• Conforms to USB 12Mbps Specification, Version 1.1
• Patented architecture
• Single chip solution for host-to-host communication
• File transfer application software running on Windows 98 and Windows 2000
• Up to 8.6Mbps transfer rate
• Suitable for mobile and SOHO environment
• Tiniest solution in the market – 16-pin SOP
• On-chip 3.3V output
• 12MHz external clock
• Internal power-on reset
• Power management support
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2. Functional Overview
The GL620USB provides a single-chip solution for connecting two or more PCs via their USB ports. According
to USB protocol, the PC is the host and the device is a slave, where the host initiates all the USB traffic and the
slave responds to the host ’s requests. In other words, a host cannot talk to another host via USB protocol; instead,
a host can only talk to one or more devices. The GL620USB’s patent-pending architecture overcomes the USB
inherently incompatibility of connecting two or more PCs by providing two independent USB transceivers and
SIEs for each host, i.e., data can be transferred in both directions simultaneously.
PC APC B
USB ConnectionUSB Connection
GL620USB
System Diagram
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GL620USB
3. Applications
We provide application program to share file between 2 PCs. This application is easy to install for end users.
Besides, the file transfer rate of the application program (combined with GL620USB) is up to 8.6Mbps. With this
file transfer application, PCs can share files on all local drives, such as hard drive, floppy, CD-ROM and network
drives.
The GL620USB-Lite file transfer function can be integrated with the following form factors:
• USB standalone cable
• USB standalone hub
• USB monitor with hub
• PC host
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4. Functional Description
Micro-
controller
USB Registers
&
FIFO Control
8 Bytes FIFO
D+
D+
8 Byte FIFO
D-
USB
Interface
USB
Interface
D-
64 Byte FIFO
64 Byte FIFO
Block diagram of GL620USB-Lite
The GL620USB-Lite is equipped with two full-speed USB ports, and each port has four endpoints to provide
different functions as follows:
- Endpoint 0: control transfer
- Endpoint 1: bulk-read transfer
- Endpoint 2: bulk-write transfer
- Endpoint 3: interrupt transfer
Two 8-bytes FIFO and four 64-bytes FIFO are built in the device as follows:
- Left 8-byte FIFO: provide a pipe to link left endpoint 0 and right endpoint 3. For example, if left host wants
to communicate with right host, left host can issue a no data control transfer and the setup command will be stored
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GL620USB
in the left 8-byte FIFO. Right host can request an interrupt transfer to get the setup command from left host. The
status stage of the left side control transfer will not be terminated until that the right side get the setup command
via interrupt transfer.
- Right 8-byte FIFO: provide a pipe to link right endpoint 0 and left endpoint 3.
- Left 64-bytes DATA0/DATA1 FIFOs: provide a pipe to link left endpoint 2 and right endpoint 1. For
example, if left host wants to transfer data to right host, left host can issue bulk write transfer and the payload will
be stored in the left 64-byte FIFOs. Right host can request a bulk read transfer to get the data from left host.
- Right 64-bytes DATA0/DATA1 FIFOs: provide a pipe to link right endpoint 2 and left endpoint 1.
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GL620USB
GPIO1
LVM
GPIO2
GPIO3
XTAL1
VCP
5. Pin Definitions and Descriptions
PIN SYMBOL I/O DESCRIPTION
1 GPIO1 B General purpose IO pin / Driving LED capability
2 GPIO2 B General purpose IO pin / Driving LED capability
3 LVM B Left D4 LVP B Left D+
5 VCP O 3.3V output
6 RVP B Right D+
7 RVM B Right D8 AGND - Ground
9 DGND - Ground
10 OSCSEL I Selection of clock type
11 EXTRST_ I External reset
12 XTAL1 I 12M crystal input
13 XTAL2 O Crystal output
14 GPIO3 B General purpose IO pin
15 GPIO4 B General purpose IO pin
16 VCC - 5V power
LVP
RVP
RVM
AGND
1
2
3
4
5
6
7
8
16-pin SOP
16
VCC
15
GPIO4
14
13
XTAL2
12
11
EXTRST_
10
OSCSEL
9
DGND
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6. Electrical Characteristics
6.1 Absolute Maximum Ratings (Voltages referenced to GND)
SYMBOL Description MIN MAX
VCC DC supply voltage -0.5V +7V
VI DC input voltage -0.5V VCC+0.5V
V
DC input voltage range for bidirect pins -0.5V VCC+0.5V
I/O
V
DC input voltage for USB D+/D- pins(PIN3, 4, 6, 7) -0.5V VCC+0.5V
AI/O
V
DC voltage applied to outputs in High Z state -0.5V VCC+0.5V
I/OZ
V
static discharge voltage 4000V
ESD
6.2 DC Characteristics (VCP/D+/D-)
SYMBOL Description MIN TYP MAX UNIT
V
VCP regulator output 3.0 3.3 3.6 V
3.3
I
VCP maximum supply current 27 41 56 mA
3.3
VOL D+/D- static output LOW(RL of 1.5K to 3.6V ) 0.3 V
VOH D+/D- static output HIGH (RL of 15K to GND ) 2.8 3.6 V
VDI Differential input sensitivity 0.2 V
VCM Differential common mode range 0.8 2.5 V
VSE Single-ended receiver threshold 0.2 V
CIN Transceiver capacitance 20 pF
ILO Hi-Z state data line leakage -10 +10
Z
Driver output resistance 28 43 Ohms
DRV
µA
6.3 DC Characteristics (PIN1, 2)
SYMBOL Description MIN TYP MAX UNIT
VDD Power Supply Voltage 4.5 5.0 5.5 V
IOL DC output sink current at 0.4V 13.01 19.54 24.82 mA
IOH DC output source current at VDD -0.4V 6.35 9.82 12.37 mA
I
DC output source current at TTL high 24.62 49.45 69.12 mA
OHTTL
VIL LOW level input voltage 0.7 V
VIH HIGH level input voltage 2.66 V
V
LOW to HIGH threshold voltage 2.02 2.38 2.66 V
TLH
V
HIGH to LOW threshold voltage 0.7 0.83 1.0 V
THL
V
Hysteresis voltage 1.1 1.55 1.79 V
HYS
VOL LOW level output voltage when IOL=16mA 0.4 V
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6.4 DC Characteristics (PIN10, 11)
SYMBOL Description MIN TYP MAX UNIT
VDD Power Supply Voltage 4.5 5.0 5.5 V
VIL LOW level input voltage 0.69 V
VIH HIGH level input voltage 2.65 V
V
LOW to HIGH threshold voltage 2.01 2.37 2.65 V
TLH
V
HIGH to LOW threshold voltage 0.69 0.82 0.99 V
THL
V
Hysteresis voltage 1.1 1.55 1.79 V
HYS
RUP Pad internal pullup resister 191.27 240.69 376.34 Kohms
6.5 DC Characteristics (PIN14, 15)
SYMBOL Description MIN TYP MAX UNIT
VDD Power Supply Voltage 4.5 5.0 5.5 V
IOL DC output sink current at 0.4V 3.89 5.94 7.56 mA
IOH DC output source current at VDD -0.4V 2.85 4.36 5.46 mA
I
DC output source current at TTL high 10.9 21.5 29.75 mA
OHTTL
VIL LOW level input voltage 0.71 V
VIH HIGH level input voltage 2.68 V
V
LOW to HIGH threshold voltage 2.03 2.39 2.68 V
TLH
V
HIGH to LOW threshold voltage 0.71 0.83 1.0 V
THL
V
Hysteresis voltage 1.1 1.55 1.8 V
HYS
VOL LOW level output voltage when IOL=4mA 0.4 V
RDN Pad internal pulldown resister 122.08 160 267.31 Kohms
6.6 Switching Characteristics
SYMBOL Description MIN TYP MAX UNIT
FX1 X1 crystal frequency 11.97 12 12.03 MHz
T
X1 cycle time 83.3 ns
CYC
T
X1 clock LOW time 0.45T
X1L
T
X1 clock HIGH time 0.45T
X1H
T
Output pad rise time from 10% to 90% swing with 30pF
r30pf
loading
T
Output pad fall time from 10% to 90% swing with 30pF
f30pf
loading
T
Output pad rise time from 10% to 90% swing with50pF
r50pf
loading
T
Output pad fall time from 10% to 90% swing with 50pF
f50pf
loading
T
D+/D- rise time with 50pF loading 4 20 ns
rUSB
T
D+/D- fall time with 50pF loading 4 20 ns
fUSB
ns
cyc
ns
cyc
6 8 12 ns
5.3 7 10.4 ns
9.5 13 19 ns
7.7 10 16 ns
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7. Package Diagram
A
Symbol
Dimension in mils Dimension in mm
Min Nom Max Min Nom Max