The HA13156 is four-channel BTL amplifier IC designed for car audio, featuring high output and low
distortion, and applicable to digital audio equipment. It provides 38 W output per channel, with a 13.7 V
power supply and at Max distortion.
Functions
• 4 ch BTL power amplifiers
• Built-in standby circuit
• Built-in muting circuit
• Built-in protection circuit (surge, T.S.D, and ASO)
• Built-in change booster ON/OFF circuit
Features
• High power for booster circuit
• Popping noise minimized
• Low output noise
• Built-in high reliability protection circuit
HA13156
Block Diagram
SW1
IN2
IN3
SW2
C12
R9
4.7µ
7.5k
BST1
C14
0.47µ
BST2
SW3
BSTSW
2 STBY
1IN1
11
12
28IN4
10
+
MUTE
15
17
13
BSTOUT
C13
100µ
16
INVCC
Buffer & Mute-1
Buffer & Mute-2
Buffer & Mute-3
Buffer & Mute-4
Protector
(ASO, Surge, TSD)
Booster
CLKGEN
19
18
+
BSTGND
PVCC1
INGND
C11
0.47µ
C10
2.2µ
24
PVCC2
Amp1
Amp2
Amp3
Amp4
TAB
3
PGND1
4SP1
5
7
PGND2
8SP2
9
21
PGND3
22SP3
23
25
PGND4
26SP4
27
6
2014
+
C9
4400µ
C1
0.1µ
C2
0.1µ
C3
0.1µ
C4
0.1µ
C5
0.1µ
C6
0.1µ
C7
0.1µ
C8
0.1µ
R1
2.2
R2
2.2
R3
2.2
R4
2.2
R5
2.2
R6
2.2
R7
2.2
R8
2.2
OUT1
OUT1
OUT2
OUT2
OUT3
OUT3
OUT4
OUT4
Unit R: Ω
+
–
+
–
+
–
+
–
C: F
VCC
+
C1 to C8 should be polyester film capacitors with no secondary resonance (non-inductive),
*
to assure stable operation.
2
Note: 1. Standby
Power is turned on when a signal of 3.5 V or 0.05 mA is impressed at pin 2.
When pin 2 is open or connected to GND, standby is turned on (output off).
5 V
2. Muting
Muting is turned off (output off) when a signal of 3.5 V or 0.2 mA is impressed at pin 10.
When pin 10 is open or connected to GND, muting is turned on (output off).
5 V
3. DC-DC converter (Booster)
DC-DC converter (Booster) in IC is turned on when a signal of 3.5 V over or 0.04 mA over is
impressed at pin 13, and get large max output power.
When pin 13 is open or connected to GND, DC-DC converter (Booster) is turned off.
This IC is generated noise, because built-in DC-DC converter (Booster).
Consequently if you use radio tuner (AM), I recommend DC-DC converter (Booster) off.
5 V
HA13156
2
37.5 k
23.5 k
10
25 k
13
30 k
20 k
Q1 ON
↓
BIAS ON
Q2 ON
↓
MUTE ON
Q3 ON
↓
Booster ON
3
HA13156
Absolute Maximum Ratings
ItemSymbolRatingUnit
Operating supply voltageV
Supply voltage when no signal*
Peak supply voltage*
Output current*
Power dissipation*
2
3
4
1
CC
VCC (DC)26V
VCC (PEAK)50V
IO (PEAK)4A
P
T
Junction temperatureTj150°C
Operating temperatureTopr–30 to +85°C
Storage temperatureTstg–55 to +125°C
Note:1. Tolerance within 30 seconds.
2. Tolerance in surge pulse waveform.
3. Value per 1 channel.
4. Value when attached on the infinite heat sink plate at Ta = 25 °C.
The derating carve is as shown in the graph below.
100
18V
83W
83 W
(W)
T
50
28 W
Power dissipation P
0
25
A: When heat sink is infinite (θj-a = 1.5°C/W)
B: When θf (thermal resistance of heat sink) = 3°C/W
(θj-a = 4.5°C/W)
Standby currentI
Standby control voltage (high)V
Standby control voltage (low)V
Muting control voltage (high)V
Muting control voltage (low)V
Boost control voltage (high)V
Boost control voltage (low)V
Booster ON (Ch1–Ch4)
Booster OFF (Ch1–Ch4)
Booster ON (Ch1–Ch4)
Booster OFF (Ch1–Ch4)
(W)
T
50
20
= 13.2 V
V
CC
VCC = 16 V
10
5
Power Dissipation P
2
1
0.020.05 0.1 0.20.51251020
Output Power Po (W)
HA13156
Power Dissipation vs. Frequency
Booster ON (Ch1–Ch4)
Booster OFF (Ch1–Ch4)
(W)
T
10
5
Power Dissipation P
VCC = 13.2 V, RL = 4 Ω, Po = 10 W, 1ch operation
0
2050 100 200500 1k2k5k1510k 20k
Frequency f (Hz)
15
HA13156
40
VCC = 13.2 V, RL = 4 Ω, V
Booster ON and OFF
35
Gain vs. Frequency
= 0 dBm,
OUT
30
25
(dB)
V
20
15
Gain G
10
5
0
2050 100 200500 1k2k5k 10k 20k50k 100k200k 500k
(Ch1–Ch4)
Frequency f (Hz)
1M
16
Package Dimensions
30.18 ± 0.25
19.81
4.32 ± 0.05
φ
3.80 ± 0.05
2.79
R1.84 ± 0.19
HA13156
4.50 ± 0.12
+ 0.05
1.55
– 0.1
Unit: mm
17.50 ± 0.13
3.80 ± 0.05
0.5 ± 0.101.0 Typ
27.0 Typ
281
10.70 ± 0.12
+ 0.06
0.40
– 0.04
Hitachi Code
JEDEC Code
EIAJ Code
Weight
5.08
17.78 ± 0.254.14 ± 0.33
4.29
SP-28TA
—
—
—
17
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URLNorthAmerica : http:semiconductor.hitachi.com/
For further information write to:
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
Europe: http://www.hitachi-eu.com/hel/ecg
Asia (Singapore): http://www.has.hitachi.com.sg/grp3/sicd/index.htm
Asia (Taiwan): http://www.hitachi.com.tw/E/Product/SICD_Frame.htm
Asia (HongKong): http://www.hitachi.com.hk/eng/bo/grp3/index.htm
Japan: http://www.hitachi.co.jp/Sicd/indx.htm
Hitachi Asia Ltd.
Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
Hitachi Asia (Hong Kong) Ltd.
Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Telex: 40815 HITEC HX
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