Datasheet 2SA564 Specification

2SA564(A)

Rev.E Mar.-2016 DATA SHEET

描述 / Descriptions

TO-92 塑封封装 PNP 半导体三极管。Silicon PNP transistor in a TO-92 Plastic Package.

特征 / Features

hFE高。

High h

用途 / Applications

用于普通放大。

General amplifier application.

内部等效电路 / Equivalent Circuit

FE

.

引脚排列 / Pinning

1

2

3

PIN1：Base PIN 2：Collector PIN 3：Emitter

放大及印章代码 / hFE Classifications & Marking

Classifications

h

FE

Symbol

hFE Range

Q R S

130~260 180~360 260~520

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2SA564(A)

Rev.E Mar.-2016 DATA SHEET

极限参数 / Absolute Maximum Ratings(Ta=25℃)

参数

Parameter

Collector to Base Voltage

V

CBO

符号

Symbol

2SA564

2SA564A

数值

Rating

-25

-45

单位

Unit

V

Collector to Emitter Voltage

V

CEO

Emitter to Base Voltage V

Collector Current - Continuous I

Collector Current – Continuous(Pulse) I

Collector Power Dissipation P

Junction Temperature

Storage Temperature Range

电性能参数 / Electrical Characteristics(Ta=25℃)

参数

Parameter

Collector Cut-Off Current I

Collector Cut-Off Current I

Collector to Base
Breakdown Voltage

V

CBO

符号

Symbol

CBO

CEO

2SA564

2SA564A

Test Conditions

VCB=-10V IE=0

VCE=-10V IB=0

IC=-10uA IE=0

2SA564A

EBO

C

CP

C

T

j

T

stg

测试条件

2SA564

-25
V

-45

-7.0 V

-100 mA

-200 mA

400

mW

150 ℃

-55～150

最小值

Min

典型值

Typ

-0.001 -1.0 μA

-10 μA

℃

最大值

Max

-25
V

-45

单位

Unit

Collector to Emitter
Breakdown Voltage

V

CEO

Emitter to Base
Breakdown Voltage

DC Current Gain hFE V

Collector to Emitter
Saturation Voltage

Output capacitance Cob

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2SA564

2SA564A

I

V

EBO

V

CE(sat)

IC=-10uA IE=0

=-10μA IC=0 -5.0 V

E

=-10V IC=-2.0mA 130 250 520

CE

IC=-100mA IB=-10mA -0.3 V

=-10V IE=0

V

CB

f=1.0MHz

-25
V

-45

3.5 pF

2SA564(A)

Rev.E Mar.-2016 DATA SHEET

外形尺寸图 / Package Dimensions

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2SA564(A)

Rev.E Mar.-2016 DATA SHEET

印章说明 / Marking Instructions

BR

A564

Q

****

说明：

BR:    为公司代码

A564：  为型号代码

Q:为h

****：  为生产批号代码，随生产批号变化。

Note:

BR: Company Code.

A564:  Product Type.

Q:   h

****: Lot No. Code,code change with Lot No.

分档代码

FE

Classifications Symbol

FE

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2SA564(A)

Rev.E Mar.-2016 DATA SHEET

波峰焊温度曲线图(无铅) / Temperature Profile for Dip Soldering(Pb-Free)

说明： Note:

1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150℃, Time:60~90sec.

2、峰值温度 255±5℃，时间持续为 5±0.5sec; 2.Peak Temp.:255±5℃, Duration:5±0.5sec.

3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec.

耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions

温度：270±5℃ 时间：10±1 sec. Temp:270±5℃ Time:10±1 sec

包装规格 / Packaging SPEC.

散件包装 / BULK

Package Type

封装形式

TO-92

Units/Bag

只/袋

1,000 10 10,000 5 50,000 135×190 237×172×102 560×245×195

1,000 10 10,000 10 100,000 135×190 237×172×102 560×245×375

Bags/Inner Box

袋/盒

Units 包装数量 Dimension 包装尺寸 (unit：mm3)

Units/Inner Box

只/盒

Inner Boxes/Outer Box

盒/箱

Units/Outer Box

只/箱

Bag 袋 Inner Box 盒 Outer Box 箱

编带包装 / AMMO

Package Type

封装形式

TO-92 3,000 1 120 10 30,000 328×230×42

Units/tape

只/纸带

Tape/Inner Box

纸带/盒

Units 包装数量 Dimension 包装尺寸 (unit：mm3)

Rows/Inner Box

纸带层/盒

Inner Boxes/Outer Box

盒/箱

Units/Outer Box

只/箱

Inner Box 盒 Outer Box 箱

小箱 480×346×235，
大箱 547×407×268

使用说明 / Notices

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