• Guaranteed to Meet IrDA
Physical Layer Specifications
1 cm to 1 Meter Operating
Distance
30° Viewing Angle
2.4 KBd to 115.2 KBd Data
Rate
• Daylight Cancellation
• Easily Implemented Direct
Connection to Various I/O
Chips
• Small Form Factor
• Several Lead and Shipping
Configurations Available
• Excellent EMI Immunity
(> 10 V/m)
Applications
• Data Comm: Serial Data
Transfer Between:
Notebook Computers
Subnotebooks
Schematic
BUTTRESS
LEAD*
PIN ONE
HP 1000
YYWW
* SIDE BUTTRESS LEADS ARE FOR MECHANICAL STABILITY AND
SHOULD NOT BE CONNECTED TO ANY ELECTRICAL POTENTIAL.
5964-9641E
Desktop PCs
PDAs
Printers
Other Peripheral Devices
• Telecom:
Modem, Fax, Pager, Phone
• Industrial:
Data Collection Devices
• Medical:
Patient and Pharmaceutical
Data Collection
Description:
The HSDL-1000 serial infrared
module performs low cost, low
power, point-to-point, through the
air data transfer in a serial, halfduplex mode.
The module has been designed to
the IrDA (Infrared Data Association) Physical Layer Specifications. The module is designed to
TXD
RXD
V+
PIN ONE
INDICATOR
PIN ONE
GND
operate from 0 to 1 meter at a
data rate of 115.2 Kbd per second
at a 30° viewing angle.
The HSDL-1000 contains a high
speed, high efficiency TS AlGaAs
875 nm LED, a PIN Silicon photodiode and an integrated circuit.
The IC contains an LED driver,
amplifiers and a quantizer.
The module is designed to interface directly with selected I/O
chips that incorporate logic which
performs pulse width modulation/
demodulation.
V+
R
LED
LED CLED A
R
I
TXD
COMPARATOR
RXD
CX1
V
CC
CX2
CX2CX3CX4
GND
LED
PHOTODIODE
+
V
PIN
V
PIN
4-33
Page 2
Package Dimensions
Option X01*
0.43
(0.017)
MAX.
3.4 ± 0.25
(0.14 ± 0.01)
12.95 (0.51)
13.45 (0.53)
6.4 ± 0.25
(0.25 ± 0.01)
3.4 ± 0.25
(0.14 ± 0.01)
Option X02*
-A-
-B-
6.2 ± 0.25
(0.24 ± 0.01)
8.54 ± 0.15
(0.336 ± 0.01)
(0.020 ± 0.003)
5.0° (10x)
DIMENSIONS IN MILLIMETERS (INCHES).
0.51 ± 0.08
MAX.
1 2345678
(8x)
-C-
0.6 ± 0.25
(0.02 ± 0.01)
0.43
MAX.
(0.017)
3.4 ± 0.25
(0.14 ± 0.01)
16.61 ± 0.15
(0.654 ± 0.01)
(10x)
0.9 ± 0.25
(0.04 ± 0.01)
1.27 ± 0.15
(0.050 ± 0.01)
0.13 ± 0.08
(0.005 ± 0.003)
13.2 ± 0.25
(0.52 ± 0.01)
6.4 ± 0.25
(0.25 ± 0.01)
(7x)
(0.08 ± 0.01)
5.93 ± 0.25
(0.23 ± 0.01)
6.9 ± 0.25
(0.27 ± 0.01)
1.9 ± 0.25
3.4 ± 0.25
(0.14 ± 0.01)
0.51 ± 0.08
(0.020 ± 0.003)
5.93 ± 0.25
(0.23 ± 0.01)
(8x)
4.56 ± 0.15
(0.180 ± 0.01)
1.28 ± 0.15
(0.050 ± 0.01)
-A-
0.60 ± 0.25
(0.02 ± 0.01)
5.0° (8x)
8.05 ± 0.15
(0.317 ± 0.01)
-B-
(0.132 ± 0.01)
3.80 ± 0.15
(0.150 ± 0.01)
COPLANARITY ± 0.05 mm (0.002 INCHES).
MAX.
3.36 ± 0.15
0.50 ± 0.13
(0.020 ± 0.005)
3.28 ± 0.15
(0.129 ± 0.01)
DIMENSIONS IN MILLIMETERS (INCHES).
6.9 ± 0.25
(0.27 ± 0.01)
1.27 ± 0.15
(0.050 ± 0.01)
6.2 ± 0.25
(0.24 ± 0.01)
8.88 ± 0.15
(0.349 ± 0.01)
(7x)
1 2345678
15.39 ± 0.15
(0.606 ± 0.01)
-C-
15.13 ± 0.15
(0.596 ± 0.01)
3.12 ± 0.15
(0.123 ± 0.01)
Note:
The -B- datum is formed by the two highest points of the combined surface formed by this surface and the corresponding surface of the
same lead on the opposite side of the package.
*X position indicates packaging. 0 = tape and reel, 1 = JEDEC standard tray.
4-34
Page 3
Package Dimensions (continued)
Option X03*
0.43 (0.02) MAX.
-B-
11.0 ± 0.13
(0.43 ± 0.01)
-A-
COPLANARITY
OF SURFACE MOUNT
LEADS TO BE
WITHIN 0.3 mm.
0.76 ± 0.15
(0.03 ± 0.01)
2.54 ± 0.15
(0.100 ± 0.01)
1.39 ± 0.15
(0.05 ± 0.01)
0.6 ± 0.25
(0.02 ± 0.01)
A BCS.30∅
7.11 ± 0.15
(0.280 ± 0.01)
2.79 ± 0.15
(0.110 ± 0.01)
3.4 ± 0.25
(0.14 ± 0.01)
(0.135 ± 0.01)
4.95 ± 0.15
(0.195 ± 0.01)
(0.020 ± 0.01)
A BCS.30∅
3.43 ± 0.15
0.51 ± 0.15
1.27 ± 0.15
(0.050 ± 0.01)
-C-
14.73 ± 0.15
(0.580 ± 0.01)
13.2 ± 0.25
(0.52 ± 0.01)
6.4 ± 0.25
(0.25 ± 0.01)
11.68 ± 0.15
(0.460 ± 0.01)
A BCS.30∅
7.62 ± 0.15
(0.300 ± 0.01)
5.9 ± 0.25
(0.23 ± 0.01)
6.9 ± 0.25
(0.27 ± 0.01)
Option X04*
DIMENSIONS IN MILLIMETERS (INCHES).
0.43 (0.02) MAX.
8.75 ± 0.15
(0.345 ± 0.01)
-B-
0.90 ± 0.25
(0.04 ± 0.01)
7.87 ± 0.15
(0.310 ± 0.01)
3.43 ± 0.25
(0.14 ± 0.010)
MAX.
3.84
(0.151)
1.27 ± 0.15
(0.050 ± 0.01)
(0.24 ± 0.01)
6.86 ± 0.25
(0.27 ± 0.01)
6.2 ± 0.25
3.81 ± 0.15
(0.150 ± 0.01)
1 2345678
(7x)
-C-
(0.626 ± 0.01)
13.21 ± 0.25
(0.52 ± 0.01)
15.89 ± 0.15
5.08 ± 0.15
(0.200 ± 0.01)
6.35 ± 0.25
(0.25 ± 0.010)
0.51 ± 0.08
(0.020 ± 0.003)
6.75 ± 0.15
(0.266 ± 0.01)
3.43 ± 0.25
(0.14 ± 0.010)
5.0° ± 3.5°
(8x)
6.79 ± 0.25
(0.27 ± 0.01)
6.22 ± 0.25
(0.24 ± 0.01)
APPROX.
COPLANARITY
± 0.076 mm (0.003 INCHES).
CG
0.61 ± 0.25
(0.02 ± 0.01)
0.76 ± 0.08
5.00°
DIMENSIONS IN MILLIMETERS (INCHES).
(0.030 ± 0.003)
(2x)
(0.162 ± 0.006)
5.93 ± 0.25
(0.23 ± 0.01)
4.12 ± 0.15
Note:
The -B- datum is formed by the two highest points of the combined surface formed by this surface and the corresponding surface of the
same lead on the opposite side of the package.
*X position indicates packaging. 0 = tape and reel, 1 = JEDEC standard tray.
4-35
Page 4
Truth Table
InputsOutputs
TXDEI
V
IH
V
IL
V
IL
X = Don’t care.
Notes:
1. EI – received in band light intensity present at detector surface.
2. Logic Low is a pulsed response. A receiver output low state VOL (RXD) is not indefinitely
maintained, but is instead a pulsed response. The output low state is maintained for a
duration dependent on the incident bit pattern and the incident intensity (EI).
[1]
LEDLEDARXD
XONLowLow
EI
EI
H
L
OFFHighLow
OFFHighHigh
[2]
[2]
Pinout
PinDescriptionSymbol
1Daylight Cancellation CapacitorCX1
2PIN Bypass CapacitorCX2
3Supply VoltageV
4Receiver Data OutputRXD
5GroundGnd
6Transmitter Data InputTXD
7LED CathodeLEDC
8LED AnodeLEDA
CC
Absolute Maximum Ratings
ParameterSymbolMin.Max.UnitsConditionsFig.
Storage TemperatureT
Operating TemperatureT
S
A
Lead Solder Temperature260CFor 10 s (1.6 mmReflow
Average LED CurrentI
Repetitive Pulsed LED CurrentI
Peak LED CurrentI
LED Anode VoltageV
LED Cathode VoltageV
Supply VoltageV
Transmitter Data Input VoltageV
Receiver Data Output VoltageV
(DC)100mA
LED
(PK)500mA≤ 90 µs Pulse Width,
LED
(RP)1.0A≤ 2 µs Pulse Width,
LED
LEDA
LEDC
CC
TXD
RXD
-2085C
070C
-0.57.0V
-0.5V
LEDA
V
07.0V
-0.55.5V
-0.5VCC + 0.5V
below seating plane)Profile
≤ 20% Duty Cycle
≤ 10% Duty Cycle
4-36
Page 5
Infrared Reflow Profile
300
250
200
150
100
TEMPERATURE – °C (T)
50
0
t1 = 8 ± 1 MINS. (SOLDER JOINT)
185 °C
0
t2 = 11.5 ± .5 MINS. (SOLDER JOINT)
T (MAX.) = 250 °C OR 235 °C (+5-0) °C
ANY PART OF COMPONENT BODY
3.5 ± .5 MINS.
(SOLDER JOINT)
T > 120 °C FOR t
GREATER THAN 2.5 MINS.
(SOLDER JOINT)
dT/dt < 3 °C/SEC.
2468101214
TIME (t)
Recommended Operating Conditions
ParameterSymbolMin.Max.UnitsConditions
Operating TemperatureT
Supply VoltageV
Logic High Transmitter Input Voltage V
(870 nm)
Logic Low Receiver Input IrradianceEI
LED (Logic High) Current PulseI
L
LEDA
Amplitudedaylight filters
Receiver Set-up Time10msFor full sensitivity after
Signal Rate2.4116Kp/s
Ambient LightSee IrDA Serial Infrared
0°70°C
4.55.5V
0.0036500mW/cm2For in-band signals*
0.3µW/cm2For in-band signals*
250mAFor one metre links with
transmitting
Physical Layer Link Specification, Appendix A for
ambient levels. See Rx
TH+ section at the end
of this data sheet also.
*Note: An in-band optical signal is a pulse/sequence where the peak wavelength, λp, is defined as 850 nm ≤ λp ≤ 900 nm, the pulse
repetition rate, PRR, is defined as 2.4 Kp/s ≤ PRR ≤ 115.2 Kp/s and the pulse width, PW, is defined as 1.6 s ≤ PW ≤ (3/16)/PRR.
4-37
Page 6
Electrical & Optical Specifications
Specifications hold over the Recommended Operating Conditions unless otherwise noted. Test Conditions represent worse case
values for the parameters under test. Unspecified test condition can be anywhere in their recommended operating range. All typicals
are at 25°C and 5V unless otherwise noted.
ParameterSymbolMin.Typ. Max.UnitConditionsFig.
Receiver DataLogic Low
[2]
VOL (RXD)
Output VoltageFor In-Band
Logic HighVOH (RXD)VCC -0.5VIO = -20 µA,
Effective0.2cm
Detector Area
TransmitterLogic LowIE
Radient
Intensity
Logic HighIE
IntensityVI = 2.5 V, θ≤ 30°
Peakλp875nm6
Wavelength
Spectral Line∆λ1/235nm6
Half Width
TransmitterViewing Angleθ3060°7
Receiverφ30°
TransmitterLogic LowIIL(TXD)-1.01.0µAGnd ≤ VI ≤ 0.3 V
Data Input
Current
Logic HighIIH(TXD)4.5mAVI = 2.5 V1
LED Anode OnVON (LEDA)2.50VI
State VoltageTj = 25°C
LED Anode OffILK (LEDA)100µAV
State LeakageVI = 0.3V
1. EI – received in band light intensity present at detector surface.
2. Pulsed Response – Logic Low is a pulsed response. A receiver output low state VOL (RXD) is not indefinitely maintained but is instead a
pulsed response. The output low state is maintained for a duration dependent on the incident bit pattern and
3. The EI ≥ 3.6 µW/cm2 condition guarantees the IrDA minimum receiver sensitivity of 4.0 µW/cm2 while allowing for 10% light loss
through a cosmetic window placed in front of the HSDL-1000. (See the Rx TH+ section at the end of this data sheet for information
on receiver sensitivity over temperature, and in the presence of ambient light.)
4-38
incident intensity (EI).
Page 7
Switching Specifications
Specifications hold over the Recommended Operating Conditions unless otherwise noted. Test Conditions represent worst case
values for the parameters under test. Unspecified test conditions can be anywhere in their recommended operating range. All
typicals are at 25°C and 5V unless otherwise noted.
ParameterSymbol Min.Typ.Max. UnitsConditionsFig.
Transmitter Turn On Time0.1µsI
= 250 mA, 1.6 µs PW13, 14
LED
Transmitter Turn Off Time0.41.0µs
Transmitter Rise Time0.6µs
Transmitter Fall Time0.6µs
Receiver Turn On Time0.4µsEI = 3.6 µW/cm2, 1.6 µs PW15, 16
Receiver Turn Off Time5.4µsEI = 500 mW/cm2, 1.6 µs PW
Receiver Rise Time1.0µs
Receiver Fall Time0.02µsEI = 3.6 µW/cm2, 1.6 µs PW
Receiver Recovery Time10ms
Application Circuit
ComponentRecommended Value
R
I
R
LED
CX10.22 µF ± 10%
CX20.4 µF minimum
CX30.10 µF ± 22%. Low inductance is critical
CX44.7 µF minimum. Larger value is recommended for noisy supplies or environments.
300 Ohms ± 5%
8.0 Ohms maximum
4-39
Page 8
1000
500
250
100
50
10
– LED PULSE CURRENT AMPLITUDE – mA
LEDA
I
234
1
V
– LEDA VOLTAGE – V
LEDA
TA = 25 °C
– LEDA VOLTAGE – V
LEDA
V
5
2.5
I
LEDA
2.4
1.6 µs PW,
3/16 DUTY CYCLE
2.3
2.2
2.1
2.0
0
= 250 mA PULSED
204080
TA – TEMPERATURE – °C
60
100
2.2
I
= 250 mA PULSED
LEDA
1.6 µs PW,
2.1
3/16 DUTY CYCLE
2.0
1.9
– LED FORWARD VOLTAGE – V
F
V
1.8
0
204080
TA – TEMPERATURE – °C
60
100
Figure 1. LED Pulse Current
Amplitude vs. LEDA Voltage.
2.0
NORMALIZED TO IE
@ I
= 250 mA
LEDA
1.5
PULSE WIDTH = 1.6 µs
1.0
0.5
0
0
NORMALIZED TRANSMITTED INTENSITY IE
I
LEDA
TO 90 µs.
100200400
– LED PULSE AMPLITUDE – mA
300
Figure 4. Transmitted Intensity vs.
LED Pulse Amplitude.
1.2
NORMALIZED TO IE
1.0
TA = 25 °C
0.8
@ I
LEDA
= 250 mA
Figure 2. LEDA Voltage vs.
Temperature.
500
1.2
1.1
1.0
0.9
0.8
0.7
NORMALIZED TRANSMITTED INTENSITY IE
NORMALIZED TO IE
@ I
LEDA
0
204080
TA – TEMPERATURE – °C
Figure 5. Transmitted Intensity vs.
Temperature.
1.2
NORMALIZED TO IE
1.0
0.8
@ I
LEDA
TA = 25 °C
= 250 mA
= 250 mA
60
Figure 3. LED Forward Voltage vs.
Temperature.
100
1.2
NORMALIZED TO IE
1.0
TA = 25 °C
0.8
0.6
0.4
0.2
0
800
NORMALIZED TRANSMITTED INTENSITY IE
@ I
= 250 mA
LEDA
850900
λ – WAVELENGTH – nm
Figure 6. Transmitted Intensity vs.
Wavelength.
1.2
1.0
0.8
NORMALIZED
TO 880 nm
TA = 25 °C
950
0.6
0.4
0.2
0
-100100
NORMALIZED TRANSMITTED INTENSITY IE
-5050
θ – HORIZONTAL TRANSMITTER
VIEWING ANGLE – °
0
Figure 7. Transmitted Intensity vs.
Horizontal Viewing Angle.
4-40
0.6
0.4
0.2
0
-100100
NORMALIZED TRANSMITTED INTENSITY IE
-5050
θ – VERTICAL TRANSMITTER
0
VIEWING ANGLE – °
Figure 8. Transmitted Intensity vs.
Vertical Viewing Angle.
0.6
0.4
0.2
0
7008009001100
NORMALIZED RECEIVER RESPONSIVITY
λ – WAVELENGTH – nm
1000
Figure 9. Receiver Responsivity vs.
Wavelength.
Page 9
1.2
TA = 25 °C
1.0
0.8
0.6
0.4
0.2
0
-100100
NORMALIZED RECEIVER RESPONSIVITY
-5050
ϕ – RECEIVER VIEWING ANGLE – °
0
1.0
0.9
0.8
0.7
0.6
– SUPPLY CURRENT – mA
CC
I
0.5
ILEDA = 250 mA
VCC = 5.5 V
VCC = 4.5 V
40
2080
TA – TEMPERATURE – °C
600100
20
TA = 25 °C
15
10
– TRANSMITTER DATA
5
INPUT CURRENT – mA
TXD
I
0
26
V
– TRANSMITTER DATA
TXD
INPUT VOLTAGE – V
408
Figure 10. Receiver Responsivity vs.
Viewing Angle.
2.0
INPUT PW = 1.6 µs
R
1.9
1.8
1.7
– TRANSMITTED PULSE WIDTH – µs
IE
PW
1.6
2060
40080
TA – TEMPERATURE – °C
= 8 Ω
LED
R
= 2 Ω
LED
Figure 13. Transmitted Pulse Width
vs. Temperature.
6
Figure 11. Supply Current vs.
Temperature.
3.0
2.9
2.8
2.7
2.6
100
2.5
PW(RXD) – RECEIVER OUTPUT PULSE WIDTH – µs
INPUT PW = 1.6 µs
EI INTENSITY = 100 µW/cm2
EI DUTY CYCLE = 20%
2060
40080
TA – TEMPERATURE – °C
Figure 14. Transmitted Pulse Width
vs. Temperature.
Figure 12. Data Input Current vs.
Data Input Voltage.
100
4.5
4.0
3.5
3.0
2.5
2.0
1.5
PW(RXD) – RECEIVER OUTPUT PULSE WIDTH – µs
EI PULSE WIDTH = 1.6 µs
EI INTENSITY = 100 µW/cm
EI INTENSITY = 3.6 µW/cm
1020
DUTY CYCLE OF LIGHT PULSE EI – %
Figure 15. Receiver Output Pulse
Width vs. Duty Cycle of Received
Signal.
TA = 25 °C
2
2
150525
5
4
3
2
PWEI – RECEIVED LIGHT PULSE WIDTH – µs
PW(RXD) – RECEIVER OUTPUT PULSE WIDTH – µs
EI INTENSITY = 100 µW/cm
EI INTENSITY = 3.6 µW/cm
20% DUTY CYCLE
T
= 25 °C
A
51025
0
15
20
2
2
30
Figure 16. Receiver Output Pulse
Width vs. Received Light Pulse Width.
4-41
Page 10
Rx TH+ (Receiver OnThreshold)
The maximum receiver onthreshold is equivalent to the
minimum receiver sensitivity.
Both are terms for the amount of
light signal which must be present
at the HSDL-1000 detector in
order to trigger a low pulse on the
receiver output (RXD). The IrDA
Physical Layer Specification
requires a minimum receiver
sensitivity of 4.0 µW/cm2, at a Bit
Error Rate of 10-9, and in the
presence of the 10 klux of
sunlight, 0-1000 lux of fluorescent
light, or 0-1000 lux of incandescent light. The fluorescent and
incandescent specifications
require minimum receiver
sensitivity with 1000 lux incident
onto the horizontal surface of the
IR link. The resulting amount of
fluorescent or incandescent light
actually reaching the detector
surface may vary between 0 and
500 lux depending upon the
design of the housing around the
HSDL-1000 module.
The HSDL-1000 VOL(RXD)
specification guarantees a
maximum receiver on-threshold
of EI = 3.6 µW/cm2, at a
BER ≤ 10-9, and TA = 0-70°C. The
EI = 3.6 µW/cm2 threshold
guarantees the IrDA minimum
receiver sensitivity of 4.0 µW/cm2,
while allowing for 10% light loss
through a cosmetic window
placed in front of the HSDL-1000.
The EI = 3.6 µW/cm2 threshold
also guarantees receiver sensitivity
with 10 klux of sunlight,
0-500 lux fluorescent light, or
0-500 lux of incandescent light
incident on the HSDL-1000
detector surface.
HSDL-1000 Reliability
Test Results
Test NameReferenceTest ConditionsTestedFailed
Solder Heat (IR Profile)See absolute profile600
Solder Heat Resistance3 times thru IR Profile + 20 Temp. Cycles600
Solder Rework CycleSolder iron tip temp. 370°C/700°F170
Temperature Cycle1010-40°C to +100°C, Dwell = 15 Minutes
Power Temp. Cycle-40°C/+100°C, Dwell = 15 minutes,600
Mechanical Shock20022 Blows each X1, X2, Y1, Y2, Z1, Z2100
Vibration Variable2007(4) 4 Minute Cycles, X, Y, Z100
FrequencyCondition Aat 50 G’s Min., 20 to 2,000 Hz
Resistance to Solvents20153 one minute immersion200
High Temp. OperatingTA= 70°C, If = 100 mAdc, VCC = 5 Vdc,600
LifeTime = 500 hours
Transfer = 5 Minutes, VCC = 5 Vdc,
If = 100 mAdc, LED On/Off = 1 Second
Total Cycles = 35
Condition B1500 G’s, 0.5 msec Pulse
Brush after solvent
Time = 500 hours
VCC = 5 VCC, Time = 500 hours
Level = 4000 V
Level = 300 V
Note: At the time of this publication, Light Emitting Diodes (LEDs) that are contained in this product are regulated for eye safety in
Europe by the Commission for European Electrotechnical Standardization (CENELEC) EN60825-1. Please refer to Application Briefs
I-008, I-009, I-015 for more information.
4-42
Loading...
+ hidden pages
You need points to download manuals.
1 point = 1 manual.
You can buy points or you can get point for every manual you upload.