Page 1
PREPARED BY: DATE: I 1 SPEC.No. Ix996047
ELECTRONIC COMPONENTS GROUP
SHARP
CORPORATION
I
Opto-Ekctronic Devices Division
SPiXIFICATION
DEVICE SPECIFICATION FOR
Light Emitting Diode
MODEL No.
GL6ZS27
1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”).
Please do not reproduce or cause anyone to reproduce them without Sharps consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.
(Precautions)
(1) This products is designed for use in the following application areas;
* OA equipment * Audio visual equipment * Home appliance
* Telecommunication equipment (Terminal) * Measuring equipment
* Tooling machines
r
If the use of the prcxluct in the above application areas is for equipment listed in paragraphs
(2) or (3), please be sure to observe the precautions given in those respective paragraphs.
(2) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;
* Transportation control and safety equipment (aircraft, train, automobile etc.)
* Traffic signals * Gas leakage sensor breakers * Rescue and security equipment
* Other safety equipment
[
(3) Please do not use this product for equipment which require extremely high reliability
and safety in function and precision, such as ;
* Space equipment * Telecommunication equipment (for trunk lines)
* Nuclear power control equipment * lMedica1 equipment
C
(4) Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
3. Please contact and consult with a Sharp sales representative for any questions about this product.
* Computers
1
I
1
1
CUSTOMER’S APPROVAL
DATE:
BY:
DATE:
PRESENTED BY:
,
M.Katoh,
Department General Manager of
Engineering Dept.,J.II
Opto-Electronic Devices Division
Electronic Components Group
SHARP CORPORATION
/
Page 2
MODELa No.
I
GL6ZS27 Swcifkation
1. Application
This specification applies to the light emitting diode &vice Model No. GL6ZS27.
[AlGalnP (dicing or scribe/brake type) Sunset-orange LED
device1
DG996047
GL6ZS27 l/10
Jurd16/!w
PAGE
2. Outline dimensions and pin
3. Ratings and characteristics
3- 1. Absolute maximum ratings
3-2. Electra-optical characteristics
3-3. Derating Curve
3-4. Characteristics Diagram
4. Reliability
4- 1. Test items and test conditions
4-2. Measurement items and Failure judgement criteria
5. Incoming inspection
5- 1. Applied standard
5-2. Sampling method and level
5-3. Test items, judgement criteria and classifica of defect
54. Test items the surface is be applied for flat type, judgement criteria and classifica of defect
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
co~ections
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*.......
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..a
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Refer to the attached sheet Page 2.
Refer to the attached sheet Page 3-4.
Refer to the attached sheet Page 5.
Refer to the attached sheet Page 6.
6. Supplement
6-1. Packing
6-2. Luminous intensity rank
6-3. Dominant wavelength rank
6-4. Environment
7 . ~ecau~onsforuse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7-l. Lead forming method
7-2. Notice of installation
7-3. Soldering Conditions
7-4. For cleaning
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Refer to the attached sheet Page 7-8.
Refer to the attached sheet Page g-10.
Page 3
3. Ratings and characteristics
I
3- 1. Absolute maximum ratings
Parameter
Power dissipation
Symbol -.
P
Value
130
Storage temperature 1 Tstg 1 -40 - 100 1 “C
soldering temperature(Note 2) 1 Tsol 1 26O(within5 seconds) I “C
(Note 1) Duty ratio=l/lO,Pulse width=O.lms
(Note 2) At the position of 1.6mm from the bottom resin package
MODEL No.
I
(Ta=25”C)
Unit
mW
Dci996047
GL6ZS27
I Jun/16/99
PAGE
I 3110
I
(Note 3) Refer
to
the suplement item 6. regarding the standard of rank classification.
3-3. Derating Curve
Peak Forward Current Derating Curve
120
3
100
E
2 80
E
2 60
Ambient Temperature Ta(‘C)
Forward Current Derating Curve
60
3 5o
L
; 40
s
= 30
5
$ 20
r
li 10
0
-25 0 25 50 75 ‘%OO 125
Ambient Temperature Ta (“C)
Page 4
MODEL No.
I
DG996047
GL6ZS27
Jun/16/99
PAGE
I 4110
Peak Forward Current vs. Duty Ratio
10
l/loo l/l0
Duty Raito DR
1
3-4. Characteristics Diagrarn(typ) (Note 1)
Forward Current vs.Forward Voltage
100
(Ta=25%1
10
(Ta=25"C)
Relative Luminous intensity
vs. Ambient Temperature
(IF=2OnA)
10
I i I I i
1
(),I I I I I I I/i 1 I I I I II 11
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6
Forward Voltage VFW
Relative Luminous lntmrity vs. Froward Voltage
1000
100
0. 1
i / i i I
I I
Y
-60-40-20 0 20 40 60 80 100 120
Ambient Temprature Ta('C)
(Ta=25"C)
(Note 1)
0.01
0.
1 1 10 100
Forward Current IF(mA)
Above
characteristic data are
typical data and not a guarantteed data.
Page 5
4. Reliability
The reliability of products shah be satisfied with items listed below.
r
DG996047 Jun/16/99
MODEL No. PAGE
GL6ZS27
5110
4- 1. Test items and test conditions
Test items
Solderability
Soldering
temperature
Mechanical shock
Variable frequency
230+5=C, 5s
Prior disposition : Dip in rosin flux
260+5”c, 5s
15 OOOm/s2, 0.5ms.
3times I iX,*Y,dZ direction
200m/s2, 100 to 2 000 to lOOHz/sweep for 4min.
Test conditions
vibration ,4times/iX,iY,fz direction
Terminal strength
(Tension)
Weight:lON, Ss/each terminal
Terminal strength Weight:SN, 0” + 90” ---f O”+ -90” + 0”
(Bending)
/each terminal
Temperature cycling -40~(3Ot~1i1$~-+1~“c(3O111in),30 cycles
W’ temP* md ‘@’
Ta=+(jf)“C, g()%w, t=lt)oh
humidity storage
High temperature storage Ta=100”C, t=lOOOh
Confidence level: 90%
Samples (n)
Defective (C)
LTPD
(o/o)
n=ll, C=O 20
n=ll,C=O 20
n=ll. C=O 20
n=ll. C=O 20
20 n=ll, C=O
n=ll, C=O 20
n=22, C=O
10
n=22, C=O 10
n=22, C=O 10
Low temperature storage Ta=-4Ot, t=lOOOh
Operation life
Ta=25”C, IF MAX, t=lOOOh *3
n=22. C=O 10
n=22. C=O 10
4-2. Measurement items and Failure judgement criteria *1
Measurement Symbol Failure judgement criteria *2
Forward voltage
Reverse current
VF
IR
v, > U.S.L. x 1.2
Ia > U.S.L. x 2.0
. Luminous intensity Iv Iv > The first stage value X 2.0 or The first stage value X 0.5 > Iv
z Solderability : Sol&r shall be adhere at the area of 95% or more of dipped portion.
z Terminal strength : Package is not destroyed, and terminal is not slack.
* 1: Measuring condition is in accordance with specification.
*2: U.S.L. is shown by Upper Specification Limit.
*3: IF w.is shown by forward current of absolute maximum ratings.
Page 6
DG996047
MODEL No.
5. Incoming inspection
5-1. Applied standard : IS0 2859-l
5-2. Sampling method and level : A single sampling plannormal inspection level II
: AQL Major defect : 0.065%
Minor defect : 0.4%
5-3. Test items, judgement criteria and classifica of defect
VO.
Test items
judgement criteria
Jun/16/!-w
PAGE
GL6ZS27 6110
classifica of defec
1
DiscoMection
2 Position of Cutting off
rim
3 Reverse terminal
4 Outline dimensions
5 characteristics
6 Cut off the rim
Not satisfy outline specification
Over the limit value of specification at Vr, Ia, and Iv
Not emit light
Different from dimension
Different from dimension
Exceed -0.2mm
White point : Exceed o 0.3mm (on top view)
7 Foreign substance
Black point : Exceed 4 0.3mm (on top view)
String form : Exceed 3.Omm (on top view)
8 Scratch
9 Void
Uneven density of
10
material for scattering
Exceed d 0.3mm or O.lmm x l.Omm (on top view)
Exceed 4 0.3mm (on top view)
Extremely uneven density
11 Unbalanced center Exceed M.25mm from package center
12 Burr
Exceed +0.2mm againstprovided dimension
Major defect
Minor defect
Insertion position of
13
terminal
Insertion position of terminal
5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defect
No.
Test items
14 Chapped the surface
15 Hollow the surface
judgement criteria
The surface chapped is striking for see the lamp top
The surface hollow is striking for see the lamp top
class&a of defect
Minor defect
Page 7
6. Supplement
6-I. Packing
6-l- 1. Inner package
Rut 25Gpcs the same luminous intensity rank products into pack and put following label by pack
Product weight : 028g (One P~G~.Kx.,T~~.)
[Indication label sample)
SHIPMENT TABLE
PART No. GL6ZS27
OUANTIlY 250
.OT No. KA99B19
SHARP’
MADE IN JAPAN
- Model number
+ Quantity of products
+Lotnumber*
Cl-Cl t- Luminous intensity rank
dominant wavelength rank
+ Production country
DG996047
MODEL No.
GL6ZS27 7110
*g cl cl01700
-a-
a 0 069 0
Jun/l6/99
PAGE
@ Production plant
code(to
be indicated alphabetically)
@ Support code
@ Year of production(the last two figures of the year)
@ Month of production (to be indicated alphabetically with January corresponding to A)
@ Date of production(Ol-3 1)
6-l-2. Outer package
Put 8 packs (the same luminous intensity rank) into outer package.
(approximately 670g per one outer package)
6-l-3. Outer package out line dimension
Width : 14Omm, Depth: 225mm, Hight: 9Omm
6-2,Luminous intensitv rank (Note 1) (Ta=25”c)
Rank
J
K
L
M
Luminous intensity unit
Condition
266 - 518
383 - 746 mcd IF2OmA
552 - 1075
795 -
( 1548 )
(Note 1) Tolerance:*lS%
In regard to luminous intensity, the following ranking shall be carried out.
However the quantity of each rank shall not be pre scribed.
In case of the distribution of the luminous intensity shift to high, at that
point new upper rank is prescribed and lower rank is delete.
6-3.Dominant wavelength rank (Note 2)
Rank
Dominant wavelength 1 Unit
I
Ta=25”C)
Condition
(Note 2) The condition of measurement : The measurement of the light emission from the front side of lamp.
This rank value is the setting value of when that classifies it the rank and be not a guarantee value.
Also I shall not ask the delivery ratio of each rank.
Page 8
6-4. Environment
M-1. Ozonosphexe destructive chemicals.
(1) The device doesn’t contain following substance.
(2) The device doesn’t have a production line whose process requks following substance.
Restricted part: CFCs~~ones,CCb,Trichloroethane(Methyc~~of~)
-2. Bromic non-burning materials
The &vice doesn’t contain bromic non-burning materials(PBBOs,PBBs)
MODEL No.
DG996047 Jun/16/!3!?
PAGE
GL6ZS27 8110
Page 9
DG996047 Jud16/99
MODEL No. PAGE
GL6ZS27
g/10
7. Precautions for
7 - 1. Lead forming method
Avoid forming a lead pin with the lead pin base as
a fulcrum:be sure to hold a lead pin firmly when
forming. Lead pins should be formed before soldering.
7 - 2. Notice of installation
7-2-l installation on a P W B
7-2-2 When an LED 1 is mounted directly on a PWB
7-2-3 Installation using a holder
(Note)Pay attention to the thermal expansion coefficient
7-Z-4 Installation to the case
use
When mounting an LED lamp on a PW,do not apply
physical stress to the lead pins.
l
The lead pin pitch should match the PWE! pin-hole
pitch:absolutely avoid widening or narrowing
the lead pins.
l
‘Jhen positioning an LED lampbasically employ
an LED with tie-bar cut or use a spacer.
If the bottom face of an LED lamp is mounted
directly on single-sided PWB,the base of the
lead pins may be subjected to physical stress
due to PWB warpcutting or clinching of lead
pins. Prior to use, be sure to check that no
disconnection inside of the resin or damage to
resin etc., is found Then an LED lamp is mounted
on a double-sided PWB,the heat during soldering
affects the resin;therefore,keep the LED lamp
more that 1.6mm afloat above the P!B.
During an LED lamp positioning,when a holder is
used, a holder should be designed not to subject
lead pins to any undue stress.
of the material used for the holder.Since the
holder expands and contracts due to preheat and
soldering heat, mechanical stress may be applied to
the lead pins, resulting in disconnection.
Do not fix part C with adhesives when fixed to the
case as shown in Figure.A hole of the case should
be designed not to subject the inside of resin
to any undue stress.
Hold I lead pin firmly
dtcn farmins
L
I
&
Good
0
n
1. Sam
Page 10
MODEL No.
I
7 - 3. S oldering Conditions
Solder the lead pins under the following conditions
Type of Soldering Conditions
1. Manual soldering 295°C 25°C) within 3 seconds
2. Wave soldering 260°C +5”c, within 5 seconds
3. Auto soldering Preheating 70°C to 8O”c, within 30 seconds
L
(Note) Avoid dipping resin into soldering bath
Avoid applying stress to lead pins while they are heated.For example ,
when the LED lamp is moved with the heat applied to the lead pins during
manual soldering or solder repair,disconnection may occur.
1 Soldering 245’C*5”c, within 5 seconds
lx996047
GL6ZS27
I
hnil6i99
PAGE
I lO/lO
7 - 4. For cleaning
( 1) Solvent cleaning : Solvent temperature 45°C or less
Immersion for 3 min or less
(2 > Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs
by cleaning bath size,ultrasonic power
output, cleaning time,PBB size or device mounting
condition etc. Please test it in actual using condition
and confirm that doesn’t occur any defect before starting
the ultrasonic cleaning.
( 3 > Applicable solvent : Ethyl alcohol, hlethyl alcohol, Isopropyl alcohol
In case when the other solvent is us&there are cases that
the packaging resin is eroded. Please use the other solvent
after thorough confirmation is performed in actual using condition.
Page 11
2. Outline dimensions and pin connixtions
MODEL No.
DG996047
GL6ZS27
Judl6/9!9
PAGE
2/10
4. 6 f0. 2
-I-
I
I
t
n-
n:
:
r
5. 8 -CO. 2
Colorless transparency
7
I
I
-43
ote) Unspecified tol. to be t02mm
Note) Cold’iolled steel leads are plated with but the tie-bar cut portions have no plating do not sol&r this part of the
unit
Lead : (Fe) Cold rolled steel
mm
Package : Epoxy resin
---ET
’ !
v
Material
Lead : Sn plated or wave soldering
Finish
Pin connections
0. Anode
0. cathode
Drawing No.
51106028
product
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