Datasheet 2SK2503 Datasheet (ROHM) [ru]

Page 1
2SK2503
Transistors

4V Drive Nch MOS FET

zStructure zExternal dimensions (Unit : mm) Silicon N-channel MOS FET
zFeatures
1) Low On-resistance.
2) Fast switching speed.
3) Wide SOA (safe operating area).
4) 4V drive.
5) Drive circuits can be simple.
6) Parallel use is easy .
zApplications
Switching
zPackaging specifications
Package Code
Type
Basic ordering unit (pieces)
2SK2503
zInner circuit
Taping
TL
2500
zAbsolute maximum ratings (Ta=25°C)
Parameter Drain-source voltage Gate-source voltage
Drain current
Reverse drain current
Continuous Pulsed Continuous
Pulsed Total power dissipation(Tc=25 Channel temperature Storage temperature
Pw ≤ 10µs, Duty cycle ≤ 1%
Symbol Limits Unit
60 V
±
20 20
150
55 to +150
°C
V
DSS
V
GSS
D
I
DP
I
DR
I
DRP
P
)
D
Tch
Tstg
20 5I
5
CPT3
(1)Gate (2)Drain (3)Source
(1) Gate (2) Drain (3) Source
V A A20 A A
W
°C °C
0.75
0.9
Abbreviated symbol : K2503
(1)
6.5
5.1
0.9
0.65
2.3
(1)
(2)
2.3
(3)
(2)
2.3
0.5
1.5
5.5
(3)
1.5
2.5
0.8Min.
0.5
1.0
9.5
Rev.A 1/5
Page 2
Transistors
zElectrical characteristics (Ta=25°C)
Parameter Gate-source leakage Drain-source breakdown voltage Zero gate voltage drain current Gate threshold voltage
Static drain-source on-state resistance
Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time
Pw ≤ 300µs, Duty cycle ≤ 1%
Symbol
I
V
(BR)DSS
I
V
R
C C C t
t
GSS
DSS
GS(th)
DS(on)
Y
fs
iss
oss
rss
d(on)
t
r
d(off)
t
f
Typ. Max. Unit Test Conditions
Min.
60
1.0
0.11
±100
10
2.5
0.135
0.17 0.20 I
4.0
520
240
100
5.0 ID=2.5A, VDD=30Vns
20 VGS=10Vns
50 RL=12ns
20 RG=10ns
nA V
V
µA
V
S pF pF pF
GS
= ±20V, VDS=0V
D
=1mA, VGS=0V
I V
DS
=60V, VGS=0V
DS
=10V, ID=1mA
V
D
=2.5A, VGS=10V
I
D
=2.5A, VGS=4V
I
D
=2.5A, VDS=10V
DS
=10V
V V
GS
=0V
f=1MHz
2SK2503
Rev.A 2/5
Page 3
Transistors
zElectrical characteristics curve
50
s
(A)
D
10
5
1
DRAIN CURRENT : I
0.5
0.1
0.5 100502101520
DS(on)
Operation in this area
is limited by R
Tc
=
25°C
Single pulse
DRAIN-SOURCE VOLTAGE : V
Fig.1 Maximum Safe Operating Area
4.0
(V)
GS(th)
3.0
2.0
1.0
GATE THRESHOLD VOLTAGE : V
0
25 0−50 75 100 125 150
25 25
CHANNEL TEMPERATURE : T
Fig.4 Gate Threshold Voltage
vs. Channel Temperature
0.3
()
DS(on)
0.2
0.1
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : R
0
Fig.7
Static Drain-Source On-State Resistance
50
GATE-SOURCE VOLTAGE : V
vs. Gate-Source Voltage
100µ
1ms
P
W
=10ms
DC Operation
I
2.5A
10
DS
V
=
DS
I
=
1mA
D
ch
(°C)
Ta=25°C Pulsed
5A
D
=
15
GS
(V)
10V
(V)
10
9 8
(A)
D
7 6 5 4 3
DRAIN CURRENT : I
2 1 0
0
DRAIN-SOURCE VOLTAGE : V
Fig.2 Typical Output Characteristics
10
V
=
10V
GS
Pulsed
5
()
DS(on)
2 1
Ta=125°C
0.5
0.2
0.1
0.05
0.02
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : R
0.01
0.01 5 100.05 0.1 0.5
Fig.5
Static Drain-Source On-State
Fig.5
Resistance vs. Drain Current ( Ι )
0.6
()
0.5
DS(on)
0.4
0.3
0.2
0.1
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : R
20
0
Fig.8
Static Drain-Source On-State Resistance
75°C 25°C
25°C
0.02 1 2
DRAIN CURRENT : I
I
D
=
2550 25 500 75 100 125 150
CHANNEL TEMPERATURE : Tch (°C)
vs. Channel Temperature
2SK2503
10
V
=
Ta=25
°C
Pulsed
10V
8V 6V 5V
4V
VGS=3V
DS
54321
(V)
()
DS(on)
STATIC DRAIN-SOURCE
ON-STATE RESISTANCE : R
0.2
(A)
D
Fig.6
Fig.6
=
10V
V
GS
Pulsed
5A
2.5A
10V
DS
Pulsed
5
Ta=125°C
75°C
2
(A)
D
0.05
DRAIN CURRENT : I
0.02
0.01
25°C
25°C
1
0.5
0.2
0.1
201 34567
GATE-SOURCE VOLTAGE : V
(V)
GS
Fig.3 Typical Transfer Characteristics
10
V
=
4V
GS
Pulsed
5
2
Ta=125°C
1
0.5
0.2
0.1
0.05
0.02
0.01
75°C 25°C
25°C
0.1 0.2 0.50.01 0.02 0.05
DRAIN CURRENT : I
1.0 2.0 5.0
(A)
D
Static Drain-Source On-State
Resistance vs. Drain Current ( ΙΙ )
100
V
=
10V
DS
(S)
Pulsed
50
fS
20
10
0.5
0.2
0.1
FORWARD TRANSFER ADMITTANCE : Y
5
2
1
Ta= −25°C
25°C 75°C
125°C
0.1 0.2 0.50.01 0.02 0.05
DRAIN CURRENT : I
1 2.0 5.0
(A)
D
Fig.9 Forward Transfer Admittance vs. Drain Current
8
10.0
10
Rev.A 3/5
Page 4
Transistors
10
VGS=0V
(A)
Pulsed
5
DR
Ta=125°C
75°C
2
25°C
25°C
1
0.5
0.2
0.1
REVERSE DRAIN CURRENT : I
0.05 0 0.5 1.0 1.5
SOURCE-DRAIN VOLTAGE : V
Fig.10 Reverse Drain Current vs. Source-Drain Voltage ( Ι )
1000
500
200
(ns)
100
50
20 10
SWITCHING TIME : t
5
2
0.10.05 0.2 0.5 1 2 5 10
DRAIN CURRENT : I
td(off)
tf tr
td(on)
D
(A)
Fig.13 Switching characteristics
(See Figures 16 and 17 for
the measurement circuit and resultant waveforms)
10
(V)
SD
Ta=25°C
DD
=30V
V
GS
=10V
V
G
=10
R Pulsed
5
(A)
DR
2
VGS=10V 0V
1
0.5
0.2
0.1
0.05
REVERSE DRAIN CURRENT : I
0.02
0.01 0 1.0 1.5
0.5
SOURCE-DRAIN VOLTAGE : V
Fig.11 Reverse Drain Current vs. Source-Drain Voltage ( ΙΙ )
1000
Ta=25°C di/dt=50A/µs
500
GS
=0V
V Pulsed
100
50
REVERSE RECOVERY TIME : trr (ns)
10
0.2 0.5
0.1
REVERSE DRAIN CURRENT : I
Fig.14 Reverse Recovery Time
vs. Reverse Drain Current
Ta=25°C
Pulsed
(V)
SD
12 51
0
DR
(A)
2SK2503
10000
5000
2000
(pF)
1000
500
200 100
CAPACITANCE : C
50
20 10
0.1 0.2 0.5 1 2 5 10 20 50 100
DRAIN-SOURCE VOLTAGE : V
Fig.12 Typical Capacitance vs. Drain-Source Voltage
Ta=25
V
Pulsed
C
iss
C
oss
C
rss
f=1MHz
=
0V
GS
(V)
DS
°C
( t )
D=1
: r
1
0.5
0.2
0.1
0.1
0.05
0.02
0.01
NORMALIZED TRANSIENT
0.01
THERMAL RESISTANCE
Single pulse
0.001 10µ
100
µ 1m 10m
PULSE WIDTH : PW
Tc=25°C
θ
(t)=r (t) θ
th(ch-c)
θ
=
6.25
°C/W
th(ch-c)
PW
T
100
m 1 10
(s)
D=
th (ch-c)
T
PW
Fig.15 Normalized Transient Thermal Resistance vs. Pulse Width
Rev.A 4/5
Page 5
Transistors
zSwitching characteristics measurement circuit
2SK2503
Pulse Width
V
GS
R
G
D.U.T.
I
D
R
V
Fig.15 Switching Time Test Circuit
L
DD
V
DS
V
V
50%
GS
10%
DS
10%
90%
t
t
d(on)
r
t
on
Fig.16 Switching Time Waveforms
90%
t
d(off)
50%
10%
90%
t
f
t
off
Rev.A 5/5
Page 6
Appendix
No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request that specifications to be separately delivered. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. Products listed in this document are no antiradiation design.
Notes
The products listed in this document are designed to be used with ordinary electronic equipment or devices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). Should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of with would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance.
About Export Control Order in Japan
Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control Order in Japan. In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause) on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.
Appendix1-Rev1.1
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