Page 1
PREPARED BY: DATE:
ZJ-dtx
/t6 /?7’
T. cleda
DEVICE SPECIFICATION FOR
ELECTRONIC COMPONENTS GROUP
SHARP CORPORATION
s PEC~CATION 1 Opto-Electronic Devices Division
Light Emitting Diode
MODEL No.
I
1. These specification sheets include materials protected under the copyright of Sharp Corporation (“Sharp”).
Please do not reproduce or cause anyone to reproduce them without Sharps consent.
2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined
in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility
for any damage resulting from use of the product which does not comply with the absolute maximum ratings
and the instructions included in these specification sheets, and the precautions mentioned below.
(Precautions)
(1) This products is designed for use in the following application areas;
* OA equipment * Audio visual equipment * Home appliance
* Telecommunication equipment (Terminal) * Measuring equipment
* Tooling machines
L
If the use of the product in the above application areas is for equipment listed in paragraphs
(2) or (3), please be sure to observe the precautions given in those respective paragraphs.
(2) Appropriate measures, such as fail-safe design and redundant design considering
the safety design of the overall system and equipment, should be taken to ensure reliability
and safety when this product is used for equipment which demands high reliability and
safety in function and precision, such as ;
* Transportation control and safety equipment (aircraft, train, automobile etc.)
* Traffic signals
* Other safety equipment
c
(3) Please do not use this product for equipment which require extremely high reliability
and safety in function and precision, such as ;
* Space equipment * Telecommunication equipment (for trunk lines)
* Nuclear power control equipment * Medical equipment
C
(4) Please contact and consult with a Sharp sales representative if there are any questions
regarding interpretation of the above three paragraphs.
* Computers
* Gas leakage sensor breakers * Rescue and security equipment
GL6ZJ27
1
I
1
1
1
3. Please contact and consult with a Sharp sales representative for any questions about this product.
DATE:
CUSTOMER’S APPROVAL.
DATE:
BY: Eiectronic Components Group
PRESENTED BY:
MKatoh,
Department General Manager of
Engineering Dept.,IH
Ooto-Electronic Devices Division
SHARP CORPORATION
Page 2
MODEL No.
GL6ZT27 Snecification
1. Application
This specification applies to the light emitting diode device Model No. GL6ZJ27.
[AlGalnP (dicing or scribe/brake type)
Grange LED device]
DG996048
GL6Zl27
Jun/16/99
PAGE
l/10 _
2. Outline dimensions and pin connections
3. Ratings and characteristics
. . . . . . . . . . . . . . . . . . . . . ..*................
. . . . . . . . . . . . . . . . . . . . . . . . . . . .
Refer to the attached sheet Page 2.
Refer to the attached sheet Page 3-4.
3- 1. Absolute maximum ratings
3-2. Electra-optical characteristics
3-3. Derating Curve
3-4. Characteristics Diagram
4. Reliability
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*............
Refer to the attached sheet Page 5.
4- 1. Test items and test conditions
4-2. Measurement items and Failure judgement criteria
5. Incoming inspection
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*.........
Refer to the attached sheet Page 6.
5- 1. Applied standard
5-2. Sampling method and level
5-3. Test items, judgement criteria and classifica of defect
54. Test items the surface is be applied for flat type, judgement criteria and classifica of defect
6. Supplement
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ..*...............
6-l. Packing
6-2. Luminous intensity rank
6-3. Dominant wavelength rank
6-4. Environnient
7. Precautions for use
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7- 1. Lead forming method
7-2. Notice of installation
7-3. Soldering Conditions
.7-4. For cleaning
Refer to the attached sheet Page 7-8.
Refer to the attached sheet Page 9- 10.
Page 3
MODEL No.
IX996048 Jun/16/99
PAGE
2 ~the dimensions and pin
COMeCtionS
Colorless transparency
I
2. 54 OM
i
Pin coMections
0. Anode
0. cathode
iote) Unspecified tol. to be +0&m
rote) Cold rolled steel leads are plated with but the tie-bar cut portions have no plating do not solder this part of the product.
unit
mm
Material
Lead : (Fe) Cold rolled steel
Package : Epoxy resin
Fiih
Lead : Sn plated or wave soldering
Drawing No.
51106029
Page 4
3. Ratings and characteristics \
(Note 1) Duty ratb=l/lO,Pulse tidth=O. lms
(Note 2) At the position of 1.6mm from the bottom resin package
MODEL No.
DG996048
Junl16l99
PAGE
GL6ZJ27 3110
(Note 3) Refer to the suplement item 6. regarding the standard of rank classification.
3-3. Derating Curve
Peak Forward Current Derating Curve
120
5
- 100
e
-25 0 25 50
Ambient Temperature Ta?C)
1585100
Forward
125
Current Derating Curve
01 I I I I 1
-25 0 25 50
Ambient Temperature Ta("C)
795
I
100 125
Page 5
DG996048 .Jun/16/99
MODEL No. PAGE
GL6ZJ27
4110
Peak Forward Current
l/100 l/10
Duty Raito
vs. Duty Ratio
1 10
DR
3-4. Characteristics Diagram(typ) (Note 11
Forward Current vs.Forward
O.l"!"'Ir""""'
1 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6
Forward Voltage VFW)
(Ta=25%)
Voltage
(Ta=25”C)
J
1000
s
.-
t
E
2
100
o-
.f E
5
2
e
.-
?fl
z 10
Relative Luminous intensity
vs. Ambient Temperature
-60 -40
-20 0
Ambient Temprature Ta(OC)-
20 40 60 80
( I F=2OmA)
100 120
::
.- 2 100
2
2
Oh
.E E
5 1
-J
2
.- 0. 1
+
2
d
(Note
Relative Luminous Intensity vs. Froward Voltage
1000
10
0.01
10 100
l)Above
0. 1 1
Forward Current IFW)
characteristicdataaretypicaldata
(Ta=25"C)
andnotagumtteeddata.
Page 6
4. Reliability
The reliability of products shall be satisfied with items listed below.
MODEL No.
DG996048
GL6ZJ27
Jun/16/99
PAGE
5/10
t-1. Test items and test conditions
Test items Test conditions
Solderability
Soldering
temperature
Mechanical shock
Variabie frequency
23Or+5'=C. 5s
Prior disposition : Dip in rosin flux
26025°C. 5s
15 OOOm/s*, 0.5ms,
3tirnes / S,fY,iZ direction
2Olh/s*,
100 to 2 000 to lOOH&weep for 4min.
vibration ,4times/&iY ,Ez direction
Terminal strength
(Tension)
Terminal strength
(Bending)
Weight:lON. Ss/each terminal
Weight:SN, 0” -90” -+ OQ -90” -+ 0”
/each terminai
Temperature cycling -40~(3Omin)~+l~“c(3~in),30 cycles
High temp* and high
humidity storage
Ta=+60”C, 9O%RH, t=lOOOh
tigh temperature storage Ta=lOO”c, t=lOOOh
Confidence level: 904
Samples (n)
Defective (Cl
LTPD
(%)
n=ll. C=O 20
n=ll, C=O 20
n=ll, C=O 20
n=ll, c=O 20
n=ll, C=O
20
n=ll, C=O 20
n=22, C=O 10
n=22, C=O 10
n=22,c=-O
10
ow temperature storage Ta=-40=, t=lOOOh
Operation life
Ta=25”C, IrMAX, t=lOOOh *3
4-2. Measurement items and Failure judgement criteria * 1
Measurement
Forward voltage
Reverse current
J.mninous intensity
QIllbOl
vF
IR
IV
Failure judgement criteria *2
v,>u.s.L.x 1.2
I,>u.s.L.x 2.0
Iv > The first stage value X 2.0 or The first stage value X 0.5 > Iv
s Solderability : Sol&r shall be adhere at the area of 95% or more of dipped portion.
Z Terminal strength : Package is not destroyed, and terminal is not slack.
*l: Measuring condition is in accordance with specification.
*2: U.S.L. is shown by Upper Specification Limit.
*3: lr MAX.is shown by forward current of absolute maximum ratings.
n=22, C=O 10
n=22, C=O 10
Page 7
DG996048 I Jun/16/9!
MODEL No. 1 PAGE
I
5. Incoming inspection
5-l. Applied standard : IS0 2859-l
5-2. Sampling method and level : A single sampling phn,normal inspection level II
: AQL Major defect : 0.065%
Minor defect : 0.4%
GL62J27 6110
classifica of defer
Exceed 9 0.3mm or O.lmm x 1.
9 Void Exceed @ 0.3mm (on top view)
Uneven density of
10
material for scattering
11 Unbalanced center
12 BUlT Exceed +0.2mm againstprovided dimension
Insertion position of
13
5-4. Test items the surface is be applied for flat type, judgement criteria and classifica of defect
No. Test items
14 Chapped the surface The surface chapped is striking for see the lamp top
15
terminal
Hollow the surface
The surface hollow is striking for see the lamp top
Extremely uneven density
Exceed M.25mm from package center
Insertion position of terminal
judgement criteria
classifica of defect
Minor defect
Page 8
DG996048
MODEL No.
I
GL6Z27
6. Supplement
6-l. Packing
6-l-l. Inner package
Put 25Opcs the same luminous intensity rank products into pack and put following label by pack.
Product weight : 0.28g (One
Prodwt,Typ.)
(Indication label sample)
SHIPMENT TABLE
PART No. GL6ZJ27
QUANXTY
LOT No.
KA99B19
SHARP’
AfADE IN JAPAN + Production country
250
O-0 t- Luminous intensity rank
+ Mcdel number
- Quantity of products
* Lot number *
dominant wavelength rank
*cl cl 00000
0 0
0 Production plant ccxie(to be indicated alphabetically)
@ Support code
@ Year of prcduction(the last two figures of the year)
@ Month of production (to be indicated alphabetically with January corresponding to
@ Date of production(Ol-31)
.Tunll61W
PAGE
I 7110
-5-G 0
A)
6-l-2. Outer package
Put 8 packs (the same luminous intensity rank) into outer package.
(approximately 670g per one outer package)
6-l-3. Outer package out line dimension
Width: 14Omm. Depth: 225mm. Hight: 90mm
(Note 1) Tolerance:flS%
In regard to luminous intensity , the following ranking shall be carried
out.
However the quantity of each rank shall not be pre scribed.
In case of the distribution of the luminous intensity shift to high, at that
point new upper rank is prescribed and lower rank is delete.
6-3.Dominant wavelength rank (Note 2)
Rank
Dominant wavelength Unit Condition
T 613.5 -
617.0
(Ta=25”C)
U 616.0 - 619.5
V 618.5 -
W
621.0 -
X 623.5 -
622.0 nm
624.5
627.0
IF2OmA
(Note 2) The condition of measurement : The measurement of the light emission from the front side of lamp.
This rank value is the setting value of when that classifies it the rank and be not a guarantee value.
Also I shall not ask the delivery ratio of each rank.
Page 9
.
64. Environment
6-4-l. ozOnosphere destructive chemicals.
(1) The &vice doesn’t contain following substance.
(2) The &vice doesn’t have a production line whose process nquires following substance.
Restricted part: CFCsJlalones,CCb,Trichloroethane(Methych)
I
642. Bromic non-burning materials
The &vice doesn’t contain bromic non-burning materials(PBBOs,PBBs)
DO996048 Junl16/99
MODELNo. PAGE
I
GL6ZJ27 1 8/10
Page 10
DG996048 I Jud16/99
MODEL No. ( PAGE
GL6ZJ27
g/10
7. Precautions
for use
7 - 1. Lead forming method
Avoid forming a lead pin with the lead pin base as
a fulcrum:be sure to hold a lead pin firmly when
forming. Lead pins should be forsed before soldering.
7 - 2. Notice of installation
7-2-l installation on a P W B
Vhen mounting an LED lamp on a PW. do not apply
physical stress to the lead pins.
*The lead pin pitch should match the PllB pin-hole
pitch:absolutely avoid widening or narrowing
the lead pins.
l
Bhen positioning an LED lamp,basically employ
an LED with tie-bar cut or use a spacer.
7-2-2 !Yhen an LED 1 is mounted directly on a P WB
If the bottom face of an LED lamp is mounted
directly on single-sided PVE$the base of the
lead pins may be subjected to physical stress
due to PWB warp,cutting or clinching of lead
pins. Prior to’ use, be sure to check that no
disconnection inside of the resin or damage to
resin etc.,is found.Yhen an LED lamp is mounted
on a double-sided PTBthe heat during soldering
affects the resin;therefore,keep the LED lamp
more that 1.6mm afloat above the PWB.
7-2-3 Installation using a holder
During an LED lamp positioning,when a holder is
used,a holder should be designed not to subject
lead pins to any undue stress.
(Note)Pay attention to the thermal expansion coefficient
of the material used for the holder.Since the
holder expands and contracts due to preheat and
soldering heat, mechanical stress may be applied to
the lead pins, resulting in disconnection.
7-2-4 Installation to the case
Do not fix part C with adhesives when fixed to the
case as shown in Figure.A hole of the case should
ide of resin be designed not to subject the ins
to any undue stress.
- y)&+FJJp-
c
d~cn formint
c
I
NG
Good
0
I
!. 6mm
Page 11
7 - 3. S oldering Conditions
Solder the lead pins under the following conditions
Type of Soldering
1. Manual soldering
2. Wave soldering
3. Auto soldering
295°C *S”c. within 3 seconds
260°C k 5°C. within 5 seconds
Preheating 70°C to 8OC, within 30 seconds
Conditions
S oldering 245°C f YC, within 5 seconds
(Note) Avoid dinning resin into soldering bath.
Avoid applying stress to lead pins while they are heated-For example ,
when the LED lamp is moved with the heat applied to the lead pins during
manual soldering or solder repair,disconnection may occur.
MODELNo.
Do48
GL6ZJ27
JunhY99
PAGE
lo/lo
i ton
7 - 4. For cleaning
( 1) Solvent cleaning : Solvent temperature 45°C or less
Immersion for 3 min or less
(2 > Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs
by cleaning bath size,ultrasonic power
output,cleaning time,Pm size or device mounting
condition etc. Please test it in actual using condition
and confirm that doesn’t occur any defect before starting
the ultrasonic cleaning.
( 3 > Applicable solvent : Ethyl alcohol, Methyl alcohol, Isopropyl alcohol
In case when the other solvent -is used, there are cases that
the packaging resin is eroded. Please use the other solvent
after thorough confirmation is performed in actual using condition.
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