Page 1
I
NTEGRATED CIRCUITS DIVISION
CPC3982
N-Channel Depletion-Mode
Vertical DMOS FET
PRELIMINARY
V
/
(BR)DSX
V
(BR)DGX
800V 380 20mA SOT-23
R
DS(on)
(max)
(min) Package
I
DSS
Features
• High Breakdown Voltage: 800V
• Low V
• Depletion Mode Device Offers Low R
at Cold Temperatures
• High Input Impedance
• Small Package Size: SOT-23
Voltage: -1.4V to -3.1V
GS(off)
Applications
• Constant Current Regulator
• Ignition Modules
• Normally-On Switches
• Solid State Relays
• Converters
• Telecommunications
• Power Supply
DS(on)
Description
The CPC3982 is an N-channel, depletion mode, field
effect transistor (FET) that utilizes IXYS Integrated
Circuits Division’s proprietary third-generation vertical
DMOS process. The third-generation process realizes
world class, high voltage MOSFET performance
in an economical silicon gate process. Our vertical
DMOS process yields a robust device, with high
input impedance, for use in high-power applications.
The CPC3982 is a highly reliable device that has
been used extensively in our Solid State Relays for
industrial and telecommunications applications.
This device excels in power applications that require
low drain-source resistance, particularly in cold
environments such as automotive ignition modules.
The CPC3982 has a minimum breakdown voltage of
800V, and is available in an SOT-23 package. As with
all MOS devices, the FET structure prevents thermal
runaway and thermal-induced secondary breakdown.
Ordering Information
Part # Description
CPC3982TTR N-Channel Depletion Mode FET, SOT-23 Pkg.
Tape and Reel (3000/Reel)
Package Pinout
(SOT-23)
DS-CPC3982-R00C
Circuit Symbol
D
3
D
G
1
2
SG
PRELIMINARY
S
1
Page 2
I
NTEGRATED CIRCUITS DIVISION
CPC3982
PRELIMINARY
Absolute Maximum Ratings @ 25ºC (Unless Otherwise Noted)
Parameter Ratings Units
Drain-to-Source Voltage 800 V
Gate-to-Source Voltage ±15 V
Pulsed Drain Current 150 mA
Total Package Dissipation
1
0.4 W
Junction Temperature 125 ºC
Operational Temperature -55 to +110 ºC
Storage Temperature -55 to +125 ºC
1
Mounted on 1"x1" 2 oz. Copper FR4 board.
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Electrical Characteristics @ 25ºC (Unless Otherwise Noted)
Parameter Symbol Conditions Min Typ Max Units
Drain-to-Source Breakdown Voltage BV
Gate-to-Source Off Voltage V
Change in V
with Temperature dV
GS(off)
GS(off)
Gate Body Leakage Current I
Drain-to-Source Leakage Current I
Saturated Drain-to-Source Current I
Static Drain-to-Source On-State Resistance R
Change in R
with Temperature dR
DS(on)
DS(on)
Forward Transconductance G
Input Capacitance C
Common Source Output Capacitance C
Reverse Transfer Capacitance C
Source-Drain Diode Voltage Drop V
Thermal Resistance, Junction to Ambient
DSX
GS(off)
/dT VDS= 15V, ID=1A - - 4.5 mV/ºC
GSS
D(off)
DSS
DS(on)
/dT - - 2.5 %/ºC
FS
ISS
OSS
RSS
SD
JA
VGS= -5V, ID=100µA 800 - - V
VDS= 15V, ID=1A -1.4 - -3.1 V
VGS=±15V, VDS=0V - - 100 nA
VGS= -5V, VDS=800V - - 1 µA
VGS= 0V, VDS=15V 20 - - mA
VGS= 0V, ID=20mA, VDS=10V
- - 380
ID= 10mA, VDS = 10V 15 - - m
VGS= -3.5V
= 25V
V
DS
f= 1MHz
20
2.2
-
-pF
13
VGS= -5V, ISD=5mA - 0.6 1 V
- - 250 - ºC/W
2
PRELIMINARY
R00C
Page 3
I
NTEGRATED CIRCUITS DIVISION
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
CPC3982
PRELIMINARY
Input Admittance
25
20
15
(mA)
D
I
10
5
0
-2.5 -2.0 -1.5 -1.0 -0.5
(VDS=10V)
VGS (V)
On-Resistance vs. Drain Current
360
340
320
300
280
On-Resistance (:)
260
240
0 5 10 15 20 25 30
(VGS=0V)
ID (mA)
Transconductance vs. Drain Current
60
50
40
30
(mS)
m
g
20
10
0
0 5 10 15 20
(VDS=10V)
ID (mA)
Capacitance vs. Drain-Source Voltage
100
10
Capacitance (pF)
1
0 5 10 15 20 25 30
(mA)
I
(VGS= -3.5V)
VDS (V)
30
25
20
15
D
10
5
0
024681012
C
ISS
C
OSS
C
RSS
VDS (V)
VGS= 0V
V
GS
V
GS
V
GS
V
GS
= -1V
= -1.2V
= -1.4V
= -1.6V
Output Characteristics
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
R00C
PRELIMINARY
3
Page 4
I
NTEGRATED CIRCUITS DIVISION
PRELIMINARY
CPC3982
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
CPC3982T MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
CPC3982T 260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or
Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be
used.
4
PRELIMINARY
R00C
Page 5
I
NTEGRATED CIRCUITS DIVISION
CPC3982
PRELIMINARY
Mechanical Dimensions
CPC3982T
(0.115 / 0.005)
2.30±0.20
(0.090±0.008)
0.99±0.10
(0.039±0.004)
(0.002±0.002)
0.05±0.05
0.94±0.06
(0.037±0.002)
CPC3982TTR Tape & Reel
177.8 DIA.
(7.00 DIA.)
2.92±0.12
3
1
0.44±0.06
(0.018±0.002)
1.90 typ
(0.075 typ)
1.30±0.10
(0.051±0.004)
2
0.95 typ
(0.035 typ)
1.75±0.10
(0.069±0.004)
0º / 5º
0.25 typ
(0.010 typ)
GAUGE PLANE
Notes: (Unless otherwise specified)
1. All dimensions are in mm (inches).
2. Reference JEDEC outline: TO-236AB.
3. Package outline dimensions inclusive of metal burrs.
4. Package outline exclusive of mold flash. Mold flash shall not exceed 0.127 (0.005).
5. Package outline exclusive of lead finish plating.
Recommended PCB Land Pattern
0.48 typ
(0.019 typ)
0.15±0.01
(0.006±0.0004)
4.00±0.10
(0.157±0.004)
(0.079±0.002)
2.00±0.05
2.20
(0.087)
0.95
(0.037)
Dimensions
(inches)
mm
0.95
(0.037)
0.65
(0.026)
1.55±0.05
(0.061±0.002)
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
Embossment
2.77±0.10
(0.109±0.004)
1.22±0.10
(0.048±0.004)
0.61 ref
(0.024 ref)
1.09 ref
(0.043 ref)
Section A-A
AA
4.00±0.10
(0.157±0.004)
NOTES:
1. All dimensions are shown in mm (inches).
2. Cumulative tolerance of 10 sprocket holes is ±0.02 (0.008).
3. Material: conductive polycarbonate.
Dimensions
(inches)
mm
3.15±0.10
(0.124±0.004)
(0.039 +0.004 - 0.000)
8.00±0.10
(0.315±0.004)
2.20 ref
(0.087 ref)
1.00 +0.10 -0.00
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC3982-R00C
©Copyright 2014, IXYS Integrated Circuits Division
5
All rights reserved. Printed in USA.
7/14/2014
Loading...