Datasheet 2SC5390 Datasheet (HIT)

Page 1
2SC5390
Silicon NPN Epitaxial
High Frequency Amplifier
Features
Excellent high frequency characteristics
fT = 1.4GHz (typ.)
Low output capacitance
Cob = 2.4 pF (typ.)
Isolated package
TO–126FM
ADE-208-492 (Z)
1st. Edition
December. 1996
Outline
TO–126FM
1
2
3
1. Emitter
2. Collector
3. Base
Page 2
2SC5390
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Collector to base voltage V Collector to emitter voltage V Emitter to base voltage V Collector current I Collector peak current i Collector power dissipation P Collector power dissipation PC*
CBO
CEO
EBO
C
c(peak)
C
1
Junction temperature Tj 150 °C Storage temperature Tstg –55 to +150 °C
Note: 1. Value at Tc = 25°C
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Collector to base breakdown voltage
Collector to emitter breakdown voltage
Collector cutoff current I Emitter cutoff current I DC current transfer ratio h Base to emitter voltage V Collector to emitter saturation
voltage Gain bandwidth product f Collector Output capacitance C
V
(BR)CBO
V
(BR)CEO
CBO
EBO
FE
BE
V
CE(sat)
T
ob
110 V IC = 10É A, IE = 0
110 V IC = 1mA, RBE =
——10µAV ——10µAV 30 100 VCE = 10 V, IC = 10mA ——1 V V ——1 V I
1.0 1.4 GHz VCE = 10 V, IC = 50mA — 2.4 3.5 pF VCB = 30V, I
110 V 110 V 3V 200 mA 400 mA
1.4 W 7W
= 100V, IE = 0
CB
= 3V, IC = 0
E B
= 10 V, IC = 10mA
CE
= 200mA, IB = 20mA
C
= 0
E
f = 1MHz
Page 3
Main Characteristics
Collector Power Dissipation
8
6
4
2
Collector Power Dissipation Pc (W)
0
Ambient Temperature Ta (°C)
vs. Temperature
Tc
Ta
50 100 150 200
Case Temperature Tc (°C)
2SC5390
1000
ic(peak)
300
I max
100
C
30
10
3
Collector Current I (mA)
1
1 3 10 30 100 300 1000
Collector to Emitter Voltage VCE (V)
Areaof Safe Operaion
C
(Tc = 25°C)
1 shot pulse Ta = 25 °C
PW = 1 ms
10 ms
DC Operation
Typical Output Characteristics
C
200
100
10 mA
9 mA
8 mA
7 mA
6 mA
5 mA
4 mA
3 mA
2 mA
500
FE
200
100
1 mA
Collector Current I (mA)
Ta = 25 °C Pulse Test
I = 0
B
DC Current Transfer Ratio h
0510
Collector to Emitter Voltage V
CE
(V)
DC Current Transfer Ratio vs.
Collector Current
25 °C
50
Ta = –25 °C
20
10
V = 10 V
CE
Pulse Test
5
1
51020 502
Collector Current IC (mA)
75 °C
100 200
Page 4
2SC5390
Collector to Emitter Saturation Voltage
vs. Collector Current
1
I / I = 10
C B
0.5
Pulse Test
CE(sat)
V (V)
0.2 Ta = –25 °C
25 °C
0.1
0.05 75 °C
0.02
Collector to Emitter Saturation Voltage
0.01
1
550
10 20 100 2002
Collector Current IC (mA)
Gain Bandwidth vs. Collector Current
5
Base to Emitter Saturation Voltage
vs. Collector Current
5
2
BE(sat)
V (V)
1
0.5
Ta = –25 °C
75 °C
25 °C
0.2
Base to Emitter Saturation Voltage
0.1 1
Collector Current I
10 20 100 20025 50
(mA)
C
Collctor Output Capacitance vs.
Collector to Base Voltage
10
I / I = 10
C B
Pulse Test
2
T
1
0.5
Gain Bandwidth f (MHz)
0.2
0.1 1
10 20 100 20025 50
Collector Current I
V = 10 V
CE
Pulse Test
(mA)
C
5
2
1
0.5
0.2
I = 0 ,
E
f = 1MHz
0.1
Collector Output Capacintace Cob (pF)
1
2 5 10 20 50 100
Collector to Base Voltage V
CB
(V)
Page 5
Package Dimentions
8.0 ± 0.4
1.0
6.0
φ
3.2
3.2 ± 0.4
+0.15 –0.1
2SC5390
Unit: mm
11.0 ± 0.515.6 ± 0.5
0.65
2.29 ± 0.5
1.9 Max 3.5
0.7
2.29 ± 0.5
1.7
Hitachi Code
EIAJ
JEDEC
TO–126FM
— —
Page 6
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi’s sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail­safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor products.
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Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan.
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