The HA13566AF is combination of Spindle and VCM Driver designed for HDD and have following
functions and features.
Functions
• 1.0 A max/3-phase spindle motor driver
• 400 mA max VCM driver
• 100 mA max retract driver
• 11 bit serial interface
• 9 bit DAC for VCM control
• Commutation logic for sensor-less motor
• Center tap pull-up driver for half wave driver
• Soft switching matrix
• Charge pump
• Booster
• Power monitor
• OTSD
Features
• Low output saturation voltage
Spindle driver1.0 V typ (@0.8 A)
0.2 V typ (@0.1 A)
VCM driver1.0 V typ (@400 mA)
• Soft switching drive
• Minimum surface mount packagebody size 7 × 7 mm
Page 2
HA13566AF
Pin Arrangement
LVI1
RETOUT
RETPOW
SPNCOMP
VREF2
CDELAY
R
VCMN
VCMP
CT
W
R
NF
PCOMP
18
19
20
21
S
22
23
24
TAB
25
V
26
27
28
123
U
VCMIN
TAB
TAB
CC2
V
(Top view)
16 15
17
TAB
456
VB
BC1
14
13
12
11
10
9
8
7
BC2
DACOUT
POWGOOD
CHAGPMP
DATA
CLK
SERENAB
COMM
PHASE
2
Page 3
Block Diagram
HA13566AF
V
CC2
3
C101
PHASE
COMM
CHAGPMP
VREF2 (1.25 V)
R1
SPNCOMP
R2
C2
C105
C106
VB
VCMIN
DACOUT
CLK
(10MHz Max)
DATA
SERENAB
C1
12
16
17
14
10
11
B - EMF
Amps
7
8
Commutation
logic
EXTCOM
Center
tap
pull-up
HALF
Charge
pump
5
6
4
SPNENAB
Booster
FBOOST
2
DAC
(9 bit)
Serial port
(11 bit)
9
1.25 V
V
CC2
LVI
Soft
switching
matrix
Current
control
RETRACT
POWGOOD
V
CC2
2
SPNENAB
BRAKE
HALF
EXTCOM
SOFTSW
RETRACT
FBOOST
VCMENAB
POR
delay
SOFTSW
BRAKE
V
CC
VCM
Driver
P
N
Spindle
driver
Retract
U
V
W
V
CC2
D0
VCMP
VCMN
1
26
25
24
27
28
18
19
23
22
21
CT
R
NF
C102
PCOMP
RETPOW
C108
RETOUT
R101
R
C103
R103
C104
R104
RS
D1
D2
D3
S
2015
CDELAY
LVI1
C107
POWGOOD
3
13
TAB
Page 4
HA13566AF
Serial Port
Construction
SERENAB
CLK
DATA
Data construction
Input Data Construction
Serial
port
A0
D0 to D9
Decoder
Figure 1 Serial Port
MD0 to MD9
Mode Control Register
A0 = 1
DD0 to DD9
Input Data Register
for DAC & VCM
A0 = 0
Mode Control
VCM Control
MSBLSB
D9D8D7D6D5D4D3D2D1D0A0
for selecting
register
Register Data
Figure 2 Input Data (1)
The serial port is required the 11 bit data (D0 to D9 and A0). Address bit A0 is used to select the register
as follows. When the data length is less than 11 bits, the internal register will not be up dated. And when
the data length is more than 11 bits, this register will take late 10 bits and ignore the faster bit.
A0Register
0Input data register of DAC & VCMGAIN
1Mode control register
Notes: 1. The spindle motor is independently winding to the value of the MD2, during the MD1 is true.
2. The bit MD4 select a commutation mode at driving by B-EMF sensing. (See Commutation
timing)
3. In order to prevent the misdetection of back-EMF amplifier, the bit MD8 should be chosen as
shown above table.
4. The bit MD9 determine the operating frequency of Booster Circuit. According to the frequency of
Input CLK at pin 10, the value of MD9 should be chosen as shown below.
CLK (at pin 10)MD9
7.1 MHz to 10 MHz0
4.0 MHz to 7.0 MHz1
Input Data Register (A0 = 0)
Bit / DD0 to DD9: These input data are used to control the output current at VCM driver as shown follows.
MSBLSB
DD9DD8DD7DD6DD5DD4DD3DD2DD1DD0
VCMGAIN
Input data of DAC
Figure 3 Input Data (2)
5
Page 6
HA13566AF
The data bit DD9 determine the transfer gain G
which is specified as the relationship between the input
VCM
data at the input data register and the output current at VCM amplifier. (See the under table)
DD9DATAIO [mA]
11FF+199.2/R
S
11000.000
1000–200.0/R
01FF+24.9/R
S
S
01000.000
0000–25.0/R
S
Data Input Timing
SERENAB
CLK
Vth (= 1/2V
t0t3t2
Vth
CC2
Typ)
Up date point
t4t5
t1
Latch point
DATA
Vth
SERENAB
Internal
DAC output
t6 : Conversion time of DAC ≤ 1µs
A0 D9
D8 D7 D6 D5 D4 D3 D2 D1 D0
Figure 4 Input Timing on Serial Port
t6
Figure 5 Conversion Timing on DAC
t0 ≥ 20ns
t1 ≥ 20ns
t2 ≥ 50ns
t6
t3 ≥ 40ns
t4 ≥ 40ns
t5 ≥ 40ns
6
Page 7
Commutation Timing
Commutation for starting up
HA13566AF
COMM
PHASE
I
U
I
V
I
W
1/f
COMM
Pulsewidth ≥ 10µs
Delay
+
0
–
+
0
–
+
0
–
Synchronous
driving by B-EMF sensing
(≅0.2s to 0.3s)
Note: 1. The frequency of COMM signal f
f
COMM (max)
f
COMM (min)
= 2.5
= 0.5
P · KT · I
P · KT · I
O
J
J
(Hz)(for begin of synchronous driving)
O
(Hz)(2)
Where,
P : Pole number of spindle motor (Hz)
K
: Torque constant (kg · cm/A)
T
I
: Start up current (A)
O
J : Moment of inertia (kg · cm · S
can be designed as follows.
COMM
(for end of synchronous driving)
2
)
7
(1)
Page 8
HA13566AF
External Commutation Mode (Full Wave Drive)
UV W
+
B-EMF
PHASE
COMM
U-Current
Switching
mode
U-Current
Soft
switching
mode
0
–
0
Delay
*2
0
+
0
–
+
+ 50 %
0
– 50 %
–
Note: 2. Provided by MPU.
8
Page 9
External Commutation Mode (Half Wave Mode)
UV W
+
HA13566AF
B-EMF
(V
CC
PHASE
COMM
U-Current
Switching
mode
U-Current
Soft
switching
mode
0
)
–
0
0
+
0
–
+
0
–
– 50 %
9
Page 10
HA13566AF
Internal Commutation Mode (Full Wave Mode)
UV W
+
B-EMF
PHASE
COMM
U-Current
Switching
mode
U-Current
Soft
switching
mode
Note: 3. When the internal commutation mode is selected, the commutation of the motor is automatically
0
–
0
0
*3
+
0
–
+
0
–
selected at the B-EMF sensing drive. But don’t open the COMM terminal.
+ 50 %
– 50 %
10
Page 11
Internal Commutation Mode (Half Wave Mode)
UV W
+
HA13566AF
B-EMF
PHASE
COMM
U-Current
Switching
mode
U-Current
Soft
switching
mode
0
–
0
0
+
0
–
+
0
– 50 %
–
11
Page 12
HA13566AF
Application
MPU
V
CC2
C2R2C1
Serial data
C107
C101
R1
V
CC2
SPNCOMP
VREF
PHASE
COMM
CHAGPMP
POWGOOD
CLK
DATA
SERENAB
DACOUT
VCMIN
CDELAY
TAB
C106C105
Booster
W
CT
R
NF
PCOMP
RETOUT
VCMP
VCMN
R
RETPOW
U
V
S
Spindle
motor
C102
R101
C103
C104
R104
C108
R
D1
D2
D3
NF
R
R103
S
R
L
12
Page 13
HA13566AF
External Component
Parts No.Recommended ValuePurposeNotes
R
1
R
2
R
101
R
, R
103
104
R
NF
R
S
C1, C
2
C
101
C
102
C
, C
103
104
C
105
C
106
C
107
C
108
D1, D2, D3—For retract
Notes: 1. This integral constants can be designed as follows.
Gctl = Control gain (see electrical characteristics)
Vref2 = Internal reference voltage (See electrical characteristics)
13
Page 14
HA13566AF
2. The retract current is determined as follows.
Iret =
where,
R
= VCM coil Resistor.
L
Vsatret = Retout saturation voltage (See electrical characteristics)
3. The motor start up current I
I
= (A)
O
Where, Vref1 = Current limiter reference voltage
(See electrical characteristics)
4. The power on reset delay time is determined as follows.
t
= 105•C
POR
Vretpow – Vsatret
R101 + R
+ R
L
Vref1
R
NF
(See electrical characteristics)(9)
107
S
is determined as follows.
O
(7)
(8)
14
Page 15
HA13566AF
Absolute Maximum Ratings (Ta = 25°C)
ItemSymbolValueUnitsNotes
Power supply voltageV
CC2
Spindle currentIspn1.0A2
VCM currentIvcm400mA2
Retract currentIret100mA2
Input voltageVin0 to V
Power dissipation (Ta = 65°C)PT11.0W3
Power dissipation (Tc = 100°C)PT22.0W3
Junction temperatureTj150°C4
Storage temperature rangeTstg–55 to +125°C
Notes: 1. Operating voltage range is 4.25 V to 5.75 V.
2. ASO of each output transistor is shown below. Operating locus must be with in the ASO.
3. Thermal resistance is shown below.
θj-c ≤ 25°C/W
θj-a ≤ 80°C/W
4. Operating junction temperature range is 0 to +125°C.
7.0V1
CC
V
4
(A)
C
1
0.5
Collector Current I
0.1
1510
Collector Emitter Voltage VCE (V)
t = 1 ms
t = 10 ms
t = 100 ms
20
Figure 6 ASO of Output Transistor (Spindle Driver)
15
Page 16
HA13566AF
4
t = 1 ms
t = 10 ms
(A)
C
1
0.5
Collector Current I
0.1
1510
Collector Emitter Voltage VCE (V)
t = 100 ms
20
Figure 7 ASO of Output Transistor (VCM Driver)
16
Page 17
Electrical Characteristics (Ta = 25°C, VCC = 5 V)
CC
CC
HA13566AF
ItemSymbolMinTypMaxUnits
Supply currentI
LogicInput low currentI
inputInput high currentI
Input low voltageV
Input high voltageV
Clock frequencyf
2. Specified by shorting between VCMIN and DACOUT.
1
18
Page 19
Package Dimensions
9.0 ± 0.2
9.0 ± 0.2
2015
21
28
1
0.32 ± 0.08
0.30 ± 0.06
7.0
HA13566AF
Unit: mm
0.65
14
7
6
M
0.13
1.0
0.5750.575
2.25 ± 0.10
0.10
Dimension including the plating thickness
Base material dimension
1.40
+ 0.09
– 0.05
0.13
1.70 Max
0.17 ± 0.05
0.15 ± 0.04
0.95 ± 0.10
0.50 ± 0.10
Hitachi Code
JEDEC
EIAJ
Weight
0° – 8°
(reference value)
FP-28T
—
—
0.2 g
19
Page 20
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
products.
Hitachi, Ltd.
Semiconductor & Integrated Circuits.
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
URLNorthAmerica : http:semiconductor.hitachi.com/
For further information write to:
Hitachi Semiconductor
(America) Inc.
179 East Tasman Drive,
San Jose,CA 95134
Tel: <1> (408) 433-1990
Fax: <1>(408) 433-0223
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Taipei Branch Office
3F, Hung Kuo Building. No.167,
Tun-Hwa North Road, Taipei (105)
Tel: <886> (2) 2718-3666
Fax: <886> (2) 2718-8180
Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
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Group III (Electronic Components)
7/F., North Tower, World Finance Centre,
Harbour City, Canton Road, Tsim Sha Tsui,
Kowloon, Hong Kong
Tel: <852> (2) 735 9218
Fax: <852> (2) 730 0281
Telex: 40815 HITEC HX
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