Page 1
PREPARED BY: DATE:
Sdt3 I( &M
7 (/Ledc
APPROVED BY: DATE:
Jti‘, / /Myy
J L&S&
33’
DEVICE SPECIFICATION FOR
MODEL No.
ELECTRO~c CObiPONENTS GROUP
SHARP CORPORATION
SPECIJWATION
Light Emitting Diode
SPECNo. Ix996046
I
ISSUE
I
hut/l 6/99
\
1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”).
Please do not reproduce or cause anyone to reproduce them without Sharps consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.
(Precautions)
(1) This products is designed for use in the following application areas;
* OA equipment * Audio visual equipment * Home appliance
* Telecommunication equipment (Terminal)
* Tooling machines
L
If the use of the product in the above application areas is for equipment listed in paragraphs
(2) or (3), please be sure to observe the precautions given in those respective paragraphs.
(2) Appropriate measures. such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;
* Transportation control and safety equipment (aircraft, train, automobile etc.)
* Traffic signals * Gas leakage sensor breakers * Rescue and security equipment
* Other safety equipment
[
(3) Please do not use this product for equipment which require extremely high reliability
and safety in function and precision, such as ;
* Space equipment
* Nuclear power control equipment * Medical equipment
c
(4) Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
3. Please contact and consult with a Sharp sales representative for any questions about this product.
* Computers
* Telecommunication equipment (for trunk lines)
GL6ZV27
* Measuring equipment
1
1
CUSTOMER’S APPROVAL
‘DATE:
BY:
DATE:
PRESENTED BY:
M.Katoh,
Department General Manager of
Engineering DeptJII
Optc-Electronic Devices Division
Electronic Components Group
SHARP CORPORATION
Jm /fC
,
3fQ@@
/Y
ry
Page 2
MODEL No.
GL6ZV27 Snecifrcation
1. Application
This specification applies to the light emitting diode device Model No. GL6ZV27.
[AlGaInP (dicing or scribe/brake type> Amber LED device]
DG996046
Jun/16/99
PAGE
GL6ZV27 l/10
2. Outline dimensions and pin
3. Ratings and characteristics
COMeCtiOIIS
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Refer to the attached sheet Page 2.
Refer to the attached sheet Page 3-4.
3- 1. Absolute maximum ratings
3-2. Eleciro-optical characteristics
3-3. Derating Curve
3-4. Characteristics Diagram
4. Reliability
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Refer to the attached sheet Page 5.
4-1. Test items and test conditions
4-2. Measurement items and Failure judgement criteria
5. Incoming inspection
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*.............o
Refer to the attached sheet Page 6.
5- 1. Applied standard
5-2. Sampling method and level
5-3. Test items, judgement criteria and classifica of defect
5-4. Test items the surface is be applied for fiat type, judgement criteria and classifrca of defect
6. Supplement
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..~
6-l. Packing
6-2. Luminous intensity rank
6-3. Dominant wavelength rank
64. Environment
7. Precautions for use
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7- 1. Lead forming method
7-2. Notice of installation
7-3. Soldering Conditions
.7-4. For cleaning
Refer to the attached sheet Page 7-8.
Refer to the attached sheet Page 9- 10.
Page 3
MODELNo.
I
DG996046
GL6ZV27
JllnA6/%
PAGE
I z/l0
2. Outline dimensions and pin
COMeCtionS
5. 8 20. 2
9,
I/
I
I
Colorless transparency
2.54 OM
l-t-
I
%b-
I
pin COMIXtiOIlS
0
ote) Unspecified tol. to be ~0.2m-n
ate) Cold rolled steel leads are plated with but the tie-bar cut portions have no plating do not solder this part of the product.
unit
mm
Lead : (Fe) Cold rolled steel
Package : Epoxy resin
Material
Finish
Lead : Sn plated or wave soidering
0. Anode
0. cathode
Drawing No.
51106027
Page 4
3.
Ratings and characteristics
(Note 1) Duty ratio=l/lO,Pulse width=O.lms
(Note 2) At the position of 1.6m.m from the bottom resin package
MODEL No.
DG996046
GL6ZV27
Jun/16/99
PAGE
3110
3-2.
Electra-optical
Parameter Sylllbol
Forward voltage
LLlminous interlsity (Note 3)
Peak emission wavelength
characteristics
vF
Iv
J-P
Conditions
IF=2OmA
Dominant wavelength Ad
Spectrum radiation bandwidth A ;1
Reverse current I,
Terminal capacitance
Viewing
Xaxis
28 l/2 IF=2OmA
Ct V=OV.f=lMHz
VR=4V
Angle YilXiS
(Note 3) Refer to the suplement item 6. regarding the standard of rank cla
3-3. Derating Curve
Peak Forward Current Derating Curve
120
a
.5
100
z
g 80
,”
2 60
-0
ii 40
i
,” 20
:
”
-25 0 25 50 7585 100 125
Forward Current Derating Curve
60
50
40
30
20
10
0
-25 0 25 50 75 85 100 125
(Ta=25”C
MIN. TYP. MAX. unit
-
2.1 2.6 V
w
;ification.
Ambient Temperature Ta(“C)
Ambient Temperature TarC)
Page 5
DG996046
Juni16i99
MODEL No. PAGE
GL6ZV27
4ilO
Peak Forward Current vs. Duty Ratio
.lO
l/l00 l/10
Duty Raito DR
1 10
3-4. Characteristics Diagram&p) (Note 1)
Forward Current vs.Forward Voltage
loo CL
CTa=25oC)
CTa=25t)
Relative Luminous Intensity
vs. Ambient Temperature
( I F=2ChnA)
z
.-
I i i i i i irl i i i i i i / i I
0.1 j I I I I I III 1 I I I I I I I I
1 1.21.41.61.8 2 2.22.42.6
Forward Voltage VFW)
Ralrtive Luminous Intensity vs. Frorard Voltue
1000
B
0. 01
0. 1 1 10 100
Forward Current IFhA)
(Ta%?!.%)
:
E
-
10
-60-40-20 0 20 40 60 80 100120
(Note 1) Above characteristic data are typical data and not a guarantteed data.
Ambient Temprature Ta (“C).
Page 6
4. Reliability
The reliability of products shall be satisfied with items listed below.
DG996O46 I Jld16/95
MODEL No. 1 PAGE
GL6ZV27
S/10
,-1. Test items and test conditions
Test items Test conditions
Solderability
Soldering
temperature
Mechanical shock
230t5”C. 5s
Prior disposition : Dip in rosin flux
26Oc-5°C. 5s
15 000m/s2, 05ms.
3times / iX.*Y,fz direction
Variable frequency 2OOm/s*, 100 to 2 000 to 1OOHzJsweep for 4min.
vibration
Terminal strength
(Tension)
Terminal strength
,4timeskX,ktY&Z direction
Weight: 1 ON, S/each terminal
Weight:SN, 0” -+ 90” * 0” -90” -0”
(Bending) /each terminal
Temperature cycling
Hgh temp’ and high
humidity storage
-40”c(30min)~+100”c(3Omin),30 cycles
Ta=+6O”c, 9O%RH, t=100Oh
igh temperature storage Ta=lOO”C, t=lOOOh
Conlidence level: 904
Samples (n)
LTPD
Defective (C) (%)
n=ll, C=O 20
n=ll,C=O 20
n=ll. C=O 20
n=ll, C=0 20
n=ll,C=O 20
n=ll,C=O 20
n=22, C=O 10
n=22, C=0 10
n=22, C=O 10
6
ow temperature storage Ta=-40”C, t=lOOOh
Operation life
Ta=25”C. &MAX, t=10O0h *3
n=22, C=O 10
n=22, C=O 10
4-2. Measurement items and Failure judgement criteria *l
Measurement Symbol
Forward voltage
Reverse current
VF
IR
Failure judgement criteria *2
v, > U.S.L. x 1.2
IR > u..%. x 2.0
Luminous intensity Iv Iv > The first stage value X 2.0 or The first stage value X 0.5 > Iv
s Solderability : Solder shall be adhere at the area of 95% or more of dipped portion.
z Terminal strength : Package is not destroyed, and terminal is not slack.
*l: Measuring condition is in accordance with specification.
*2: U.S.L. is shown by Upper Specification Limit.
*3: IF m.is shown by forward current of absolute maximum ratings.
Page 7
DG996046 Jlud16/9!I
MODEL No. PAGE
5. Incoming inspection
5-1. Applied standard : IS0 2859-l
5-2. Sampling method and level : A single sampling pIan,normal inspection level II
: AQL Major defect : 0.065%
Minor defect : 0.4%
GL6ZV27 6110
T-3 Tmt itwr~c idwmrnt m-it&a and chxnifica nf defect
. -. * -“- .--..“* - ----- -. .-. -- -- ------- --
YO.
Test items
1 Disconnection
2 Position of Cutting off
rim
3
Reverse terminal
4
Outline dimensions
5
characteristics
Over the limit value of specification at V,, Ia, and Iv
Not satisfy outline specification
-----
judgement criteria
Not emit light
Different from dimension
Different from dimension
6 Cutofftherim Exceed -0.2mm
White point : Exceed 4 0.3mm (on top view)
7 Foreign substance Black point : Exceed 4 0.3nun (on top view)
String form : Exceed 3.Omm (on top view)
8 Scratch
Exceed # 0.3mm or O.lmm x l.Omm (on top view)
9 Void Exceed 4 0.3mm (on top view)
Uneven density of
10
material for scattering
Extremely uneven density
classifica of defec
Major defect
Minor defect
11
Unbalanced center
12
Insertion position of
13
terminal
Burr
Exceed fo.25mm from package center
Exceed +0.2mm againstprovided dimension
Insertion position of terminal
5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defect
No. Test items
14
Chapped the surface
15 Hollow the surface
judgement criteria
The surface chapped is striking for see the lamp top
The surface hollow is striking for see the lamp top
classifica of defec
Minor defect
Page 8
6. Supplement
6-l. Packing
6-l-l. Inner package
Put 25Opcs the same luminous intensity rank products into pack and put following label by pack.
Product weight : 0.28g (One Product,Typ.)
(Tdication label sample)
SHIPUENT TABLE
PART No. GL6ZV27
QUANTITY 250
LOT No.
0 Production plant code(to be indicated alphabetically)
@ Support code
@ Year of production(the last two figures of the year)
@ Month of production
@ Date of production(Ol-31)
KA99B19
R-0 t- Luminous intensity rank
SHARP’
MADE IN JAPAN
+ Model number
+ Quantity of products
+ Lot number *
dominant wavelength rank
+ Production country
(to be indicated alphabetically with January corresponding to A)
DG996046
MODEL No.
GL6ZV27
*cl cl clclclclcl
- -~--
a -0
Jun/16/!x
PAGE
7110
Q@ 0
6-l-2. Outer package
Put 8 packs (the same luminous intensity rank) into outer package.
(approximately 670g per one outer package)
6-l-3. Outer package out line dimension
Width: 14Omm, Depth : 225mm. Hight : 90mm
6-2.Luminous intensity rank (Note 1)
Rank Luminous intensity
I 185 - 360
J
K
L
I
(Note 1) Tolersnce:flS%
In regard to luminous intensity , the following ranking shall be carried out.
However the quantity of each rank shall not be pre scribed.
In case of the distribution of the luminous intensity shift to high, at that
point new upper rank is prescribed and lower rank is delete.
266 - 518
383 - 746
I
552 - ( 1075 j
unit
mcd
(Ta=25”c )
Condition
1~2omA
L 1 591.0 - 594.5 1
1
(Note 2) The condition of measurement : The measurement of the light emission from the front side of lamp.
This rank value is the setting value of when that classifies it the rank and be not a guarantee value.
Also I shall not ask the delivery ratio of each rank.
I
I
Page 9
6-4. Environment
641. Ozonosphere destructive chemicals.
(1) The &vice does& contain following substance.
(2) The &vice doesn’t have a production line whose process requires following substance.
Restricted part: CF~on~CC~o~~~e~yc~o~fo~)
642. Bromic non-burning materials
The &vice doesn’t contain bromic non-burning materials(PBBOs,PBBs)
MODEL. No.
Do996046
Jun/16/!39
PAGE
GL6ZV27 8110
Page 10
7.
Precautions
7 -
1.
for use
Lead forming method
Avoid fowing a lead pin with the lead pin base as
a fulcrum:be sure to hold a lead pin firmly when
forming. Lead pins should be formed before soldering.
7 -
2.
Notice of installation
7-Z-l installation on a P W B
&en mounting an LED lamp on a PIIB.do not apply
physical stress to the lead pins.
*The lead pin pitch should match the PYB pin-hole
pitch:absolutely avoid widening or narrowing
the lead pins.
l
Ihen positioning an LED lamp,basically employ
an LED with tie-bar cut or use a spacer.
7-2-2 When an LED 1 is mounted directly on a P WB
If the bottom face of an LED lamp is mounted
directly on single-sided PVBthe base of the
lead pins way be subjected to physical stress
due to PWB warp.cutting or clinching of lead
pins. Prior to use, be sure to check that no
disconnection inside of the resin or damage to
resin etc., is found. when an LED lamp is mounted
on a double-sided PWB,the heat during soldering
affects the resin;therefore.keep the LED lamp
more that 1.6nun afloat above the PRI.
7-2-3 Installation using a holder
During an LED lamp positioning,when a holder is
used, a holder should be designed not to subject
lead pins to any undue stress.
(Note)Pay attention to the themal expansion coefficient
of the material used for the holder.Since the
holder expands and contracts due to preheat and
soldering heat, mechanical stress may be applied to
the lead pins, resulting in disconnection.
7-2-4 Installation to the case
Do not fix part C with adhesives when fixed to the
case as shown in Figure.A hole of the case should
be designed not to subject the inside of resin
to any undue stress.
MODEL No.
IX996046
GL6ZV27
Jud16/99
PAGE
g/10
Good
Page 11
iMODEL No.
I
7 - 3. S oldering Conditions
Solder the lead pins under the following conditions
Type of Soldering 1
I 1. Manual soldering 295”C*YC, within 3 seconds
2. Wave soldering
26O”c+5‘C. within 5 seconds
3. Auto soldering Preheating 70°C to 80°C. within 30 seconds
Soldering 245”c+5”c, within 5 seconds
(Note) Avoid dipping resin into soldering bath.
Avoid applying stress to lead pins while they are heated-For example ,
when the LED lamp is moved with the heat applied to the lead pins during
manual soldering or solder repair,disconnection may occur.
Conditions
Do6046
GL6ZV27
Jud16/99
PAGE
I lO/lO
7 - 4. For cleaning
( 1) Solvent cleaning : Solvent temperature 45°C or less
Immersion for 3 min or less
(2) Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs
by cleaning bath size,ultrasonic power
output,cleaning time,PIB size or device mounting
condition etc. Please test it in actual using condition
and confirm that doesn’t occur any defect before starting
the ultrasonic cleaning.
( 3 > Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol
In case when the other solvent is u&there are cases that
the packaging resin is eroded. Please use the other solvent
after thorough confirmation is performed in actual using condition.
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