Datasheet FDP7045L, FDB7045L Datasheet (Fairchild Semiconductor)

FDP7045L/FDB7045L

N-Channel Logic Level PowerTrench

®

MOSFET

FDP7045L/FDB7045L

January 2000

General Description

This N-Channel Logic Level MOSFET has been designed
specifically to improve the overall efficiency of DC/DC
converters using either synchronous or conventional
switching PWM controllers.

These MOSFETs feature faster switching and lower gate
charge than other MOSFETs with comparable R
specifications resulting in DC/DC power supply designs
with higher overall efficiency.

G

D

S

TO-220

FDP Series

Absolute Maximum Ratings

DS(on)

G

TC = 25°C unless otherwise noted

Features

 100 A, 30 V. R

 Critical DC electrical parameters specified at elevated
temperature.

 Rugged internal source-drain diode can eliminate the
need for an external Zener diode transient suppressor.

 High performance PowerTrench technology for
extremely low R

 175°C maximum junction temperature rating.

= 0.0045 W @ VGS = 10 V

DS(ON)

= 0.006 W @ VGS = 4.5 V.

R

DS(ON)

.

DS(ON)

D

G

S

TO-263AB

FDB Series

D

S

Symbol Parameter

V

DSS

V

GSS

I

D

D

TJ, T

STG

Drain-Source Voltage 30 V
Gate-Source Voltage
Maximum Drain Current - Continuous (Not e 1) 100

- Pulsed (Note 1) 300
Total Power Dissipation @ TC = 25°C 125 WP
Derate above 25°C0.85W/
Operating and Storage Junction Temperature Range -65 to +175

Thermal Characteristics

R

JC

θ

R

JA

θ

Thermal Resistance, Junction-to-Case 1.2
Thermal Resistance, Junction-to-Ambient 62.5

Package Outlines and Ordering Information

Device Marking Device Reel Size Tape Width Quantity

FDB7045L FDB7045L 13’’ 24mm 800
FDP7045L FDP7045L Tube N/A 45

ã1999 Fairchild Semiconductor Corporation

FDP7045L FDB7045L

20 V

±

75

FDP7045L/FDB7045L Rev.C

Units

A

C

°

C

°

C/W

°

C/W

°

FDP7045L/FDB7045L

Electrical Characteristics

TC = 25°C unless otherwise noted

Symbol Parameter Test Conditions Min Typ Max Units

Off Characteristics

BV

DSS

DSS

BV

∆

T

J

∆

I

DSS

I

GSSF

I

GSSR

On Characteristics

V

GS(th)

GS(th)

V

∆

T

J

∆

R

DS(on)

I

D(on)

g

FS

Drain-Source Breakdown

VGS = 0 V, ID = 250 µA30 V
Voltage
Breakdown Voltage Temperature

ID = 250 µA, Referenced to 25°C22 mV/
Coefficient

Zero Gate Voltage Drain Current VDS = 24 V, VGS = 0 V 1
Gate-Body Leakage Current,

VGS = 20 V, VDS = 0 V 100 nA

A

µ

Forward
Gate-Body Leakage Current,

VGS = -20 V, VDS = 0 V -100 nA
Reverse

(Note 2)

Gate Threshold Voltage VDS = VGS, ID = 250 µA11.53V
Gate Threshold Voltage

ID = -250 µA, Referenced to 25°C-5 mV/
Temperature Coefficient

Static Drain-Source
On-Resistance

VGS = 10 V, ID = 50 A,

= 10 V, ID = 50 A, TJ=125°C

V

GS

= 4.5 V,ID = 40 A

V

GS

0.0039

0.0056

0.0048

0.0045

0.0070

0.0060

Ω

On-State Drain Current VGS = 10 V, VDS = 10 V 50 A
Forward Transconductance VDS = 5 V, ID = 50 A 120 S

Dynamic Characteristics

C

iss

C

oss

C

rss

Input Capacitance 5400 pF
Output Capacitance 1170 pF
Reverse Transfer Capacitance

V

= 15 V, VGS = 0 V,

DS

f = 1.0 MHz

530 pF

C

°

C

°

(Note 2)

Switching Characteristics

t
t
t
t
Q
Q
Q

d(on)

r

d(off)

f

g

gs

gd

Turn-On Delay Time 14 30 ns
Turn-On Rise Time 114 160 ns
Turn-Off Delay Time 105 150 ns
Turn-Off Fall Time
Total Gate Charge 50 70 nC
Gate-Source Charge 16 nC
Gate-Drain Charge

V

= 15 V, ID = 50 A,

DD

= 10 V

V

GS

115 160 ns

V

= 15 V,

DS

= 50 A, VGS = 5 V

I

D

16 nC

Drain-Source Diode Characteristics and Maximum Ratings

I

S

V

SD

Maximum Continuous Drain-Source Diode Forward Current
Drain-Source Diode Forward

V = 0 V, I = 50 A
Voltage

Notes:

1. Calculated continuous current based on maximum allowable junction temperature. Actual maximum continuous current limited by package constraints to 75A.

2. Pulse Test: Pulse Width £ 300 ms, Duty Cycle £ 2.0%

(Note 2)

(Note 2)

75 A

0.95 1.2 V

FDP7045L/FDB7045L Rev.C

Typical Characteristics

FDP7045L/FDB7045L

80

VGS = 10V

3.5V

4.5V

60

40

20

, DRAIN-SOURCE CURRENT (A)

D

I

0

00.511.52

3.0V

, DRAIN-SOURCE VOLTAGE (V)

V

DS

2.5V

2.2

2

1.8
VGS = 3.0V

1.6

1.4

, NORMALIZED

DS(ON)

1.2

R

1

DRAIN-SOURCE ON-RESISTANCE

0.8

0 20406080

3.5V

4.0V

4.5V

I

, DRAIN CURRENT (A)

D

5.0V

Figure 1. On-Region Characteristics. Figure 2. On-Resistance Variation

with Drain Current and Gate Voltage.

1.8
ID = 50A

= 10V

V

GS

1.6

1.4

1.2

, NORMALIZED

1

DS(ON)

R

0.8

DRAIN-SOURCE ON-RESISTANCE

0.6

-50 -25 0 25 50 75 100 125 150 175

T

, JUNCTION TEMPERATURE (oC)

J

0.014

0.012

0.01

0.008

0.006

, ON-RESISTANCE (OHM)

0.004

DS(ON)

R

0.002

0

246810

, GATE TO SOURCE V O LTAGE (V)

V

GS

6.0V

TA = 125oC

TA = 25oC

7.0V
10V

ID = 38A

Figure 3. On-Resistance Variation

with Temperature.

60

VDS = 5V

50

40

30

20

, DRAIN CURRENT (A)

D

I

10

0

11.522.533.54

TA = 125oC

25oC

-55oC

V

, GATE TO SOURCE VOLTAGE (V)

GS

Figure 5. Transfer Characteristics.

Figure 4. On-Resistance Variation

with Gate-to-Source Voltage.

100

VGS = 0V

10

1

0.1

0.01

0.001

, REVERSE DRAIN CURRENT (A)

S

I

0.0001
0 0.2 0.4 0.6 0.8 1 1.2 1.4

TA = 125oC

25oC

-55oC

V

, BODY DIODE FORWARD VOLTAGE ( V )

SD

Figure 6. Body Diode Forward Voltage

Variation with Source Current

and Temperature.

FDP7045L/FDB7045L Rev.C

Typical Characteristics (continued)

FDP7045L/FDB7045L

10

ID = 50A

8

VDS = 5V

15V

10V

6

4

2

0

0 20406080100

Q

, GATE CHARGE (nC)

g

7000

6000

C

ISS

5000

4000

3000

2000

C

1000

0

OSS

C

RSS

5 1015202530

V

, DRAIN TO SOURCE VOLTAGE (V)

DS

Figure 7. Gate-Charge Characteristics. Figure 8. Capacitance Characteristics.

1000

100

R

DS(ON)

LIMIT

10ms

1ms

10µs

100µs

100ms

VGS = 10V

10

SINGLE PULSE

= 1.2oC/W

R

JC

θ

T

= 25oC

C

1

0.1 1 10 100

V

, DRAIN-SOURCE VOLTAGE (V)

DS

5000

SINGLE PULSE

= 1.2oC/W

R

4000

JC

θ

T

= 25oC

C

3000

2000

1000

0

0.01 0.1 1 10 100 1000

SINGLE PULSE TIME (SEC)

f = 1MHz

= 0 V

V

GS

Figure 9. Maximum Safe Operating Area. Figure 10. Single Pulse Maximum

Power Dissipation.

1

E
V

I
T
C
E
F
F
E

D
E
Z

I
L
A

M
R
O
N
,

)

t

(

r

TRANSIENT THERMAL RESISTANCE

D = 0.5

0.5

0.3

0.2

0.2

0.1

0.1

0.05

0.03

0.02

0.01

0.05

0.02

0.01

Single Pulse

0.01 0.05 0.1 0.5 1 5 10 50 100 500 1000
t ,TIME (ms)

1

R (t) = r(t) * R

JC

θ

R = 1.2 °C/W

JC

θ

P(pk)

t

1

t

2

T - T = P * R (t)

J

C

Duty Cycle, D = t / t

JC

θ

JC

θ

2

1

Figure 11. Transient Thermal Response Curve.

Thermal characterization performed using the conditions described in Note 1.
Transient themal response will change depending on the circuit board design.

FDP7045L/FDB7045L Rev.C

TO-220 Tape and Reel Data and Package Dimensions

TO-220 Tube Packing
Configuration: Figure 1.0

45 units per Tube

12 Tubes per Bag

530mm x 130mm x 83mm

2 bags per Box

Conduct ive Plastic Bag

Intermediate box

Packaging Description:

TO-220 parts are ship ped normally in tube. The tub e is
made of PVC plas tic treated wi th anti -stati c agent .These
tubes in s tandard opt ion are placed in side a di ssipativ e
plastic bag, barcode labeled, and placed inside a box
made of r ecy cl able cor rug ate d pape r. On e bo x c ont ain s
tw o ba gs m ax im um (se e fi g. 1. 0). A nd on e or se ver al o f
these boxes are placed ins ide a labeled shipp ing box
wh ic h c omes in d i f f er en t si z es de pe ndi n g o n th e nu m be r
of parts shipped. The other opt ion comes in bulk as
described in the Packagin g In fo rm atio n tab le. The un it s in
this op tion ar e placed inside a s mall box laid w ith anti­static bu bble sheet. These smaller box es are indiv idually
labeled and plac ed inside a lar ger box (see fig. 3.0).
These larger or int ermediate boxes then w ill be placed
finally ins ide a labeled ship ping box whic h st ill co mes in
diff erent sizes depending on the nu m ber of units sh ipped.

TO-220 Packaging
Information: Figure 2.0

TO-220 Packaging Information

Packaging Option
Packaging type

Qty per Tube/Box
Box Dimension (mm)
Max qty per Box
Weight per unit (gm)

Note/Comments

Stan dard

(no fl ow code)

Rail/Tube

45

530x130x83

1,080

1.4378

S62Z
BULK

114x102x51

1,500

1.4378

TO-220 bulk Packing
Configuration: Figure 3.0

FSCINT Label

300 units per

EO70 box

114mm x 102mm x 51mm

TO-220 Tube
Configuration: Figure 4.0

Note: All dim ensions are in inches

9852

9852

F

F

NDP4060L

NDP4060L

300

EO70 Immediate Box

9852

F

NDP4060L

9852

F

NDP4060L

9852

F

NDP4060L

9852

F

NDP4060L

Anti-static

Bubbl e Sheets

5 EO70 boxes per per

Interme di ate Box

9852

9852

F

NDP4060L

F

NDP4060L

20.000
+0.031

-0.065

F

NDP4060L

1080 units maximum

quantity per box

FSCINT Label

0.123

+0.001

-0.003

9852

9852

F

NDP4060L

9852

F

NDP4060L

FSCINT Label samp le

LOT:

NSID:

D/C1:

530mm x 130mm x 83mm

Intermediate box

FSCINT Label

0.450

9852

F

NDP4060L

±.030

0.800

FAIRCHILD SEMICONDUCTOR CORPORAT ION

CBVK741B019

FDP7060

SPEC REV:

D9842

1500 units maximum

quantity per intermediate box

0.165

0.080

0.275

1.300
±.015

0.032
±.003

0.275

QA REV:

0.160

HTB:B

QTY:

1080

SPEC:

B2

(FSCINT)

August 1999, Rev. B

TO-220 Tape and Reel Data and Package Dimensions, continued

TO-220 (FS PKG Code 37)

1:1

Scale 1:1 on letter size paper

Dimensions shown below are in:

inches [millimeters]

Part Weight per unit (gram): 1.4378

September 1998, Rev. A

TO-263AB/D2PAK Tape and Reel Data and Package
Dimensions

TO-263AB/D2PAK Packaging
Configuration: Figure 1.0

ELECTROSTATIC

SENSITIVE DEVICES

DO NOT SHIP OR STORE NEAR STRONG ELECTROSTATIC
ELECTROMAGNETIC, MAGNETIC OR RADIOACTIVE FIELDS

TNR DATE
PT NUMBER
PEEL STRENGTH MIN ______________gms

Customized
Label

MAX _____________ gms

ESD Label

Moisture Sensitive

Antistatic Cover Tape

CAUTION

Label

F63TNR
Label

Static Dissipative

Embossed Car rier Tape

FDB603AL

F

9835

Packaging Description:

TO-263/D2PAK parts are shipped in tape. The carrier tape
is made from a dissipative (carbon filled) polycarbonate
resin. The cover tape is a multilayer film (Heat Activated
Adhesive in nature) primarily composed of polyester film,
adhesive layer, sealant, and anti-static sprayed agent.
These reeled parts in standard option are shipped with
800 unit s per 13" or 330cm di ameter reel. Th e reels are
dark blue in color and is made of polystyrene plastic (anti­static coated). This and some other options are further
described in the Packaging Information table.

These full reels are individually barcode labeled, dry
packed, and placed inside a standard intermediate box
(illus trated in fi gure 1.0) ma de of recycla ble corru gated
brown paper. One box contains one reel maximum. And
these boxes are placed inside a barcode labeled shipping
box which comes in different sizes depending on the
number of parts shipped.

FDB603AL

F

9835

FDB603AL

F

9835

FDB603AL

F

9835

TO-263AB/D2PAK Packaging Information

Packaging Option
Packaging type

Qty per Reel/Tube/Bag
Reel Size
Box Dimension (mm)
Max qty per Box
Weight per unit (gm)
Weight per Reel

Note/Comments

Standard

(no flow code)

TNR

13" Dia

359x359x57 530x130x83

1.4378 1.4378

1.6050 -

L86Z

Rail/Tube

800 45

800 1,080

-

F63TNR Label sample

LOT: CBVK741B019

FSID: FDB6320L

D/C1: D9842 QTY1: SPEC REV:
D/C2: QTY2: CPN:

QTY: 800

SPEC:

N/F: F (F63TNR)3

TO-263AB/D2PAK Tape Leader and Trailer
Configuration: Figure 2.0

TO-263AB/D2PAK Unit Orientation

359mm x 359mm x 57mm

Stand a r d In t e rm ed iate box

ESD Label

Moisture Sensitive

Label

F63TNR Label

DRYPACK Bag

Carrier Tape

Cover Tape

Trailer Tape
400mm minimum or
25 empty pockets

Components

Leader Tape
1520mm minimum or
95 empty pockets

September 1999, Rev. B

TO-263AB/D2PAK Tape and Reel Data and Package Dimensions, continued

TO-263AB/D2PAK Embossed Carrier Tape
Configuration: Figure 3.0

T

K0

Wc

Tc

B0

A0

P0

D0

P1

User Direction of Feed

Dimensions are in millimeter

E1

F

W

E2

D1

Pkg ty pe

T

O263AB/

2

D

PAK

(24mm)

Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481

rotational and lateral movement requirements (see sketches A, B, and C).

TO-263AB/D

A0 B0 W D0 D1 E1 E2 F P1 P0 K0 T Wc Tc

10.60

15.80

24.0

1.55

1.60

1.75

22.25

+/-0.10

+/-0.10

+/-0.3

+/-0.05

10 deg maximum component rotation

Sketch A (Side or Front Sectional View)

Component Rotation

2

PAK Reel Configuration:

+/-0.10

+/-0.10

B0

Sketch B (Top View)

Component Rotation

min

11.50
+/-0.10

10 deg maximum

A0

Figure 4.0

W1 Measured at Hub

Dim A

max

Dim N

16.0
+/-0.1

Typical
component
cavity
center line

Typical
component
center line

Dim A

Max

Dim D

min

4.0
+/-0.1

4.90

0.450
+/-0.150

21.0
+/-0.3

0.9mm
maximum

+/-0.10

0.9mm
maximum

Sketch C (Top View)

Component lateral movement

B Min

Dim C

0.06
+/-0.02

Tape Size

24mm 13" Dia

Reel

Option

DETAIL AA

13" Diameter Option

See detail AA

W2 max Measured at Hub

W3

Dimensions are in inches and millimeters

Dim A Dim B Dim C Dim D Dim N Dim W1 Dim W2 Dim W3 (LSL-USL)

13.00

0.059

1.5

512 +0.020/ -0.008
13 +0.5/-0.2

330

0.795

20.2

4.00
100

0.961 +0.078/-0.000

24.4 +2/0

1.197

30.4

0.941 – 0.1.079

23.9 – 27.4

August 1999, Rev. B

TO-263AB/D2PAK Tape and Reel Data and Package Dimensions, continued

TO-263AB/D2PAK (FS PKG Code 45)

1:1

Scale 1:1 on letter size paper

Dimensions shown below are in:

inches [millimeters]

Part Weight per unit (gram): 1.4378

August 1998, Rev. A

TRADEMARKS

The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.

ACEx™
CoolFET™
CROSSVOLT™

2

E

CMOS

TM

FACT™
FACT Quiet Series™

®

FAST
FASTr™
GTO™
HiSeC™

ISOPLANAR™
MICROWIRE™
POP™
PowerTrench



QFET™
QS™

Quiet Series™
SuperSOT™-3
SuperSOT™-6
SuperSOT™-8

SyncFET™
TinyLogic™
UHC™
VCX™

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER
NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICA TION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROV AL OF FAIRCHILD SEMICONDUCTOR CORPORA TION.
As used herein:

1. Life support devices or systems are devices or
systems which, (a) are intended for surgical implant into
the body, or (b) support or sustain life, or (c) whose
failure to perform when properly used in accordance
with instructions for use provided in the labeling, can be
reasonably expected to result in significant injury to the
user.

2. A critical component is any component of a life
support device or system whose failure to perform can
be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or

effectiveness.

PRODUCT STA TUS DEFINITIONS
Definition of Terms

Datasheet Identification Product Status Definition

Advance Information

Preliminary

No Identification Needed

Obsolete

Formative or
In Design

First Production

Full Production

Not In Production

This datasheet contains the design specifications for
product development. Specifications may change in
any manner without notice.

This datasheet contains preliminary data, and
supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.

This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.

This datasheet contains specifications on a product
that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.

Rev. D