Datasheet FAN2502 Datasheet (Fairchild Semiconductor)

www.fairchildsemi.com

FAN2502, FAN2503

150 mA CMOS LDO Regulators

Features

• Ultra Low Power Consumption

• 150 mV dropout voltage at 150 mA

• 25 µA ground current at 150 mA

• Enable/Shutdown Control

• SOT23-5 package

• Thermal limiting

• 300 mA peak current

Applications

• Cellular Phones and accessories

•PDAs

• Portable cameras and video recorders

• Laptop, notebook and palmtop computers

Description

The F AN2502/03 family of micropower lo w-dropout v oltage
regulators utilize CMOS technology to offer a new level of
cost-effective performance in GSM and TDMA cellular
handsets, Laptop and Notebook portable computers, and
other portable devices. Features include extremely low
power consumption and low shutdown current, low dropout
voltage, exceptional loop stability able to accommodate a

wide variety of external capacitors, and the compact SOT23-5
surface-mount package. The F AN2502/03 family of products
offer significant improvements over older BiCMOS designs
and are pin-compatible with many popular devices. The
output is thermally protected against overload.

The FAN2502 and FAN2503 devices are distinguished by
the assignment of pin 4:

FAN2502: pin 4 – ADJ, allowing the user to adjust the

output voltage over a wide range using an external voltage
divider.

FAN2502-XX: pin 4 – BYP, to which a bypass capacitor

may be connected for optimal noise performance. Output
voltage is fixed, indicated by the suffix XX.

FAN2503-XX: pin 4 – ERR

, a flag which indicates that the
output voltage has dropped below the specified minimum
due to a fault condition.

The standard fixed output voltages available are 2.5V, 2.6V,

2.7V, 2.8V , 2.85V, 3.0V , and 3.3V. Custom output voltage are
also available: please contact your local Fairchild Sales
Office for information.

Block Diagrams

V

IN

Bandgap

FAN2502

EN

Error
Amplifier

Thermal

Sense

p

V

IN

FAN2503-XX

V

OUT

ADJ

GND

Bandgap

V

IN

FAN2502-XX

EN

Error
Amplifier

Thermal

Sense

Bandgap

p

Error
Amplifier

Thermal

Sense

ERR

V

OUT

GND

EN

BYP

p

V

OUT

GND

REV. 1.1.7 2/14/03

0:

1:

0:

. 1:

PRODUCT SPECIFICATION FAN2502/FAN2503

Pin Assignments

15

V

IN

V

OUT

EN

2

3

4

ADJ/BYP/ERR

GND

Pin No. FAN2502 FAN2502-XX FAN2503-XX

1. V

IN

V

IN

2. GND GND GND

3. EN EN EN

4. ADJ BYP ERR

5. V

OUT

V

OUT

Pin Descriptions

Pin Name Pin No. Type Pin Function Description

ADJ 4 Input

BYP 4 Passive

ERR 4 Open drain FAN2503-XX Error. Error flag output.

EN 3 Digital Input Enable.

V

V

IN

OUT

1 Power in
5 Power out

GND 2 Power

FAN2502 Adjust. Ratio of potential divider from VOUT to ADJ

determines output voltage.

FAN2502-XX Bypass. Connect 470 pF capacitor for noise reduction.

Output voltage < 95% of nominal.
Output voltage > 95% of nominal.

Shutdown V
Enable V

OUT

OUT

.

Voltage Input. Supply voltage input.
Voltage Output. Regulated output voltage.
Ground.

V

V

OUT

IN

Functional Description

Designed utilizing CMOS process technology, the
FAN2502/03 family of products are carefully optimized for
use in compact battery-powered devices, offering a unique
combination of low power consumption, extremely low
dropout voltages, high tolerance for a variety of output
capacitors, and the ability to disable the output to less than
1µA under user control. In the circuit, a difference amplifier
controls the current through a series-pass P-Channel
MOSFET, comparing the load voltage at the output with an
onboard low-drift bandgap reference. The series resistance
of the pass P-Channel MOSFET is approximately 1 Ω ,
resulting in an unusually low dropout voltage under load
when compared to older bipolar pass-transistor designs.

2

Protection circuitry is provided onboard for overload condi­tions. In conditions where the device reaches temperatures
exceeding the specified maximums, an onboard circuit shuts
down the output, where it remains suspended until it has
cooled before re-enabling. The user is also free to shut down
the device using the Enable control pin at any time.

Careful design of the output regulator amplifier assures loop
stability over a wide range of ESR values in the external
output capacitor. A wide range of values and types can be
accomodated, allowing the user to select a capacitor meeting
his space, cost, and performance requirements, and enjoy
reliable operation over temperature, load, and tolerance
variations.

REV. 1.1.7 2/14/03

3

FAN2502/FAN2503 PRODUCT SPECIFICATION

Depending on the model selected, a number of control and
status functions are available to enhance the operation of the
LDO regulator. An Enable pin, available on all devices,
allows the user to shut down the regulator output to conserv e
power, reducing supply current to less than 1µA. The
adjustable-voltage versions of the device utilize pin 4 to
connect to an external voltage divider which feeds back to
the regulator error amplifier, thereby setting the voltage as
desired. Two other functions are available at pin 4 in the
fixed-voltage versions: in noise-sensitive applications, an
external Bypass capacitor connection is provided that allows
the user to achieve optimal noise performance at the output,
while the Error output functions as a diagnostic flag to
indicate that the output voltage has dropped more than 5%
below the nominal fixed voltage.

Applications Information

External Capacitors – Selection

The FAN2502/03 allows the user to utilize a wide variety of
capacitors compared to other LDO products. An innovative
design approach offers significantly reduced sensitivity to
ESR (Effective Series Resistance), which de grades re gulator
loop stability in older designs. While the improvements fea­tured in the FAN2502/03 family greatly simplify the design
task, capacitor quality still must be considered if the designer
is to achieve optimal circuit performance. In general,
ceramic capacitors offer superior ESR performance, at a
lower cost and a smaller case size than tantalums. Those with
X7R or Y5Vdielectric offer the best temperature coefficient
characteristics. The combination of tolerance and variation
over temperature in some capacitor types can result in signif­icant variations, resulting in unstable performance over rated
conditions.

Input Capacitor

An input capacitor of 2.2µF (nominal value) or greater,
connected between the Input pin and Ground, located in
close proximity to the device, will improve transient
response and noise rejection. Higher values will offer supe­rior input ripple rejection and transient response. An input
capacitor is recommended when the input source, either a
battery or a regulated AC voltage, is located far from the
device. Any good quality ceramic, tantalum, or metal film
capacitor will give acceptable performance, however tanta­lum capacitors with a surge current rating appropriate to the
application must be selected to avoid catastrophic failure.

Output Capacitor

An output capacitor is required to maintain regulator loop
stability. Unlike many other LDO regulators, the FAN2502/
03 family of products are nearly insensitve to output capaci­tor ESR. Stable operation will be achieved with a wide
variety of capacitors with ESR values ranging from 10m Ω to
10 Ω or more. Tantalum or aluminum electrolytic, or multi­layer ceramic types can all be used. A nominal value of at
least 1µF is recommended.

Bypass Capacitor (FAN2502 Only)

In the fixed-voltage configuration, connecting a capacitor
between the bypass pin and ground can significantly reduce
noise on the output. Values ranging from 470pF to 10nF can
be used, depending on the sensitivity to output noise in the
application.

At the high-impedance Bypass pin, care must be taken in the
circuit layout to minimize noise pickup, and capacitors must
be selected to minimize current loading (leakage). Noise
pickup from external sources can be considerable. Leakage
currents into the Bypass pin will directly affect regulator
accuracy and should be kept as low as possible; thus, high­quality ceramic and film types are recommended for their
low leakage characteristics. Cost-sensitive applications not
concerned with noise can omit this capacitor.

Control Functions

Enable Pin

Applying a voltage of 0.4V or less at the Enable pin will
disable the output, reducing the quiescent output current to
less than 1µA, while a voltage of 2.0V or greater will enable
the device. If this shutdown function is not needed, the pin
can simply be connected to the V
float will cause erratic operation.

Error Flag (FAN2503 only)

To indicate conditions such as input voltage dropout
(low V

), overheating, or overloading (e xcessi v e output cur -

IN

rent), the ERR pin indicates a fault condition. It is an open­drain output which is HIGH when the voltage at V
greater than 95% of the nominal rated output voltage and
LOW when V

is less than 95% or the rated output volt-

OUT

age, as specified in the error trip level characteristics.

A logic pullup resistor of 100K Ω is recommended at this
output. The pin can be left disconnected if unused.

Thermal Protection

The F AN2502/03 is designed to supply high peak output cur ­rents of up to 1A for brief periods, however this output load
will cause the device temperature to increase and exceed
maximum ratings due to power dissipation. During output
overload conditions, when the die temperature exceeds the
shutdown limit temperature of 150°C, onboard thermal
protection will disable the output until the temperature drops
below this limit, at which point the output is then re-enabled.
During a thermal shutdown situation the user may assert the
power-down function at the Enable pin, reducing power
consumption to the minimum level I

pin. Allowing this pin to

IN

OUT

x V

GND

IN

.

is

REV. 1.1.7 2/14/03

PRODUCT SPECIFICATION FAN2502/FAN2503

Thermal Characteristics

The FAN2502/03 is designed to supply 150mA at the
specified output voltage with an operating die (junction)
temperature of up to 125°C. Once the power dissipation and
thermal resistance is known, the maximum junction
temperature of the device can be calculated. While the po wer
dissipation is calculated from known electrical parameters,
the thermal resistance is a result of the thermal characteris­tics of the compact SOT23-5 surface-mount package and the
surrounding PC Board copper to which it is mounted.

The power dissipation is equal to the product of the input-to­output voltage differential and the output current plus the
ground current multiplied by the input voltage, or:

P

VINV

D

The ground pin current I

–()I

OUT

OUTVIN

can be found in the charts

GND

provided in the Electrical Characteristics section.

The relationship describing the thermal behavior of the
package is:

T



J max()TA

-------------------------------

P

=

D max()



θ

JA



I

+=

GND

–

the device to enter a thermal cycling loop, in which the
circuit enters a shutdown condition, cools, re-enables, and
then again overheats and shuts down repeatedly due to an
unmanaged fault condition.

Operation of Adjustable Version

The adjustable version of the FAN2502/03 includes an input
pin ADJ which allows the user to select an output voltage
ranging from 1.5V to near V
divider . The voltage V

ADJ

the onboard error amplifier which adjusts the output voltage
until V

is equal to the onboard bandgap reference voltage

ADJ

of 1.32V(typ). The equation is:

V

OUT

The total value of the resistor chain should not exceed
250K Ω total to keep the error amplifier biased during
no-load conditions. Programming output voltages very near
V

need to allow for the magnitude and variation of the

IN

dropout voltage V

over load, supply, and temperature

DO

variations. Note that the low-leakage FET input to the
CMOS Error Amplifier induces no bias current error to the
calculation.

, using an external resistor

IN

presented to the ADJ pin is fed to

R

1.32V 1

--------------- -+×=
R

upper
lower

where T
ture of the die, which is 125°C, and T
ing temperature. θ
board layout and can be empirically obtained. While the θ

is the maximum allowable junction tempera-

J(max)

is dependent on the surrounding PC

JA

is the ambient operat-

A

JC

(junction-to-case) of the SOT23-5 package is specified at
130°C /W, the θ

of the minimum PWB footprint will be at

JA

least 235°C /W. This can be improved upon by providing a
heat sink of surrounding copper ground on the PWB.
Depending on the size of the copper area, the resulting θ

JA

can range from approximately 180°C /W for one square inch
to nearly 130°C /W for 4 square inches. The addition of
backside copper with through-holes, stiffeners, and other
enhancements can also aid in reducing this value. The heat
contributed by the dissipation of other devices located
nearby must be included in design considerations.

Once the limiting parameters in these two relationships have
been determined, the design can be modified to ensure that
the device remains within specified operating conditions.
If overload conditions are not considered, it is possible for

General PWB Layout Considerations

T o achieve the full performance of the device, careful circuit
layout and grounding technique must be observed. Establish­ing a small local ground, to which the GND pin, the output
and bypass capacitors are connected, is recommended, while
the input capacitor should be grounded to the main ground
plane. The quiet local ground is then routed back to the main
ground plane using feedthrough vias. In general, the high­frequency compensation components (input, bypass, and
output capacitors) should be located as close to the device as
possible. The proximity of the output capacitor is especially
important to achieve optimal noise compensation from the
onboard error amplifier, especially during high load condi­tions. A lar ge copper area in the local ground will provide the
heat sinking discussed above when high power dissipation
significantly increases the temperature of the device.
Component-side copper provides significantly better thermal
performance for this surface-mount device, compared to that
obtained when using only copper planes on the underside.

4

REV. 1.1.7 2/14/03

FAN2502/FAN2503 PRODUCT SPECIFICATION

Absolute Maximum Ratings

(beyond which the device may be damaged)

1

Parameter Min Typ Max Unit
Power Supply Voltages

V

(Measured to GND) 0 7 V

IN

Enable Input (EN)

Applied voltage (Measured to GND)

2

07V

ERR Output

Applied voltage (Measured to GND)

2

07V

Power

Dissipation

3

Internally limited

Temperature

Junction -65 150 °C
Lead Soldering (5 seconds) 260 °C
Storage -65 150 °C
Electrostatic Discharge

Notes:

1. Functional operation under any of these conditions is NOT implied. Performance and reliability are guaranteed only
if Operating Conditions are not exceeded.

2. Applied voltage must be current limited to specified range.

3. Based upon thermally limited junction temperature:

4

4kV

T

–

J max()TA

P

-------------------------------=

D

4. Human Body Model is 4kV minimum using Mil Std. 883E, method 3015.7. Machine Model is 400V minimum using JEDEC
method A115-A.

Θ

JA

Recommended Operating Conditions

Parameter Min Nom Max Units

V

V

V

OUT

V

ERR

T

θ

θ

IN

EN

JA
JC

Input Voltage Range 2.7 6.5 V
Output Voltage Range, Adjustable V

REF

Enable Input Voltage 0 V
ERR

Flag Voltage V

Junction Temperature -40 +125 °C

J

V

-V

IN

DO
IN
IN

Thermal resistance 220 °C/W
Thermal resistance 130 °C/W

V
V
V

REV. 1.1.7 2/14/03

5

PRODUCT SPECIFICATION FAN2502/FAN2503

Electrical Characteristics (Notes 1, 2)

Symbol Parameter Conditions Min. Typ. Max. Units

Regulator

V

DO

∆V

O

V

DO

3

∆V

O

I

GND

Protection

I

GSD

T

SH

E

TL

Enable Input

V

IL

V

IH

I

IH

I

I

Drop Out Voltage I

= 100 µA 2.5 4 mV

OUT

I

= 50 mA 50 75 mV

OUT

I

= 100 mA 100 140 mV

OUT

I

= 150 mA 150 180 mV

OUT

Output Voltage Accuracy -2 2 %
Reference Voltage Accuracy, Adjustable

1.24 1.32 1.40 V

Mode
Output Voltage Accuracy, Adjustable Mode -6 6 %
Ground Pin Current I

= 150 mA 50 µA

OUT

Current Limit Thermally Protected
Shut-Down Current EN = 0V 1 µA
Thermal Protection Shutdown Temperature 150 °C
ERR Trip Level FAN2503 only 90 95 99 %

Logic Low Voltage 1.2 0.4 V
Logic High Voltage 2.0 1.4 V
Input Current High 1 µA
Input Current Low 1 µA

Switching Characteristics (Notes 1, 2)

Parameter Conditions Min. Typ. Max. Unit

Enable Input

4

Response time 500 µsec

Error Flag (FAN2503-XX)

Response time 3 msec

Performance Characteristics (Notes 1, 2)

Symbol Parameter Conditions Min. Typ. Max. Units

∆V

/∆V

OUT

∆V

OUT/VOUT

e

N

IN

PSRR Power Supply Rejection 120 Hz,

Notes:

1. Unless otherwise stated, T

2. Bold values indicate -40 ≤ T

3. The adjustable version, has a bandgap voltage range of 1.24V to 1.40V with a nominal value of 1.32V.

4. When using repeated cycling.

Line regulation VIN = (V
Load regulation I

OUT

OUT

= 0.1 to 150mA 1.0 2.0 %

Output noise 10Hz–1KHz

= 10µF,

C

OUT

C

= 0.01µF

BYP

>10KHz,
C

= 10µF,

OUT

= 0.01µF

C

BYP

= 10µF,

C

OUT

C

= 0.01µF

BYP

= 25°C, VIN = V

A

≤ 125°C.

J

OUT

+ 1V, I

= 100µA, VIH > 2.0 V.

OUT

+ 1) to 6.5V 0.3 % / V

<7

µV/

<0.01

43 dB

Hz

6 REV. 1.1.7 2/14/03

FAN2502/FAN2503 PRODUCT SPECIFICATION

Typical Performance Characteristics

100

I

OUT

C

80

OUT

60

40

PSRR (dB)

20

0

10

100

I

OUT

C

80

OUT

60

40

PSRR (dB)

20

0

10

Power Supply
Rejection Ratio

= 100µA

= 1.0µF Cer.

1k

100

10k

Frequency (Hz)

Power Supply
Rejection Ratio

= 150mA

= 1.0µF Cer.

VIN = 4.0V
V

OUT

1k

100

10k

Frequency (Hz)

VIN = 4.0V
V

OUT

100k

= 3.0V

100k

= 3.0V

1M

1M

10M

10M

Power Supply

100

PSRR (dB)

Rejection Ratio

VIN = 4.0V
V

80

OUT

60

40

20

0

100 1k 10k 100k 1M 10M

10

I
C

= 3.0V

Frequency (Hz)

Power Supply

100

PSRR (dB)

Rejection Ratio

VIN = 4.0V
V

= 3.0V

80

OUT

60

40

20

0

10

I

OUT

C

100 1k 10k 100k 1M 10M

Frequency (Hz)

= 10mA

OUT

= 1.0µF Cer.

OUT

= 100µA

= 10µF Cer.

OUT

Power Supply

100

PSRR (dB)

Rejection Ratio

VIN = 4.0V
V

80

OUT

60

40

20

0

100 1k 10k 100k 1M 10M

10

I
C

= 3.0V

Frequency (Hz)

Power Supply

100

PSRR (dB)

Rejection Ratio

VIN = 4.0V
V

= 3.0V

80

OUT

60

40

20

0

100 1k 10k 100k 1M 10M

10

I
C

Frequency (Hz)

= 100mA

OUT

= 1.0µF Cer.

OUT

= 10mA

OUT

= 10µF Cer.

OUT

Power Supply Power Supply

I

OUT

C

80

OUT

Rejection Ratio

= 100mA

= 10µF Cer.

100

VIN = 4.0V

60

40

PSRR (dB)

V

= 3.0V

OUT

20

0

10

100

1k

10k

100k

1M

10M

Frequency (Hz) Frequency (Hz)

Power Supply

Rejection Ratio vs. Voltage Drop

70
60

I

= 100µA

OUT

50
40
30

PSRR (dB)

20
10

0

10mA

100mA

C

= 10µF Cer.

150mA

OUT

3.0 3.6 4.1

Voltage (V)

100

80

60

40

PSRR (dB)

20

0

10

10

1

Hz)

0.1

0.01

Noise (µV/

0.001

0.0001
10

Rejection Ratio

I

= 150mA

OUT

C

= 10µF Cer.

OUT

VIN = 4.0V
V

1k

10k

100

100k

Noise Performance

VIN = 4.0V
V

C

= 1.0µF

OUT

= 0.01µF

C

BYP

I

= 10µA

L

1k

100

10k

Frequency (Hz)

OUT

OUT

= 3.0V

1M

= 3.0V

100k

10M

1M

Rejection Ratio vs. Voltage Drop

Power Supply

70
60

I

= 100µA

OUT

50
40
30

PSRR (dB)

20
10

0

3.0 3.6 4.1

100mA

150mA

C

OUT

= 1.0µF Cer.

Voltage (V)

Ground Pin Current

25.00

VIN = 4V
V

= 3V

OUT

10

1

Load Current (mA)

Quiescent Current (µA)

23.00

21.00

19.00

17.00

15.00

0.1

10mA

100

REV. 1.1.7 2/14/03 7

PRODUCT SPECIFICATION FAN2502/FAN2503

Typical Performance Characteristics (continued)

Quiescent Current (µA)

Ground Pin Current

35.00

30.00

25.00

20.00

15.00

10.00

5.00

0.00

3.0

Ground Pin Current

75

V

= 4V

IN

V

OUT

I

= 150mA

L

50

25

Quiescent Current (µA)

0

-40

V
I

OUT

4.0

5.0

Input Voltage (V)

= 3V

0

40

Temperature (°C)

OUT

= 3V

= 100µA

6.0

80

7.0

125

Ground Pin Current

35.00

30.00

25.00

20.00

15.00

10.00

Quiescent Current (µA)

5.00

0.00

3.0

4.0

Input Voltage (V)

150.00

Dropout Voltage

120.00

90.00

60.00

Dropout Voltage (mV)

30.00

0.00
25

0.1

Output Current (mA)

50

V

OUT

I

OUT

5.0

100 125 150

75

= 3V

= 150mA

6.0

7.0

75

50

25

Quiescent Current (µA)

0

-40

3.5

3.0
V

2.5

R

2.0

1.5

1.0

Output Voltage (V)

0.5

0.0

0.0 1.0

Ground Pin Current

V

= 4V

IN

V

= 3V

OUT

I

= 100µA

L

0

40

80

Temperature (°C)

Dropout Characteristics

= 3V

OUT

= 30KΩ

OUT

R

= 20Ω

OUT

2.0

3.0

Input Voltage (V)

4.0

125

5.0

Dropout Voltage

8

6

4

I

= 100µA

2

Dropout Voltage (mV)

0

-40

L

0

40

125

80

Temperature (°C)

Functional Characteristics

Enable Pin Delay

Enable

(1V/div)

Enable Voltage

(1V/div)

Output Voltage

V

OUT

Time (20µs/div)

Dropout Voltage

200

150

100

50

Dropout Voltage (mV)

0

0

-40

Temperature (°C)

I

= 150mA

L

40

125

80

(1V/div)

Disable Voltage

(1V/div)

Output Voltage

Disable

V

OUT

3.05

3

2.95

2.9

Output Voltage (V)

2.85

-40

Shutdown Delay

Time (20µs/div)

Output Voltage

vs. Temperature

V

= 4V

IN

Typical 3V device
I

= 100µA

L

0

40

Temperature (°C)

125

80

8 REV. 1.1.7 2/14/03

FAN2502/FAN2503 PRODUCT SPECIFICATION

Mechanical Dimensions

5-Lead SOT-23-5 (S) Package

Symbol

A .035 .057
A1 .000 .006
B .008
c .003 .010
D .106 .122
E .059 .071
e
e1
H .087 .126
L

α

B

Inches

Min. Max. Min. Max.

.020

.037 BSC
.075 BSC

.004 .024 .10 .60

0° 10°

e

Millimeters

.90 1.45
.00 .15
.20
.08 .25

2.70 3.10

1.50 1.80

2.20 3.20

0° 10°

E

.50

.95 BSC

1.90 BSC

H

Notes

Notes:

1.

Package outline exclusive of mold flash & metal burr.

2.

Package outline exclusive of solder plating.

3.

EIAJ Ref Number SC-74A.

L

e1

D

A

A1

c

REV. 1.1.7 2/14/03 9

PRODUCT SPECIFICATION FAN2502/FAN2503

Ordering Information

Product Number V

OUT

Pin 4 Function Package Marking

FAN2502SX Adj. Adjust AEA
FAN2502S25X 2.5 Bypass AEE
FAN2502S26X 2.6 Bypass AEG
FAN2502S27X 2.7 Bypass AEJ
FAN2502S28X 2.8 Bypass AEM
FAN2502S285X 2.85 Bypass AEN
FAN2502S30X 3.0 Bypass AEW
FAN2502S33X 3.3 Bypass AE3
FAN2503S25X 2.5 Error output AFE
FAN2503S26X 2.6 Error output AFG
FAN2503S27X 2.7 Error output AFJ
FAN2503S28X 2.8 Error output AFM
FAN2503S285X 2.85 Error output AFN
FAN2503S30X 3.0 Error output AFW
FAN2503S33X 3.3 Error output AF3

Tape and Reel Information

Quantity Reel Size Width

3000 7" 8mm

DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:

1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body,
or (b) support or sustain life, and (c) whose failure to
perform when properly used in accordance with
instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the
user.

2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.

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2/14/03 0.0m 005

 2000 Fairchild Semiconductor Corporation

Stock#DS30002502