/cm

λPK = 875 nm,

VR = 5 V

Noise Equivalent Power NEP 6.2 x W/Hz

-15

10

1/2

VR = 5 V

λPK = 875 nm

Detectivity D 6.3 x cm* VR = 5 V

Optical Rise and Fall Times, tr/t

12

10

f

7.5 ns VR = 5 V

1/2

Hz

/W λPK = 875 nm

10%-90% RL = 1 kΩ

λPK = 875 nm

Bandwidth f

c

50 MHz VR = 5 V

RL = 1 kΩ

λPK = 875 nm

2

2

2

2

2

2

Fig. 14,

15

Fig. 13

Fig. 17

Fig. 17

4-81

1.5

1.0

TA = 25 °C
I

= 50 mA

FDC



1,000

100

TA = 25 °C

2.0

1.8

1.6

I

FDC

I

FDC

= 100 mA

= 50 mA

0.5

RELATIVE RADIANT INTENSITY

0

850 950

λ – WAVELENGTH – nm

900800

Figure 1. Relative Radiant Intensity
vs. Wavelength.

5.00

4.50
PULSE WIDTHS < 100 µs

4.00
TA = 25°C

3.50

3.00

2.50

2.00

1.50

1.00

0.50

NORMALIZED RADIANT INTENSITY

0

0 500

I

– PEAK FORWARD CURRENT – mA

FPK

100

200 300

400

10

– PEAK FORWARD CURRENT – mA

1

FPK

I

1.0

1.5 2.0 2.5 3.00.50

VF – FORWARD VOLTAGE – V

Figure 2. Peak Forward Current vs.
Forward Voltage.

1.00

TA = 25°C

0.10

NORMALIZED RADIANT INTENSITY

0.01

0.1 10
I

– FORWARD CURRENT – mA

FPK

1

1.4

1.2

– FORWARD VOLTAGE – V

F

V

1.0

-20
TA – AMBIENT TEMPERATURE – °C

I

= 1 mA

FDC

0 20406080

Figure 3. Forward Voltage vs Ambient
Temperature.

120

100

80

60

40

20

– MAXIMUM DC FORWARD CURRENT – mA

FDC

I

Rθja = 220 °C/W
Rθja = 270 °C/W
Rθja = 370 °C/W

0

-20

-40 100

0 20406080

TA – AMBIENT TEMPERATURE – °C

Figure 4. Normalized Radiant
Intensity vs. Peak Forward Current.

500

400

300

200

100

– PEAK FORWARD CURRENT – mA

0

FPK

I

0.01 10

0.1 1

tPW – PULSE WIDTH – ms

DUTY FACTOR

7 %
10 %
20 %
50 %

Figure 7. Maximum Peak Forward
Current vs. Duty Factor.

4-82

Figure 5. Normalized Radiant
Intensity vs. Peak Forward Current
(0 to 10 mA).

600

500

DUTY FACTOR

400

300

200

100

– PEAK FORWARD CURRENT – mA

0

FPK

I

-40 100

10 %
20 %
50 %

PULSE WIDTHS < 100 µs

-20

TA – AMBIENT TEMPERATURE – °C

10 %

20 %

50 %

0 20406080

Figure 8. Maximum Peak Forward
Current vs. Ambient Temperature.
Derated Based on T

JMAX

= 110°C.

Figure 6. Maximum DC Forward
Current vs. Ambient Temperature.
Derated Based on T

JMAX

= 110°C.

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

RELATIVE RADIANT INTENSITY

0

-100°

-80° -60° -40° -20° 0° 20° 40° 60° 80° 100°

θ – ANGLE FROM OPTICAL CENTERLINE – DEGREES (CONE HALF ANGLE)

IF = 50 mA

T

= 25°C

A

Figure 9. Relative Radiant Intensity vs. Angular Displacement
HSDL-4400.

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

RELATIVE RADIANT INTENSITY

0

-50°

-40° -30° -20° -10° 0° 10° 20° 30° 40° 50°

θ – ANGLE FROM OPTICAL CENTERLINE – DEGREES (CONE HALF ANGLE)

IF = 50 mA

T

= 25°C

A

Figure 10. Relative Radiant Intensity vs. Angular Displacement
HSDL-4420.

2
1
0

-1

-2

-3

-4

-5

-6

-7

-8

RELATIVE RADIANT INTENSITY

-9

-10
1E+5 1E+8

1E+6 1E+7

f – FREQUENCY – Hz

T

= 25°C

A

9 MHz

Figure 11. Relative Radiant Intensity
vs. Frequency.

10.000

1.000

0.100

0.010

– REVERSE DARK CURRENT – nA

D

I

0.001
0 100

T

VR = 5 V

20 40 60

– AMBIENT TEMPERATURE – °C

A

Figure 12. Reverse Dark Current vs.
Ambient Temperature.

1.40

1.30

1.20

1.10

1.00

0.90

0.80

0.70

NORMALIZED PHOTOCURRENT

80

0.60

-40 100
– AMBIENT TEMPERATURE – °C

T

A

V

= 5 V

R

060

80-20 20 40

Figure 13. Relative Reverse Light
Current vs. Ambient Temperature.

4-83

10

VR = 5 V

TA = 25°C

1

0.1

NORMALIZED PHOTOCURRENT

0.01

0.01 10

0.1

– IRRADIANCE – mW/cm

E

e

1

1.40

1.30

1.20

1.10

1.00

0.90

0.80

0.70

NORMALIZED PHOTOCURRENT

0.60
040

2

V

TA = 25°C

10 30

15

– REVERSE VOLTAGE – V

R

3552025

5

Ee = 0 mW/cm

4

3

2

1

– DIODE CAPACITANCE – pF

O

C

0

0.1 100
– REVERSE VOLTAGE – V

V

R

f = 1 MHz
TA = 25°C

101

2

Figure 14. Reverse Light Current vs.
Irradiance

1.2

1.0

0.8

0.6

0.4

0.2

NORMALIZED PHOTOCURRENT

0

700 1100

850

800 1000

λ – WAVELENGTH – nm

VR = 5 V

TA = 25°C

1050750 900 950

Figure 15. Reverse Light Current vs.
Reverse Voltage.

Figure 17. Relative Spectral
Sensitivity vs. Wavelength.

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

NORMALIZED PHOTOCURRENT

0

-40° -30° -20° -10° 0° 10° 20° 30° 40° 50°

-50°

θ – ANGLE FROM OPTICAL CENTERLINE – DEGREES (CONE HALF ANGLE)

Figure 16. Diode Capacitance vs.
Reverse Voltage.

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

NORMALIZED PHOTOCURRENT

0

-100°

-80° -60° -40° -20° 0° 20° 40° 60° 80° 100°

θ – ANGLE FROM OPTICAL CENTERLINE – DEGREES (CONE HALF ANGLE)

VR = 5 V

TA = 25°C

Figure 18. Relative Radiant Intensity vs. Angular Displacement.
HSDL-5400.

Figure 19. Relative Radiant Intensity vs. Angular Displacement.
HSDL-5420.

Note: At the time of this publication, Light Emitting Diodes (LEDs) that are contained in this product are regulated for eye safety in

Europe by the Commission for European Electrotechnical Standardization (CENELEC) EN60825-1. Please refer to Application Briefs
I-008, I-009, I-015 for more information.

4-84